WO2010016421A1 - Heat treating device and heat treating method - Google Patents

Heat treating device and heat treating method Download PDF

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Publication number
WO2010016421A1
WO2010016421A1 PCT/JP2009/063555 JP2009063555W WO2010016421A1 WO 2010016421 A1 WO2010016421 A1 WO 2010016421A1 JP 2009063555 W JP2009063555 W JP 2009063555W WO 2010016421 A1 WO2010016421 A1 WO 2010016421A1
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WO
WIPO (PCT)
Prior art keywords
substrate
gas
shower head
heater
heat treatment
Prior art date
Application number
PCT/JP2009/063555
Other languages
French (fr)
Japanese (ja)
Inventor
清 高橋
Original Assignee
芝浦メカトロニクス株式会社
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Publication date
Application filed by 芝浦メカトロニクス株式会社 filed Critical 芝浦メカトロニクス株式会社
Priority to CN2009801399336A priority Critical patent/CN102177407A/en
Priority to JP2010523837A priority patent/JP5436429B2/en
Publication of WO2010016421A1 publication Critical patent/WO2010016421A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0083—Chamber type furnaces with means for circulating the atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00—Arrangement of elements for electric heating in or on furnaces
    • F27D11/02—Ohmic resistance heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D9/00—Cooling of furnaces or of charges therein
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

Definitions

  • the present invention relates to a heat treatment apparatus and a heat treatment method.
  • Patent Document 1 discloses that a heat treatment is performed on a workpiece by operating a heater provided at a position close to the periphery of the workpiece to be processed while the pressure in the processing chamber is set to a pressure equal to or higher than the atmospheric pressure.
  • Patent Document 1 an air flow is generated in the heating chamber by a fan. However, this is not always uniformly applied to the surface to be processed of the workpiece, and the air flow is not heated. Insufficient to heat the surface evenly.
  • the present invention has been made in view of the above-described problems, and provides a heat treatment apparatus and a heat treatment method capable of uniformly heat-treating even a large substrate evenly in a plane.
  • a sealed container that can be sealed against the atmosphere, a processing space that is provided in the sealed container and can accommodate a substrate, and provided in the sealed container so as to face the processing space.
  • a heater a gas introduction hole into which a gas that is inactive to the substrate and heats or cools the substrate is introduced, and is introduced to the inside through the gas introduction hole provided facing the substrate.
  • a dispersion plate is provided to partition an upstream chamber and a downstream chamber on the gas outlet side, and the dispersion plate is formed with a plurality of through holes for communicating the upstream chamber and the downstream chamber.
  • a heat treatment apparatus is provided.
  • the processing space in which the substrate is accommodated is depressurized, and after the depressurization, the substrate is heated by a heater provided facing the processing space.
  • a heater provided facing the processing space.
  • a gas that is inert to the substrate and heated is sprayed onto the substrate from a shower head provided facing the substrate.
  • a heat treatment method is provided that heats the substrate.
  • a heat treatment apparatus and a heat treatment method capable of uniformly heat-treating even a large substrate evenly in a plane.
  • FIG. 1 The schematic diagram which illustrates the principal part structure of the heat processing apparatus which concerns on embodiment of this invention.
  • FIG. 1 is a schematic view illustrating the main configuration of a heat treatment apparatus according to an embodiment of the invention.
  • the heat treatment apparatus according to the embodiment of the present invention has a structure in which an upper heater 21, a lower heater 22 and a shower head 10 are provided in a sealed container 1 capable of maintaining an atmosphere sealed with respect to the atmosphere.
  • the upper heater 21 and the lower heater 22 are, for example, a sheath heater or a lamp heater in which a heating wire is held in a metal tube.
  • the upper heater 21 and the lower heater 22 are provided to face each other, and a processing space 20 is formed between them.
  • An upper cover 23 that surrounds the periphery of the processing space 20 is provided at the top of the processing space 20, and a lower cover 24 that surrounds the periphery of the processing space 20 is provided at the bottom of the processing space 20.
  • a part of the upper cover 23 and the lower cover 24 is opened, and a carry-in / out port 25 for the substrate 5 is formed.
  • the substrate 5 to be processed is transferred into and out of the processing space 20 through the loading / unloading port 25.
  • the shower head 10 is provided on the upper heater 21.
  • An exhaust port 26 is provided below the lower heater 22.
  • An exhaust system such as a vacuum pump (not shown) is connected to the exhaust port 26, and the inside of the sealed container 1 including the processing space 20 is exhausted through the exhaust port 26. Further, the gas blown from the shower head 10 is also exhausted from the processing space 20 through the exhaust port 26. Considering the flow of gas blown from the shower head 10 toward the substrate 5, it is desirable that the exhaust port 26 be below the lower heater 22.
  • FIG. 2 is a perspective view of the shower head 10 as viewed from below.
  • FIG. 3 is a cross-sectional view of the shower head 10, and
  • FIG. 4 is an enlarged view of a main part in FIG.
  • the shower head 10 is formed in a square block shape having a planar size close to the area of the substrate 5 to be processed. As shown in FIG. 3, the shower head 10 has an upstream chamber 13 and a downstream chamber partitioned by a dispersion plate 17 therein. 14 are formed.
  • the dispersion plate 17 is provided at a substantially middle position in the thickness direction of the shower head 10 and substantially parallel to the surface direction of the shower head 10.
  • a gas introduction hole 15 (see FIG. 3) is formed at the center of the top plate portion 11 of the shower head 10, and the gas introduction hole 15 communicates with the upstream chamber 13.
  • a gas introduction pipe 16 is connected to the gas introduction hole 15, and the gas introduction pipe 16 is connected to a gas supply source (not shown).
  • An upstream chamber 13 is formed between the top plate portion 11 and the dispersion plate 17.
  • a shower plate 12 is provided at the bottom of the shower head 10.
  • a downstream chamber 14 is formed between the shower plate 12 and the dispersion plate 17.
  • a plurality of gas blowout holes 31 are formed in the shower plate 12. As shown in FIG. 2, each gas blowing hole 31 is formed in a slit shape extending in parallel with each other.
  • the shower plate 12 faces the processing space 20 via the upper heater 21.
  • the upper heater 21 is composed of, for example, a plurality of sheath heaters or lamp heaters, and the gas blown out from the gas outlet holes 31 of the shower plate 12 passes through the gaps between the plurality of sheath heaters or lamp heaters and is accommodated in the processing space 20. Is sprayed onto the substrate 5 that has been applied.
  • a plurality of through holes 32 for communicating the upstream chamber 13 and the downstream chamber 14 are formed in the dispersion plate 17.
  • the gas introduced into the upstream chamber 13 from the gas introduction hole 15 flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17, and the gas flowing into the downstream chamber 14 flows from the gas outlet hole 31 of the shower plate 12. Blow outside the shower plate.
  • the through holes 32 and the gas blowing holes 31 are arranged so that the gas blowing holes 31 are not positioned (overlap) just below the position of the through holes 32 of the dispersing plate 17 (positions in the surface direction of the dispersing plate 17). The position in the surface direction is shifted. The center of the through hole 32 is located directly above the portion of the shower plate 12 where the gas blowing holes 31 are not formed.
  • the total opening area of all the gas blowing holes 31 is made larger than the total opening area of all the through holes 32.
  • the opening area of each through hole 32 is made smaller than the opening area of each gas blowing hole 31, and the number of through holes 32 is made smaller than the number of gas blowing holes 31.
  • the opening areas of the through holes 32 and the gas blowing holes 31 may be the same, and only the number of the through holes 32 may be reduced.
  • the gas introduced into the upstream chamber 13 at a relatively high pressure has the dispersion plate 17 and the total opening area of the through holes 32 formed in the dispersion plate 17 is not so large. Therefore, instead of immediately flowing into the downstream chamber 14, the upstream chamber 13 is filled while diffusing in the surface direction in the upstream chamber 13. The gas filled in the upstream chamber 13 flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17.
  • the gas flowing into the downstream chamber 14 from the through hole 32 of the dispersion plate 17 is immediately shifted from the gas outlet hole 31 to the outside because the positions of the through hole 32 and the gas outlet hole 31 of the shower plate 12 are shifted. Rather than being blown out, the inside of the downstream chamber 14 diffuses in the surface direction and spreads in the downstream chamber 14.
  • the momentum (speed and pressure) is gradually reduced, and the gas is uniformly distributed in the surface direction.
  • the gas can be uniformly blown from all the gas blowing holes 31 over the entire surface direction of the shower plate 12 without being biased toward the specific gas blowing holes 31.
  • a plurality of internal heaters 18 are provided in the shower head 10.
  • Each internal heater 18 is supported on the dispersion plate 17 and disposed in the upstream chamber 13, and both ends thereof pass through the side wall of the shower head 10 and are connected to a power source (not shown).
  • the substrate 5 to be processed in the embodiment of the present invention is a substrate used for, for example, a flat panel display, a solar cell, etc.
  • the heat treatment apparatus according to the present embodiment has a large size with a side length of 1 meter or more. It is effective for uniform heating / cooling treatment of substrates.
  • the substrate 5 is carried into the processing space 20 from the carry-in / out entrance 25 by, for example, a carrying robot.
  • the substrate 5 is positioned between the upper heater 21 and the lower heater 22 in the processing space 20 and is supported by a support portion (not shown).
  • the upper heater 21 faces the upper surface of the substrate 5, and the lower heater 22 faces the lower surface of the substrate 5, and heats the substrate 5 mainly by radiant heat.
  • the inside of the sealed container 1 including the processing space 20 in which the substrate 5 is accommodated and held is decompressed. After reducing the pressure in the processing space 20 to about 0.6 Pa, for example, the upper heater 21 and the lower heater 22 are turned on to start heating the substrate 5.
  • the temperature in the substrate 5 or the processing space 20 is monitored by a temperature measuring means (not shown). When the temperature reaches a desired temperature, gas is introduced into the shower head 10 and gas is blown out from the gas blowing holes 31.
  • the gas used here is an inert gas with respect to the substrate 5, for example, nitrogen gas.
  • the substrate 5 is heated under the atmospheric pressure or a gas pressure slightly higher than the atmospheric pressure by the gas replacement after the pressure reduction.
  • the gas introduced from the gas introduction hole 15 fills the upstream chamber 13 as described above.
  • the gas in the upstream chamber 13 is heated by the internal heater 18 provided in the upstream chamber 13.
  • the heated gas flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17, and is further blown out from the gas blowing hole 31 to the lower side of the shower head 10. This gas is blown against the substrate 5 to heat the substrate 5.
  • Blowing the heated gas against the substrate 5 enables efficient and uniform heat treatment without lowering the temperature of the substrate 5 already heated by the upper heater 21 and the lower heater 22.
  • the heating of the substrate 5 can be raised to a desired temperature in a relatively short time only by heating by the upper heater 21 and the lower heater 22, but heating unevenness occurs in the surface direction particularly when the size of the substrate 5 is large. It becomes easy.
  • the gas heated from the shower plate 12 spreading in the surface direction of the substrate 5 is blown to the substrate 5. Heat treatment can be performed evenly.
  • the gas when the gas enters the shower head 10, the gas does not go out immediately, and is diffused in the surface direction to be filled to some extent in the shower head 10, so that it is not biased in the surface direction. Gas can be blown out evenly. For this reason, the uniform heating in which the uneven heating in the surface direction of the substrate 5 is further suppressed is possible.
  • the covers 23 and 24 surrounding the processing space 20 are provided above and below the processing space 20 so that the gas blown from the shower head 10 is filled in the processing space 20. be able to. Thereby, the heating gas can be uniformly distributed in the surface direction of the substrate 5 without being affected by the position of the exhaust port 26 so much, which also contributes to the uniform heating of the substrate 5.
  • the gas heated outside the shower head 10 may be introduced into the shower head 10 without providing the heater 18 inside the shower head 10. .
  • the temperature drop of the gas when it reaches the substrate 5 can be further suppressed, and an efficient heat treatment can be performed.
  • the internal heater 18 is provided upstream from the through hole 32 and the gas blowing hole 31, the gas can be heated before the gas is dispersed in a large number of small holes. The temperature distribution can be made uniform.
  • the substrate 5 is heat-treated at a temperature of, for example, 100 to 1000 ° C. for several minutes to several tens of hours by blowing the upper heater 21 and the lower heater 22 and gas.
  • the upper heater 21 and the lower heater 22 may be provided. However, it is desirable to provide both the upper heater 21 and the lower heater 22 from the viewpoint of increasing the temperature of the substrate 5 to a desired temperature in the initial stage of heating in a short time and reducing the overall processing time.
  • the shower head 10 is provided on the upper heater 21, the radiant heat of the upper heater 21 is not blocked by the shower head 10, and a plurality of gases blown from the shower head 10 are generated in the upper heater 21.
  • the radiant heat of the upper heater 21 is not blocked by the shower head 10, and a plurality of gases blown from the shower head 10 are generated in the upper heater 21.
  • the upper heater 21 and the lower heater 22 are turned off, the supply of the heating gas from the shower head 10 is stopped, and the temperature of the substrate 5 is lowered (returned to normal temperature). At this time, when it is desired to quickly lower the temperature of the substrate 5 to room temperature, it is effective to blow an unheated gas from the shower head 10 onto the substrate 5. That is, gas is introduced into the shower head 10 with the internal heater 18 turned off, blown out from the gas blowing holes 31 and blown onto the substrate 5.
  • the gas is sprayed evenly in the surface direction of the substrate 5 without unevenness, thereby preventing breakage such as cracking due to a temperature difference in the surface direction of the substrate 5.
  • the substrate 5 is quickly raised to a desired temperature by the upper heater 21 and the lower heater 22, and then the substrate 5 is supplied by gas supply using the shower head 10. Heating and cooling can be performed while spraying gas evenly over the entire surface. This makes it difficult to create a temperature difference in the substrate surface, improving the processing quality and preventing damage.
  • the gas blown against the substrate is not limited to those described in the above embodiment as long as it is inert so as not to cause a reaction or alteration to the substrate (including a film formed thereon) material. Further, the gas species may be changed between heating and cooling the substrate.

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Abstract

A heat treating device is provided with a closed container (1), a processing space (20) provided in the closed container (1) and capable of containing a substrate (5), heaters (21, 22) arranged in the closed container (1) so as to face the processing space (20), and a shower head (10) provided inside the closed container (1) and having a gas introducing hole (15) and gas ejecting holes (31), the gas introducing hole (15) being adapted such that gas inactive to the substrate (5) and heating and cooling the substrate (5) is introduced into the gas introducing hole (15), the gas ejecting holes (31) being arranged facing the substrate (5) and ejecting the gas, which is introduced into the shower head (10) through the gas introducing hole (15), toward the substrate (5).  A dispersing plate (17) is provided in the shower head (10), and the dispersing plate (17) partitions the inside of the shower head (10) into an upstream chamber (13) on the gas introducing hole (15) side and a downstream chamber (14) on the gas ejecting hole (31) side.  The dispersing plate (17) has formed therein through-holes (32) for interconnecting the upstream chamber (13) and the downstream chamber (14).

Description

熱処理装置及び熱処理方法Heat treatment apparatus and heat treatment method
　本発明は、熱処理装置及び熱処理方法に関する。 The present invention relates to a heat treatment apparatus and a heat treatment method.
　特許文献１には、処理室内圧力を大気圧以上の圧力としつつ、処理対象であるワーク周辺の近接した位置に設けたヒータを作動させて、ワークに対する加熱処理を行うことが開示されている。 Patent Document 1 discloses that a heat treatment is performed on a workpiece by operating a heater provided at a position close to the periphery of the workpiece to be processed while the pressure in the processing chamber is set to a pressure equal to or higher than the atmospheric pressure.
特許第２６２２３５６号公報Japanese Patent No. 2622356
　ヒータを用いたワークの加熱処理において、加熱処理する対象が特に大型基板である場合には、加熱ムラにより基板面内で大きな温度差が生じ破損に至る場合がある。 In the heat treatment of a workpiece using a heater, when a heat treatment target is a particularly large substrate, a large temperature difference may occur in the substrate surface due to uneven heating, leading to breakage.
　なお、特許文献１では、ファンにより加熱室内に気流を発生させているが、これはワークの被処理面に対して均一に当たるとは限らず、また気流は加熱されておらず、したがってワーク被処理面を均等に加熱するには不十分である。 In Patent Document 1, an air flow is generated in the heating chamber by a fan. However, this is not always uniformly applied to the surface to be processed of the workpiece, and the air flow is not heated. Insufficient to heat the surface evenly.
　本発明は上述の問題に鑑みてなされ、大型の基板であっても面内でムラなく均等に熱処理できる熱処理装置及び熱処理方法を提供する。 The present invention has been made in view of the above-described problems, and provides a heat treatment apparatus and a heat treatment method capable of uniformly heat-treating even a large substrate evenly in a plane.
　本発明の一態様によれば、大気に対して密閉可能な密閉容器と、前記密閉容器内に設けられ、基板を収容可能な処理空間と、前記密閉容器内で前記処理空間に対向して設けられたヒータと、前記基板に対して不活性であり前記基板を加熱または冷却するガスが導入されるガス導入孔と、前記基板に対向して設けられ前記ガス導入孔を介して内部に導入された前記ガスを前記基板に向けて吹き出させる複数のガス吹出孔とを有し、前記密閉容器内に設けられたシャワーヘッドと、を備え、前記シャワーヘッドの内部には、前記ガス導入孔側の上流室と前記ガス吹出孔側の下流室とを仕切る分散板が設けられ、前記分散板には前記上流室と前記下流室とを連通させる複数の貫通孔が形成されていることを特徴とする熱処理装置が提供される。
　また、本発明の他の一態様によれば、基板が収容された処理空間内を減圧し、前記減圧後、前記処理空間に対向して設けられたヒータにより前記基板を加熱し、前記ヒータの加熱により前記基板もしくは前記処理空間内が所望の温度になったら、前記基板に対して不活性であり且つ加熱されたガスを、前記基板に対向して設けられたシャワーヘッドから前記基板に吹き付けて前記基板を加熱することを特徴とする熱処理方法が提供される。 According to one aspect of the present invention, a sealed container that can be sealed against the atmosphere, a processing space that is provided in the sealed container and can accommodate a substrate, and provided in the sealed container so as to face the processing space. A heater, a gas introduction hole into which a gas that is inactive to the substrate and heats or cools the substrate is introduced, and is introduced to the inside through the gas introduction hole provided facing the substrate. A plurality of gas blowing holes for blowing the gas toward the substrate, and a shower head provided in the sealed container, wherein the shower head has a gas inlet hole side. A dispersion plate is provided to partition an upstream chamber and a downstream chamber on the gas outlet side, and the dispersion plate is formed with a plurality of through holes for communicating the upstream chamber and the downstream chamber. A heat treatment apparatus is provided.
According to another aspect of the present invention, the processing space in which the substrate is accommodated is depressurized, and after the depressurization, the substrate is heated by a heater provided facing the processing space. When the inside of the substrate or the processing space reaches a desired temperature by heating, a gas that is inert to the substrate and heated is sprayed onto the substrate from a shower head provided facing the substrate. A heat treatment method is provided that heats the substrate.
　本発明によれば、大型の基板であっても面内でムラなく均等に熱処理できる熱処理装置及び熱処理方法が提供される。 According to the present invention, there is provided a heat treatment apparatus and a heat treatment method capable of uniformly heat-treating even a large substrate evenly in a plane.
本発明の実施形態に係る熱処理装置の要部構成を例示する模式図。The schematic diagram which illustrates the principal part structure of the heat processing apparatus which concerns on embodiment of this invention. 図１に示すシャワーヘッドを下側から見た斜視図。The perspective view which looked at the shower head shown in FIG. 1 from the lower side. 同シャワーヘッドの断面図。Sectional drawing of the shower head. 図３に示すシャワーヘッドの要部の拡大図。The enlarged view of the principal part of the shower head shown in FIG.
　以下、図面を参照し、本発明の実施形態について説明する。
　図１は、本発明の実施形態に係る熱処理装置の要部構成を例示する模式図である。
　本発明の実施形態に係る熱処理装置は、大気に対して密閉された雰囲気を維持可能な密閉容器１内に、上ヒータ２１、下ヒータ２２およびシャワーヘッド１０が設けられた構造を有する。上ヒータ２１、下ヒータ２２は、例えば金属管の中に発熱線を保持したシースヒータ、あるいは、ランプヒータである。上ヒータ２１と下ヒータ２２とは対向して設けられ、それらの間に処理空間２０が形成される。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view illustrating the main configuration of a heat treatment apparatus according to an embodiment of the invention.
The heat treatment apparatus according to the embodiment of the present invention has a structure in which an upper heater 21, a lower heater 22 and a shower head 10 are provided in a sealed container 1 capable of maintaining an atmosphere sealed with respect to the atmosphere. The upper heater 21 and the lower heater 22 are, for example, a sheath heater or a lamp heater in which a heating wire is held in a metal tube. The upper heater 21 and the lower heater 22 are provided to face each other, and a processing space 20 is formed between them.
　処理空間２０の上部にはその周囲を囲む上カバー２３が設けられ、処理空間２０の下部にはその周囲を囲む下カバー２４が設けられている。上カバー２３及び下カバー２４の一部は開口され、基板５の搬出入口２５が形成されている。この搬出入口２５を介して、処理対象である基板５は処理空間２０に搬出入される。 An upper cover 23 that surrounds the periphery of the processing space 20 is provided at the top of the processing space 20, and a lower cover 24 that surrounds the periphery of the processing space 20 is provided at the bottom of the processing space 20. A part of the upper cover 23 and the lower cover 24 is opened, and a carry-in / out port 25 for the substrate 5 is formed. The substrate 5 to be processed is transferred into and out of the processing space 20 through the loading / unloading port 25.
　シャワーヘッド１０は上ヒータ２１の上に設けられている。下ヒータ２２の下方には排気口２６が設けられている。排気口２６には図示しない真空ポンプなどの排気系が接続され、その排気口２６を通じて、処理空間２０を含む密閉容器１内が排気される。また、シャワーヘッド１０から吹き出したガスも排気口２６を通じて処理空間２０内から排気される。シャワーヘッド１０から基板５に向けて吹き付けられるガスの流れを考慮すると、排気口２６は下ヒータ２２の下方にあることが望ましい。 The shower head 10 is provided on the upper heater 21. An exhaust port 26 is provided below the lower heater 22. An exhaust system such as a vacuum pump (not shown) is connected to the exhaust port 26, and the inside of the sealed container 1 including the processing space 20 is exhausted through the exhaust port 26. Further, the gas blown from the shower head 10 is also exhausted from the processing space 20 through the exhaust port 26. Considering the flow of gas blown from the shower head 10 toward the substrate 5, it is desirable that the exhaust port 26 be below the lower heater 22.
　次に、シャワーヘッド１０の詳細について説明する。
　図２はシャワーヘッド１０を下側から見た斜視図である。
　図３はシャワーヘッド１０の断面図であり、図４は図３における要部の拡大図を示す。 Next, details of the shower head 10 will be described.
FIG. 2 is a perspective view of the shower head 10 as viewed from below.
FIG. 3 is a cross-sectional view of the shower head 10, and FIG. 4 is an enlarged view of a main part in FIG.
　シャワーヘッド１０は、処理対象である基板５の面積に近い平面サイズを有する四角いブロック状に形成され、図３に示すように、その内部には分散板１７によって仕切られた上流室１３と下流室１４とが形成されている。 The shower head 10 is formed in a square block shape having a planar size close to the area of the substrate 5 to be processed. As shown in FIG. 3, the shower head 10 has an upstream chamber 13 and a downstream chamber partitioned by a dispersion plate 17 therein. 14 are formed.
　分散板１７は、シャワーヘッド１０の厚み方向の略中間位置に、シャワーヘッド１０の面方向に対して略平行に設けられている。シャワーヘッド１０の天板部１１の中心にはガス導入孔１５（図３参照）が形成され、そのガス導入孔１５は上流室１３に通じている。また、ガス導入孔１５にはガス導入管１６が接続され、ガス導入管１６は図示しないガス供給源に接続されている。天板部１１と分散板１７との間に上流室１３が形成されている。シャワーヘッド１０の底部にはシャワープレート１２が設けられている。このシャワープレート１２と分散板１７との間に下流室１４が形成されている。 The dispersion plate 17 is provided at a substantially middle position in the thickness direction of the shower head 10 and substantially parallel to the surface direction of the shower head 10. A gas introduction hole 15 (see FIG. 3) is formed at the center of the top plate portion 11 of the shower head 10, and the gas introduction hole 15 communicates with the upstream chamber 13. A gas introduction pipe 16 is connected to the gas introduction hole 15, and the gas introduction pipe 16 is connected to a gas supply source (not shown). An upstream chamber 13 is formed between the top plate portion 11 and the dispersion plate 17. A shower plate 12 is provided at the bottom of the shower head 10. A downstream chamber 14 is formed between the shower plate 12 and the dispersion plate 17.
　シャワープレート１２には複数のガス吹出孔３１が形成されている。図２に示すように、各々のガス吹出孔３１は、互いに平行に延在するスリット状に形成されている。シャワープレート１２は、上ヒータ２１を介して処理空間２０に対向する。上ヒータ２１は例えば複数本のシースヒータもしくはランプヒータから構成され、シャワープレート１２のガス吹出孔３１から吹き出したガスは、それら複数本のシースヒータもしくはランプヒータ間の隙間を抜けて、処理空間２０に収容された基板５に吹き付けられる。 A plurality of gas blowout holes 31 are formed in the shower plate 12. As shown in FIG. 2, each gas blowing hole 31 is formed in a slit shape extending in parallel with each other. The shower plate 12 faces the processing space 20 via the upper heater 21. The upper heater 21 is composed of, for example, a plurality of sheath heaters or lamp heaters, and the gas blown out from the gas outlet holes 31 of the shower plate 12 passes through the gaps between the plurality of sheath heaters or lamp heaters and is accommodated in the processing space 20. Is sprayed onto the substrate 5 that has been applied.
　分散板１７には、上流室１３と下流室１４とを連通させる複数の貫通孔３２（図４参照）が形成されている。ガス導入孔１５から上流室１３内に導入されたガスは、分散板１７の貫通孔３２を通り下流室１４に流入し、下流室１４内に流入したガスはシャワープレート１２のガス吹出孔３１からシャワープレート外部に吹き出す。 A plurality of through holes 32 (see FIG. 4) for communicating the upstream chamber 13 and the downstream chamber 14 are formed in the dispersion plate 17. The gas introduced into the upstream chamber 13 from the gas introduction hole 15 flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17, and the gas flowing into the downstream chamber 14 flows from the gas outlet hole 31 of the shower plate 12. Blow outside the shower plate.
　ここで、本実施形態では、シャワーヘッド１０内にガスが入ってから出ていくまでの流れの中で、上流側の方が圧力が高く下流側の方が圧力が低くなるような圧力差が生じるようにコンダクタンスを徐々に増やす構造にしている。 Here, in the present embodiment, in the flow from when the gas enters the shower head 10 until it exits, there is a pressure difference such that the pressure is higher on the upstream side and lower on the downstream side. It is structured to increase the conductance gradually so as to occur.
　具体的には、分散板１７の貫通孔３２の位置（分散板１７の面方向の位置）の真下にガス吹出孔３１が位置しない（重ならない）ように、貫通孔３２とガス吹出孔３１の面方向における位置をずらしている。シャワープレート１２におけるガス吹出孔３１が形成されていない部分の真上に、貫通孔３２の中心が位置している。 Specifically, the through holes 32 and the gas blowing holes 31 are arranged so that the gas blowing holes 31 are not positioned (overlap) just below the position of the through holes 32 of the dispersing plate 17 (positions in the surface direction of the dispersing plate 17). The position in the surface direction is shifted. The center of the through hole 32 is located directly above the portion of the shower plate 12 where the gas blowing holes 31 are not formed.
　さらに、すべての貫通孔３２の開口総面積よりも、すべてのガス吹出孔３１の開口総面積の方が大きくなるようにしている。例えば、個々の貫通孔３２の開口面積を個々のガス吹出孔３１の開口面積より小さくし、且つ貫通孔３２の数をガス吹出孔３１の数よりも少なくしている。あるいは、貫通孔３２及びガス吹出孔３１個々の開口面積は同じとし、個数のみを貫通孔３２の方が少なくなるようにしてもよい。 Furthermore, the total opening area of all the gas blowing holes 31 is made larger than the total opening area of all the through holes 32. For example, the opening area of each through hole 32 is made smaller than the opening area of each gas blowing hole 31, and the number of through holes 32 is made smaller than the number of gas blowing holes 31. Alternatively, the opening areas of the through holes 32 and the gas blowing holes 31 may be the same, and only the number of the through holes 32 may be reduced.
　このような構造とすることで、比較的高圧で上流室１３内に導入されたガスは、分散板１７があること及びその分散板１７に形成された貫通孔３２の開口総面積がそれほど大きくないことから、すぐに下流室１４に流れ込むのではなく、上流室１３内を面方向に拡散しつつ上流室１３内に充満する。上流室１３内に充満したガスは分散板１７の貫通孔３２を通って下流室１４に流入する。 By adopting such a structure, the gas introduced into the upstream chamber 13 at a relatively high pressure has the dispersion plate 17 and the total opening area of the through holes 32 formed in the dispersion plate 17 is not so large. Therefore, instead of immediately flowing into the downstream chamber 14, the upstream chamber 13 is filled while diffusing in the surface direction in the upstream chamber 13. The gas filled in the upstream chamber 13 flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17.
　そして、分散板１７の貫通孔３２から下流室１４内に流入したガスは、貫通孔３２とシャワープレート１２のガス吹出孔３１との位置がずれていることから、すぐにガス吹出孔３１から外部に吹き出すのではなく、下流室１４内を面方向に拡散し下流室１４内に広がる。 The gas flowing into the downstream chamber 14 from the through hole 32 of the dispersion plate 17 is immediately shifted from the gas outlet hole 31 to the outside because the positions of the through hole 32 and the gas outlet hole 31 of the shower plate 12 are shifted. Rather than being blown out, the inside of the downstream chamber 14 diffuses in the surface direction and spreads in the downstream chamber 14.
　したがって、シャワーヘッド１０内に導入されたガスは、シャワーヘッド１０内を上流側から下流側に進むにつれて、勢い（速度や圧力）が徐々に弱められ、面方向に均一に分布するようになり、特定のガス吹出孔３１に偏ることなく、シャワープレート１２の面方向全体にわたってすべてのガス吹出孔３１から均一にガスを吹き出させることができる。 Therefore, as the gas introduced into the shower head 10 progresses through the shower head 10 from the upstream side to the downstream side, the momentum (speed and pressure) is gradually reduced, and the gas is uniformly distributed in the surface direction. The gas can be uniformly blown from all the gas blowing holes 31 over the entire surface direction of the shower plate 12 without being biased toward the specific gas blowing holes 31.
　また、シャワーヘッド１０内には、複数本の内部ヒータ１８が設けられている。各々の内部ヒータ１８は、分散板１７上に支持されて上流室１３内に配置され、その両端はシャワーヘッド１０の側壁を貫通して、図示しない電源に接続されている。 Also, a plurality of internal heaters 18 are provided in the shower head 10. Each internal heater 18 is supported on the dispersion plate 17 and disposed in the upstream chamber 13, and both ends thereof pass through the side wall of the shower head 10 and are connected to a power source (not shown).
　次に、本実施形態に係る熱処理装置を用いた処理方法について説明する。 Next, a processing method using the heat treatment apparatus according to this embodiment will be described.
　本発明の実施形態で処理対象とする基板５は、例えばフラットパネルディスプレイ、太陽電池などに用いられる基板であり、特に本実施形態に係る熱処理装置は、１辺の長さが１メートル以上の大型基板に対する均等加熱・冷却処理に有効である。 The substrate 5 to be processed in the embodiment of the present invention is a substrate used for, for example, a flat panel display, a solar cell, etc. In particular, the heat treatment apparatus according to the present embodiment has a large size with a side length of 1 meter or more. It is effective for uniform heating / cooling treatment of substrates.
　基板５は、例えば搬送ロボットにより、搬出入口２５から処理空間２０内に搬入される。基板５は、処理空間２０内で上ヒータ２１と下ヒータ２２との間に位置して、図示しない支持部に支持される。上ヒータ２１は基板５の上面に対向し、下ヒータ２２は基板５の下面に対向し、それぞれ主に輻射熱によって基板５を加熱する。 The substrate 5 is carried into the processing space 20 from the carry-in / out entrance 25 by, for example, a carrying robot. The substrate 5 is positioned between the upper heater 21 and the lower heater 22 in the processing space 20 and is supported by a support portion (not shown). The upper heater 21 faces the upper surface of the substrate 5, and the lower heater 22 faces the lower surface of the substrate 5, and heats the substrate 5 mainly by radiant heat.
　基板５が収容保持された処理空間２０を含む密閉容器１内は減圧される。処理空間２０内を例えば０．６Ｐａ程度にまで減圧後、上ヒータ２１及び下ヒータ２２をオンにして基板５の加熱を開始する。 The inside of the sealed container 1 including the processing space 20 in which the substrate 5 is accommodated and held is decompressed. After reducing the pressure in the processing space 20 to about 0.6 Pa, for example, the upper heater 21 and the lower heater 22 are turned on to start heating the substrate 5.
　基板５もしくは処理空間２０内の温度は図示しない温度測定手段によってモニタされ、その温度が所望の温度になったら、シャワーヘッド１０にガスを導入し、ガス吹出孔３１からガスを吹き出させる。ここで用いられるガスは、基板５に対して不活性なガスであり、例えば窒素ガスなどである。 The temperature in the substrate 5 or the processing space 20 is monitored by a temperature measuring means (not shown). When the temperature reaches a desired temperature, gas is introduced into the shower head 10 and gas is blown out from the gas blowing holes 31. The gas used here is an inert gas with respect to the substrate 5, for example, nitrogen gas.
　上記減圧後のガス置換により、大気圧あるいは大気圧より若干高いガス圧力下で基板５は加熱される。ガス導入孔１５から導入されたガスは前述したように上流室１３に充満するが、このとき上流室１３に設けられた内部ヒータ１８により、上流室１３内のガスは加熱される。そして、この加熱されたガスが分散板１７の貫通孔３２を通って下流室１４に流入し、さらにガス吹出孔３１からシャワーヘッド１０の下方に吹き出す。このガスは、基板５に対して吹き付けられ基板５を加熱する。 The substrate 5 is heated under the atmospheric pressure or a gas pressure slightly higher than the atmospheric pressure by the gas replacement after the pressure reduction. The gas introduced from the gas introduction hole 15 fills the upstream chamber 13 as described above. At this time, the gas in the upstream chamber 13 is heated by the internal heater 18 provided in the upstream chamber 13. Then, the heated gas flows into the downstream chamber 14 through the through hole 32 of the dispersion plate 17, and is further blown out from the gas blowing hole 31 to the lower side of the shower head 10. This gas is blown against the substrate 5 to heat the substrate 5.
　加熱されたガスを基板５に対して吹き付けることで、上ヒータ２１及び下ヒータ２２によりすでに加熱を受けている基板５の温度を低下させず、効率的に均一な加熱処理を行える。上ヒータ２１及び下ヒータ２２による加熱だけでは、基板５を比較的短時間で所望の温度にまで昇温させることはできるが、特に基板５のサイズが大きい場合には面方向で加熱ムラが生じやすくなる。しかし、本実施形態では、上ヒータ２１及び下ヒータ２２による加熱に加えて、基板５の面方向に広がるシャワープレート１２から加熱されたガスを基板５に吹き付けるため、基板５の面方向の加熱ムラを抑えて均等に加熱処理することができる。 Blowing the heated gas against the substrate 5 enables efficient and uniform heat treatment without lowering the temperature of the substrate 5 already heated by the upper heater 21 and the lower heater 22. The heating of the substrate 5 can be raised to a desired temperature in a relatively short time only by heating by the upper heater 21 and the lower heater 22, but heating unevenness occurs in the surface direction particularly when the size of the substrate 5 is large. It becomes easy. However, in this embodiment, in addition to the heating by the upper heater 21 and the lower heater 22, the gas heated from the shower plate 12 spreading in the surface direction of the substrate 5 is blown to the substrate 5. Heat treatment can be performed evenly.
　さらに、前述したように、ガスがシャワーヘッド１０内に入ったときに、すぐに出て行かないようにし、面方向に拡散させてシャワーヘッド１０内である程度充満させることで面方向に偏らずに均等にガスを吹き出させることができる。このため、基板５の面方向の加熱ムラをよりいっそう抑えた均等加熱が可能となる。 Further, as described above, when the gas enters the shower head 10, the gas does not go out immediately, and is diffused in the surface direction to be filled to some extent in the shower head 10, so that it is not biased in the surface direction. Gas can be blown out evenly. For this reason, the uniform heating in which the uneven heating in the surface direction of the substrate 5 is further suppressed is possible.
　また、図１に示すように、処理空間２０の上下に、処理空間２０の周囲を囲むカバー２３、２４が設けられていることで、シャワーヘッド１０から吹き出したガスを処理空間２０内に充満させることができる。これにより、排気口２６の位置の影響をそれほど受けずに、基板５の面方向に加熱ガスを均一に分布存在させることができ、このことも基板５の均等加熱に寄与する。 Further, as shown in FIG. 1, the covers 23 and 24 surrounding the processing space 20 are provided above and below the processing space 20 so that the gas blown from the shower head 10 is filled in the processing space 20. be able to. Thereby, the heating gas can be uniformly distributed in the surface direction of the substrate 5 without being affected by the position of the exhaust port 26 so much, which also contributes to the uniform heating of the substrate 5.
　なお、加熱されたガスを基板５に対して吹き付けるにあたっては、シャワーヘッド１０の内部にヒータ１８を設けずに、シャワーヘッド１０の外部で加熱されたガスをシャワーヘッド１０内に導入してもよい。ただし、シャワーヘッド１０内でガスを加熱した方が、基板５に届いたときのガスの温度低下をより抑制でき効率的な加熱処理を行える。また、内部ヒータ１８は、貫通孔３２及びガス吹出孔３１よりも上流に設けられているため、多数の小孔でガスが分散される前にガスを加熱することができ、ガスの面方向の温度分布の均一化も図れる。 When the heated gas is blown against the substrate 5, the gas heated outside the shower head 10 may be introduced into the shower head 10 without providing the heater 18 inside the shower head 10. . However, when the gas is heated in the shower head 10, the temperature drop of the gas when it reaches the substrate 5 can be further suppressed, and an efficient heat treatment can be performed. Moreover, since the internal heater 18 is provided upstream from the through hole 32 and the gas blowing hole 31, the gas can be heated before the gas is dispersed in a large number of small holes. The temperature distribution can be made uniform.
　上ヒータ２１、下ヒータ２２およびガスの吹き付けにより、基板５は、例えば、１００～１０００℃の温度で数分から数十時間、加熱処理される。 The substrate 5 is heat-treated at a temperature of, for example, 100 to 1000 ° C. for several minutes to several tens of hours by blowing the upper heater 21 and the lower heater 22 and gas.
　なお、上ヒータ２１と下ヒータ２２はどちらか一方のみであってもよい。ただし、加熱初期に基板５を所望の温度にまで短時間で昇温させ、全体の処理時間の短縮化を図る観点からは、上ヒータ２１及び下ヒータ２２を両方設けた方が望ましい。 Note that only one of the upper heater 21 and the lower heater 22 may be provided. However, it is desirable to provide both the upper heater 21 and the lower heater 22 from the viewpoint of increasing the temperature of the substrate 5 to a desired temperature in the initial stage of heating in a short time and reducing the overall processing time.
　また、上ヒータ２１の上にシャワーヘッド１０を設けていることで、上ヒータ２１の輻射熱がシャワーヘッド１０で遮られることがなく、さらに、シャワーヘッド１０から吹き出したガスが上ヒータ２１における複数本のシースヒータ間もしくはランプヒータ間を通り抜けることでそのとき加熱され、基板５に届くときの温度を低下しにくくできる。 In addition, since the shower head 10 is provided on the upper heater 21, the radiant heat of the upper heater 21 is not blocked by the shower head 10, and a plurality of gases blown from the shower head 10 are generated in the upper heater 21. By passing through between the sheath heaters or between the lamp heaters, it is possible to make it difficult to lower the temperature when heated and reach the substrate 5 at that time.
　基板５の加熱処理後、上ヒータ２１及び下ヒータ２２をオフにし、且つシャワーヘッド１０からの加熱ガスの供給を停止して、基板５の温度を下げていく（常温に戻す）。このとき、基板５の温度を早く常温にまで下げたい場合には、シャワーヘッド１０から、加熱されていないガスを基板５に吹き付けるのが有効である。すなわち、内部ヒータ１８をオフにした状態でガスをシャワーヘッド１０内に導入し、ガス吹出孔３１から吹き出させて基板５に吹き付ける。 After the heat treatment of the substrate 5, the upper heater 21 and the lower heater 22 are turned off, the supply of the heating gas from the shower head 10 is stopped, and the temperature of the substrate 5 is lowered (returned to normal temperature). At this time, when it is desired to quickly lower the temperature of the substrate 5 to room temperature, it is effective to blow an unheated gas from the shower head 10 onto the substrate 5. That is, gas is introduced into the shower head 10 with the internal heater 18 turned off, blown out from the gas blowing holes 31 and blown onto the substrate 5.
　このときも、前述した加熱時と同様、ガスは基板５の面方向にムラなく均等に吹き付けられ、これにより、基板５の面方向の温度差による割れ等の破損を防ぐことができる。 Also at this time, as in the heating described above, the gas is sprayed evenly in the surface direction of the substrate 5 without unevenness, thereby preventing breakage such as cracking due to a temperature difference in the surface direction of the substrate 5.
　以上説明したように本発明の実施形態によれば、上ヒータ２１及び下ヒータ２２によって迅速に基板５を所望の温度にまで上昇させた上で、シャワーヘッド１０を使ったガス供給により、基板５の全面にムラなく均等にガスを吹き付けながら加熱や冷却をすることができる。これにより、基板面内に温度差ができにくくなり、処理品質を向上させ、また破損を防げる。 As described above, according to the embodiment of the present invention, the substrate 5 is quickly raised to a desired temperature by the upper heater 21 and the lower heater 22, and then the substrate 5 is supplied by gas supply using the shower head 10. Heating and cooling can be performed while spraying gas evenly over the entire surface. This makes it difficult to create a temperature difference in the substrate surface, improving the processing quality and preventing damage.
　以上、具体例を参照しつつ本発明の実施形態について説明した。しかし、本発明は、それらに限定されるものではなく、本発明の技術的思想に基づいて種々の変形が可能である。 The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to them, and various modifications can be made based on the technical idea of the present invention.
　基板に対して吹き付けるガスは、基板（これに形成された膜等も含む）材料に対して反応や変質を生じさせない不活性なものであればよく、上記実施形態で挙げたものに限らない。また、基板の加熱時と冷却時とでガス種を変えてもよい。 The gas blown against the substrate is not limited to those described in the above embodiment as long as it is inert so as not to cause a reaction or alteration to the substrate (including a film formed thereon) material. Further, the gas species may be changed between heating and cooling the substrate.
　５　基板
　１０　シャワーヘッド
　１２　シャワープレート
　１３　上流室
　１４　下流室
　１５　ガス導入孔
　１７　分散板
　１８　内部ヒータ
　２０　処理空間
　２１　上ヒータ
　２２　下ヒータ
　２６　排気口
　３１　ガス吹出孔
　３２　貫通孔 5 Substrate 10 Shower head 12 Shower plate 13 Upstream chamber 14 Downstream chamber 15 Gas introduction hole 17 Dispersing plate 18 Internal heater 20 Processing space 21 Upper heater 22 Lower heater 26 Exhaust port 31 Gas outlet hole 32 Through hole

Claims (9)

  1. 　大気に対して密閉可能な密閉容器と、
    　前記密閉容器内に設けられ、基板を収容可能な処理空間と、
    　前記密閉容器内で前記処理空間に対向して設けられたヒータと、
    　前記基板に対して不活性であり前記基板を加熱または冷却するガスが導入されるガス導入孔と、前記基板に対向して設けられ前記ガス導入孔を介して内部に導入された前記ガスを前記基板に向けて吹き出させる複数のガス吹出孔とを有し、前記密閉容器内に設けられたシャワーヘッドと、
    　を備え、
    　前記シャワーヘッドの内部には、前記ガス導入孔側の上流室と前記ガス吹出孔側の下流室とを仕切る分散板が設けられ、前記分散板には前記上流室と前記下流室とを連通させる複数の貫通孔が形成されていることを特徴とする熱処理装置。     A sealed container that can be sealed against the atmosphere;
    A processing space provided in the sealed container and capable of accommodating a substrate;
    A heater provided facing the processing space in the sealed container;
    A gas introduction hole into which a gas that is inert to the substrate and heats or cools the substrate is introduced; and the gas that is provided facing the substrate and introduced into the inside through the gas introduction hole. A plurality of gas blowing holes for blowing toward the substrate, a shower head provided in the sealed container,
    With
    A dispersion plate is provided inside the shower head to partition the upstream chamber on the gas introduction hole side and the downstream chamber on the gas blow-out hole side, and the dispersion plate communicates the upstream chamber and the downstream chamber. A heat treatment apparatus in which a plurality of through holes are formed.
  2. 　前記貫通孔の前記分散板の面方向の位置は、前記ガス吹出孔の位置に対してずれていることを特徴とする請求項１記載の熱処理装置。 The heat treatment apparatus according to claim 1, wherein the position of the through hole in the surface direction of the dispersion plate is deviated from the position of the gas blowing hole.
  3. 　前記複数の貫通孔すべての開口の総面積よりも、前記複数のガス吹出孔すべての開口の総面積の方が大きいことを特徴とする請求項１または２に記載の熱処理装置。 The heat treatment apparatus according to claim 1 or 2, wherein a total area of all the plurality of gas blowing holes is larger than a total area of all the plurality of through holes.
  4. 　前記シャワーヘッド内に、内部ヒータが設けられていることを特徴とする請求項１記載の熱処理装置。 The heat treatment apparatus according to claim 1, wherein an internal heater is provided in the shower head.
  5. 　前記内部ヒータは、前記貫通孔及び前記ガス吹出孔よりも上流に設けられたことを特徴とする請求項４記載の熱処理装置。 The heat treatment apparatus according to claim 4, wherein the internal heater is provided upstream of the through hole and the gas blowing hole.
  6. 　前記ヒータは、前記処理空間を挟んで対向する一対のヒータを有することを特徴とする請求項１記載の熱処理装置。 The heat treatment apparatus according to claim 1, wherein the heater includes a pair of heaters facing each other with the processing space interposed therebetween.
  7. 　基板が収容された処理空間内を減圧し、
    　前記減圧後、前記処理空間に対向して設けられたヒータにより前記基板を加熱し、
    　前記ヒータの加熱により前記基板もしくは前記処理空間内が所望の温度になったら、前記基板に対して不活性であり且つ加熱されたガスを、前記基板に対向して設けられたシャワーヘッドから前記基板に吹き付けて前記基板を加熱することを特徴とする熱処理方法。     The processing space in which the substrate is accommodated is depressurized,
    After the depressurization, the substrate is heated by a heater provided facing the processing space,
    When the substrate or the processing space reaches a desired temperature due to the heating of the heater, a gas that is inert to the substrate and heated is supplied from a shower head provided opposite to the substrate to the substrate. And heat the substrate by spraying on the substrate.
  8. 　前記シャワーヘッドの内部における上流側と下流側との間が分散板により複数の空間に仕切られ、前記シャワーヘッド内に導入された前記ガスは前記複数の空間内で拡散されつつ下流側に進むにつれて徐々に圧力が低下されることを特徴とする請求項７記載の熱処理方法。 Between the upstream side and the downstream side in the shower head is partitioned into a plurality of spaces by a dispersion plate, and the gas introduced into the shower head proceeds downstream while being diffused in the plurality of spaces. The heat treatment method according to claim 7, wherein the pressure is gradually reduced.
  9. 　前記ヒータ及び前記ガスの吹き付けによる前記基板の加熱後、
    　前記ヒータをオフにし、且つ加熱を受けていないガスを前記シャワーヘッドから前記基板に吹き付けて前記基板を冷却することを特徴とする請求項７または８に記載の熱処理方法。     After heating the substrate by spraying the heater and the gas,
    9. The heat treatment method according to claim 7, wherein the heater is turned off and the substrate is cooled by spraying an unheated gas from the shower head onto the substrate.
PCT/JP2009/063555 2008-08-08 2009-07-30 Heat treating device and heat treating method WO2010016421A1 (en)

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