JP2006188762A - 蒸着膜厚測定方法及び蒸着システム - Google Patents
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- 230000008021 deposition Effects 0.000 title claims abstract description 114
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- 239000000463 material Substances 0.000 claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 239000013078 crystal Substances 0.000 claims description 38
- 238000007740 vapor deposition Methods 0.000 claims description 37
- 238000005259 measurement Methods 0.000 claims description 9
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- 238000001771 vacuum deposition Methods 0.000 description 8
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- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
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- 239000012071 phase Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
【解決手段】蒸着率測定センサー26が蒸着源20から基板30に噴射される物質の蒸着率を感知する段階と、感知された蒸着率を制御部に伝送する段階と、感知された蒸着率と蒸着率測定センサー26のライフ数値を媒介変数とする変換式によって基板30に形成される蒸着膜の厚さを換算する段階からなる。
【選択図】図4
Description
(ただし(1)式中、α及びβはの常数である。)
また、本発明の実施形態によれば、蒸着システムは真空チャンバと、前記真空チャンバの一側に設置された基板と、前記真空チャンバの他側に設置されて前記基板に向けて目標蒸着率で蒸着物質を噴射する蒸着源と、前記蒸着源から噴射される蒸着物質の蒸着率を感知する蒸着率測定センサーと、前記感知された蒸着率と前記蒸着率測定センサーのライフ数値を媒介変数とする変換式によって前記基板に形成される蒸着膜の厚さを算出する制御部と、を有することを特徴とする。
ここで、α及びβはの常数である。
すなわち、図5は図2に示された換算厚さを本発明による換算蒸着厚さの変換式に代入して逆算したとき、逆算蒸着厚さを示すグラフであり、逆算蒸着厚さと実際の蒸着厚さは一致することが分かる。
20…蒸着源、
30…基板、
40…マスク、
50…チャック、
100…蒸着システム。
Claims (11)
- 蒸着率測定センサーが蒸着源から基板に噴射される物質の蒸着率を感知する段階と、
前記感知された蒸着率と前記蒸着率測定センサーのライフ数値を媒介変数とする変換式によって前記基板に形成される蒸着膜の厚さを算出する段階と、を有することを特徴とする蒸着膜厚測定方法。 - 前記ライフ数値は、
前記蒸着率測定センサーが蒸着率を感知したときから感知を終了したときまでのライフ区間の数値であることを特徴とする請求項1に記載の蒸着膜厚測定方法。 - 前記蒸着率測定センサーは、
クリスタルセンサーであることを特徴とする請求項1に記載の蒸着膜厚測定方法。 - 前記変換式は、下記(1)式の関係を満足させることを特徴とする請求項1に記載の蒸着システムの蒸着膜厚測定方法。
蒸着膜厚さ=β−α×ライフ数値 …(1)
(ただし(1)式中、α及びβはの常数である。) - 真空チャンバと、
前記真空チャンバの一側に設置された基板と、
前記真空チャンバの他側に設置されて前記基板に向けて目標蒸着率で蒸着物質を噴射する蒸着源と、
前記蒸着源から噴射される蒸着物質の蒸着率を感知する蒸着率測定センサーと、
前記感知された蒸着率と前記蒸着率測定センサーのライフ数値を媒介変数とする変換式によって前記基板に形成される蒸着膜の厚さを算出する制御部と、を有することを特徴とする蒸着システム。 - 前記ライフ数値は、
前記蒸着率測定センサーが蒸着率を感知したときから感知を終了したときまでのライフ区間の数値であることを特徴とする請求項5に記載の蒸着システム。 - 前記蒸着率測定センサーは、
クリスタルセンサーであることを特徴とする請求項6に記載の蒸着システム。 - 前記クリスタルセンサーは、
前記蒸着源に設置されることを特徴とする請求項7に記載の蒸着システム。 - 前記制御部は、
前記蒸着率測定センサーのライフ数値が増加するほど前記蒸着物質の目標蒸着率が増加するように前記蒸着源の作動を制御することを特徴とする請求項5に記載の蒸着システム。 - 前記基板は、
有機電界発光素子用基板であることを特徴とする請求項5に記載の蒸着システム。 - 前記変換式は、下記式、の関係を満足させることを特徴とする請求項5に記載の蒸着システム。
蒸着膜厚さ=β−α×ライフ数値 …(1)
(ただし(1)式中、α及びβはの常数である。)
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KR1020050000968A KR100611883B1 (ko) | 2005-01-05 | 2005-01-05 | 증착시스템 및 이에 사용되는 증착두께 측정방법 |
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JP4611884B2 JP4611884B2 (ja) | 2011-01-12 |
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US (1) | US20060147613A1 (ja) |
JP (1) | JP4611884B2 (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010261099A (ja) * | 2009-04-30 | 2010-11-18 | Samsung Mobile Display Co Ltd | 蒸着ソース |
JP2011042868A (ja) * | 2009-07-24 | 2011-03-03 | Hitachi High-Technologies Corp | 真空蒸着方法及びその装置 |
JP2012112037A (ja) * | 2010-11-04 | 2012-06-14 | Canon Inc | 成膜装置及びこれを用いた成膜方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100761100B1 (ko) * | 2006-02-08 | 2007-09-21 | 주식회사 아바코 | 유기발광소자의 증착막 형성방법 및 장치 |
CN101824647B (zh) * | 2009-03-04 | 2012-07-25 | 和舰科技(苏州)有限公司 | 一种pecvd薄膜沉积的自动化制程控制方法 |
KR20140077625A (ko) * | 2012-12-14 | 2014-06-24 | 삼성디스플레이 주식회사 | 유기물 증착 장치 |
KR101413355B1 (ko) * | 2013-01-30 | 2014-07-01 | 주식회사 야스 | 제어모듈 일체형 증착율 센서 |
KR102365900B1 (ko) * | 2015-07-17 | 2022-02-22 | 삼성디스플레이 주식회사 | 증착 장치 |
CN110672667B (zh) * | 2019-10-17 | 2021-02-26 | 北京航空航天大学 | 一种用于测量等离子体沉积的动态压阻探针 |
WO2022022817A1 (en) * | 2020-07-29 | 2022-02-03 | Applied Materials, Inc. | Computer implemented method for improving measurement quality of a deposition rate measurement device and deposition measurment system |
Family Cites Families (4)
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US4425871A (en) * | 1981-02-09 | 1984-01-17 | Applied Magnetics Corporation | Apparatus for sensing deposition of a thin film layer of a material |
JPH1120245A (ja) | 1997-07-03 | 1999-01-26 | Oki Data:Kk | 画像処理装置及び画像処理方法 |
JP2000012218A (ja) * | 1998-06-23 | 2000-01-14 | Tdk Corp | 有機el素子の製造装置および製造方法 |
US6820485B2 (en) * | 2003-04-21 | 2004-11-23 | Tangidyne Corporation | Method and apparatus for measuring film thickness and film thickness growth |
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2005
- 2005-01-05 KR KR1020050000968A patent/KR100611883B1/ko active IP Right Grant
- 2005-12-22 JP JP2005370950A patent/JP4611884B2/ja active Active
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- 2006-01-04 TW TW095100270A patent/TWI293337B/zh active
- 2006-01-05 CN CN200610000429A patent/CN100582294C/zh active Active
- 2006-01-05 US US11/325,310 patent/US20060147613A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010261099A (ja) * | 2009-04-30 | 2010-11-18 | Samsung Mobile Display Co Ltd | 蒸着ソース |
JP2013117073A (ja) * | 2009-04-30 | 2013-06-13 | Samsung Display Co Ltd | 蒸着ソース |
US8557046B2 (en) | 2009-04-30 | 2013-10-15 | Samsung Display Co., Ltd. | Deposition source |
JP2011042868A (ja) * | 2009-07-24 | 2011-03-03 | Hitachi High-Technologies Corp | 真空蒸着方法及びその装置 |
JP2012112037A (ja) * | 2010-11-04 | 2012-06-14 | Canon Inc | 成膜装置及びこれを用いた成膜方法 |
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Publication number | Publication date |
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TW200628625A (en) | 2006-08-16 |
JP4611884B2 (ja) | 2011-01-12 |
CN100582294C (zh) | 2010-01-20 |
KR20060080486A (ko) | 2006-07-10 |
CN1824829A (zh) | 2006-08-30 |
KR100611883B1 (ko) | 2006-08-11 |
TWI293337B (en) | 2008-02-11 |
US20060147613A1 (en) | 2006-07-06 |
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