JP2006188748A - Method for forming shadow mask pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a shadow mask pattern, which easily forms a mask having a large area by firstly welding a shadow mask in a state of applying tensile force to a mask frame and forming the vapor deposition pattern by using laser light, in a simple production step and facility and in a short period of production time. <P>SOLUTION: This method for forming a shadow mask pattern comprises the steps of: bonding the shadow mask 10 to the mask frame 20; and forming the pattern on the bonded shadow mask 10. The above step of bonding the shadow mask 10 to the mask frame 20 comprises the steps of: making the shadow mask 10 adjoin to the mask frame 20; applying the external force to the shadow mask 10; and bonding the shadow mask 10 to which the external force is applied, to the mask frame 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for forming a shadow mask pattern. More specifically, the present invention relates to a mask mask having a large area by first welding a mask frame with a tensile force and forming a vapor deposition pattern using a laser. The present invention relates to a method for forming a shadow mask pattern that is easy, has simple processing steps and equipment, and can reduce processing time.

  In general, a vacuum deposition method for depositing a thin film in a vacuum state is widely used in the field of semiconductors and display elements. For such a vacuum vapor deposition method, a shadow mask having a specific pattern is used on a substrate on which vapor deposition is performed, and vapor deposition is performed only on portions other than those shielded by the shadow mask.

  However, since the shadow mask is in the form of a sheet metal having a thin thickness, when aligned with the substrate, the shadow mask is in close contact with the substrate while supporting only the edges, but at this time, the central portion of the shadow mask is not supported. Since it is supported only at the end, complete adhesion is not achieved. In particular, when the substrate is supported in the vertical direction, a phenomenon of dropping downward due to the weight of the central portion itself occurs, and a problem arises that a pattern error occurs during the deposition process. Such a problem becomes more apparent when depositing a large-area substrate.

FIG. 1 is a diagram showing a general shadow mask.
As shown in FIG. 1, the shadow mask 10 is configured by forming a pattern of a blocking region 11 and a transmission region 12 corresponding to a deposition region of a substrate (not shown).

FIG. 2 is a diagram illustrating a process of depositing a deposition material on a display element substrate on which metal wiring is formed using a general shadow mask.
Referring to FIG. 2, the display element includes a gate line 32 and a data line 31 that intersect with each other to define a pixel region, and a thin film transistor positioned at the intersection of the gate line 32 and the data line 31. .

  A vapor deposition material is deposited on each pixel region 33. As shown in the figure, a shadow is formed on the lower portion of the substrate 30 such that one surface of the substrate 30 on which the array wiring and the driving element are formed faces downward. The mask 10 is positioned. In this state, a thin film is formed in each pixel region 33 through the vapor deposition process.

  However, in a display element having a large area recently requested, a warp phenomenon due to the weight of the shadow mask occurs as the shadow mask increases in area. A problem has arisen in that it is difficult to ensure the accuracy of the pattern because the distance from the substrate becomes large.

  In order to solve such problems, conventionally, a method for improving the accuracy of the mask pattern by arranging a magnetic material on the substrate has been proposed.

FIG. 3 is a diagram illustrating a process of depositing a magnetic material on a substrate on which a metal wiring is formed and depositing a deposition material on the substrate through a shadow mask.
As shown in FIG. 3, the method uses the point that the shadow mask 10 is a metal material, the shadow mask 10 and the magnet 50 are arranged on opposite sides of the substrate 30, and the attractive force of the magnet 50 is used. In this way, the shadow mask 10 is prevented from sagging.

  However, in this case, the extent to which the shadow mask 10 hangs forms a gradient over the entire area, and if the strength of the magnetic field increases, the shadow mask 10 is pulled more than necessary, and as a result, the surface of the substrate 30 is pulled. Problems that cause damage occur.

  In addition, the shadow mask described above has been manufactured by an etching method or an electroforming method. However, both of these two methods have the integration of the transmission region of the shadow mask and the limit to the thickness of the shadow mask.

  In addition, the etching method is almost impossible when the distance between the transmissive regions is 30 μm or less, and has a disadvantage that a rectangular pattern is not realized and a right angle portion is rounded.

  Since the electroforming method has nickel as a main component, it has a weakness to heat, and since the interval between the transmission regions is only 90% of the thickness of the shadow mask, it is difficult to integrate the transmission regions. The production period is about 5 days and it is difficult to meet the production schedule.

  In addition, in such a shadow mask pattern forming method, referring to FIG. 4, in order to form a film formation layer (not shown) having a predetermined structure on one surface of the substrate 30, A shadow mask 10 having a transmissive region 12 in which a pattern corresponding to the structure is formed is fixed to a mask frame 20. At this time, the shadow mask 10 is fixed to the mask frame 20 by welding or the like in a state where a tensile force is applied in the direction indicated by the arrow A.

  The vapor deposition material supplied in the direction of arrow B from the evaporation source (not shown) passes through the processing region 22 of the mask frame 20 and the transmission region 12 of the shadow mask 10 and is deposited on the substrate 30. Then, a predetermined structure of the film formation layer is formed. Reference numeral 11 denotes a fixing portion that is fixed by performing a welding operation on the mask frame 20 without forming a pattern.

  On the other hand, the mask pattern is formed by processing the shadow mask 10 with a pattern forming apparatus (not shown). In order to form a pattern on the shadow mask 10, as shown in FIG. 5, a tension corresponding to the tensile force applied to the mask on which the pattern is formed is applied to the shadow mask 10 when being fixed to the mask frame. In this state, the pattern forming apparatus is moved in the transmission region 12 of the shadow mask 10 in a direction from one side to the other side, for example, in the direction of arrow C.

  When a pattern is formed on the shadow mask 10 by the above-described method, the rigidity between adjacent patterns is weakened by the tension applied to the shadow mask 10. As a result, while the pattern is formed on the shadow mask 10 to which the same magnitude of tension is applied from all directions, the rigidity of the portion where the pattern is formed first is weakened, so the rigidity distribution of the entire mask varies. As a result, it becomes impossible to obtain a pattern having a desired structure. That is, in the shadow mask, the rigidity at the part where the pattern is formed first is not the same as the rigidity at the part where the pattern is not formed. , Will come to me. In particular, when a pattern is formed on a shadow mask for large area vapor deposition, a rigid variation phenomenon appears conspicuously as the pattern is formed as described above, making it difficult to obtain a pattern having a desired shape. .

On the other hand, as a document describing a technique related to a conventional method for forming a shadow mask pattern, there are Patent Document 1 that discloses an organic EL mask, Patent Document that describes a shadow mask and a method for manufacturing an organic electroluminescence display element using the shadow mask. 2. Patent Document 3 describing a shadow mask and a method for producing a full-curler organic EL using the shadow mask.
Korean Patent Publication No. 2004-0054937 Specification Korean Patent Publication No. 2003-0077370 Specification Korean Patent Publication No. 2002-0027959

  The present invention has been devised to solve the conventional problems as described above. First, a mask frame is welded in a state where a tensile force is applied, and a deposition pattern is formed using a laser. Accordingly, it is an object of the present invention to provide a method for forming a shadow mask pattern, in which a large-area mask can be easily manufactured, processing steps and equipment are simple, and processing time is shortened.

  Another object of the present invention is to prevent a phenomenon in which rigidity varies depending on whether or not a pattern is formed in a shadow mask by a tensile force applied to the shadow mask while a pattern having a predetermined structure is formed on the shadow mask. It is an object of the present invention to provide a method for forming a shadow mask pattern that prevents a pattern from being formed or fluttered.

  In order to achieve the above object, a shadow mask pattern forming method according to the present invention comprises a step of attaching a shadow mask onto a mask frame and a step of forming a pattern on the attached shadow mask. To do.

  Further, the step of attaching the shadow mask on the mask frame includes the step of adjoining the shadow mask on the mask frame, the step of applying an external force to the shadow mask, and the external force being applied on the mask frame. Joining the shadow mask. Here, the external force applied to the shadow mask is preferably performed by a front end tensile force.

  Moreover, it is preferable that the joining which attaches the shadow mask on the mask frame is performed by welding.

  More preferably, the welding is preferably performed by a plurality of spot weldings.

  The pattern formed on the shadow mask is performed by laser processing. More preferably, the laser processing for forming a pattern on the shadow mask is preferably performed by laser water jet processing.

  According to the present invention, in the method of forming a pattern on a shadow mask, the shadow mask comprising: a fixed portion that is fixed in a state where a tensile force is applied to the mask frame; and a transmission region on which the pattern is formed. A step of fixing the shadow mask while applying a tension corresponding to the tensile force, a step of selecting a pattern formation start position in a transmission region of the fixed shadow mask, and a formation in a spiral direction from the pattern formation start position. Forming the pattern along a path. At this time, the spiral direction is a direction from the center of the transmission region of the shadow mask toward the outside. The spiral direction is a direction from the outside to the center of the transmission region of the shadow mask.

  The shadow mask may be made of a stainless steel material.

  Further, the material of the stainless steel member is any one selected from the group consisting of SUS304, SUS430, and SUS304 + SUS430.

  Also, according to one embodiment of the present invention, a method of forming a pattern on a shadow mask comprising: a fixed portion that is fixed in a state where a tensile force is applied to a mask frame; and a transmission region on which a pattern is formed. A step of positioning an auxiliary sheet having a relatively large thickness under the shadow mask; and applying the tension corresponding to the tensile force to the shadow mask and the auxiliary sheet together with the shadow mask and the auxiliary sheet. The method includes a step of fixing, and a step of forming a pattern in a transmission region of the fixed shadow mask.

  According to another embodiment of the present invention, a method of forming a pattern on a shadow mask comprising: a fixed portion that is fixed to a state in which a tensile force is applied to the mask frame; and a transmission region on which the pattern is formed. The step of fixing the shadow mask while applying a tension corresponding to the tensile force to the shadow mask, the step of forming a slit in the fixed part of the shadow mask, and forming a pattern in the transmission region of the shadow mask And a stage of performing.

As described above, according to the method of forming a shadow mask pattern according to the present invention, a mask having a large area is formed by first welding a mask frame with a tensile force and forming a deposition pattern using a laser. Manufacture is easy, processing steps and equipment are simple, and processing time can be saved.

  Further, when a predetermined pattern is formed on the shadow mask fixed in a state where an external force is applied, the distribution of tension applied to the shadow mask is uniformly formed while the pattern is formed. As a result, it is possible to obtain a highly accurate mask pattern by preventing a phenomenon that the mask pattern does not appear or flicker.

  Hereinafter, a preferred embodiment of a method for forming a shadow mask pattern according to the present invention will be described in detail with reference to the accompanying drawings. The term “shadow mask” means a steel plate for forming a pattern, the term “mask” means a steel plate on which a pattern is formed, and the term “mask pattern” means a pattern formed on the shadow mask. Means. As described above, specific terms used in describing the present invention are terms that are justified for the convenience of description, and may vary depending on the intention or practice of a person skilled in the art. It should not be understood as a meaning of limiting the structural elements.

  FIG. 6 is a diagram illustrating a stage in which a shadow mask of a shadow mask pattern forming method according to an embodiment of the present invention is adjacent to a mask frame, and FIG. 7 is a shadow of a shadow mask pattern forming method according to an embodiment of the present invention. FIG. 8 is a diagram illustrating a stage in which a tensile force acts on the mask, and FIG. 8 is a diagram illustrating a stage in which the shadow mask of the shadow mask pattern forming method according to the embodiment of the present invention is welded onto the mask frame. 9 is a diagram illustrating a stage in which a pattern is formed by laser water jet processing on a shadow mask of the shadow mask pattern forming method according to the embodiment of the present invention.

  As shown in FIGS. 6 to 9, the shadow mask 10 is adjacent to the mask frame 20 before being processed. The mask frame 20 includes a support region 21 that constitutes the frame body, and a processing region 22 that is surrounded by the support region 21 and that defines an empty space.

  An external force, that is, a tensile force F acts on the shadow mask 10 adjacent to the mask frame 20 in the front end direction. The shadow mask 10 pulled in the front end direction by the tensile force F is attached to the mask frame 20 in a pulled state. At this time, the shadow mask 10 is preferably attached to the mask frame 20 by a welding method, and more preferably, the surface where the support region 21 of the mask frame 20 and the shadow mask 10 are in contact is attached by a plurality of spot welds W. The

  After that, in the shadow mask 10 attached on the mask frame 20 by spot welding W in a state of being pulled by an external force, a transmission region 12 having a certain shape, that is, a pattern is formed. Laser processing is performed to form a pattern on the shadow mask 10.

  The thinner the laser is, the better the workability of the laser is. The laser can be processed with an interval between the transmission regions 12 of 10 μm or less, and the size of the transmission region 12 can be 10 μm or less. Therefore, there is an advantage that the transmission region 12 can be integrated.

  Preferably, laser water jet processing L / W is performed in order to improve the optical characteristics of the laser and prevent thermal damage to the workpiece due to high heat generated during laser processing. The laser-water jet processing L / W is a well-known technique, and is a technique in which when a high pressure water is jetted, the laser is jetted together at a deep portion thereof. Is improved, and high heat generated by the laser is cooled by water.

Hereinafter, another embodiment of a method for forming a shadow mask pattern according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 10 is a view illustrating that a pattern is formed on a vertically arranged mask frame in a shadow mask pattern forming method according to another embodiment of the present invention. Referring to FIG. 10, the shadow mask 10 is attached on the mask frame 20 arranged in a vertical state. A vertical deposition system in an in-line facility for large area substrate deposition and mass production is one of efficient methods from the viewpoint of minimizing the equipment area.

  However, when the large area substrate and the shadow mask 10 corresponding to the large area substrate are vertically mounted on such an in-line process equipment, the shadow mask 10 is caused to drop downward due to its own weight. . Therefore, the pattern formed on the shadow mask 10 also hangs downward, causing a pattern distortion phenomenon and causing a pattern defect during vapor deposition.

  Therefore, in another embodiment of the present invention, by attaching the shadow mask 10 on the mask frame 20 arranged in a vertical state, the sagging phenomenon due to the weight of the shadow mask 10 is reflected in advance to improve the alignment accuracy. A pattern of the shadow mask 10 can be formed.

  First, the shadow mask 10 comes adjacent to the vertically arranged mask frame 20. The mask frame 20 is configured by a support region (not shown) constituting the frame body and a processing region (not shown) that defines a space surrounded by the support region. A uniform tensile force F acts on the shadow mask 10 adjacent to the mask frame 20 in the front end direction on the shadow mask 10 by the tension system 70. The shadow mask 10 pulled in the front end direction by the pulling force F is fixed on the mask frame 20 by the plurality of fixing members 72 of the pulling system 70 in the pulled state.

  Thereafter, the shadow mask 10 fixed in the tensioned state by the fixing member 72 is attached on the mask frame 20. At this time, the shadow mask 10 is preferably attached to the mask frame 20 by a welding method using a welding machine 90, and more preferably, a plurality of surfaces are in contact with the support region of the mask frame 20 and the shadow mask 10. It adheres by spot welding W. On the shadow mask 10 attached on the mask frame 20 by spot welding W while being pulled by an external force, a transmissive region 12 having a certain shape, that is, a pattern is formed. Preferably, laser water jet processing L / W is performed to form a pattern on the shadow mask 10.

Hereinafter, other embodiments of the present invention will be described with reference to the accompanying drawings.
First, in the shadow mask pattern forming method according to the present invention, a shadow mask to be formed is fixed to a mask frame (not shown). At this time, when the shadow mask is fixed to the mask frame by welding or the like, an external force A corresponding to the applied tensile force is applied. This is because the structure of the mask pattern and the substrate is easily aligned by the tensile force applied when the shadow mask is fixed to the mask frame.

  Thereafter, a shadow mask is manufactured by forming a pattern to be formed on a shadow mask fixed to the mask frame using a pattern forming apparatus (not shown) such as a water jet laser apparatus. At this time, the user of the pattern forming apparatus grasps the overall structure of the pattern to be formed on the shadow mask, and then selects the pattern formation start position so that the tension A applied to the shadow mask is uniform. The desired structure pattern is formed by moving the pattern forming apparatus along a substantially spiral path.

  As shown in FIG. 11a, when the pattern formation start position is selected at the center of the transmissive region 12 of the shadow mask 10, the user forms the pattern forming apparatus along the pattern formation path d indicated by a solid line. Set the program to move.

  Thereafter, the perforation apparatus forms a pattern having a desired structure in the transmission region 12 of the shadow mask 10 while moving in a spiral direction along the pattern formation path d according to a program set by the user. At this time, the distance from the pattern formed in the transmission region 12 of the shadow mask 10 to the position where the external force A is applied is maintained almost the same, so that the tension distribution is formed on the shadow mask. It is possible to prevent the pattern from appearing or disappearing.

  Similarly, as shown in FIG. 11b, when the pattern formation start position is selected at one side corner of the transmission region 12 of the shadow mask 10, the user follows the pattern formation path e indicated by the solid line. The program is set so that the pattern forming apparatus moves.

  Thereafter, the pattern forming apparatus forms a desired structural pattern in the transmission region 12 of the shadow mask 10 while moving in the spiral direction along the pattern formation path e according to a program set by the user. At this time, the distance from the pattern formed in the transmission region 12 of the shadow mask 10 to the position where the external force A is applied is maintained almost the same, so the distribution of the tension applied to the shadow mask varies. It is possible to prevent the pattern from becoming unclear and preventing it from coming out.

  According to another embodiment of the present invention, as shown in FIG. 12, the distribution of the tension applied to the shadow mask 10 during the formation of the pattern in the transmission region 12 of the shadow mask 10 is prevented from varying. In addition, a perforated hole 15 such as a slit or hole of a predetermined size is processed in advance in the blocking area 23b of the shadow mask 10.

  Thereafter, a desired shape pattern is formed in the transmission region 12 of the shadow mask 10 using a pattern forming apparatus. At this time, the perforated hole 15 relaxes the tension applied to the shadow mask 10 on the transmissive region 12 so that a desired shape pattern is smoothly formed in the transmissive region 12.

  On the other hand, when a pattern is formed on the transmission region 12 of the shadow mask 10 by the pattern forming apparatus, the pattern formation start position is selected so that the tension A applied to the shadow mask 10 is uniform, and a substantially spiral path A desired structure pattern is formed by moving the pattern forming apparatus along the line. At this time, the spiral path is directed outward from the center of the transmissive region 12 as shown in FIG. 11a or directed from one side corner of the transmissive region 12 to the center as shown in FIG. 11b.

According to another embodiment of the present invention, as shown in FIG. 13, the pattern is formed in order to prevent the distribution of the tension applied to the shadow mask 10 from varying during the pattern formation. After positioning the relatively thick auxiliary sheet 40 under the shadow mask 10 to be applied, a tension in the direction of arrow A is applied thereto. Then, a predetermined pattern is formed in the transmission region 12 of the shadow mask 10 by the pattern forming apparatus.

  As described above, even if the tension distribution in the shadow mask 10 is varied while the pattern is formed by the pattern forming apparatus, the degree of variation in the tension distribution is compensated by the auxiliary sheet 40, and the ultimate distribution is achieved. Specifically, a desired structural mask pattern can be formed on the shadow mask 10.

  On the other hand, when the pattern forming apparatus forms a pattern on the shadow mask 10 positioned above the auxiliary sheet 40, the pattern formation start position is selected so that the tension A applied to the shadow mask 10 is uniform. A pattern forming apparatus is moved along a spiral path to form a desired structural pattern. At this time, the spiral path is directed outward from the center of the transmissive region 12 as shown in FIG. 11a or directed from one side corner of the transmissive region 12 to the center as shown in FIG. 11b.

  On the other hand, the material of the shadow mask 10 is made of a stainless steel material such as invar containing nickel element or elinvar containing nickel element and chromium element. A typical stainless steel material may be any one selected from the group consisting of SUS 304, SUS 430, and SUS 304 + SUS 430. Further, it is more preferable that the material of the shadow mask has a characteristic that it can be magnetized by a relatively small thermal expansion coefficient and magnetism.

  Further, the pattern formed in the transmission region of the shadow mask can be in the form of dots, stripes, or a mixture thereof.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the above descriptions are merely for the purpose of illustrating the present invention and are not limited to the meaning or the claims. It is not intended to limit the scope of the invention. Therefore, it goes without saying that various changes and modifications can be made by those skilled in the art based on the above description without departing from the technical idea of the present invention.

It is a figure which shows a general shadow mask. It is a diagram illustrating a process of depositing a deposition material on a display element substrate on which metal wiring is formed using a general shadow mask. It is a figure which shows the process in which a magnetic body is arrange | positioned above the board | substrate with which metal wiring was formed, and vapor deposition material is vapor-deposited on a board | substrate through a shadow mask. It is a disassembled perspective view which shows roughly the mounting state of the mask for manufacturing a general organic electroluminescent element. It is the schematic which shows the process in which a pattern is formed in a mask sheet according to the conventional embodiment. FIG. 6 is a diagram illustrating a stage where a shadow mask is adjacent to a mask frame in a method for forming a shadow mask pattern according to an embodiment of the present invention. It is a figure which shows the step which tensile force acts on a shadow mask in the formation method of the shadow mask pattern by embodiment of this invention. It is a figure which shows the step which welds a shadow mask on a mask frame in the formation method of the shadow mask pattern by embodiment of this invention. It is a figure which shows the step which forms a pattern by laser water jet processing on a shadow mask in the formation method of the shadow mask pattern by embodiment of this invention. It is a figure which shows that a pattern is formed on the mask frame arrange | positioned vertically in the formation method of the shadow mask pattern by other embodiment of this invention. FIG. 5 is a schematic diagram illustrating a process of forming a pattern along a spiral path on a mask sheet according to the present invention. FIG. 5 is a schematic diagram illustrating a process of forming a pattern along a spiral path on a mask sheet according to the present invention. It is a figure which shows the process in which a pattern is formed in a mask sheet according to one Embodiment of this invention. It is a figure which shows the process in which a pattern is formed in a mask sheet according to other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Shadow mask 11 Blocking area 12 Transmission area 15 Perforation hole 20 Mask frame 21 Support area 22 Processing area 30 Substrate 31 Data wiring 32 Gate wiring 33 Each pixel area 40 Auxiliary sheet 50 Magnet 70 Tensile system 72 Fixing member 90 Welding machine F Tensile force L / W Laser water jet W Spot welding A Tensile force application direction B Vapor deposition material supply direction C Pattern forming device movement direction d, e Pattern formation path

Claims (20)

Depositing a shadow mask on the mask frame;
Forming a pattern on the attached shadow mask, and forming a shadow mask pattern. Depositing the shadow mask on the mask frame comprises:
Adjoining the shadow mask on the mask frame;
Applying an external force to the shadow mask;
Bonding the shadow mask to which an external force is applied on the mask frame;
The method of forming a shadow mask pattern according to claim 1, comprising:   The method of forming a shadow mask pattern according to claim 2, wherein the external force applied to the shadow mask is performed by a front end tensile force.   The method for forming a shadow mask pattern according to claim 2, wherein joining for attaching the shadow mask onto the mask frame is performed by welding.   The method of forming a shadow mask pattern according to claim 4, wherein the welding is performed by a plurality of spot weldings.   The method of forming a shadow mask pattern according to claim 1, wherein the pattern formed on the shadow mask is performed by laser processing.   The method of forming a shadow mask pattern according to claim 6, wherein the laser processing for forming a pattern on the shadow mask is performed by laser water jet processing. In a method of forming a pattern on a shadow mask comprising a fixed portion fixed in a state where a tensile force is applied to a mask frame, and a transmission region where a pattern is formed,
Fixing the shadow mask while applying a tension corresponding to the tensile force to the shadow mask;
Selecting a pattern formation start position in the transmission region of the fixed shadow mask;
Forming the pattern along a spiral formation path from the pattern formation start position, and forming a shadow mask pattern.   9. The method of forming a shadow mask pattern according to claim 8, wherein the spiral direction is a direction from the center of the transmission region of the shadow mask toward the outside.   9. The method of forming a shadow mask pattern according to claim 8, wherein the spiral direction is a direction from the outside to the center of the transmission region of the shadow mask.   9. The method of forming a shadow mask pattern according to claim 8, wherein the shadow mask is made of a stainless steel material.   The method of forming a shadow mask pattern according to claim 11, wherein the stainless steel material is any one selected from the group consisting of SUS304, SUS430, and SUS304 + SUS430. In a method of forming a pattern on a shadow mask comprising a fixed portion fixed in a state in which a tensile force is applied to a mask frame, and a transmission region where a pattern is formed,
Positioning an auxiliary sheet having a relatively large thickness under the shadow mask;
Fixing the shadow mask and the auxiliary sheet together while applying a tension corresponding to the tensile force to the shadow mask and the auxiliary sheet;
Forming a pattern in a fixed transmission region of the shadow mask, and forming a shadow mask pattern. Forming the pattern comprises:
Selecting a pattern formation start position in the transmission region of the shadow mask;
Forming the pattern along a spiral formation path from the pattern formation start position;
The method of forming a shadow mask pattern according to claim 13, comprising:   15. The method of forming a shadow mask pattern according to claim 14, wherein the spiral direction is a direction from the center of the transmission region of the shadow mask toward the outside.   The method of forming a shadow mask pattern according to claim 14, wherein the spiral direction is a direction from the outside to the center of the transmission region of the shadow mask. In a method of forming a pattern on a shadow mask comprising a fixed portion fixed in a state where a tensile force is applied to a mask frame, and a transmission region where a pattern is formed,
Fixing the shadow mask while applying a tension corresponding to the tensile force to the shadow mask;
Forming a perforated hole in the fixed part of the shadow mask;
Forming a pattern in a transmission region of the shadow mask, and forming a shadow mask pattern. Forming the pattern comprises:
Selecting a pattern formation start position in the transmission region of the shadow mask;
Forming the pattern along a spiral formation path at the pattern formation start position;
The method for forming a shadow mask pattern according to claim 17, comprising:   19. The method of forming a shadow mask pattern according to claim 18, wherein the spiral direction is a direction from the center of the transmission region of the shadow mask toward the outside.   The method of forming a shadow mask pattern according to claim 18, wherein the spiral direction is a direction from the outside to the center of the transmission region of the shadow mask.

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