CN106350768A - Metal mask for vapor deposition, method for manufacturing metal mask for vapor deposition - Google Patents
Metal mask for vapor deposition, method for manufacturing metal mask for vapor deposition Download PDFInfo
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- CN106350768A CN106350768A CN201610561108.7A CN201610561108A CN106350768A CN 106350768 A CN106350768 A CN 106350768A CN 201610561108 A CN201610561108 A CN 201610561108A CN 106350768 A CN106350768 A CN 106350768A
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- Prior art keywords
- mask
- mentioned
- evaporation
- metal
- sheet metal
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The present invention provides a metal mask for vapor deposition, which can improve the accuracy of the structure of the pattern formed by vapor deposition and the improvement of the operability of the metal mask for vapor deposition and a method for manufacturing the metal mask for vapor deposition. The metal mask comprises a mask portion (32) which is provided with a contact surface for contacting with a vapor deposition target and a non-contact surface on the side opposite to the contact surface, forms into a sheet, and has a plurality of mask holes passing through from first openings in the contact surface to second openings in the non-contact surface, with the first openings being smaller than the second openings; and a mask frame (31) has a higher rigidity than the mask portion and forms into a frame shape enclosing the mask holes. The mask portion (32) has a portion in which the plurality of mask holes are surrounded in the non-contact surface, and the portion is joined to the mask frame through a joint portion.
Description
Technical field
The present invention relates to the manufacture method of evaporation metal mask and evaporation metal mask.
Background technology
When being deposited with to the evaporation object such as substrate by evaporation material, sometimes using metal mask.This evaporation gold
Belong to mask and possess contact surface and noncontact face.Contact surface is the face being contacted with evaporation object.Noncontact face is and contact surface
The face of opposition side.The mask hole penetrating into contact surface from noncontact face possesses noncontact side opening and contacts side opening.Noncontact
Side opening is in noncontact face and supplies the opening of evaporation material entrance.Contact side opening is positioned at contact surface and evaporation object pair
Put.The evaporation material entering into and through contact side opening from noncontact side opening is piled up to evaporation object.Thus, formed according to
According in the pattern (for example, referring to Japanese Unexamined Patent Publication 2015-055007 publication) of the contact position of side opening, shape.
In order to improve the precision of the position on pattern etc., the passage sections of the mask hole of evaporation metal mask are amassed, from non-
Contact side opening monotonously reduces towards contact side opening.In recent years, in order to improve the precision of the uniformity of the thickness of pattern etc., also
Wish to make noncontact side opening with contact the distance between side opening, i.e. the lower thickness of evaporation metal mask.
On the other hand, it is impossible to access enough evaporation metal masks in the evaporation metal mask of thinner thickness
Mechanical resistance, the operability of therefore evaporation metal mask is significantly low.
Content of the invention
It is an object of the invention to, providing can be by by being deposited with the essence on the construction such as position or thickness of the pattern being formed
The evaporation metal mask that both raisings of the operability of the raising of degree and evaporation metal mask take into account and evaporation are used
The manufacture method of metal mask.
For solving the evaporation metal mask of above-mentioned problem, possesses mask portion, this mask portion possesses for right with evaporation
As contact surface and the noncontact face with above-mentioned contact surface opposition side of contact, be formed as plate shape, and, this mask portion has
Penetrate into multiple mask hole of the second opening positioned at above-mentioned noncontact face respectively from the first opening positioned at above-mentioned contact surface, on
The size stating the first opening is less than the size of above-mentioned second opening.And, this evaporation metal mask is also equipped with mask frame, should
Mask frame has the rigidity higher than aforementioned mask portion, and is formed as the frame-shaped surrounding above-mentioned multiple mask hole.Above-mentioned cover
Mould portion has the part surrounding above-mentioned multiple mask hole in above-mentioned noncontact face, is covered with above-mentioned by junction surface in this part
Mold framework engages.
The manufacture method of the evaporation metal mask for solving above-mentioned problem is, comprising: form the operation in mask portion, should
Mask portion possess for the evaporation contact surface of the object contact and noncontact face with above-mentioned contact surface opposition side, be formed as piece
Shape, and, this mask portion has and penetrates into positioned at above-mentioned noncontact face from the first opening positioned at above-mentioned contact surface respectively
Multiple mask hole of the second opening, the size of above-mentioned first opening is less than the size of above-mentioned second opening；With
The operation that aforementioned mask portion is engaged with mask frame, this mask frame has the rigidity higher than aforementioned mask portion,
And be formed as the frame-shaped that above-mentioned multiple mask hole are surrounded, and, aforementioned mask portion has in above-mentioned noncontact face will be above-mentioned
The part that multiple mask hole are surrounded, in the operation that this mask portion is engaged with mask frame, aforementioned mask portion passes through to connect in this part
Conjunction portion is engaged with aforementioned mask framework.
According to above-mentioned each composition, the evaporation material entering to mask in the hole from the second opening, by having than the second opening
First opening of little size is piled up to evaporation object.Therefore, it is possible to improve the construction of the pattern being made up of evaporation material
On precision.And, the noncontact face that the second opening is located at is engaged with the mask frame with the rigidity higher than mask portion.Cause
This, easily make contact surface and evaporation object contact, and can improve the evaporation metal mask rigidity of itself, and then can carry
The operability of high evaporation metal mask.
In above-mentioned evaporation metal mask or, possess with share an aforementioned mask framework engage many
Individual aforementioned mask portion.
In the manufacture method of above-mentioned evaporation metal mask or, by aforementioned mask framework and above-mentioned noncontact
The operation that face engages is to engage multiple aforementioned mask portions with an aforementioned mask framework.
According to above-mentioned each composition, the quantity of the mask hole required for a mask frame can be split to multiple masks
Portion.And, compared with the composition of the whole mask hole required for possessing a mask frame with a mask portion, above-mentioned evaporation gold
Belong to mask more excellent in the following areas.That is, even if it is also possible to will be with the case that the part in a mask portion be deformed
The size in the new mask portion that the mask portion of deformation is changed is suppressed to one of multiple mask portions.And then additionally it is possible to suppression
The consumption repairing required various materials of evaporation metal mask.
In above-mentioned evaporation metal mask or, aforementioned mask portion is sheet metal, above-mentioned contact surface and above-mentioned
At least one party in noncontact face includes even surface, and above-mentioned even surface is set to the anti-of the direct reflection to the incident light of this even surface
Rate of penetrating is more than 45.2%, and the thickness of above-mentioned sheet metal is less than 50 μm.
In the manufacture method of above-mentioned evaporation metal mask or, aforementioned mask portion be sheet metal, above-mentioned contact
At least one party in face and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to the mirror to the incident light of this even surface
The reflectance of face reflection is more than 45.2%, and the thickness of above-mentioned sheet metal is less than 50 μm.
The thickness that mask portion has is thinner, and the effect engaging with aforementioned mask framework is more notable.According to above-mentioned each composition,
For the relatively thin mask portion of the thickness with less than 50 μm, the effect above can be obtained.
In above-mentioned evaporation metal mask or, aforementioned mask portion is sheet metal, above-mentioned contact surface and above-mentioned
At least one party in noncontact face includes even surface, and above-mentioned even surface is set to the anti-of the direct reflection to the incident light of this even surface
Rate of penetrating is more than 53.0%, and the thickness of above-mentioned sheet metal is less than 40 μm.
In the manufacture method of above-mentioned evaporation metal mask or, aforementioned mask portion be sheet metal, above-mentioned contact
At least one party in face and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to the mirror to the incident light of this even surface
The reflectance of face reflection is more than 53.0%, and the thickness of above-mentioned sheet metal is less than 40 μm.
According to above-mentioned each composition, for the relatively thin mask portion of the thickness with less than 40 μm, the effect above can be obtained.
In above-mentioned evaporation metal mask or, it is flat that aforementioned mask framework possesses that above-mentioned junction surface is located at
Face, above-mentioned plane has the size of the outside extension towards aforementioned mask portion.
According to above-mentioned evaporation metal mask, the plane being engaged with noncontact face is extended towards the outside in mask portion.That is, cover
Mold framework possesses the surface construction that the noncontact face in the mask portion with plate shape virtually extends.Therefore, flat in mask frame
In the scope of face extension, the space suitable with the thickness in mask portion is readily formed at around mask portion.As a result, can
The evaporation object contacting with contact surface is suppressed physically to interfere with mask frame.
Brief description
Fig. 1 is the plane graph of the planar configuration of the mask set representing an embodiment.
Fig. 2 is the sectional view of the example of cross-sectional configuration partly representing that mask portion has.
Fig. 3 is the sectional view of the other examples of cross-sectional configuration partly representing that mask portion has.
Fig. 4 is the section partly representing the example of joint construction between the edge in mask portion and mask frame
Figure.
Fig. 5 is the section partly representing the other examples of joint construction between the edge in mask portion and mask frame
Figure.
Fig. 6 is the mask hole that possesses of quantity and each mask portion of the mask hole representing that evaporation metal mask has
The figure of one example of the relation between quantity, (a) is the plane graph of the planar configuration representing evaporation metal mask, and (b) is
Represent the sectional view of the cross-sectional configuration of evaporation metal mask.
Fig. 7 is the number of mask hole that possesses of quantity and mask portion of the mask hole representing that evaporation metal mask has
The figure of the other examples of the relation between amount, (a) is the plane graph of the planar configuration representing evaporation metal mask, and (b) is table
Show the sectional view of the cross-sectional configuration of evaporation metal mask.
Fig. 8 is the sectional view that an example for evaporation metal mask base material represents cross-sectional configuration.
Fig. 9 is the sectional view that other examples for evaporation metal mask base material represent cross-sectional configuration.
Figure 10 is to represent each manufacture method, the surface roughness of piece object surface of evaporation metal mask base material, Yi Jizheng
The plating figure of the relation between the reflectance of piece object surface of metal mask base material.
Figure 11 is the chart of the reflectance of piece object surface representing each evaporation metal mask base material.
Figure 12 is the figure that illustrates of an example of the manufacture method of the evaporation metal mask to an embodiment,
A () to (h) is the process chart of the flow process representing operation respectively.
Figure 13 is the figure that illustrates of other examples of the manufacture method of the evaporation metal mask to an embodiment,
A () to (e) is the process chart of the flow process representing operation respectively.
Figure 14 is the figure that illustrates of other examples of the manufacture method of the evaporation metal mask to an embodiment,
A () to (f) is the process chart of the flow process representing operation respectively.
The explanation of symbol
F ... stress, s ... evaporation object, v ... space, eps ... electrode surface, h1 ... backside openings, h2 ... surface opening,
Pr ... resist layer, rm ... photoresistive mask, sh ... ladder height, t1, t32 ... thickness, tm ... intermediate transfer base material, 10 ... masks
Device, 20 ... main frames, 21 ... main frame hole, 30 ... evaporation metal masks, 31 ... mask frames, 31e ... framework inner side edge
Edge, 32,32a, 32b, 32c ... mask portion, 32bn ... junction surface, 32e ... peripheral edge portion, 32h ... mask hole, 32k ... base
Material, 32lh ... mask macropore, 32sh ... mask apertures, 33,33a, 33b, 33c ... mask frame hole, 311 ... the framework back sides,
312 ... framework surfaces, 321 ... mask backside, 322 ... mask surfaces, 323 ... mask sheet.
Specific embodiment
Referring to figs. 1 to Figure 14, an enforcement to evaporation metal mask and the manufacture method of evaporation metal mask
Mode illustrates.
[mask set]
As shown in Figure 1, mask set 10 possesses main frame 20 and multiple evaporation metal mask 30.Main frame 20 has
There is multiple evaporation metal masks 30 are supported rectangular box-like.Main frame 20 is installed on the evaporation dress for being deposited with
Put.Main frame 20 has multiple main frame hole 21.Each main frame hole 21 is several with scope residing for metal mask 30 throughout each evaporation
Overall, insertion main frame 20.
Evaporation metal mask 30 possesses mask frame 31 and multiple mask portion 32.Mask frame 31 has to mask portion 32
The billet tabular being supported.Mask frame 31 is installed on main frame 20.Mask frame 31 has multiple mask frame holes 33.Respectively
Mask frame hole 33 is almost overall throughout scope residing for corresponding mask portion 32, insertion mask frame 31.Mask frame 31 has
There is the rigidity higher than mask portion 32, and there is the frame-shaped surrounding each mask frame hole 33.Each mask portion 32 passes through deposition, glues
Close and be fixed in and mark off corresponding mask frame hole 33, mask frame 31 framework inner side edge edge.
Next, illustrating to an example of the cross-sectional configuration that mask portion 32 has with reference to Fig. 2, with reference to Fig. 3 pair
The other examples of the cross-sectional configuration that mask portion 32 has illustrate.
Like that, an example in mask portion 32 is to be made up of mask sheet 323 to example as shown in Figure 2.Mask sheet 323 is single
Any one of duplexer of one sheet metal, the sheet metal of multilamellar and sheet metal and resin sheet.Constitute mask sheet 323
The material of sheet metal is nickel or iron-nickel alloy.Constitute the material of the sheet metal of mask sheet 323, for example, contain more than 30 mass %
Nickel iron-nickel alloy, for the invar iron-nickel alloy with the alloy of 36 mass % nickel and 64 mass % ferrum as main constituent among these
(invar).By the alloy of 36 mass % nickel and 64 mass % ferrum be main constituent in the case of, residual components include chromium, manganese,
The additives such as carbon, cobalt.In the case that the sheet metal constituting mask sheet 323 is invar iron-nickel alloy piece, the thermal expansion of sheet metal
Coefficient for example, 1.2 × 10-6/ DEG C degree.If have the mask sheet 323 of such thermal coefficient of expansion, then mask portion 32
The degree of thermal expansion is matched with the degree of the thermal expansion of glass substrate.Therefore, glass substrate is used as being deposited with the one of object
Individual example is preferable.
The example that mask sheet 323 has contact surface is mask backside 321.Mask sheet 323 possesses the one of noncontact face
Individual example is mask surface 322, and this mask surface 322 is the face with mask backside 321 opposition side.Mask surface 322 is to steam
It is used for the face opposed with vapor deposition source in plating appts.Mask backside 321 is for right with evaporations such as glass substrates in evaporation coating device
Face as contact.
The distance between thickness that mask sheet 323 has, i.e. mask surface 322 and mask backside 321 are more than 1 μm
Less than 100 μm, preferably less than more than 1 μm 50 μm, more preferably less than more than 2 μm 40 μm.If mask sheet 323 has
Thickness is less than 40 μm, then the depth being formed at mask hole 32h of mask sheet 323 is less than 40 μm.This relatively thin mask sheet
323 is more excellent in the following areas.That is, observing steaming from the particle (evaporation particle) of the evaporation material flying towards mask sheet 323
During plating object, compared with thicker mask sheet 323, can make to be unable to the part of attachment due to evaporation metal mask 30
(becoming the part blocked) reduces.In other words, shadow effect can be suppressed.
Each mask portion 32 has multiple mask hole 32h of insertion mask sheet 323.Mark off the hole side of mask hole 32h,
With respect to the thickness direction of mask sheet 323, there is inclination in section view.Mark off the shape of the hole side of mask hole 32h,
Can be linear in section view, can be the semicircle arcuation stretched out of outside towards mask hole 32h or have many
The curve-like of the complexity of individual inflection point.
The second opening that mask surface 322 includes each mask hole 32h is surface opening h2.Mask backside 321 includes respectively covering
First opening of nib 32h is backside openings h1.When overlooking, the size of surface opening h2 is more than the size of backside openings h1.
Each mask hole 32h is the path for passing through from the evaporation particle of vapor deposition source distillation.From vapor deposition source distillation evaporation particle from surface
Opening h2 enters towards backside openings h1.As long as surface opening h2 is more than mask hole 32h of backside openings h1, then can be for
The evaporation particle suppression shadow effect entering from surface opening h2.Additionally, the mask hole in the section parallel with mask backside 321
The area of 32h can also be to move towards surface opening h2 from backside openings h1 with this section, from backside openings h1 to surface
Opening h2, this area monotonously increases.In other words, the sectional area of mask hole 32h can also be, from surface opening h2 towards the back side
Opening h1, sectional area monotonously reduces.If such mask hole 32h, then can suppress above-mentioned shadow effect further.
In other examples shown in Fig. 3, each mask portion 32 has multiple mask hole 32h of insertion mask sheet 323 respectively.
In example shown in Fig. 3, when overlooking, the size of surface opening h2 is more than the size of backside openings h1.Each mask hole 32h by
The mask macropore 32lh with the surface opening h2 and mask apertures 32sh with backside openings h1 is constituted.Mask macropore 32lh is
From the surface opening h2 hole that its sectional area monotonously reduces towards mask backside 321.Mask apertures 32sh is from backside openings
The h1 hole that its sectional area monotonously reduces towards mask surface 322.Mark off the hole side of each mask hole 32h, regard in section
In figure, has the part that mask macropore 32lh is connected with mask apertures 32sh.Mask macropore 32lh is connected with mask apertures 32sh
Part, positioned at the centre of the thickness direction of mask sheet 323.Mask macropore 32lh and the part tool being connected with mask apertures 32sh
There is the shape that the inner side towards mask hole 32h projects.In the hole side of mask hole 32h towards inner side position the most prominent and mask
The distance between back side 321 is ladder height sh.The cross-sectional configuration being before illustrated in Figure 2, is so that ladder height sh is become
Zero example.From the viewpoint suppressing above-mentioned shadow effect, preferably ladder height sh is zero.Additionally, in order to obtain ladder height sh
It is zero mask portion 32, for example, preferably make the thickness of mask sheet 323 be less than 40 μm, will pass through from mask surface 322 to covering
The Wet-type etching at the mould back side 321, to form mask hole 32h, carries out Wet-type etching without from mask backside 321.
[joint in mask portion]
Next, with reference to Fig. 4 to the cross-sectional configuration that the joint construction between mask portion 32 and mask frame 31 has
One example illustrates.Cross-sectional configuration joint construction between mask portion 32 and mask frame 31 being had with reference to Fig. 5
Other examples illustrate.
Example as shown in Figure 4 like that, continuously has in the peripheral edge portion 32e of mask sheet 323 and does not form mask hole 32h
Region.On the mask surface 322 that mask sheet 323 has, part that the peripheral edge portion 32e of mask sheet 323 is comprised with
Mask frame 31 engages.Mask frame 31 possesses the framework inner side edge edge 31e marking off each mask frame hole 33.Inside framework
Edge part 31e possesses the framework back side 311 opposed with mask sheet 323.Framework inner side edge edge 31e has and the framework back side 311
The face of opposition side is framework surface 312.The thickness t31 of framework inner side edge edge 31e, i.e. the framework back side 311 and framework surface 312
The distance between, thicker than the thickness t32 that mask sheet 323 has, thus, mask frame 31 has higher than mask sheet 323 firm
Property.Particularly, situation about being hung down due to deadweight for framework inner side edge edge 31e, framework inner side edge edge 31e are towards mask
The situation of the central displacement in portion 32, mask frame 31 has the rigidity higher than mask sheet 323.With connecing that mask surface 322 engages
Conjunction portion 32bn is located at the framework back side 311 of framework inner side edge edge 31e.
Junction surface 32bn, throughout the almost complete cycle of framework inner side edge edge 31e, continuously or intermittently arranges.Engage
Portion 32bn is the deposition trace being formed by the deposition of the framework back side 311 and mask surface 322.Deposition trace is to constitute mask frame
The mixture of the material in 31 material and composition mask portion 32.Or, junction surface 32bn is by the framework back side 311 and mask surface
322 bonding layers being engaged.Bonding layer comprises different from the material of the material constituting mask frame 31, composition mask portion 32
Material.In mask frame 31, the framework back side 311 of framework inner side edge edge 31e is connect with the mask surface 322 of mask sheet 323
Close.Mask surface 322 is engaged with mask frame 31, therefore compared with the evaporation metal mask not possessing mask frame 31,
Evaporation metal mask 30 rigidity of itself can be improved.
Mask frame 31 applies each mask sheet 323 as the outside pulling towards this mask sheet 323 to mask sheet 323
Stress f.Additionally, for mask frame 31, applying mask frame 31 also by main frame 20 by outer towards mask frame 31
Layback moves such stress.The size of this stress is same degree with the stress f of mask sheet 323.Therefore, tearing open from main frame 20
The evaporation unloading with, in metal mask 30, being released from based on the stress of main frame 20 and the joint of mask frame 31, to mask sheet 323
The stress f applying also is relaxed.The position of the junction surface 32bn on the framework back side 311, preferably makes stress f in mask sheet
The position isotropically acting in 323.The position of the junction surface 32bn on the framework back side 311, is had based on mask sheet 323
Shape and the shape that has of mask frame hole 33 properly selecting.
Constitute for example, less than more than 1 μm 50 μm of the thickness of the mask sheet 323 in mask portion 32.Mask surface 322 and covering
At least one party at the mould back side 321, includes even surface in the region surrounding mask hole 32h.Even surface is for example set to, to even surface
The reflectance of the incident direct reflection of light is more than 45.2%.Or, even surface is for example set to, and three-dimensional surface roughness sa is
Less than 0.11 μm, and three-dimensional surface roughness sz is less than 3.17 μm.
The sheet metal constituting mask sheet 323 is manufactured by any one method following: (a) metal material based on electrolysis
Separate out；The rolling of (b) metal material and grinding；The precipitation of (c) metal material based on electrolysis and grinding；(d) only metal
The rolling of material.The thickness that mask portion 32 has is thinner, then the effect that the joint in mask frame 31 and mask portion 32 is brought
More notable.According to foregoing illustrative mask portion 32, for the relatively thin mask portion 32 with less than 50 μm thickness, can obtain
State effect.
Additionally, in sheet metal, there is the higher trend of the reflectance on the surface of the more thin then sheet metal of thickness of sheet metal.
Additionally, in sheet metal, having the three-dimensional surface roughness sa on surface of the more thin then sheet metal of thickness, the three-dimensional surface of sheet metal
The less trend of roughness sz.Additionally, proceed by the surface from mask sheet 323 losing for the wet type forming mask hole 32h
In the case of quarter, above-mentioned even surface is comprised by the surface of mask sheet 323 additionally it is possible to improve and the photoresistive mask being formed at surface
Close property.
Constitute for example, less than more than 2 μm 40 μm of the thickness of the mask sheet 323 in mask portion 32.This composition is also cover
Mould surface 322 and at least one party of mask backside 321, comprise even surface in the region surrounding mask hole 32h.Even surface example
As being set to, it is more than 53.0% to the reflectance of the direct reflection of the incident light of even surface.Or, even surface is for example set to, and three
Dimension table surface roughness sa is less than 0.019 μm, and three-dimensional surface roughness sz is less than 0.308 μm.According to covering of illustrating herein
Mould portion 32, for the very thin mask portion 32 with less than 40 μm thickness, can obtain particularly excellent effect.Additionally, from
In the case that the surface of mask sheet 323 proceeds by the Wet-type etching for forming mask hole 32h, by the table of mask sheet 323
Bread contains above-mentioned even surface additionally it is possible to reduce the size of the minimum resolution of photoresistive mask being formed at surface.
Additionally, by measure from Halogen light project light incide object surface when direct reflection reflected light, according under
State formula (1) to calculate reflectance r.From Halogen light project light with respect to object surface normal direction with 45 ° ± 0.2 ° of incidence
Angle is to the 14mm of object surface2Region incident.The area that reflected light is carried out with the element of light is 11.4mm2.
Reflectance r=[light quantity of the light quantity/incident illumination of the reflected light of direct reflection] × 100 ... (1)
Additionally, three-dimensional surface roughness sa and sz is the value by measuring according to the method for iso 25178.Three-dimensional table
Surface roughness sa is the arithmetic average height in the definition region have required area.Three-dimensional surface roughness sz is with regulation
Maximum height in the definition region of area.
The framework back side 311 is the plane residing for the 32bn of junction surface.The framework back side 311 is from the neighboring of mask surface 322
Portion 32e extends towards the outside of mask sheet 323.In other words, framework inner side edge edge 31e has mask surface 322 to mask table
The surface construction that the outside in face 322 virtually extends.Framework inner side edge edge 31e is from the peripheral edge portion 32e court of mask surface 322
Extend to the outside of mask sheet 323.In the scope extending in the framework back side 311, the space v suitable with the thickness of mask sheet 323
It is readily formed at mask sheet 323 around.As a result, around mask sheet 323, can suppress to be deposited with object s and cover
Mold framework 31 is physically interfered.
In the example as shown in fig. 5, the peripheral edge portion 32e in mask sheet 323 also continuously has and does not form mask hole 32h
Region.The peripheral edge portion 32e of mask surface 322 is by the joint based on junction surface 32bn, and is possessed with mask frame 31
The framework back side 311 engage.Mask frame 31 applies each mask sheet 323 by the outside towards this mask sheet 323 to mask sheet 323
Stress f as pulling.Mask frame 31, in the scope extending in the framework back side 311, forms suitable with the thickness of mask sheet 323
Space v.
[quantity in mask portion]
Next, with reference to Fig. 6 to the quantity of mask hole 32h that evaporation metal mask 30 possesses and each mask portion 32
One example of the relation between the quantity of mask hole 32h being possessed illustrates.Additionally, with reference to Fig. 7 to evaporation metal
Relation between the quantity of mask hole 32h that the quantity of mask hole 32h that mask 30 possesses and mask portion 32 possess its
He illustrates example.
As shown in the example of Fig. 6 (a), mask frame 31 for example has 3 mask frame holes 33, as multiple masks
Frame aperture 33.As shown in the example of Fig. 6 (b), evaporation metal mask 30 respectively possesses one in each mask frame hole 33
Mask portion 32.That is, the framework inner side edge edge 31e marking off mask frame hole 33a is engaged with a mask portion 32a.Mark off
Another framework inner side edge edge 31e of mask frame hole 33b is engaged with another mask portion 32b.Mark off mask frame hole
A remaining framework inner side edge edge 31e of 33c is engaged with a remaining mask portion 32c.
Evaporation metal mask 30 can be to multiple evaporation object Reusabilities.Therefore, evaporation metal mask 30 is had
Standby multiple mask hole 32h are required the degree of precision of the construction of the position of mask hole 32h, mask hole 32h etc. respectively.As Fig. 6
Shown composition like that, is held by a mask portion 32 with by the quantity of mask hole 32h required for a mask frame 31
The composition of load is compared, the structure that the quantity of mask hole 32h required for a mask frame 31 is undertaken by 3 mask portions 32
Become more excellent in the following areas.For example, in the case that the part in a mask portion 32 creates deformation, can reduce and institute
The size in the new mask portion 32 that the mask portion 32 of deformation changes.And, can also suppress evaporation metal mask 30 manufacture,
The consumption of the various materials required for repairing.Additionally, the inspection related to the construction of mask hole 32h, preferably in mask frame
31 engage with mask portion 32 in the state of carry out.From this viewpoint, above-mentioned junction surface 32bn is preferably capable deformation
Mask portion 32 is replaced by the composition in new mask portion 32.And, it is thinner to constitute the thickness of the mask sheet 323 in mask portion 32, mask
The size of hole 32h is less, then the yield rate in mask portion 32 is more easily reduced.Therefore, each mask frame hole 33 respectively possesses one and covers
The composition in mould portion 32, also more suitable with metal mask 30 for the evaporation requiring fine.
As shown in the example of Fig. 7 (a), mask frame 31 for example has 3 mask frame holes 33, as multiple masks
Frame aperture 33.As shown in the example of Fig. 7 (b), evaporation metal mask 30 possesses what multiple mask frame holes 33 were shared
One mask portion 32.That is, mark off the framework inner side edge edge 31e of mask frame hole 33a, mark off mask frame hole 33b's
The framework inner side edge edge 31e and framework inner side edge edge 31e marking off mask frame hole 33c, being shared with them
Individual mask portion 32 engages.
Additionally, if the quantity of mask hole 32h required for a mask frame 31 is held by a mask portion 32
The composition of load, then can make the quantity in the mask portion 32 engaging with mask frame 31 become one.Therefore, it is possible to mitigate mask frame
Frame 31 engages required load with mask portion 32.And, it is thicker to constitute the thickness of the mask sheet 323 in mask portion 32, mask hole
The size of 32h is bigger, then the yield rate in mask portion 32 more easily improves.Therefore, possess that each mask frame hole 33 shared covers
The composition in mould portion 32, more suitable with metal mask 30 for the evaporation requiring low resolution.
[manufacture method of evaporation metal mask]
Next, illustrating to each example of the manufacture method of evaporation metal mask.Additionally, Fig. 8 and Fig. 9 table respectively
Show an example of the evaporation that utilized in the manufacture method employ Wet-type etching metal mask base material.Figure 10 represents evaporation
The characteristic of the piece object surface of the sheet metal 32s being possessed with metal mask base material.Figure 11 represents the piece pair that sheet metal 32s possesses
Reflectance as face.A part for piece object surface comprises the even surface of mask sheet 323.Piece object surface is throughout the entirety of piece object surface
Have and even surface identical surface characteristic.
Additionally, illustrating to an example of the method forming mask hole by Wet-type etching with reference to Figure 12.Additionally, ginseng
According to Figure 13, one example of the method being formed mask hole by electrolysis is illustrated.Form mask with reference to Figure 14 to by electrolysis
The other examples of the method in hole illustrate.
Additionally, manufacturing method and the manufacture evaporation metal illustrated in fig. 3 of evaporation metal mask 30 illustrated in fig. 2
The method of mask 30 is compared, and the mode being the etching that evaporation metal mask base material 32k is carried out to the base material of mask sheet 323 is not
With, but the operation beyond it is almost same.Hereinafter, main to the evaporation illustrated in fig. 2 manufacture method of metal mask 30
Illustrate, with regard to the evaporation illustrated in fig. 3 manufacture method of metal mask 30, omit the explanation of its repetition.
Sheet metal 32s possesses mask surface 322 and mask backside 321.
Photoresistive mask is formed on mask surface 322, mask is formed by the etching proceeding by from mask surface 322
In the method for piece 323, mask surface 322 is piece object surface.Mask surface 322 and mask backside 321 are formed respective anti-
Erosion mask, mask is formed by the etching that proceeds by from mask surface 322 and the etching proceeding by from mask backside 321
In the method for piece 323, mask surface 322 and mask backside 321 are piece object surface.Piece object surface is in evaporation metal mask shape
It is formed the face of photoresistive mask during one-tenth.
The material of composition metal piece 32s is nickel or iron-nickel alloy, and the ferrum nickel for example, containing nickel more than 30 mass % closes
Gold, for the invar iron-nickel alloy with the alloy of the nickel of 36 mass % and the ferrum of 64 mass % as main constituent among these.In metal
In the case that piece 32s is invar iron-nickel alloy piece, the thermal coefficient of expansion for example, 1.2 × 10 of sheet metal 32s-6/ DEG C degree.If
The sheet metal 32s with such thermal coefficient of expansion, then the journey of the thermal expansion in the mask portion 32 being manufactured using sheet metal 32s
Degree is matched with the degree of the thermal expansion of glass substrate, and therefore an example as evaporation object is suitable for using glass substrate.
For example, less than more than 1 μm 100 μm of the thickness t1 that sheet metal 32s has, preferably less than more than 1 μm 50 μm, more
It is preferably less than more than 2 μm 40 μm.If the thickness t1 that sheet metal 32s has is less than 40 μm, can make to be formed at gold
The depth belonging to the hole of piece 32s is less than 40 μm.Have a thickness that the sheet metal 32s of t1, manufactured using sheet metal 32s
Evaporation metal mask in more excellent in the following areas.That is, seeing from the evaporation particle being flown with metal mask towards evaporation
When examining film forming object, can reduce due to evaporation metal mask becomes undesirable part blocked.In other words, can press down
Shadow effect processed.
The surface characteristic of the piece object surface that sheet metal 32s has preferably meets following [conditions 1] and [condition 2] extremely
A few side.
Below 0.019 μm of [condition 1] three-dimensional surface roughness sa and below 0.308 μm of three-dimensional surface roughness sz.
The reflectance r 97.0% of [condition 2] 53.0% object surface.
Three-dimensional surface roughness sa and sz is the value by measuring according to the method for iso 25178.By measure from
The light that Halogen light projects incides the reflected light of direct reflection during object surface, calculates reflectance r according to following formula (2).From
Halogen light project light with respect to object surface normal direction with 14mm from 45 ° ± 0.2 ° of incident angle to object surface2Area
Domain is incident.The area that reflected light is carried out with the element of light is 11.4mm2.
Reflectance r=[light quantity of the light quantity/incident illumination of the reflected light of direct reflection] × 100 ... (2)
If meeting the surface characteristic of at least one party of [condition 1] and [condition 2], then can suppress to shine to object surface
The light penetrated is scattered due to object surface.And, to during positioned at the resist layer irradiation light of resist object surface, light can be suppressed
A part scattered due to object surface, and the optical countermeasures that scattered lose the exposure object region in oxidant layer beyond region carry out
Irradiate.As a result, it is possible to suppression is by exposing and developing and the construction of the photoresistive mask of formation and designed photoresistive mask
Produce difference between construction, and the construction of mask hole 32h being formed by wet etching can be suppressed to cover with designed
Difference is produced between the construction of nib 32h.
Additionally, as shown in figure 9, evaporation metal mask base material in addition to sheet metal 32s additionally it is possible in mask backside
321 and at least one party of mask surface 322 be also equipped with resinite pb.That is, evaporation metal mask base material can be used as sheet metal
32s is embodied with the duplexer of resinite pb.The material constituting the resinite pb being located at mask surface 322 is resist.Structure
The material becoming to be located at the resinite pb of mask backside 321 is, for example, resist, polyimides.
In the case that the material constituting resinite pb is resist, resinite pb is resist layer.As resinite pb
Resist layer after being formed plate shape, be adhered to mask surface 322.Or, as the resist of resinite pb
Layer is formed by the masking liquid being used for being formed resist layer is coated to mask surface 322.
In the case that the material constituting resinite pb is polyimides, resinite pb is close to mask backside 321.Polyamides
Thermal coefficient of expansion and the interdependence of its temperature that imines has, with the thermal coefficient of expansion of invar iron-nickel alloy and its temperature
Interdependence is same degree, the expansion of the resinite pb therefore being produced by the temperature change by resinite pb, contraction, suppression
Sheet metal 32s produces warpage.
For example, less than more than 5 μm 50 μm of the thickness t2 of resinite pb.From the stacking improving resinite pb and sheet metal 32s
From the viewpoint of the mechanical strength of body, the thickness t2 of resinite pb is preferably more than 5 μm.Additionally, in the mistake forming mask portion 32
Cheng Zhong, to remove resinite pb from sheet metal 32s sometimes through to dippings such as alkaline solutions.Required for from this removing of suppression
From the viewpoint of time becomes long, the thickness of resinite pb is preferably less than 50 μm.
The manufacture method of sheet metal make with the following method in any one: (a) electrolysis；(b) rolling and grinding；(c) electricity
Solution and grinding；D () only rolls.
Additionally, when forming the mother metal of rolling for manufacturing sheet metal 32s, generally, will use being used for being formed rolling
The material of mother metal in the oxygen that is mixed into remove.When the oxygen that will be mixed in material removes, for example, by deoxidations such as granular aluminum, magnesium
Agent is mixed in the material for forming mother metal.As a result, aluminum, magnesium wrap as metal-oxides such as aluminium oxide, magnesium oxide
It is contained in mother metal.Before mother metal is rolled, the major part of metal-oxide is removed from mother metal.On the other hand, metal-oxide
A part residue in the mother metal of the object becoming rolling.In this point, according to the manufacture method using electrolysis, gold can be suppressed
Belong to oxide and be mixed into sheet metal 32s.
A () is electrolysed
In the case that the manufacture method as sheet metal 32s uses electrolysis, on the surface being electrolysed used electrode
Form sheet metal 32s.Then, from the surface separation sheet metal 32s of electrode.Thus, produce to have and become covering of piece object surface
Mould surface 322 and the face contacting with the surface of electrode before are the sheet metal 32s of mask backside 321.In the surface of electrode tool
In the case of having the surface characteristic being same degree with piece object surface, the mask surface 322 of sheet metal 32s and mask backside 321
Both sides there is the surface characteristic suitable with piece object surface.The surface of electrode have the surface roughness bigger than piece object surface,
In the case of the reflectance lower than piece object surface, the mask surface 322 of sheet metal 32s has the surface spy suitable with piece object surface
Property.Additionally, the both sides in mask surface 322 and mask backside 321 have in the composition of the surface characteristic suitable with piece object surface,
When piece object surface forms resist layer, mask surface 322 and bearing required for the difference of mask backside 321 can be mitigated
Lotus.Additionally, separated sheet metal 32s can also be carried out annealing after by separation.
It is electrolysed used electrobath and for example comprise iron ion supplying agent, nickel ion supplying agent and ph buffer agent.Additionally,
Being electrolysed used electrobath can also be containing stress demulcent, fe3+The chelating agent such as ion mill agent, malic acid, citric acid
Deng, and it is adjusted to be suitable for the weakly acidic solution of the ph of electrolysis.Iron ion supplying agent be, for example, FeSO47H2O,
Ferrous chloride, sulfamic acid ferrum etc..Nickel ion supplying agent is, for example, nickel sulfate (ii), Nickel dichloride. (ii), sulfamic acid acid nickel, bromine
Change nickel.Ph buffer agent is, for example, boric acid, malonic acid.Malonic acid is also as fe3+Ion mill agent is worked.Stress demulcent is for example
For saccharin sodium.It is electrolysed the aqueous solution that used electrobath e.g. contains above-mentioned additive, and pass through 5% sulphuric acid or carbonic acid
Ph is adjusted to such as less than more than 23 by the ph regulator such as nickel.
It is electrolysed the group that used electrolytic condition is the nickel in the surface characteristic and sheet metal 32s that piece object surface has
Become than etc. according to the temperature of electrobath, electric current density and electrolysis time controlled condition.Employ above-mentioned electrobath
Anode under electrolytic condition is, for example, pure iron and nickel.Negative electrode under electrolytic condition is, for example, the corrosion resistant plates such as sus304.Electrobath
For example, less than more than 40 DEG C 60 DEG C of temperature.Electric current density is, for example, 1a/dm2Above 4a/dm2Below.
B () grinds
Sheet metal 32s before grinding can be manufactured by electrolysis it is also possible to be manufactured by rolling.To be made by rolling
Make in the method for the sheet metal 32s before grinding, first metal mother metal is rolled, then the mother metal after rolling is carried out
Annealing.Now, the step difference on the surface than mother metal for the step difference on the surface of sheet metal 32s before grinding is little.Additionally, before grinding
The step difference at the back side than mother metal for the step difference at the back side of sheet metal 32s is little.Then, the surface to the sheet metal 32s before grinding,
Implement chemical or electric attrition process.Thus, produce and there is the sheet metal 32s that abradant surface is piece object surface.
The lapping liquid that chemical grinding is used is, for example, the chemical grinding of the iron-based alloy with hydrogen peroxide as main constituent
Liquid.Electricity grinds the electrolytic polishing liquid that used electrolyte is the electrolytic polishing liquid of perchloric acid system, sulphuric acid system.Additionally, before grinding
Sheet metal 32s for example can be embodied as, the metal film-making after rolling is added by the Wet-type etching based on acidic etching liquid
Work obtains relatively thin piece.
With reference to Figure 10 and Figure 11, to the three-dimensional surface roughness sa of sheet metal 32s, three-dimensional surface roughness sz, reflection
One example of the machining accuracy of rate r and photoresistive mask illustrates.Figure 10 represents each water from test example 1 to test example 9
Accurate three-dimensional surface roughness sa, three-dimensional surface roughness sz and reflectance r.Figure 11 represent from test example 1 to test example 9
Each level in, the test example 1 that becomes representational example, test example 2, test example 3, the respective reflectance of test example 9.
As shown in Figure 10, test example 1, test example 2, test example 3, test example 6, test example 7 are using above-mentioned respectively
A sheet metal 32s that () electrolysis is 20 μm come the thickness to manufacture.Test example 4, test example 5 are by coming to using (b) rolling respectively
The sheet metal 32s manufacturing be ground and manufacture, thickness is 20 μm of sheet metal 32s.Additionally, being manufactured by (a) electrolysis
Sheet metal 32s there is the face with electrode contact.Now, the three-dimensional surface roughness sa of the electrode of sus is 0.018 μm, three
Dimension table surface roughness sz is 0.170 μm.Test example 8, test example 9 are the sheet metal 32s being manufactured by rolling respectively, and are not
Apply the sheet metal 32s grinding.Test example 8, the respective thickness of the test example 9 respective thickness than test example 4, test example 5 is thick
The amount of grinding of test example 4 and test example 5 is 10 μm.
Test example 1, test example 2, test example 3, test example 6, test example 7 are respectively by using with the addition of following additives
Aqueous solution and be adjusted to the electrobath of ph2.3, and by electric current density in 1 (a/dm2) more than 4 (a/dm2) in following scope
Changed and obtained.The ratio of components phase of test example 1, test example 2, test example 3, test example 6, the respective ferrum of test example 7 and nickel
Mutually different.
(test example electrolyte)
Ferrous sulfate hydrate: 83.4g
Nickel sulfate (ii) six water and thing: 250.0g
Nickel dichloride. (ii) six water and thing: 40.0g
Boric acid: 30.0g
Saccharin sodium water two and thing: 2.0g
Malonic acid: 5.2g
Temperature: 50 DEG C
Test example 4, test example 5 are implemented to employ peroxidating to by the sheet metal 32s before rolling grinding respectively
The chemical grinding of chemical grinding liquid of hydrogen system and obtain.
Test example 8, test example 9 are to pass through rolling sheet metal 32s in test example 4,5 respectively, and are to be not carried out
The level of chemical grinding.
In the three-dimensional surface roughness sa in each level of test example 7, being able to confirm that piece object surface from test example 1 it is
Less than 0.019 μm, and the three-dimensional surface roughness sz of piece object surface is less than 0.308 μm.On the other hand, in test example 8, test
Each level of example 9, substantially 0.04 μm of the three-dimensional surface roughness sa of piece object surface.Thereby, it is possible to confirm: by above-mentioned
In (a) electrolysis, (b) rolling and the sheet metal 32s grinding and manufacturing, with the sheet metal 32s obtaining thinner thickness, three-dimensional table
Surface roughness sa is greatly reduced.Additionally, in test example 8, each level of test example 9, the three-dimensional surface of piece object surface is thick
Rugosity sz is more than 0.35 μm.Thereby, it is possible to confirm: manufactured by above-mentioned (a) electrolysis, (b) rolling and grinding
In sheet metal 32s, with the sheet metal 32s obtaining thinner thickness, three-dimensional surface roughness sz is lowered.
As shown in figs.10 and 11, it is able to confirm that: above-mentioned in each level of test example 3 from test example 1
Reflectance r is less than more than 53.0% 97.0%.On the other hand, in test example 8, each level of test example 9, it is able to confirm that
Arrive: reflectance r is less than 53.0%, and there is the half breadth bigger than other test examples.Thereby, it is possible to confirm: if
By above-mentioned (a) be electrolysed, (b) rolling and grind and manufacture sheet metal 32s, then can obtain more than 53.0% larger
Reflectance r.
It is able to confirm that: divide in the minimum of the photoresistive mask being formed in test example 1 to 7 respective object surface of test example
The size of resolution is to be dispersed in less than more than 4 μm 5 μm by ultraviolet light when being exposed on resist layer formation circular port
In the range of.On the other hand, the photoresistive mask being formed by same preparation method in test example 8,9 respective object surface of test example
Minimum resolution a size of, the exposure by ultraviolet light resist layer formed circular port when, be more than 7 μm.
Example as shown in Figure 12 (a)～(h), in an example of the manufacture method of evaporation metal mask,
First, the base material preparing mask sheet 323 is deposited with metal mask base material 32k (with reference to Figure 12 (a)).Additionally, evaporation metal
Mask substrate 32k, in addition to the sheet metal 32s being processed into mask sheet 323, is preferably also equipped with for carrying out to sheet metal 32s
The supporter sp supporting.Then, resist layer is formed on the mask surface 322 that evaporation metal mask base material 32k has
Pr (with reference to Figure 12 (b)), carries out the exposure for resist layer pr and development.Thus, mask surface 322 is formed against corrosion
Mask rm (with reference to Figure 12 (c)).Next, the Wet-type etching starting from mask surface 322 by using photoresistive mask rm,
Form mask hole 32h (with reference to Figure 12 (d)) in evaporation with metal mask base material 32k.Now, starting from mask surface 322
Towards the mask surface 322 of the Wet-type etching of mask backside 321, form surface opening h2, be more lingeringly etched than it
Mask backside 321, form little backside openings h1 of specific surface opening h2.Then, remove photoresistive mask from mask surface 322
Rm, thus produces aforementioned mask portion 32 (with reference to Figure 12 (e)).Finally, by the peripheral edge portion 32e of mask surface 322 with cover
The framework inner side edge edge 31e of mold framework 31 engages, and by supporter sp from mask portion 32 demoulding, thus produces evaporation gold
Belong to mask 30 (with reference to Figure 12 (f) to (h)).
Additionally, in the manufacture method with metal mask 30 for the evaporation being illustrated in Figure 3, to the evaporation without supporter sp
With metal mask base material 32k, to evaporation corresponding with mask backside 321 face of metal mask base material 32k, implement above-mentioned work
Sequence.Thus, form mask apertures 32sh.Then, will be used for protecting resist of mask apertures 32sh etc. to be filled in mask apertures
32sh.Then, to evaporation corresponding with mask surface 322 face of metal mask base material 32k, implement above-mentioned operation, thus make
Produce mask portion 32.
For example, in the case that mask sheet 323 is made up of the sheet metal of iron-nickel alloy, preparing evaporation metal mask
In the operation of base material 32k, using electrolysis, rolling.As the evaporation post processing of metal mask base material 32k, it is suitably used and grinds
Mill, annealing etc..
In the case of using supporter sp, for example, supporter sp is engaged with the sheet metal 32s being formed at electrode surface.
Then, as the duplexer of sheet metal 32s and supporter sp, evaporation is separated from electrode surface with metal mask base material 32k.
In the case of using rolling, the mother metal for manufacturing sheet metal 32s is rolled, then, to by rolling
And the sheet metal 32s annealing manufacturing, thus obtain evaporation metal mask base material 32k.Now, in the situation using supporter sp
Under, supporter sp is engaged with the sheet metal 32s being manufactured by rolling.
Additionally, passing through sheet metal 32s obtained from electrolysis, passing through sheet metal 32s obtained from rolling, can be by being based on
The Wet-type etching of acidic etching liquid and process thinner it is also possible to be processed thinner by cmp.
In example shown in Figure 12 (f), as by the peripheral edge portion 32e of mask surface 322 and mask frame 31
The method that framework inner side edge edge 31e engages, using resistance welding.Now, formed in the supporter sp with insulating properties multiple
Through hole sph.Each through hole sph is formed at the position opposed with the position becoming junction surface 32bn in supporter sp.So
Afterwards, in the state of mask portion 32 is applied with towards the stress in the outside in mask portion 32, using logical via through hole sph
Electricity, forms the junction surface 32bn of interval.Thus, deposition is carried out to peripheral edge portion 32e and framework inner side edge edge 31e.
In example shown in Figure 12 (g), as by the peripheral edge portion 32e of mask surface 322 and mask frame 31
The method that framework inner side edge edge 31e engages, using laser welding.Now, using the supporter sp with light transmission, via
Support body sp is to the position irradiating laser l becoming junction surface 32bn.Then, by irradiating laser l off and on, it is consequently formed interval
Junction surface 32bn, or by continuously prolonged exposure laser l, it is consequently formed continuous junction surface 32bn.Thus, by neighboring
Edge 32e and framework inner side edge edge 31e carries out deposition.Additionally, mask portion 32 is being applied with the outside towards mask portion 32
Stress in the state of in the case that supporter sp is supported to mask portion 32, also can omit to mask portion in this welding
32 stress applies.
In example shown in Figure 12 (h), as by the peripheral edge portion 32e of mask surface 322 and mask frame 31
The method that framework inner side edge edge 31e engages, using ultrasonic bonding.Now, peripheral edge portion 32e and framework inner side edge edge
31e is clamped by fixture cp etc., applies ultrasound wave to the position becoming junction surface 32bn.The part being applied directly ultrasound wave is permissible
It is mask frame 31 or mask portion 32.Additionally, in the case of using ultrasonic bonding, in mask frame 31, supporting
Body sp is formed with based on fixture cp by impression.
Example as shown in Figure 13 (a)～(e), in the other examples of the manufacture method of evaporation metal mask,
First, the surface in the used electrode ep of electrolysis is to form resist layer pr (with reference to Figure 13 (a)) on electrode surface eps.Connect
, by being exposed to resist layer pr and developing, an example thus forming pattern on electrode surface eps resists
Erosion mask rm (with reference to Figure 13 (b)).Photoresistive mask rm is, in the section orthogonal with electrode surface eps, has top and is located at electricity
The back taper mesa-shaped of pole surface eps, and there is more big then parallel with the electrode surface eps section of the distance of ionization electrode surface eps
The bigger shape of area.Next, carrying out employing the electrolysis of the electrode surface eps with photoresistive mask rm.Thus, with to electricity
The mode extending in region beyond photoresistive mask rm in the eps of pole surface, sheet metal 32s is formed as mask portion 32 (with reference to Figure 12
(c)).
Now, piling up beyond the space that photoresistive mask rm is occupied has sheet metal 32s, shape therefore on sheet metal 32s
Become there is the hole of the shape that the shape to photoresistive mask rm is followed.Then, mask hole 32h in mask portion 32 self matchingly
Formed.That is, worked as the mask backside 321 with backside openings h1 in the face being contacted with electrode surface eps.Additionally, having
The opening bigger than backside openings h1 is that the most surface of surface opening h2 works as mask surface 322.
Next, only photoresistive mask rm is removed from electrode surface eps, thus, being formed makes from backside openings h1 to surface
Opening h2 becomes mask hole 32h (with reference to Figure 13 (d)) of hollow.Finally, outer in the mask surface 322 with surface opening h2
Peripheral edge portion 32e engages the framework back side 311 of framework inside edge portion 31e, then, mask frame 31 is applied for by mask
The stress that portion 32 peels off from electrode surface eps.Or, peeled off from electrode surface eps with the mask portion 32 of the joints such as supporter,
And the framework back side 311 of framework inside edge portion 31e is engaged in the peripheral edge portion 32e of mask surface 322.Thus, produce
Evaporation in the state of mask frame 31 engages mask portion 32 metal mask 30 (with reference to Figure 12 (e)).
Example as shown in Figure 14 (a)～(f), in the other examples of the manufacture method of evaporation metal mask,
First, it is being electrolysed used electrode surface eps formation resist layer pr (with reference to Figure 14 (a)).Then, resist layer pr is entered
Row exposure and development, an example thus forming pattern on electrode surface eps is photoresistive mask rm (with reference to Figure 14
(b)).Photoresistive mask rm is, in the section orthogonal with electrode surface eps, has the frustum that bottom is located at electrode surface eps
Shape, and there is the less shape of the area in more big then parallel with the electrode surface eps section of the distance of ionization electrode surface eps.Connect
Get off, carry out employing the electrolysis of the electrode surface eps with photoresistive mask rm, with to the photoresistive mask in electrode surface eps
The mode extending in region beyond rm, sheet metal 32s is formed as mask portion 32 (with reference to Figure 14 (c)).
Here is also that piling up beyond the space that photoresistive mask rm is occupied has sheet metal 32s, therefore in sheet metal 32s
Upper formation has the hole of the shape that the shape to photoresistive mask rm is followed.Then, mask hole 32h in mask portion 32 self
Formed with joining.That is, the face being contacted with electrode surface eps, is worked as the mask surface 322 with surface opening h2, has
The little opening of specific surface opening h2 is the most surface of backside openings h1, works as mask backside 321.
Next, only removing photoresistive mask rm from electrode surface eps, thus, being formed makes from backside openings h1 to surface
Opening h2 becomes mask hole 32h (with reference to Figure 14 (d)) of hollow.Then, the mask backside 321 with backside openings h1 connects
Close intermediate transfer base material tm, then, middle transfer substrate tm is applied for answering mask portion 32 from electrode surface eps stripping
Power.Thus, in the state of engaging mask portion 32 on intermediate transfer base material tm, mask surface 322 is peeled off from electrode surface eps
(with reference to Figure 14 (e)).Finally, the peripheral edge portion 32e in the mask surface 322 with surface opening h2 engages framework inner side edge
The framework back side 311 of edge 31e, then, intermediate transfer base material tm is peeled off from mask portion 32.Thus, produce in mask frame
Evaporation metal mask 30 (with reference to Figure 14 (f)) in the state of mask portion 32 is engaged on frame 31.
According to above-mentioned embodiment, the effect being exemplified below can be obtained.
(1) evaporation material entering in surface opening h2 is to mask hole 32h, by the little back of the body of big small specific surface opening h2
Face opening h1 is piled up to evaporation object.Therefore, it is possible to improve the precision on the construction of the pattern being made up of evaporation material.
(2) because mask surface 322 is engaged with mask frame 31, therefore, it is possible to make mask backside 321 and evaporation object
Contact become easy, and evaporation metal mask 30 rigidity of itself can be improved.
The quantity of (3) mask hole 32h required for mask frame 31 is for example divided to give 3 mask portions 32.Therefore,
Even if carrying out more it is also possible to reduce with the mask portion 32 being deformed in the case that the part in a mask portion 32 is deformed
The size in the new mask portion 32 changing.
(4) if from the surface opening h2 example that the sectional area of mask hole 32h monotonously reduces to backside openings h1
Son, then for the evaporation particle entering from surface opening h2, can suppress shadow effect better.
(5) mask hole 32h with the shape that the shape to photoresistive mask rm is followed is formed by electrolysis, therefore
Alleviate this load of etching sheet metal additionally being carried out for forming mask hole 32h.
Claims (9)
1. a kind of evaporation metal mask, wherein, possesses:
Mask portion, possess for the evaporation contact surface of the object contact and noncontact face with above-mentioned contact surface opposition side, shape
Become plate shape, and, this mask portion has to penetrate into from the first opening positioned at above-mentioned contact surface respectively and non-connects positioned at above-mentioned
Multiple mask hole of the second opening of contacting surface, the size of above-mentioned first opening is less than the size of above-mentioned second opening；And
Mask frame, has the rigidity higher than aforementioned mask portion, and is formed as the frame-shaped surrounding above-mentioned multiple mask hole,
Aforementioned mask portion has the part surrounding above-mentioned multiple mask hole in above-mentioned noncontact face, passes through to connect in above-mentioned part
Conjunction portion is engaged with aforementioned mask framework.
2. evaporation metal mask as claimed in claim 1, wherein,
There are the multiple aforementioned mask portions engaging with the aforementioned mask framework sharing.
3. evaporation metal mask as claimed in claim 1 or 2, wherein,
Aforementioned mask portion is sheet metal,
At least one party in above-mentioned contact surface and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to this even surface
The reflectance of the incident direct reflection of light is more than 45.2%,
The thickness of above-mentioned sheet metal is less than 50 μm.
4. evaporation metal mask as claimed in claim 1 or 2, wherein,
Aforementioned mask portion is sheet metal,
At least one party in above-mentioned contact surface and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to this even surface
The reflectance of the incident direct reflection of light is more than 53.0%,
The thickness of above-mentioned sheet metal is less than 40 μm.
5. evaporation metal mask as claimed in claim 3, wherein,
Aforementioned mask framework possesses the plane that above-mentioned junction surface is located at,
Above-mentioned plane has the size of the outside extension towards aforementioned mask portion.
6. a kind of manufacture method of evaporation metal mask, wherein, comprising:
Formed mask portion operation, this mask portion possess for evaporation object contact contact surface and with above-mentioned contact surface phase
The noncontact face tossed about, is formed as plate shape, and, this mask portion has to be passed through from the first opening positioned at above-mentioned contact surface respectively
Lead to multiple mask hole of the second opening positioned at above-mentioned noncontact face, the size of above-mentioned first opening is less than above-mentioned second opening
Size；With
The operation that aforementioned mask portion is engaged with mask frame, this mask frame has the rigidity higher than aforementioned mask portion, and shape
Become the frame-shaped that above-mentioned multiple mask hole are surrounded, and, aforementioned mask portion has in above-mentioned noncontact face will be above-mentioned multiple
The part that mask hole is surrounded, in the operation that this mask portion is engaged with mask frame, aforementioned mask portion passes through junction surface in this part
Engage with aforementioned mask framework.
7. the manufacture method of evaporation metal mask as claimed in claim 6, wherein,
The operation that aforementioned mask framework is engaged with above-mentioned noncontact face is, by multiple aforementioned mask portions and an aforementioned mask frame
Bridge joint closes.
8. the manufacture method of evaporation metal mask as claimed in claims 6 or 7, wherein,
Aforementioned mask portion is sheet metal,
At least one party in above-mentioned contact surface and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to this even surface
The reflectance of the incident direct reflection of light is more than 45.2%,
Formed in the operation in aforementioned mask portion, the thickness of above-mentioned sheet metal is set to less than 50 μm.
9. the manufacture method of evaporation metal mask as claimed in claims 6 or 7, wherein,
Aforementioned mask portion is sheet metal,
At least one party in above-mentioned contact surface and above-mentioned noncontact face includes even surface, and above-mentioned even surface is set to this even surface
The reflectance of the incident direct reflection of light is more than 53.0%,
Formed in the operation in aforementioned mask portion, the thickness of above-mentioned sheet metal is set to less than 40 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311802064.9A CN117821896A (en) | 2015-07-17 | 2016-07-15 | Metal mask for vapor deposition and method for manufacturing metal mask for vapor deposition |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015143509 | 2015-07-17 | ||
| JP2015-143509 | 2015-07-17 | ||
| JP2015-171440 | 2015-08-31 | ||
| JP2015171440 | 2015-08-31 | ||
| JP2016079099 | 2016-04-11 | ||
| JP2016-079099 | 2016-04-11 | ||
| JP2016-081362 | 2016-04-14 | ||
| JP2016081362 | 2016-04-14 |
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| CN202311802064.9A Division CN117821896A (en) | 2015-07-17 | 2016-07-15 | Metal mask for vapor deposition and method for manufacturing metal mask for vapor deposition |
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| CN201610561108.7A Pending CN106350768A (en) | 2015-07-17 | 2016-07-15 | Metal mask for vapor deposition, method for manufacturing metal mask for vapor deposition |
| CN202311802064.9A Pending CN117821896A (en) | 2015-07-17 | 2016-07-15 | Metal mask for vapor deposition and method for manufacturing metal mask for vapor deposition |
| CN201620749297.6U Active CN205974646U (en) | 2015-07-17 | 2016-07-15 | Metal mask for coating by vaporization |
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| CN202311802064.9A Pending CN117821896A (en) | 2015-07-17 | 2016-07-15 | Metal mask for vapor deposition and method for manufacturing metal mask for vapor deposition |
| CN201620749297.6U Active CN205974646U (en) | 2015-07-17 | 2016-07-15 | Metal mask for coating by vaporization |
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| JP (1) | JP6120038B1 (en) |
| CN (3) | CN106350768A (en) |
| TW (1) | TWI665319B (en) |
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| US11746407B2 (en) | 2017-09-15 | 2023-09-05 | Toppan Printing Co., Ltd. | Method for manufacturing deposition mask, method for manufacturing display device and deposition mask |
| TWI777253B (en) * | 2017-09-15 | 2022-09-11 | 日商凸版印刷股份有限公司 | Vapor deposition mask, vapor deposition mask with glass substrate, and mask sheet with glass substrate |
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| CN111373070A (en) * | 2017-11-21 | 2020-07-03 | Lg伊诺特有限公司 | Metal plate and deposition mask using the same |
| CN110997970A (en) * | 2018-04-11 | 2020-04-10 | 凸版印刷株式会社 | Substrate for vapor deposition mask, method for producing vapor deposition mask, and method for producing display device |
| CN112639156B (en) * | 2018-08-16 | 2023-04-18 | 悟劳茂材料公司 | Method for manufacturing frame-integrated mask and frame |
| CN112639156A (en) * | 2018-08-16 | 2021-04-09 | 悟勞茂材料公司 | Method for manufacturing frame-integrated mask and frame |
| CN108940750B (en) * | 2018-09-27 | 2020-06-30 | 京东方科技集团股份有限公司 | Glass cement coating mask plate and glue spreader |
| CN108940750A (en) * | 2018-09-27 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of glass cement coating mask plate and glue spreader |
| CN111057997A (en) * | 2018-10-17 | 2020-04-24 | 皮姆思株式会社 | Open mask sheet for thin film process and method for producing the same |
| CN111218644B (en) * | 2018-11-27 | 2022-05-17 | Tgo科技株式会社 | Method for manufacturing frame-integrated mask and method for separating/replacing mask of frame-integrated mask |
| CN111218644A (en) * | 2018-11-27 | 2020-06-02 | Tgo科技株式会社 | Method for manufacturing frame-integrated mask and method for separating/replacing mask of frame-integrated mask |
| WO2021098304A1 (en) * | 2019-11-21 | 2021-05-27 | 昆山国显光电有限公司 | Mask, evaporation system, and mask preparation method |
| CN111826608A (en) * | 2020-07-30 | 2020-10-27 | 昆山工研院新型平板显示技术中心有限公司 | Mask plate, preparation method of mask plate and evaporation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6120038B1 (en) | 2017-04-26 |
| TW201708576A (en) | 2017-03-01 |
| JP2017193775A (en) | 2017-10-26 |
| TWI665319B (en) | 2019-07-11 |
| CN117821896A (en) | 2024-04-05 |
| CN205974646U (en) | 2017-02-22 |
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