JP2006185975A - Method of manufacturing multilayered electronic component element assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered electronic component element assembly which can prevent poor adhesion between insulating layers and can also prevent a internal defect at the time of burning even if the individual insulating layers are made thin and the number of layers is increased. <P>SOLUTION: The method of manufacturing the multilayered electronic component element assembly comprises a process A wherein an insulating layer is formed on one principal plane of a first support body; process B wherein through holes are formed through the first support body and the insulation layer at predetermined positions of the insulating layer; process C wherein an insulation sheet held on a second support body is pasted on the insulating layer so as to close the openings of the through holes; process D wherein a conductive layer is formed inside the through holes of the insulation sheet from the other principal plane side of the first support body to form a composite sheet consisting of the insulation sheet, insulating layer, and conductive layer; and process E wherein after delaminating the first support body from the composite sheet, the composite sheet from which the first support body has been delaminated is stacked on a laminate, and then the second support body is delaminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer electronic component body such as a multilayer ceramic capacitor.

  In recent years, with the downsizing and high density of electronic devices, there has been a demand for miniaturization and high functionality of laminated electronic components. As a multilayer ceramic capacitor 10 which is a typical multilayer electronic component, as shown in FIG. 6, a conductive layer 26 is interposed between adjacent insulating sheets 24 inside a multilayer body 11 in which a plurality of insulating sheets 24 are stacked. In addition, a structure in which the external electrode 12 connected to one end of the conductive layer 24 is attached from the side surface to the main surface of the multilayer body 11 is known. Further, thinning and multilayering of the insulating sheet 24, the conductive layer 26, and the like constituting the laminated body 11 are being promoted.

  With such thinning and multilayering, the thickness of the conductive layer (conductor material) 26 has been greatly affected by the quality of products. That is, a step due to the thickness of the conductive layer 26 is generated between a portion where the conductive layer 26 is formed and a portion where the conductive layer 26 is not formed. There is a problem that the adhesion of the resin becomes weak and internal defects such as delamination and cracks are easily generated during firing.

In order to solve such problems, as shown in FIG. 7, (a) a step of forming a conductive layer 36 and an insulating layer 31 on the first support 32 by screen printing, and (b) a conductive layer. Transferring the layer 36 and the insulating layer 31 onto the insulating sheet 34 formed on the second support 35 to form a composite sheet 37 comprising the conductive layer 36, the insulating layer 31, and the insulating sheet 34; and (c). By repeating the step of peeling the first support 32, the step of (d) transferring the composite sheet 37 to the laminated body 38, and the step of (e) peeling the second support 35, a large size is obtained. JP-A-2001-244117 discloses a method of manufacturing a multilayer ceramic electronic component by forming a multilayer body and firing a multilayer body extracted from a large-sized multilayer body (see Patent Document 1). The laminated body refers to an insulating sheet and / or a composite sheet or a composite sheet in which a plurality of layers are laminated.
JP 2001-244117 A (page 8, FIG. 9)

  However, according to the above manufacturing method, as shown in FIG. 8, the void portion V is generated due to the sagging of the end face peculiar to screen printing at the boundary portion that is a branch region of the conductive layer 36 and the insulating layer 31. In addition, there is a problem that it is difficult to completely eliminate the step due to the lamination. Further, in the manufacturing method, the accuracy of screen printing for forming the insulating layer 31 is usually 30 to 200 μm, and due to such printing misalignment, a part of the insulating layer 31 is electrically conductive as shown in FIG. There is a problem in that it rides on the layer 36, or conversely, a part of the conductive layer 36 rides on the insulating layer 31, resulting in a step difference.

  Furthermore, in order to meet the demand for cost reduction of multilayer electronic components, large-scale laminates have been increased in area in the manufacturing process, which has caused the problem of misalignment due to printing. Had.

  The present invention has been devised in view of the above-mentioned problems, and its purpose is to prevent accumulation of steps during lamination even when the number of laminations is increased by thinning an insulating sheet, and insulation is achieved. An object of the present invention is to provide a method for manufacturing a multilayer electronic component element body that can prevent poor adhesion between sheets and internal defects during firing.

The method for producing a multilayer electronic component element according to the first aspect of the present invention includes: a multilayer electronic component element in which a composite sheet is laminated and integrated on a laminate in which an insulating layer, an insulating sheet, and a conductor layer are laminated. A manufacturing method of
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet held on the second support so as to close the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling off the first support from the composite sheet, stacking the composite sheet from which the first support has been peeled off, and then peeling off the second support, e.
It is a manufacturing method of the laminated electronic component element | base_body characterized by comprising.

The invention of claim 2 is a method for manufacturing a multilayer electronic component element body in which a composite sheet is laminated and integrated on a laminate in which an insulating layer, an insulating sheet, and a conductor layer are laminated.
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet held on the second support so as to close the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling the first and second supports from the composite sheet, the step e of laminating the composite sheet peeled from the first and second supports on a laminate;
It is a manufacturing method of the laminated electronic component element | base_body characterized by comprising.

Further, the invention of claim 3 is a method for manufacturing a multilayer electronic component element body in which a composite sheet is laminated and integrated on a laminate in which an insulating layer, an insulating sheet, and a conductor layer are laminated.
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet so as to block the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling the first support from the composite sheet, the step e of laminating the composite sheet on a laminate;
It is a manufacturing method of the laminated electronic component element | base_body characterized by comprising.

The invention of claim 4 is a method for producing a multilayer electronic component element body in which a composite sheet is laminated and integrated on a laminate in which an insulating layer, an insulating sheet, and a conductor layer are laminated.
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet so as to block the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After laminating the composite sheet on the laminate, a step e of peeling the first support;
It is a manufacturing method of the laminated electronic component element | base_body characterized by comprising.

  Furthermore, the method for producing a multilayer electronic component body according to the present invention is characterized in that the conductive layer is formed by either a die coating method or a spray coating method.

  According to the method for manufacturing a multilayer electronic component element body of the present invention, after forming the through hole penetrating the first support and the insulating layer, the insulating sheet or the insulating sheet is attached to the surface of the insulating layer. The support is attached so as to close the through hole, and then a conductive layer is formed in the through hole region of the other main surface of the first support, and the second support is peeled off as necessary. Forming a composite sheet consisting of an insulating sheet, an insulating layer, and a conductive layer, the insulating layer and the conductive layer do not overlap to form a step. As a result, even when a plurality of composite sheets are laminated, the adhesion is reduced. The effect of preventing the occurrence of internal defects can be obtained.

  Further, the present invention provides a method for manufacturing a multilayer electronic component body, wherein the conductive layer is formed using either a die coating method or a spray coating method, so that the surface of the conductive layer becomes flat, and the insulating layer, the conductive layer, Since no void portion is generated at the boundary, there is no reduction in adhesion when laminated, and the effect of preventing the occurrence of internal defects can be obtained.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  A typical multilayer electronic component will be described using a multilayer ceramic capacitor.

  FIG. 1 is a longitudinal sectional view of a multilayer ceramic capacitor. In this figure, 1 (31) is an insulating layer, 4 (34) is an insulating sheet, 6 (36) is a conductive layer, 11 is a laminate, 12 is an external electrode, and these mainly constitute a multilayer ceramic capacitor. . In addition, (31), (34), and (36) are the codes | symbols demonstrated by the prior art, and it demonstrates using the codes | symbols 1, 4, and 6 below.

The insulating sheet 4 and the insulating layer 1 constituting the laminate 11 are mainly composed of a dielectric material having a high dielectric constant whose main component is BaTiO ₃ , CaTiO ₃ , SrTiO _3, or the like, or TiO ₂ or the like. It is a dielectric material for temperature compensation, and its thickness is, for example, 1 μm to 3 μm per layer. The number of laminated insulating sheets 4 in the laminate 11 is, for example, 20 to 2000 layers.

  The conductive layer 6 is formed between adjacent insulating sheet 4 layers inside the laminate 11, and the material thereof is a conductor material mainly composed of a metal such as Ni, Cu, Cu—Ni, Ag—Pd, and the like. The thickness is, for example, 0.5 μm to 2 μm. The pair of conductive layers 6 that face each other with the insulating sheet 4 between them has a capacitance between the facing regions, and one end thereof is led out to a different end face of the laminate 11.

  The external electrode 12 deposited from the end surface to the main surface of the multilayer body 11 is, for example, a conductor material such as Cu having high conductivity and not easily eroded by solder, and the thickness thereof is set to 5 μm to 10 μm, for example. Is done. The external electrode 12 is connected to one end of the conductive layer 6 led to the end face, and is electrically connected to a capacitance formed inside the stacked body 11.

  In general, the surface of the external electrode 12 has a thickness of 1 μm to 3 μm for improving heat resistance when mounted on a circuit board with solder, or a thickness for easily applying solder. Is coated with a 4 μm to 5 μm solder or Sn layer (not shown in FIG. 1).

  Next, a first manufacturing method of the multilayer electronic component body of the present invention will be described with reference to FIG. In the drawings, each symbol is not distinguished before and after firing.

  First, as shown in FIG. 2A, a ceramic green sheet to be the insulating layer 1 is formed by applying a ceramic slurry to one main surface of the first support 2 and drying it (step a).

  Here, as the first support 2, a PET film, a polypropylene film, or the like is used in consideration of strength, smoothness, releasability, and the like. As a method for forming the insulating layer 1, a die coater method or a microscopic method is used. Examples include gravure printing.

Next, as shown in FIG. 2B, the through hole 3 is formed so as to penetrate both the first support 2 and the insulating layer 1. The vertical and horizontal lengths of the through holes 3 have predetermined dimensions according to the shape of the conductive layer 6 formed in the through holes 3. In general, the shape is rectangular, and the length and width are 0.8 mm to 3.4 mm × 0.1 mm to 1.2 mm. In the case of laser beam irradiation, such a through hole 3 is formed using a CO ₂ laser, a UV-YAG laser, an excimer laser, or the like as the type of laser. Moreover, you may form the through-hole 3 with a drill, a punch, etc. as another method. (Process b)
Next, as shown in FIG. 2C, the insulating sheet 4 held by the second support 5 is adhered to the insulating layer 1 so as to close the through hole 3. As the second support 5, a PET film, a polypropylene film, or the like is used according to the first support 2. (Process c)
Next, as shown in FIG. 2 (d), a conductive material is applied on the insulating sheet 2 exposed from substantially the entire surface of the first support 2 and the through holes 3 of the first support 2, and the internal electrode The conductive layer 6 is formed, and the composite sheet 7 composed of the insulating sheet 2, the insulating layer 1, and the conductive layer 6 is formed. Examples of a method for applying a conductive material on the substantially entire surface of the first support 2 and the insulating sheet 4 exposed from the through holes 3 of the first support 2 include a die coating method and a spray coating method.

  In the coating method using the die coating method, a paste is made by adding an additive or a resin, an organic solvent or water to a metal powder such as Ni, Cu, Ag, Pd, etc., and the ink is led from the tank to the die die of the die coater, and the paste from the head nozzle A conductive layer 6 is formed on the surface of the insulating sheet 2 in the through hole 3 by discharging. The coating thickness is controlled by the discharge amount and the molding speed according to the paste viscosity.

  In the spray coating method, an additive or resin, organic solvent or water is added to a metal powder such as Ni, Cu, Ag, Pd to create a paste, ink is introduced from a tank to a spray gun, and the paste is applied from the nozzle part. The conductive layer 6 is formed on the surface of the insulating sheet 4 in the through hole 3 by jetting. The coating thickness is controlled by appropriately changing the paste viscosity, spray pressure, number of coatings, and the like.

  Next, as shown in FIG. 2 (e), the first support 2 is peeled from the composite sheet 7, and then the composite sheets 7 from which the first support 2 is peeled are sequentially laminated. Then, the second support 5 is peeled off. This process is repeated to form the large laminate 9.

  As a method for peeling off the first support 2, a method (peeling method) of transferring by bringing an adhesive tape into contact with the first support 2 coated with a conductive material may be used. At this time, it is necessary for the peel strength to be greater between the first support 2 and the adhesive tape than between the insulating sheet 4 and the first support 2. Moreover, in order to peel reliably, it is desirable to peel so that peeling angle (theta) may become an acute angle.

  Further, as a specific procedure after the first support 2 is peeled off, the second support 5 is lined between the stacked body 8 placed on the lower mold and the upper mold. The composite sheet 7 is disposed so that the second support 5 is on the upper mold side, and then the second support 5 is pressurized and heated to the lower mold side with the upper mold, thereby combining By repeating the step of thermocompression bonding the sheet 7 to the laminate 8, the large laminate 9 is formed.

  Thereafter, the large laminate 9 is cut for each element region to obtain an unfired laminate 11.

  Further, the unfired laminate 11 is fired under a predetermined atmosphere and temperature conditions to obtain the laminate 11. In the laminate 11, a plurality of composite sheets 7 are laminated, and the conductive layer 6 is exposed on a pair of end faces.

  Next, a conductor film to be the external electrode 12 is formed on the pair of end surfaces of the multilayer body 11 by a dipping method. Further, the conductor film is baked by adding a predetermined atmosphere, temperature and time to form the external electrode 12. Then, Ni plating / Sn plating is formed on the surface of the external electrode 12.

  In this way, a multilayer ceramic capacitor 10 as shown in FIG. 1 is obtained.

  You may form as shown in Claim 2 in the manufacturing method of the above-mentioned multilayer ceramic capacitor. That is, the manufacturing method is the same as the above-described manufacturing method up to steps a to d, but in step e, the second support 5 may be peeled off before the composite sheet 7 is laminated on the stack 8. Absent. The manufacturing method is shown in FIG. That is, in FIG. 3, the 2nd support body 5 does not exist in a lamination process.

  Moreover, you may form as shown in Claim 3, 4 in the manufacturing method of the above-mentioned multilayer ceramic capacitor. That is, in the manufacturing method described above, the second support 5 is integrated with the insulating sheet 4, but the second support 5 may be omitted and only the insulating sheet 4 may be attached to the through-hole 3. . The manufacturing method is shown in FIGS.

  In this case, the first support 2 may be peeled before or after the composite sheet 7 is laminated on the laminated body 8.

  In FIG. 4, the first support 2 is peeled off before the laminating step, and the composite sheet 7 is laminated on the laminated body 8 in the state of only the composite sheet 7. In FIG. 5, the composite sheet 7 is laminated on the laminated body 8 using the surface of the composite sheet 7 to which the first support 2 is not attached, and after the lamination, the first support 2 is attached. It is peeling.

  According to these manufacturing methods, after the through hole 3 penetrating the first support 2 and the insulating layer 1 is formed, the insulating sheet 4 is adhered to the surface of the insulating layer 1 so as to close the through hole 3. Thereafter, the conductive layer 6 is formed in the through hole region of the insulating sheet 4 on the other main surface of the first support 2, and the composite sheet 7 composed of the insulating sheet 4, the insulating layer 1, and the conductive layer 6 is formed. The insulating layer 1 and the conductive layer 6 do not overlap to form a step, and as a result, even when a plurality of composite sheets 7 are laminated, the adhesiveness is not lowered and the generation of internal defects can be prevented. Is obtained.

  In addition, since the conductive layer is formed by using either the die coating method or the spray coating method, the surface of the conductive layer becomes flat, and no gap is formed at the boundary between the insulating layer and the conductive layer. The effect of preventing the occurrence of internal defects without causing a decrease in adhesion is obtained.

  The inventor conducted the following experiment on the relationship between the thickness of the conductive layer 6 and the insulating layer 1 and confirmed the occurrence of internal defects due to the difference in thickness between the conductive layer 6 and the insulating layer 1.

In the sample, either a die coating method (Table 1) or a spray coating method (Table 2) was used as a printing method of the conductive layer 6, and a die coating method was used as a method of forming the insulating layer 1. Further, 100 samples were examined as 100 samples.

In the determination, the non-defective product “◯” had 0/100 defective samples, and if there was even one defective sample, it was determined as a defective “x”.

  As a result, when the thickness of the insulating layer 1 is expressed as Zt and the thickness of the conductive layer 6 is expressed as Dt, the insulating layer has a relationship of 0.67Zt ≦ Dt ≦ 1.5Zt in both cases of the die coating method and the spray coating method. By satisfying the relationship between the thickness of 1 and the thickness of the conductive layer 6, poor adhesion and internal defects during firing can be completely eliminated.

  Furthermore, the present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention.

  For example, in the above embodiment, the multilayer electronic component 10 of the present invention has been described using an example in which the multilayer electronic component 10 is applied to a multilayer ceramic capacitor, but the present invention includes a multilayer inductor, a multilayer piezoelectric component, a circuit board, a semiconductor component, etc. The present invention can be applied to various laminated electronic components 10.

1 is a longitudinal sectional view of a multilayer ceramic capacitor described in the present invention and the prior art. It is a figure which shows the manufacturing method of the multilayer electronic component of this invention, (a) is an insulating layer formation process, (b) is a through-hole formation process, (c) is an insulation sheet adhesion process, (d) is a conductor layer and a composite. (E) is a schematic sectional view showing a first support peeling and lamination and a second support peeling step. It is a figure which shows the manufacturing method of the multilayer electronic component of this invention, (a) is an insulating layer formation process, (b) is a through-hole formation process, (c) is an insulation sheet adhesion process, (d) is a conductor layer and a composite. (E) is a schematic sectional view showing a first support and a second support peeling and laminating step. It is a figure which shows the manufacturing method of the multilayer electronic component of this invention, (a) is an insulating layer formation process, (b) is a through-hole formation process, (c) is an insulation sheet adhesion process, (d) is a conductor layer and a composite. It is a schematic sectional drawing which shows a sheet | seat formation process, (e) 1st support body peeling and a lamination process. It is a figure which shows the manufacturing method of the multilayer electronic component of this invention, (a) is an insulating layer formation process, (b) is a through-hole formation process, (c) is an insulation sheet adhesion process, (d) is a conductor layer and a composite. (E) is a schematic cross-sectional view of the lamination and the first support peeling process. It is a conventional multilayer ceramic capacitor longitudinal section. It is a figure which shows the manufacturing method of the conventional multilayer electronic component, (a) Insulating layer formation process, (b) Insulation sheet adhesion process, (c) 1st support body peeling process, (d) Lamination process, (e) It is a 2nd support body peeling process. It is a figure which shows the cross section of the insulating sheet in the conventional manufacturing method of a multilayer electronic component, an insulating layer, and a conductive layer. It is a figure which shows the cross section of the insulating sheet in the conventional manufacturing method of a multilayer electronic component, an insulating layer, and a conductive layer, and shows the state of an insulating layer printing shift.

Explanation of symbols

10 ... Multilayer ceramic capacitors (multilayer electronic components)
11... Laminated bodies 1, 21, 31... Insulating layers 2, 22, 32... First support 3. 34 ... Insulating sheets 5, 25, 35 ... Second supports 6, 26, 36 ... Conductive layers 7, 37 ... Composite sheets 8, 38 ... Laminate 9, 39 ... ... Large laminate 12 ..... External electrode

Claims (5)

A laminated electronic component body manufacturing method in which a composite sheet is laminated and integrated on a laminated body in which an insulating layer, an insulating sheet, and a conductor layer are laminated,
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet held on the second support so as to close the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling off the first support from the composite sheet, stacking the composite sheet from which the first support has been peeled off, and then peeling off the second support, e.
A method for producing a laminated electronic component body, comprising: A laminated electronic component body manufacturing method in which a composite sheet is laminated and integrated on a laminated body in which an insulating layer, an insulating sheet, and a conductor layer are laminated,
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet held on the second support so as to close the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling the first and second supports from the composite sheet, the step e of laminating the composite sheet peeled from the first and second supports on a laminate;
A method for producing a laminated electronic component body, comprising: A laminated electronic component body manufacturing method in which a composite sheet is laminated and integrated on a laminated body in which an insulating layer, an insulating sheet, and a conductor layer are laminated,
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet so as to block the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After peeling the first support from the composite sheet, the step e of laminating the composite sheet on a laminate;
A method for producing a laminated electronic component body, comprising: A laminated electronic component body manufacturing method in which a composite sheet is laminated and integrated on a laminated body in which an insulating layer, an insulating sheet, and a conductor layer are laminated,
Forming an insulating layer on one main surface of the first support;
Forming a through-hole penetrating the first support and the insulating layer at a predetermined location of the insulating layer; and b.
A step c of adhering an insulating sheet so as to block the opening of the through hole on the surface of the insulating layer;
Forming a conductive layer in the through hole of the insulating sheet from the other main surface side of the first support, and forming a composite sheet comprising the insulating sheet, the insulating layer, and the conductive layer; and ,
After laminating the composite sheet on the laminate, a step e of peeling the first support;
A method for producing a laminated electronic component body, comprising: The method for producing a multilayer electronic component element body according to claim 1, wherein the conductive layer is formed by either a die coating method or a spray coating method.

Images