JP2006153680A - Device for measuring film thickness/resistance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately measure the film thickness of a printed pattern, etc. on a surface of a glass substrate for a plasma display panel, and the resistance value of an electrode in a stable state using a single device. <P>SOLUTION: This film thickness/resistance measuring instrument 1 is equipped with a positioning/fixing means 20 for positioning and fixing an object 5 under a measurement carried by a carrying means 10; a film thickness measuring means 30 for measuring the thickness of the printed pattern 6 on the surface of the fixed object 5; first and second resistance measuring means 40 and 50 for measuring the resistance value of the printed pattern 6 on the surface of the object 5; a first XY coarse movement robot 60, for mounting thereon the measuring means 30 and 40 to move the measuring means 30 and 40 to arbitrary positions on the object 5; a second XY coarse movement robot 61 for mounting thereon the second resistance measuring means 50, to cause it to operate interlockingly with the first resistance measuring means 40; a choice means 65 for choosing between film thickness measurement and resistance measurement; and a control means 70 for controlling the instrument as a whole. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a film thickness resistance measuring apparatus, and in particular, a film thickness resistance for measuring the film thickness of a printed pattern or the like formed on the surface of a glass substrate and the resistance value of an electrode in a plasma display panel manufacturing process. It relates to a measuring device.

  Conventionally, in order to measure the printing deviation, film thickness, and printed shape of solder supplied on a land pattern for mounting components on a printed wiring board, for example, the inspection apparatus described in Patent Document 1 uses XY movement of an XY orthogonal robot. A displacement sensor that scans the film thickness of the solder existing on the printed wiring board and an ITV area sensor that detects printing misalignment are mounted and fixed on the body, and the displacement sensor with respect to the traveling direction of the XY moving body by a rotation mechanism Always performs a horizontal scan, and an accurate scan is possible. Moreover, the printed wiring board of a to-be-measured object is supplied in an apparatus with a conveyance conveyor, and after positioning and measuring, it is discharged | emitted from an apparatus.

  On the other hand, Patent Document 2 includes two pairs of XY movement mechanisms that face each other and measuring probes that are held opposite to each other by a predetermined angle on a Y-axis arm, and the two measurement probes are chain driven. The auto probe apparatus is capable of measuring the electrical characteristics of a resistive film or the like formed on a thin film substrate by freely controlling the interval between measurement probes and the direction connecting them by the XY movement mechanism according to the above. Has been.

Japanese Patent No. 2691789 JP-A-61-180148

  However, in the solder printing inspection apparatus described in Patent Document 1, the printed wiring board that is the object to be measured is fixed on the transport conveyor, so the printed wiring board cannot be held in a horizontal plane, and printing is performed. There is a problem that a warp due to the printed wiring board itself, a gap due to bending or the like occurs between the pattern and the displacement sensor, and an accurate measurement result cannot be obtained.

  In this solder printing inspection device, the measurement sensor is driven by an XY orthogonal robot, so the measurement sensor cannot be moved in a stable state due to a mechanism error of the XY orthogonal robot, and the film thickness value is stabilized. There was a problem that it could not be measured.

  Furthermore, since the solder printing inspection apparatus described in Patent Document 1 does not have the Z-axis correction function of the displacement sensor, the thickness value of the printed pattern can be measured when the thickness of the printed wiring board is changed. There is a problem that the displacement sensor parameters or the like need to be changed or the model needs to be replaced.

  Moreover, this solder printing inspection apparatus does not have a function of measuring the resistance value of the electrode printed on the printed wiring board, and cannot measure the resistance value.

  On the other hand, the auto-probe device disclosed in Patent Document 2 has a problem that an accurate positioning operation of the measurement probe on the print pattern cannot be performed and an error occurs in the measurement value because the driving method of the XY axis movement is chain drive. was there.

  In addition, this auto-probe device measures resistance using the two-terminal method, but the two-terminal method measures even the contact resistance generated between the probe and the object to be measured. There was a problem that could not get.

  Therefore, the present invention has been made in view of the above problems in the prior art, and in the manufacturing process of the plasma display panel, the film thickness of the printed pattern and the like formed on the surface of the glass substrate, and the resistance of the electrode It is an object of the present invention to provide a film thickness resistance measuring apparatus capable of accurately measuring values with a single apparatus in a stable state.

  In order to achieve the above object, the present invention provides a film thickness resistance measuring apparatus, a conveying means for conveying an object to be measured, a positioning fixing means for positioning and fixing an object to be measured conveyed by the conveying means, A film thickness measuring means for measuring the thickness of the printed pattern on the surface of the object to be measured positioned and fixed by the positioning and fixing means, and a resistance value of the printed pattern on the surface of the object to be measured positioned and fixed by the positioning and fixing means. A first resistance measuring means and a second resistance measuring means provided with a measuring terminal, the film thickness measuring means and the first resistance measuring means, and the film thickness measuring means at an arbitrary position of the object to be measured. And a first XY coarse motion robot that moves the first resistance measurement means and a second resistance measurement means, and a second XY coarse motion that operates in conjunction with the first resistance measurement means only during resistance measurement. A bot; selection means for selecting whether to perform film thickness measurement by the film thickness measurement means or resistance measurement by the first resistance measurement means and the second resistance measurement means; and control means for controlling the entire apparatus. It is characterized by that.

  According to the present invention, when the object to be measured is inserted into the apparatus by the conveying means and the positioning and fixing means, the conveyed object to be measured can be positioned and fixed, and the horizontal stability of the object to be measured is guaranteed. Thus, the measurement operation can be performed in a stable state, and the measurement accuracy is improved.

  In addition, since the first resistance measuring unit and the second resistance measuring unit are separately mounted on the XY coarse motion robot, it is possible to measure the resistance in accordance with the direction of the printed pattern on the object to be measured.

  Furthermore, by selecting which of the film thickness measurement and the resistance measurement is performed by the selection unit, two types of measurement can be performed with one apparatus.

  In the film thickness resistance measuring apparatus, the conveying means includes a confirmation sensor for confirming the presence of the object to be measured, a plurality of conveying rollers positioned below the object to be measured, and a conveyance for driving the plurality of conveying rollers. A motor and an actuator for moving the plurality of conveying rollers up and down can be provided.

  In the film thickness resistance measuring apparatus, the positioning fixing means includes a positioning pin for positioning the conveyed object to be measured, an actuator for driving the positioning pin, a suction pad for fixing the object to be measured, and the object to be measured. A substrate fixing base for fixing and holding an object can be provided.

  In the film thickness resistance measuring apparatus, the film thickness measuring means includes a laser displacement sensor that measures the film thickness of the printed pattern on the object to be measured, and a Z axis that holds the laser displacement sensor and finely adjusts the measurement height. And an XY fine movement stage that mounts the Z axis and performs a measurement operation, and a monitor optical system that observes the measurement operation.

  In the film thickness resistance measuring apparatus, each of the first resistance measuring means and the second resistance measuring means can drive two measuring units each having a contact type terminal independently with respect to the XYZθ axis direction. It can comprise so that it may have. This makes it possible to measure both the vertical and horizontal print pattern directions using the four-terminal method without moving the measurement object, enabling more accurate contact with the print pattern, disconnection, missing pattern, etc. Can also be detected.

  An object to be measured that is measured by the film thickness resistance measuring apparatus can be a glass substrate for plasma display. Accordingly, it is possible to provide an inexpensive measuring device having a simple configuration while improving the quality of the plasma display glass substrate inspection process.

  As described above, according to the present invention, the film thickness of the printed pattern and the like formed on the surface of the glass substrate for the plasma display panel and the resistance value of the electrode can be accurately measured in a single device. A film thickness resistance measuring device capable of measuring can be provided.

  FIG. 10 shows a glass substrate for plasma display (hereinafter referred to as “glass substrate”) as an example of an object to be measured measured by the film thickness resistance measuring apparatus according to the present invention. In addition, FIG. 10 has shown the state which is measuring the resistance of the glass substrate 5 with the film thickness resistance measuring apparatus concerning this invention. After the conductive film is printed on the surface of the glass substrate 5, the glass substrate 5 is supplied to a film thickness resistance measuring device to measure the film thickness. Further, after the glass substrate 5 is baked, the film thickness according to the present invention is applied. The resistance value is measured by supplying the resistance measurement device.

  1 to 3 show an embodiment of a film thickness resistance measuring apparatus according to the present invention. The film thickness resistance measuring apparatus 1 includes a glass substrate 5 of an object to be measured from the outside in the film thickness resistance measuring apparatus 1. A substrate transporting part (conveying means) 10 for transporting to the substrate, a substrate fixing part (positioning fixing means) 20 for positioning and fixing the glass substrate 5, and a conductive pattern printed on the surface of the glass substrate 5 (hereinafter referred to as "printing pattern" The film thickness measuring unit 30 for measuring the film thickness 6), the first resistance measuring unit 40 and the second resistance measuring unit 50 for measuring the resistance value of the printed pattern 6, the film thickness measuring unit 30 and the first resistance. A first XY coarse motion robot 60 that is mounted with the measurement unit 40 and moves to an arbitrary position of the glass substrate 5; a second XY coarse motion robot 61 that is equipped with the second resistance measurement unit 50 and operates only during resistance measurement; Operate these to display inspection data An operation panel 65, and a control unit 70 for controlling the respective units.

  As shown in FIG. 4, the substrate transport unit 10 includes a confirmation sensor 11 that confirms the presence of the glass substrate 5, a transport motor 13 that drives the transport roller 12, and an actuator 14 that moves the transport roller 12 up and down. Then, the glass substrate 5 is conveyed to the substrate fixing unit 20.

  As shown in FIG. 5, the substrate fixing unit 20 includes a positioning pin 21 that positions the conveyed glass substrate 5, an actuator 22 that drives the positioning pin 21, a suction pad 23 that fixes the glass substrate 5, and a glass substrate. And a substrate fixing base 24 for fixing and holding 5.

  The film thickness measuring unit (film thickness measuring means) 30 holds a laser displacement sensor 31 that measures the film thickness of the printed pattern 6 on the surface of the glass substrate 5 as shown in FIG. The first Z axis 32 for fine adjustment, an XY fine movement stage 33 that mounts the first Z axis 32 and performs a measurement operation, and a monitoring optical system 34 (see FIG. 6B) for observing the measurement operation.

  As shown in FIG. 6B, the first resistance measurement unit (resistance measurement means) 40 holds the first measurement terminal 41 for measuring the resistance value of the printed pattern 6 and moves up and down while holding the first measurement terminal 41. The XY fine movement stage 33 (FIG. 6A) includes the second Z-axis 42 that performs the measurement operation, the rotary actuator 43 that rotates the first measurement terminal 41, and the monitoring optical system 44 that observes the measurement state. ))).

  The second measurement terminal unit 50 operates only at the time of measuring the resistance of the printed pattern 6, and as shown in FIG. 7, the second measurement terminal 51 holds the second measurement terminal 51 and performs a vertical movement and measurement operation. It is composed of a 3Z axis 52 and a rotary actuator 53 that rotates the second measurement terminal 51.

  As shown in FIG. 3, the operation panel 65 includes a touch panel 66 for operating the film thickness resistance measuring device 1, a monitor 67 for displaying a film thickness / resistance measurement state, a film thickness measurement controller 68, and a resistance measuring device 69. It consists of.

  The control unit 70 performs control and data management of the film thickness resistance measuring apparatus 1 as a whole, and operates the film thickness resistance measuring apparatus 1 to perform film thickness measurement / resistance measurement of the glass substrate 5.

  Next, the operation of the film thickness resistance measuring apparatus having the above configuration will be described with reference to FIGS.

  When the operator supplies the glass substrate 5 to the substrate transport unit 10 shown in FIGS. 1 and 2, the presence of the glass substrate 5 is detected by the confirmation sensor 11 in FIG. 4, the transport motor 13 is driven, and the glass substrate 5 is It is conveyed to the board | substrate fixing | fixed part 20 of FIG. Next, the conveyance roller 12 is lowered by the actuator 14, and the glass substrate 5 is transferred to the substrate fixing unit 20.

  The glass substrate 5 conveyed to the substrate fixing unit 20 is positioned by moving the positioning pin 21 of FIG. 5 by the actuator 22 according to the set substrate size, and the glass substrate 5 is fixed by the suction pad 23. As a result, the substrate 5 is fixed to the substrate fixing base 24, the positioning accuracy in the horizontal direction of each size substrate is stabilized, and an accurate measurement operation can be performed.

  The measurement work by the film thickness resistance measuring apparatus 1 is performed by the operator selecting either film thickness measurement or resistance measurement by the operation panel 65 after fixing the substrate in FIG.

  When the operator selects the film thickness measurement work, the film thickness measurement controller 68 is activated, and the film thickness measurement unit 30 in FIG. 6A is moved to the measurement position by the first XY coarse movement robot 60, and is moved by the first Z axis 32. The laser displacement sensor 31 is lowered to the measurement height. Then, under the control of the film thickness measurement controller 68 in FIG. 3, the laser displacement sensor 31 emits laser light 35 as shown in FIG. 8, and zero value correction on the surface of the glass substrate 5 as shown in FIG. 36, the laser displacement sensor 31 is reciprocated from the measurement start position to the print pattern 6 as shown in FIG. 8 by the XY fine movement stage 33 of FIG. As shown in FIG. 4, the film thickness 37 of the printed pattern 6 (10 μm to 100 μm in this apparatus) is measured.

  The film thickness resistance measuring apparatus 1 can register 1 to 50 measurement positions per substrate, and the zero value correction 36 is performed for each measurement position to minimize an error due to the surface roughness of the glass substrate 5. Yes. At that time, the measurement state is monitored by the monitoring optical system 34 in FIG. 6B, and the measurement locus and measurement data are displayed on the monitor by the film thickness measurement controller 68 in FIG.

  All the measurement data is stored in the control unit (control means) 70 and can be transmitted to the host device. It is also possible to perform measurement at an arbitrary position on the glass substrate 5 that is not registered as a measurement position by JOG operation on the operation panel 65.

  Next, when the resistance measurement operation is selected, the resistance measuring device 69 in FIG. 3 is activated, and the rotary actuators 43 and 53 in FIGS. 6 and 7 are driven in accordance with the direction of the printed pattern 6 on the glass substrate 5. The first measurement terminal 41 and the second measurement terminal 51 are rotated. This is because the direction of the current terminal and the voltage terminal coincides with the electrode direction because the four-terminal method is used. Thereafter, the first resistance measurement unit 40 moves to the measurement position registered by the first XY coarse movement robot 60, and the second resistance measurement unit 50 also moves to the measurement position registered by the second XY coarse movement robot 61.

  Driving the second Z axis 42 of the first resistance measurement unit 40 and lowering the first measurement terminal 41, simultaneously driving the third Z axis 52 of the second resistance measurement unit 50, lowering the second measurement terminal 51, The first measurement terminal 41 and the second measurement terminal 51 are brought into contact with the printed pattern 6 on the glass substrate 5 to perform a resistance measurement operation. The measurement state can be observed by the monitoring optical system 44. The film thickness resistance measuring apparatus 1 can register 1 to 50 measurement positions per substrate, and the measurement data is displayed on the operation panel, and all the measurement data is stored in the control unit 70 and transmitted to the host apparatus. You can also

  After completion of the measurement operation, the suction pad 23 and the positioning pin 21 of the substrate fixing unit 20 in FIG. 5 are released, the conveyance roller 13 is raised by the actuator 14 of the substrate conveyance unit 10, the conveyance motor 13 is driven, and the glass substrate 5 Recover.

It is a top view which shows the whole film thickness resistance measuring apparatus concerning this invention. It is AA sectional drawing of FIG. It is a front view of the film thickness resistance measuring apparatus of FIG. It is a front view which shows the board | substrate conveyance part of the film thickness resistance measuring apparatus of FIG. It is a front view which shows the board | substrate fixing | fixed part of the film thickness resistance measuring apparatus of FIG. It is a figure which shows the film thickness measurement part / 1st resistance measurement part of the film thickness resistance measuring apparatus of FIG. 1, Comprising: (a) is a front view, (b) is a BB arrow line view of (a). It is a front view which shows the 2nd resistance measurement part of the film thickness resistance measuring apparatus of FIG. It is a figure which shows the film thickness measurement state by the film thickness resistance measuring apparatus of FIG. It is a figure which shows the film thickness measurement state by the film thickness resistance measuring apparatus of FIG. It is a figure which shows the resistance measurement state by the film thickness resistance measuring apparatus of FIG. 1, Comprising: (a) is the glass substrate by which the printing pattern was extended in the vertical direction, (b) was by the printing pattern extended in the horizontal direction. The state which is measuring the glass substrate is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film thickness resistance measuring apparatus 5 Glass substrate 6 Print pattern 10 Substrate conveyance part 11 Confirmation sensor 12 Conveyance roller 13 Conveyance motor 14 Actuator 20 Substrate fixing part 21 Positioning pin 22 Actuator 23 Adsorption pad 24 Substrate fixation base 30 Film thickness measurement part 31 Laser Displacement sensor 32 First Z axis 33 XY fine movement stage 34 Monitor optical system 35 Laser light 36 0 value correction 37 Film thickness 40 First resistance measurement unit 41 First measurement terminal 42 Second Z axis 43 Rotating actuator 44 Monitor optical system 50 2 resistance measurement unit 51 2nd measurement terminal 52 3rd Z axis 53 rotary actuator 60 1st XY coarse motion robot 61 2nd XY coarse motion robot 65 operation panel 66 touch panel 67 monitor 68 film thickness measurement controller 69 resistance measurement device 70 control unit

Claims (6)

Conveying means for conveying the object to be measured;
Positioning fixing means for positioning and fixing an object to be measured conveyed by the conveying means;
A film thickness measuring means for measuring the thickness of the printed pattern on the surface of the object to be measured positioned and fixed by the positioning and fixing means;
A first resistance measuring means and a second resistance measuring means provided with measuring terminals for measuring the resistance value of the printed pattern on the surface of the object to be measured positioned and fixed by the positioning fixing means;
A first XY coarse movement robot which is equipped with the film thickness measurement means and the first resistance measurement means, and moves the film thickness measurement means and the first resistance measurement means to an arbitrary position of the object to be measured;
A second XY coarse motion robot equipped with the second resistance measuring means and operating in conjunction with the first resistance measuring means only during resistance measurement;
Selection means for selecting whether to perform film thickness measurement by the film thickness measurement means or resistance measurement by the first resistance measurement means and the second resistance measurement means;
A film thickness resistance measuring apparatus comprising a control means for controlling the entire apparatus. The conveying means is
A confirmation sensor for confirming the presence of the object to be measured;
A plurality of conveying rollers located below the object to be measured;
A transport motor for driving the plurality of transport rollers;
The film thickness resistance measuring apparatus according to claim 1, further comprising an actuator that moves the plurality of conveying rollers up and down. The positioning and fixing means includes
A positioning pin for positioning the object to be measured,
An actuator for driving the positioning pin;
A suction pad for fixing the object to be measured;
The film thickness resistance measuring apparatus according to claim 1, further comprising a substrate fixing base that fixes and holds the object to be measured. The film thickness measuring means includes
A laser displacement sensor for measuring a film thickness of a printed pattern on the object to be measured;
A Z-axis that holds the laser displacement sensor and finely adjusts the measurement height;
An XY fine movement stage which mounts the Z axis and performs a measurement operation;
The film thickness resistance measuring apparatus according to claim 1, further comprising a monitoring optical system for observing the measuring operation.   Each of the first resistance measurement unit and the second resistance measurement unit includes a mechanism capable of independently driving two measurement units including contact-type terminals with respect to the XYZθ axis direction. Item 5. The film thickness resistance measuring device according to any one of Items 1 to 4.   6. The film thickness resistance measuring apparatus according to claim 1, wherein the object to be measured is a glass substrate for plasma display.

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