JP2006150807A - Mold for molding fine structure, preparation method of mold for molding fine structure and molding method of fine structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold capable of manufacturing a precise, fine structure in a highly efficient manner; to provide a method for preparing this mold easily and at a low cost; and to provide a method for highly efficiently molding the precise, fine structure using this mold. <P>SOLUTION: A prototype 11, on the surface of which a needed unevenness pattern 11a is formed, is prepared. On the surface, on which the unevenness pattern is formed, of the prototype 11, a carbon layer 2 consisting of graphite and the like is formed. Using the carbon layer 2 as a cathode, a metal layer 3 by electroplating, such as nickel, is formed. The interface of the unevenness pattern 11a and the carbon layer 2 is separated to obtain a mold 1A for molding a fine structure. Between the unevenness pattern 2a of the mold 1A and the substrate 14 a molding material 15 is uniformly extended to transfer the unevenness pattern 11a of the prototype 11 to the surface of the molding material 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mold material for forming a fine structure, a method for producing a mold material for forming a fine structure, and a method for forming a fine structure, and more particularly, to a means for improving mold releasability and durability.

  In recent years, there has been an increasing need for technologies for mass-producing fine structures in many fields such as semiconductor devices, recording media, optical elements, and microfluidic devices. For example, microlens arrays can be manufactured by improving the 2P method. Techniques (for example, refer to Patent Document 1), techniques for manufacturing a fine structure of 100 nm or less by a nanoimprint method (for example, refer to Patent Document 2), and the like have been proposed. As described above, in the manufacturing method of the fine structure in which the molding material is pressed against the mold material and the concavo-convex pattern formed on the mold material is transferred to the molded product, the detachability between the mold material and the molded product is improved. It is important to increase the productivity of molded products, and conventionally, a mold release layer is formed on the surface of a mold material, or the mold material itself is formed of a mold release material.

  By the way, in the technical field of fine structures, since the uneven pattern is increasingly miniaturized, and there is a tendency to increase the demand for a molded article using a chemically reactive material such as a sol-gel material. With this technique, it is becoming difficult to peel off the molded product from the mold material, and a higher-performance release structure is required. Further, in order to produce a large amount of fine structures with high efficiency, improvement in the strength of the mold material itself is also required.

In recent years, various techniques using a vacuum-deposited carbon film as a mold have been proposed as means for meeting such demands. For example, Keiichiro Watanabe and others at Himeji Institute of Technology are producing microlenses using a three-dimensional diamond-like carbon mold produced by focused ion beam chemical vapor deposition (FIB-CVD) (see Non-Patent Document 1, for example). . Hirai et al. Of Osaka Prefecture University have succeeded in obtaining a narrow groove having a width of 100 nm or less and a depth of 1.0 μm by using a micro mold using a chemical vapor deposition (CVD) diamond layer ( For example, refer nonpatent literature 2.).
JP-A-8-248207 US Pat. No. 5,772,905 “Nanoimprinting three-dimensional microlens mold made by focused-ion-beam chemical vapor deposition”, J Vac Sci Techno B. VOL. 22 NO. 1; PAGE. 22-26; (200401-200402) “TIEN High Aspect Pattern Fabrication by Nano Imprint Lithography Using Fine Diamond Mold”, Jpn J Appl Phys Part 1, VOL. 42 NO. 6B; PAGE. 3863-3866; (200330630)

  However, since all of these methods apply the required processing by applying a semiconductor manufacturing technique such as electron beam lithography or etching to the surface of the carbon film that has been vacuum-deposited, a great deal of effort is required in the production of the mold material. Therefore, there is an inconvenience that the fine structure as a product is expensive.

  In addition, after replicating a mold such as nickel from the original mold, if a carbon film is vacuum-deposited on the surface of the mold, a mold material for molding a fine structure having high strength and excellent peelability is obtained. However, in this method, since the carbon film cannot be uniformly formed corresponding to the complicated surface shape of the mold, the shape of the mold is disturbed and a molded product having a desired shape cannot be duplicated. In addition, in order to prevent such inconvenience, if the mold is made thin in consideration of the thickness of the carbon film, the strength is insufficient at the portion where the aspect ratio is large, and the required durability cannot be obtained.

  The present invention has been made to solve such deficiencies of the prior art, and an object of the present invention is to provide a mold material capable of producing a precise fine structure with high efficiency, and to easily and reduce the mold material. It is an object to provide a method for manufacturing at a low cost, and to provide a method for forming a precise microstructure with high efficiency using this mold material.

  In order to achieve the above object, the present invention relates to a mold for forming a fine structure, a carbon layer having a required uneven pattern formed on the surface, and a direct or conductive metal layer on the back side of the carbon layer. And an electroplating metal layer formed.

  According to such a configuration, since the molding surface of the molded product is formed by the carbon layer, even when a chemically reactive material such as a sol-gel material or a polymer composition is used as the molding material, The peelability can be improved, and a fine structure having a fine concavo-convex pattern can be produced with high efficiency. Moreover, since a required uneven | corrugated pattern is formed in the surface of a carbon layer, it does not produce disorder in the uneven | corrugated pattern to transfer, but can manufacture a highly efficient fine structure. Furthermore, since the electroplated metal layer is formed on the back side of the carbon layer, the mechanical strength of the mold material can be increased, and a large number of microstructures can be stably produced.

  According to the present invention, in the microstructure forming mold material having the above configuration, the carbon layer is made of diamond-like carbon (hereinafter abbreviated as “DLC”) or graphite.

  DLC is carbon in which both SP2 and SP3 binding components are present when analyzed by Raman spectroscopy, and has the property of being harder than graphite. When molding a shape with a low aspect ratio or a molding material with a low viscosity such as a sol-gel material, there is no special problem with using a relatively soft material such as graphite. When molding is performed or when molding a molding material having high viscosity, if a soft carbon film is used, the mold is likely to be deformed by repeated molding. Since DLC has a higher hardness than graphite, the use of DLC instead of graphite can increase the strength of the mold material and can prevent deformation of the mold material during molding.

  Moreover, the present invention has a configuration in which a mold release layer is present in the surface layer portion of the carbon layer in the microstructure forming mold material having the above configuration.

  A normal molded product can be sufficiently released by a carbon layer, but when a highly reactive material is used as a molding material, a release layer such as a fluorine layer is formed at least on the surface layer of the carbon layer. Thus, the releasability can be improved.

  According to the present invention, in the microstructure forming mold material having the above-described configuration, the thickness of the carbon layer is thicker than the size of the step of the concavo-convex pattern.

  The layer thickness of the carbon layer is not limited as long as it can withstand the pressure at the time of molding, but in order to form an electroplated metal layer with a uniform thickness on the back side of the carbon layer, the uneven pattern step It is more desirable to make it thicker than the size of.

  On the other hand, regarding the method for producing a mold for forming a fine structure, the present invention includes a step of producing a prototype having a surface with a required concavo-convex pattern formed thereon, and a carbon layer having a required layer thickness on the surface of the original concavo-convex pattern. Forming the electroplating metal layer directly on the carbon layer or via the conductive metal layer, peeling the interface between the prototype and the carbon layer, and forming the carbon layer and the electroplating metal. And a step of obtaining a mold for forming a fine structure integrated with a layer.

  In this way, after forming a carbon layer of a required layer thickness on the surface of the original concavo-convex pattern, the required concavo-convex pattern can be formed on the surface of the carbon layer by peeling the interface between the original and the carbon layer. it can.

  Further, the present invention provides a method for producing a mold for forming a fine structure having the above-described configuration, in which a mold release layer is formed on the surface of the original pattern after forming the original mold and before forming the carbon layer. After the electroplating metal layer is formed, the interface between the original mold and the release layer is peeled off.

  The release layer is a layer made of a release agent and is formed by coating or vapor deposition. When this release layer is formed on the original concave / convex pattern forming surface, the release property between the original mold and the carbon film can be improved, so that the productivity of the mold material for forming a fine structure can be increased.

  Further, the present invention provides a method for producing a mold for forming a fine structure having the above-described structure, after forming the original mold and before forming the carbon layer, forming a soluble film on the concave / convex pattern forming surface of the original mold, After the electroplating metal layer was formed, the soluble film was dissolved, and the interface with the carbon layer was peeled off from the prototype.

  A soluble film | membrane is a film | membrane which can melt | dissolve at an acid or high temperature, without damaging a prototype and the mold material for fine structure shaping | molding. When this soluble film is formed on the surface of the original concavo-convex pattern, the releasability between the original and the carbon film can be improved, so that the productivity of the mold for forming a fine structure can be increased.

  Further, regarding the method of forming a fine structure, the present invention relates to a carbon layer having a required uneven pattern formed on the surface, and an electroplated metal formed directly or via a conductive metal layer on the back side of the carbon layer. A mold for forming a fine structure having a layer is used, and a molding material for the fine structure is pressed against the uneven pattern, and the uneven pattern is transferred to the fine structure. A sol-gel material or a polymer composition can be used as the molding material for the microstructure.

  Thus, a microstructure forming mold material having a carbon layer having a required uneven pattern formed on the surface and an electroplating metal layer formed directly or via a conductive metal layer on the back side of the carbon layer. When the microstructure is molded, the molding surface of the molded product is formed by the carbon layer. Therefore, when a chemically reactive material such as a sol-gel material or a polymer composition is used as the molding material In addition, the peelability of the molded product can be improved, and a fine structure having a fine concavo-convex pattern can be produced with high efficiency. In addition, since the required concavo-convex pattern is formed on the surface of the carbon layer, the concavo-convex pattern to be transferred is not disturbed, and a high-performance fine structure can be manufactured. Furthermore, since the electroplating metal layer is formed on the back surface side of the carbon layer, the mechanical strength of the mold material is high, and a large number of fine structures can be stably manufactured.

  Since the molding surface of the microstructure of the present invention is formed by a carbon layer, the molding material is formed of a chemically reactive material such as a sol-gel material or a polymer composition. In addition, the peelability of the molded product can be improved, and a fine structure having a fine concavo-convex pattern can be produced with high efficiency. Moreover, since a required uneven | corrugated pattern is formed in the surface of a carbon layer, it does not produce disorder in the uneven | corrugated pattern to transfer, but can manufacture a highly efficient fine structure. Furthermore, since the electroplated metal layer is formed on the back side of the carbon layer, the mechanical strength of the mold material can be increased, and a large number of microstructures can be stably produced.

  In the method for producing a mold for forming a microstructure of the present invention, after forming a carbon layer having a required layer thickness on the surface of the original concavo-convex pattern, the interface between the master and the carbon layer is peeled off. A required uneven pattern can be formed.

  The method for forming a microstructure of the present invention includes a carbon layer having a predetermined uneven pattern formed on the surface and an electroplated metal layer formed directly or via a conductive metal layer on the back side of the carbon layer. Since the microstructure is formed using the mold for forming the microstructure, a high-performance microstructure having a fine uneven pattern can be manufactured with high efficiency.

  Hereinafter, an embodiment of a mold for forming a microstructure according to the present invention will be described with reference to FIGS. 1 is a cross-sectional view of a mold for forming a fine structure according to the first embodiment, FIG. 2 is a cross-sectional view of a mold for forming a fine structure according to the second embodiment, and FIG. 3 is a fine structure according to the third embodiment. FIG. 4 is a cross-sectional view of a mold for molding a microstructure according to the fourth embodiment.

  As shown in FIGS. 1 to 4, the microstructure forming molds 1 </ b> A to 1 </ b> D according to the present invention each have a carbon layer 2 having a required uneven pattern 2 a formed on the surface, and a back surface of the carbon layer 2. It is mainly composed of an electroplating metal layer 3 formed on the side. As shown in FIG. 1, the microstructure forming mold material 1 </ b> A according to the first embodiment has an electroplating metal layer 3 on the back surface of the carbon layer 2 formed thicker than the step size d of the uneven pattern 2 a. Are formed directly without any other film, and the microstructure forming mold material 1B according to the second embodiment is thicker than the step size d of the uneven pattern 2a as shown in FIG. An electroplated metal layer 3 is formed on the back surface of the formed carbon layer 2 via a conductive metal layer 4. In addition, as shown in FIG. 3, the microstructure forming mold 1C according to the third embodiment has an electroplated metal layer on the back surface of the carbon layer 2 formed thinner than the step size d of the uneven pattern 2a. 3 is formed directly without any other film, and in the microstructure forming mold material 1D according to the fourth embodiment, as shown in FIG. 4, a release layer 5 is formed on the surface layer portion of the concavo-convex pattern 2a. In addition, an electroplating metal layer 3 is formed on the back surface of the carbon layer 2 via a conductive metal layer 4.

  The carbon layer 2 is formed of DLC or graphite, and the electroplating metal layer 3 is formed of nickel or a nickel alloy. When the carbon layer 2 is formed with a conductor such as graphite, the electroplated metal layer 3 can be directly formed on the back surface of the conductive carbon layer 2 as a cathode. On the other hand, when the carbon layer 2 is formed with a nonconductor such as DLC, the conductive metal layer 4 is sputtered on the back surface of the carbon layer 2, and the back surface of the conductive metal layer 4 is used as a cathode. An electroplated metal layer 3 is formed on the substrate. The conductive metal layer 4 is formed of the same metal material as the metal material forming the electroplating metal layer 3. The release layer 5 is formed of a metal film such as a gold film or a gold alloy film, or an organic material such as stearic acid monoglyceride.

  Next, an embodiment of a method for producing a microstructure forming mold according to the present invention and a method for forming a microstructure using the microstructure forming mold according to the present invention will be described with reference to FIGS. 5 and 6. . FIG. 5 is a flowchart showing a method for producing a microstructure forming mold 1A according to the first embodiment and a method for forming a microstructure using the same, and FIG. 6 is a mold for forming a microstructure according to the fourth embodiment. It is a flowchart which shows the manufacturing method of 1D, and the shaping | molding method of the fine structure using the same.

  In the production of the microstructure forming mold 1A according to the first embodiment, first, as shown in FIG. 5A, a prototype 11 having a required uneven pattern 11a formed on the surface is produced. This prototype 11 is produced by processing a silicon wafer or the like. Next, conductive carbon 12 such as graphite is deposited on the surface of the original pattern 11 by the vapor deposition method, and as shown in FIG. A thick carbon layer 2 is formed. Next, nickel or nickel alloy 13 is electroplated (electroformed) using the conductive carbon layer 2 as a cathode, and as shown in FIG. A plated metal layer 3 is formed. Thereafter, the interface between the concavo-convex pattern 11a and the carbon layer 2 is peeled off, thereby obtaining the microstructure forming mold material 1A shown in FIG. 5 (d).

  In forming a microstructure using the mold material 1A, as shown in FIG. 5 (e), the molding material 15 is uniformly spread between the uneven pattern 2a of the mold material 1A and the flat substrate 14. After stretching and solidifying the molding material 15, the interface between the mold material 1A and the molding material 15 is peeled off. As a result, as shown in FIG. 5 (f), a microstructure 10 </ b> A is obtained that is composed of the substrate 14 and the molding material 15 and in which the concave / convex pattern 11 a of the prototype 11 is replicated on the molding material 15.

  In producing the microstructure forming mold material 1D according to the fourth embodiment, first, as shown in FIG. 6A, a prototype 11 having a required uneven pattern 11a formed on the surface is produced. Next, as shown in FIG. 6 (b), a release agent 21 such as stearic acid monoglyceride is uniformly applied to the concave / convex pattern forming surface of the original 11 to form a required release layer 5. Next, non-conductive carbon 22 such as DLC is deposited on the release layer 5 by the vapor deposition method, and as shown in FIG. 6C, the thickness is larger than the step size d of the concavo-convex pattern 2a. A meat carbon layer 2 is formed. Next, a conductive metal 23 is sputtered on the nonconductive carbon layer 2 to form a required conductive metal layer 4 on the back surface of the carbon layer 2 as shown in FIG. Next, nickel or a nickel alloy 13 is electroplated (electroformed) using the conductive metal layer 4 as a cathode, and the conductive metal layer 4 is interposed on the back side of the carbon layer 2 as shown in FIG. Thus, the electroplated metal layer 3 having a required thickness is formed. Thereafter, the interface between the concavo-convex pattern 11a and the carbon layer 2 is peeled to obtain a microstructure forming mold 1D shown in FIG. 6 (f).

  In forming a microstructure using the mold material 1D, as shown in FIG. 6G, the molding material 15 is uniformly spread between the uneven pattern 2a of the mold material 1D and the flat substrate 14. After stretching and solidifying the molding material 15, the interface between the mold material 1D and the molding material 15 is peeled off. As a result, as shown in FIG. 6 (h), a microstructure 10D is obtained which is composed of the substrate 14 and the molding material 15 and in which the concave / convex pattern 11a of the prototype 11 is replicated on the molding material 15.

Instead of the release layer 5, a soluble film such as SiO ₂ can be formed on the concave / convex pattern forming surface of the master 11. Also, a method for producing a microstructure forming mold 1B according to the second embodiment, a method for producing a microstructure forming mold 1C according to the third embodiment, and a microstructure using each of these molds 1B and 1C. The manufacturing method can be easily implemented by applying each of the above-described techniques, and thus the description thereof is omitted.

  Hereinafter, more specific examples and comparative examples will be given to clarify the effects of the present invention.

<Example 1>
As a prototype, a Si wafer in which grooves having a line width of 0.4 μm and a depth of 0.2 μm are formed at equal intervals is used, and a 0.3 μm-thick graphite film is vacuumed as a carbon layer on the groove forming surface of the Si wafer. It formed with the vapor deposition apparatus. The film formation of the graphite film was performed under the conditions shown in the column of Example 1 in FIG.

  Next, electrolytic plating was performed in a sulfamic acid Ni solution to form a 0.3 mm thick Ni electroplated film as an electroplated metal layer on the graphite film. The carbon film on which this Ni electroplating film was formed was peeled off from the Si wafer, and a mold material for forming a microstructure having an original inverted pattern formed on one side was produced.

  Next, after diluting phenyltriethoxysilane and dimethyldiethoxysilane with ethyl alcohol, the solution hydrolyzed with an aqueous acid solution was poured into the mold with the molding surface facing upward, and heated to form a sol-gel. A borosilicate glass plate was placed on top and heated to 200 ° C. for 30 minutes to cure the sol-gel material. The sol-gel material was naturally air-cooled and then released from the mold material to obtain a molded product in which the same groove pattern as that of the original mold was formed on one side.

<Example 2>
As a prototype, a Ni plate in which lenticular projections having a diameter of 40 μm and a height of 4 μm are arranged at equal intervals in the vertical and horizontal directions is used, and a SiO ₂ film having a thickness of 0.1 μm is formed as a soluble film on the projection forming surface of the Ni plate. It formed with the RF sputtering apparatus. Subsequently, a DLC film having a thickness of 1 μm was formed as a carbon layer using a plasma CVD apparatus. Further on this, an Ni film having a thickness of 0.1 μm was formed as an electroplating metal layer by an RF sputtering apparatus. The film forming conditions for each film are shown in the column of Example 2 in FIG.

Next, electrolytic plating was performed in a sulfamic acid Ni solution using the Ni film as an electrode to form a Ni electroplated film having a thickness of 0.3 mm. The DLC film with the Ni electroplated film was peeled off from the Ni plate by dissolving the SiO ₂ film in an HF solution, and a mold member for forming a microstructure having an original inverted pattern formed on one side was produced.

  A plate-shaped Sumita Optical Glass K-PG375 (dislocation point Tg = 343 ° C.) having a thickness of 0.5 mm is placed on the heater, and the glass plate and the mold are heated to 375 ° C. Was pressed for 5 minutes, cooled to 200 ° C., and then the mold was released to prepare a microlens array.

<Example 3>
As a prototype, an Si wafer in which grooves having a line width of 0.4 μm and a depth of 0.2 μm are formed at equal intervals is used, and an Au film having a thickness of 0.1 μm is formed as a peeling layer on the groove forming surface of the Si wafer. It formed with the sputtering device. Subsequently, a DLC film having a thickness of 1 μm was formed as a carbon layer with the same RF sputtering apparatus. Subsequently, a Ni film having a thickness of 0.1 μm was formed as a conductive metal film on the same RF sputtering apparatus. The film forming conditions for each film are shown in the column of Example 3 in FIG.

  Next, the Ni film was used as an electrode for electrolytic plating in a sulfamic acid Ni solution to form a 0.3 mm thick Ni electroplated film as an electroplated metal layer. The interface between the Si wafer and the Au film was peeled off, and a mold material for forming a fine structure having an original inverted pattern formed on one side was produced.

A plate-like polycarbonate having a thickness of 0.6 mm (transition point Tg = 130 ° C.) is placed on the heater, and the glass plate and the mold are heated to 210 ° C. with a pressing pressure of 10 kg / cm ^2. After pressing for a minute and cooling to 100 ° C., the mold was released from the mold material to obtain a molded product in which the same groove pattern as the original mold was formed on one side.

<Example 4>
As a prototype, an Si wafer in which grooves having a line width of 0.4 μm and a depth of 0.2 μm are formed at equal intervals is used, and stearic acid monoglyceride as a mold release agent is added to an acetone solvent on the groove forming surface of the Si wafer. A solution in which about 1 wt% was dissolved was spin-coated.

  Subsequently, a DLC film having a thickness of 1 μm was formed as a carbon layer with the same RF sputtering apparatus. Subsequently, a Ni film having a thickness of 0.1 μm was formed as a conductive metal film on the same RF sputtering apparatus. The film forming conditions for each film are shown in the column of Example 4 in FIG.

  Next, the Ni film was used as an electrode for electroplating in a sulfamic acid Ni solution to form a 0.3 mm thick Ni electroformed film as an electroplated metal layer. The interface between the Si wafer and the release layer was peeled off, and a mold material for forming a microstructure having an original reversal pattern formed on one side was produced.

A plate-like polycarbonate (transition point Tg = 130 ° C.) having a thickness of 0.6 mm is placed on the heater, and the glass plate and the mold material are heated to 210 ° C. with a pressing pressure of 10 kg / cm ² , and the mold material is pressed for 5 minutes. After cooling to 100 ° C., the mold was released from the mold material to obtain a molded product in which the same groove pattern as the original mold was formed on one side.

<Example 5>
As a prototype, a Si wafer in which grooves having a line width of 0.4 μm and a depth of 0.2 μm are formed at equal intervals is used, and a 0.1 μm thick SiO ₂ film is formed as a soluble film on the groove forming surface of the Si wafer. It formed with the RF sputtering apparatus. Subsequently, a fluorine-containing DLC film having a thickness of 0.2 μm was formed as a carbon layer using a plasma CVD apparatus. Further on this, an Ni film having a thickness of 0.1 μm was formed as a conductive metal film by an RF sputtering apparatus. The film forming conditions for each film are shown in the column of Example 5 in FIG.

Next, the Ni film was used as an electrode for electrolytic plating in a sulfamic acid Ni solution to form a 0.3 mm thick Ni electroplated film as an electroplated metal layer. The DLC film with the Ni electroplated film was peeled off from the Si wafer by dissolving the SiO ₂ film in an HF solution, and a mold member for forming a microstructure having an original inverted pattern formed on one side was produced.

  A solution obtained by mixing epoxy silane, methacryloxy silane, and titanium alkoxide at a molar ratio of 90: 5: 5 is allowed to react, and 25 mol% of a methacrylate monomer and a peroxide polymerization catalyst are added thereto to further promote the reaction. A viscous solution was prepared. This viscous solution was poured onto the mold material with the molding surface facing upward, a borosilicate glass plate was placed on top, and heated to 140 ° C. for 30 minutes to cure the sol-gel material. The sol-gel material was naturally air-cooled and then released from the mold material to obtain a molded product in which the same groove pattern as that of the original mold was formed on one side.

<Comparative example 1>
A Si wafer having a groove structure in which the direction of unevenness is reversed from that of Example 1 was used as a prototype, and a graphite film having a thickness of 0.05 μm was formed as a carbon layer on the surface by a vacuum deposition apparatus. The graphite film was formed under the conditions shown in Comparative Example 1 in FIG. 7, and this was used as a mold material.

  After diluting phenyltriethoxysilane and dimethyldiethoxysilane with ethyl alcohol, the solution hydrolyzed with an aqueous acid solution is poured onto the mold with the molding surface facing upward, and heated to form a sol-gel. A borosilicate glass plate was placed on top and heated to 200 ° C. for 30 minutes to cure the sol-gel material. The sol-gel material was naturally air-cooled and then released from the mold material to obtain a molded product in which the same groove pattern as that of the original mold was formed on one side.

<Comparative example 2>
A DLC film having a thickness of 0.6 μm was formed as a carbon layer on the Si wafer using a plasma CVD apparatus. Next, electron beam machining was performed on the DLC film to produce a mold material in which grooves having a line width of 0.4 μm and a depth of 0.2 μm were arranged at equal intervals.

A plate-like polycarbonate having a thickness of 0.6 mm (transition point Tg = 130 ° C.) is placed on the heater, and the glass plate and the mold material are heated to 210 ° C. at a press pressure of 10 kg / cm ² for 5 minutes. After pressing and cooling to 100 ° C., the mold was released from the mold material to obtain a molded product in which the same groove pattern as the original mold was formed on one side.

<Comparative Example 3>
An attempt was made to produce a mold for forming a fine structure in the same manner as in Example 2 except that the SiO ₂ film, which is a soluble film, was not formed on the original Ni plate.

<Comparative example 4>
A microstructured molded article was obtained in the same manner as in Example 3 except that a 0.3 μm thick graphite film was formed by vacuum deposition instead of forming a DLC film on the Au film as the release layer. The film formation of the graphite film was performed by an electron beam evaporation method under conditions of an ultimate vacuum of 5 × 10 ⁻⁶ Torr, a vacuum during film formation of 4 × 10 ⁻⁴ Torr, and a film formation rate of 1 nm / sec.

<Comparative Example 5>
A mold having a microstructure in the same manner as in Example 5 except that a DLC film not containing fluorine having a thickness of 0.2 μm was formed instead of forming a fluorine-containing DLC film continuously on the SiO ₂ film. Was made. Subsequently, a microstructured molded product was molded in the same manner as in Example 4.

  In FIG. 8, for Examples 1 to 5 and Comparative Examples 1 to 5, the releasability indicating whether or not the molding material can be successfully released from the mold during molding, and whether or not the mold shape can be successfully transferred during molding. It summarizes the moldability shown, the repeated durability showing how many times the molding can be repeated with the same mold, and the mass productivity when mass-producing molds.

  As is apparent from this figure, Examples 1 to 5 are all excellent in releasability, moldability, and repeated durability. On the other hand, in Comparative Example 1, the carbon film provided on the surface of the Ni mold cannot cope with the complicated surface shape of the mold, and a uniform film cannot be formed. There was a problem. In Comparative Example 2, since the DLC film is directly electron beam processed, a mold having excellent mold releasability, moldability, and repeated durability was obtained, but the mold productivity was poor. In Comparative Example 3, the DLC film provided on the Ni base material did not peel from the Ni base material, and the mold itself could not be produced. In Comparative Example 4, polycarbonate, which must be molded in a relatively high viscosity state with respect to the graphite mold, was used as a molding material. However, although there was no problem in molding itself, there was a problem in repeated durability. In Comparative Example 5, the release of the DLC film on the mold surface was insufficient with respect to the highly reactive organic-inorganic hybrid sol-gel material, so that the molding material could not be released successfully.

It is sectional drawing of the mold material for fine structure shaping | molding which concerns on 1st Embodiment. It is sectional drawing of the mold material for fine structure shaping | molding which concerns on 2nd Embodiment. It is sectional drawing of the mold material for fine structure shaping | molding which concerns on 3rd Embodiment. It is sectional drawing of the mold material for fine structure shaping | molding which concerns on 4th Embodiment. It is a flowchart which shows the preparation method of the mold material 1A for fine structure shaping | molding which concerns on 1st Embodiment, and the shaping | molding method of a fine structure using the same. It is a flowchart which shows the preparation method of the mold material 1D for fine structure shaping | molding which concerns on 4th Embodiment, and the shaping | molding method of a fine structure using the same. It is a table | surface figure which shows the film-forming conditions of each film | membrane concerning an Example and a comparative example. It is a table | surface figure which compares and shows the mold release property, moldability, repetition durability, and mass-productivity of each type | mold material which concerns on an Example and a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A-1D Mold material for fine structure shaping | molding 2 Carbon layer 2a Concavity and convexity pattern 3 Electroplating metal layer 4 Conductive metal layer 5 Release layer 11 Prototype 14 Substrate

Claims (9)

  It has a carbon layer having a required concavo-convex pattern formed on the surface, and an electroplated metal layer formed directly or via a conductive metal layer on the back side of the carbon layer. Mold material.   The mold material for forming a fine structure according to claim 1, wherein the carbon layer is made of diamond-like carbon or graphite.   The mold for molding a fine structure according to claim 1, wherein a release layer is present in a surface layer portion of the carbon layer.   2. The mold for forming a fine structure according to claim 1, wherein a thickness of the carbon layer is thicker than a level difference of the uneven pattern.   A step of producing a prototype in which a required concavo-convex pattern is formed on the surface, a step of forming a carbon layer of a required layer thickness on the concavo-convex pattern forming surface of the original, and a conductive metal layer directly or on the carbon layer. A step of forming an electroplating metal layer via, and a step of peeling the interface between the prototype and the carbon layer to obtain a mold for molding a fine structure in which the carbon layer and the electroplating metal layer are integrated. A method for producing a mold for forming a microstructure, comprising:   After forming the prototype, before forming the carbon layer, a release layer is formed on the concave / convex pattern forming surface of the prototype, and after forming the electroplated metal layer, the interface between the prototype and the release layer. The method for producing a mold for forming a microstructure according to claim 5, wherein:   After forming the prototype, before forming the carbon layer, form a soluble film on the concave / convex pattern forming surface of the prototype, and after forming the electroplated metal layer, dissolve the soluble film, The method for producing a mold for forming a microstructure according to claim 5, wherein the interface with the carbon layer is peeled off.   Using a mold for forming a fine structure having a carbon layer having a required concavo-convex pattern formed on the surface and an electroplating metal layer formed directly or via a conductive metal layer on the back side of the carbon layer, A method for forming a fine structure, comprising pressing a molding material for the fine structure against the concavo-convex pattern, and transferring the concavo-convex pattern to the fine structure.   4. The method for forming a microstructure according to claim 3, wherein the molding material for the microstructure is a sol-gel material or a polymer composition.

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