CN107394558B - Impression block and the method that micro-structure is formed on the coating of conductive terminal - Google Patents
Impression block and the method that micro-structure is formed on the coating of conductive terminal Download PDFInfo
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- CN107394558B CN107394558B CN201610327026.6A CN201610327026A CN107394558B CN 107394558 B CN107394558 B CN 107394558B CN 201610327026 A CN201610327026 A CN 201610327026A CN 107394558 B CN107394558 B CN 107394558B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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Abstract
The method that the invention discloses a kind of to form micro-structure on the coating of conductive terminal, comprising the following steps: manufacture an impression block, be formed with the first micro-structure on the surface of the impression block；It is imprinted with coating of the impression block to conductive terminal, to form second micro-structure complementary with the first micro-structure on the impression block on the surface of the coating.In addition, the first micro-structure is formed on the surface of the impression block the invention also discloses a kind of impression block, to be suitable for imprinting out second micro-structure complementary with first micro-structure on the coating of conductive terminal with the impression block.In the present invention, micro-structure is directly imprinted out on the coating of conductive terminal by impression block, easy to operate, moreover, it can be used repeatedly for the impression block, cost is very cheap.
Description
Technical field
Micro-structure is formed on the coating of conductive terminal the present invention relates to a kind of impression block and using the impression block
Method.
Background technique
In the prior art, in order to improve electric connector conductive terminal electric property, generally require in conductive terminal
Surface on one layer of gold, silver, tin or its alloy layer are electroplated.For tin and tin alloy coat, in actual application, meeting exists
Oxide layer is formed on the surface of coating, which can reduce the electric property of conductive terminal, for example, will increase conductive terminal
Surface contacted resistance.Therefore, in practical applications, need to apply biggish positive pressure in conductive terminal to remove tin and tin
Oxide layer on the surface of alloy layer.But with the micromation of electric connector, the conductive terminal of connector is smaller and smaller,
It is difficult to obtain enough positive pressures, so that the application of tin and tin alloy coat has received very big limitation.
In the prior art, in order to which the surface contacted resistance for reducing conductive terminal (is applied with the contact engaging and separating force for reducing conductive terminal
The positive pressure being added in conductive terminal is bigger, and contact engaging and separating force is bigger), need the surface to tin and tin alloy coat to modify,
For example, processing micro-structure on the surface of tin and tin alloy coat using laser, this can meet reduction conductive terminal simultaneously
Surface contacted resistance and reduce conductive terminal contact engaging and separating force requirement.
But laser processing technology is complex, it is difficult to the dimensional accuracy and shape for the micro-structure for controlling, and processing
Shape precision is poor, and higher cost.
Summary of the invention
The purpose of the present invention aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect.
It is an object of the present invention to provide a kind of impression block and with the impression block conductive terminal coating
The upper method for forming micro-structure, can directly imprint out micro-structure on the coating of conductive terminal by impression block, operate
It is convenient, it is low in cost.
According to an aspect of the present invention, a kind of method forming micro-structure on the coating of conductive terminal is provided, including
Following steps:
S100: an impression block is manufactured, is formed with the first micro-structure on the surface of the impression block；With
S200: being imprinted with coating of the impression block to conductive terminal, so as to the shape on the surface of the coating
At second micro-structure complementary with the first micro-structure on the impression block.
The embodiment of an exemplary according to the present invention, the step S100 the following steps are included:
S110: a silicon template is provided, is formed with micro-structure on the surface of the silicon template；
S120: using the silicon template as mold, manufacturing a polymer template, thus by the micro-structure in the silicon template
It is transferred on the surface of the polymer template；
S130: the polymer template formation have micro-structure surface on formed one layer of hard alloy layer, thus will
On microstructure transfer printing to the hard alloy layer on the polymer template；
S140: the polymer template for being formed with the hard alloy layer being immersed into metal plating liquid and carries out electroforming, with
Just cast is powered on into a metal substrate in the hard alloy layer；With
S150: removing the polymer template, to obtain the pressure with the hard alloy layer and the metal substrate
Die plate, the micro-structure on the hard alloy layer constitute the first micro-structure of the impression block.
The embodiment of another exemplary according to the present invention, the micro-structure on the surface of the silicon template use photoetching work
Skill is formed.
The embodiment of another exemplary according to the present invention is formed in the silicon template described poly- using spin coating proceeding
Object template is closed, or the polymer template is formed in the silicon template using molding process.
The embodiment of another exemplary according to the present invention, the polymer template are made of dimethyl silicone polymer.
The embodiment of another exemplary according to the present invention, using physical gas-phase deposition in the polymer template
Surface on form the hard alloy layer.
The thickness of the embodiment of another exemplary according to the present invention, the hard alloy layer is uniform, and the hard
Alloy-layer with a thickness of 20 nanometers to 50 nanometers.
The embodiment of another exemplary according to the present invention, the hard alloy layer include that bianry alloy or ternary are closed
Gold.
The embodiment of another exemplary according to the present invention, the hard alloy layer include Ti-W alloy, Cr-W alloy
Or Ti-Cr-W alloy.
The embodiment of another exemplary according to the present invention, the metal plating liquid is nickel electroforming solution, so that electroforming shape
At metal substrate be ni substrate.
The embodiment of another exemplary according to the present invention is carried out with coating of the impression block to conductive terminal
When coining, it is 50Mpa to 200Mpa that the impression block, which is applied to the pressure on the coating of conductive terminal, and keeps the pressure
Time be 5s to 300s.
According to another aspect of the present invention, a kind of impression block is provided, it is characterised in that:
The first micro-structure is formed on the surface of the impression block, to be suitable for the impression block in conductive terminal
Coating on imprint out second micro-structure complementary with first micro-structure.
The embodiment of an exemplary according to the present invention, the impression block include: metal substrate, are formed on surface
There is micro-structure；And hard alloy layer, it is formed on the surface with the micro-structure of the metal substrate, wherein described hard
Matter alloy-layer has micro-structure corresponding with the micro-structure on the metal substrate, the micro-structure conduct on the hard alloy layer
First micro-structure of the impression block.
The hardness of the embodiment of another exemplary according to the present invention, the hard alloy layer is greater than the metal substrate
Hardness, and the hardness of the metal substrate be greater than the conductive terminal coating hardness.
The embodiment of another exemplary according to the present invention, the metal substrate are made of nickel, the hard alloy layer
It is made of the hard alloy that hardness is greater than nickel.
The embodiment of another exemplary according to the present invention, the hard alloy include that bianry alloy or ternary are closed
Gold.
The embodiment of another exemplary according to the present invention, the hard alloy include Ti-W alloy, Cr-W alloy or
Ti-Cr-W alloy.
In the embodiment of aforementioned each exemplary according to the present invention, through impression block on the coating of conductive terminal
Micro-structure directly is imprinted out, easy to operate, moreover, it can be used repeatedly for the impression block, cost is very cheap.
By the description made for the present invention of below with reference to attached drawing, other objects and advantages of the present invention will be aobvious and easy
See, and can help that complete understanding of the invention will be obtained.
Detailed description of the invention
Fig. 1 shows the stereoscopic schematic diagram of the silicon template of the embodiment of an exemplary according to the present invention；
Fig. 2 shows silicon template cross-sectional view shown in FIG. 1；
Fig. 3 shows the schematic diagram that polymer template is manufactured using Fig. 1 and silicon template shown in Fig. 2 as mold；
Fig. 4 shows the cross-sectional view of manufactured the polymer template in Fig. 3；
Fig. 5 shows that the formation of polymer template shown in Fig. 4 has to be formed on the surface of micro-structure and has become hard alloy layer
Schematic diagram；
Fig. 6 shows the schematic diagram that hard alloy layer shown in Fig. 4 powers on cast into metal substrate；
Fig. 7 shows the schematic diagram of the impression block of the embodiment of an exemplary according to the present invention；
Fig. 8 shows the schematic diagram for imprinting micro-structure on the coating of conductive terminal with impression block shown in Fig. 7；
Fig. 9 shows the cross-sectional view that the conductive terminal of micro-structure is had been imprinted on coating；With
Figure 10 shows the stereoscopic schematic diagram that the conductive terminal of micro-structure is had been imprinted on coating.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.Illustrating
In book, the same or similar drawing reference numeral indicates the same or similar component.Following reference attached drawings are to embodiment of the present invention
Illustrate to be intended to explain present general inventive concept of the invention, and is not construed as to a kind of limitation of the invention.
In addition, in the following detailed description, to elaborate many concrete details to provide to present disclosure convenient for explaining
The comprehensive understanding of embodiment.It should be apparent, however, that one or more embodiments without these specific details can also be with
It is carried out.In other cases, well known construction and device is diagrammatically embodied to simplify attached drawing.
General technical design according to the present invention, provides a kind of side that micro-structure is formed on the coating of conductive terminal
Method, comprising the following steps: manufacture an impression block, be formed with the first micro-structure on the surface of the impression block；With with institute
Impression block is stated to imprint the coating of conductive terminal, so as on the surface of the coating formed with the impression block on
The complementation of the first micro-structure the second micro-structure.
Another general technical design according to the present invention, provides a kind of impression block, on the surface of the impression block
On be formed with the first micro-structure, thus be suitable for imprinted out on the coating of conductive terminal with the impression block and described first micro- knot
Second micro-structure of structure complementation.
Fig. 7 shows the schematic diagram of the impression block 300,400 of the embodiment of an exemplary according to the present invention.
As shown in fig. 7, in the illustrated embodiment, being formed with the first micro-structure on the surface of impression block 300,400
310。
Fig. 8 display imprints micro-structure with impression block 300,400 shown in Fig. 7 on the coating 510 of conductive terminal 500
Schematic diagram.Fig. 9 shows the cross-sectional view that the conductive terminal 500 of micro-structure 501 is had been imprinted on coating 510；Coating is shown with Figure 10
The stereoscopic schematic diagram of the conductive terminal 500 of micro-structure 501 is had been imprinted on 510.
As shown in Figure 7 to 10, it can use impression block shown in Fig. 7 300,400 in the coating to conductive terminal 500
510 imprint out second micro-structure 501 complementary with aforementioned first micro-structure 310 directly on a surface.
In the embodiment of an example of the present invention, coating 510 can be the gold being formed in conductive terminal 500,
Silver or tin coating or the alloy layer comprising gold, silver or tin.
In the illustrated embodiment, the first micro-structure 310 on the surface of impression block 300,400 is formed in as protrusion knot
Structure, the second micro-structure 501 being stamped on the coating 510 of conductive terminal 500 are bowl configurations.But the present invention is not limited to
The embodiment of diagram, for example, being formed in the table of impression block 300,400 in the embodiment of another exemplary of the invention
The first micro-structure 310 on face can be bowl configurations, the second micro-structure 501 being stamped on the coating 510 of conductive terminal 500
It can be bulge-structure.
In the embodiment of an example of the present invention, if Fig. 7 and Fig. 8 are clearly illustrated, the impression block 300,400
It mainly include metal substrate 400 and hard alloy layer 300.Micro-structure 410 is formed on the surface of metal substrate 400.Hard
Alloy-layer 300 is formed on the surface with micro-structure 410 of metal substrate 400.In this way, hard alloy layer 300 just have with
The corresponding micro-structure 310 of micro-structure 410 on metal substrate 400.The micro-structure 310 on hard alloy layer 300 is as coining
Aforementioned first micro-structure of template 300,400.
Typically, the material price of hard alloy layer 300 is significantly larger than the material price of metal substrate 400, therefore, is
Cost is reduced, only forms a thin layer hard alloy layer 300 on the surface of metal substrate 400.In an example of the present invention
In the embodiment of property, metal substrate 400 can be made of the higher metal of cheap and hardness, for example, nickel.Hard alloy layer
300 can be made of the alloy of hard metal substrate 400, for example, can be made of the hard alloy that hardness is greater than nickel.
In the embodiment of an example of the present invention, aforementioned hard alloy layer 300 can be by bianry alloy or three
First alloy is made, for example, Ti-W alloy, Cr-W alloy or Ti-Cr-W alloy.
In the embodiment of an example of the present invention, the thickness of hard alloy layer 300 is uniform, and hard alloy layer
300 with a thickness of 20 nanometers to 50 nanometers.
In the embodiment of an example of the present invention, the hardness of hard alloy layer 300 should be greater than metal substrate 400
Hardness, and the hardness of metal substrate 400 should be greater than conductive terminal 500 coating 510 hardness.In this way, can be
The second micro-structure 501 is easily imprinted out on the coating 510 of conductive terminal 500.
Illustrate the coating using aforementioned impression template 300,400 in conductive terminal 500 below with reference to Fig. 7 to Figure 10
The method that micro-structure 501 is formed on 510, this method mainly comprise the steps that
S100: an impression block 300,400 is manufactured, is formed with the first micro-structure on the surface of impression block 300,400
310, as shown in Figure 7；With
S200: it is imprinted with coating 510 of the impression block 400 to conductive terminal 500, so as on the surface of coating 510
It is upper to form second micro-structure 501 complementary with the first micro-structure 310 on impression block 300,400, as shown in Fig. 8 to Figure 10.
In the embodiment of an example of the present invention, in the coating 510 with impression block 400 to conductive terminal 500
When being imprinted, impression block 400, which is applied to the pressure on the coating 510 of conductive terminal 500, to be 50Mpa to 200Mpa,
And the time for keeping the pressure can be 5s to 300s.It note that the pressure and the time needs for keeping the pressure that coining is
It adjusts according to the actual situation.In addition, it is necessary to which explanation, aforementioned impression can be carried out in room temperature or at room temperature, without to conduction
Terminal 500 heats, and therefore, operation is very easy.
Illustrate the process for manufacturing aforementioned impression template 300,400 below with reference to Fig. 1 to Fig. 7.
Firstly, as depicted in figs. 1 and 2, a silicon template 100 as depicted in figs. 1 and 2 is provided, in the silicon template 100
Micro-structure 110 is formed on surface.Micro- knot in the embodiment of an example of the present invention, on the surface of silicon template 100
Structure 110 can be formed using photoetching process.In the illustrated embodiment, the micro-structure 110 on the surface of silicon template 100 is protrusion
Structure, still, the present invention are not limited to the embodiment of diagram, micro-structure 110 or recess on the surface of silicon template 100
Structure.
Then, as shown in Figure 3 and Figure 4, it is mold with silicon template 100, a polymer template 200 is manufactured, thus by silicon
Micro-structure 110 in template 100 is transferred on the surface of polymer template 200.In this way, as shown in Figure 3 and Figure 4, so that it may
The micro-structure 210 complementary with the micro-structure 110 in silicon template 100 is formed on the surface of polymer template 200.
In the embodiment of an example of the present invention, polymerization can be formed in silicon template 100 using spin coating proceeding
Object template 200, or polymer template 200 can be formed in silicon template 100 using molding process.
In the embodiment of an example of the present invention, aforementioned polymer template 200 can be by dimethyl silicone polymer
Or other any suitable polymer materials are made.
Then, as shown in figure 5, polymer template 200 formation have micro-structure 210 surface on form one layer of hard and close
Layer gold 300, so that the micro-structure 210 on polymer template 200 is transferred on hard alloy layer 300.In this manner it is possible to hard
The micro-structure 310 complementary with the micro-structure 210 on polymer template 200 is formed on matter alloy-layer 300.
It, can be using physical gas-phase deposition in polymer template in the embodiment of an example of the present invention
Hard alloy layer 300 is formed on 200 surface.
In the embodiment of an example of the present invention, the thickness of hard alloy layer 300 is uniform, and hard alloy layer
300 with a thickness of 20 nanometers to 50 nanometers.Hard alloy layer 300 can be made of bianry alloy or ternary alloy three-partalloy, for example, firmly
Matter alloy-layer can be made of Ti-W alloy, Cr-W alloy or Ti-Cr-W alloy.
Then, the polymer template 200 for being formed with hard alloy layer 300 is immersed into metal plating liquid and carries out electroforming,
To power on cast at a metal substrate 400, as shown in Figure 6 in hard alloy layer 300.
In the embodiment of an example of the present invention, aforementioned metal electroforming solution can be nickel electroforming solution, in this way, electroforming
The metal substrate 400 of formation can be ni substrate.
Finally, as shown in fig. 7, polymer template 200 is removed, so that obtaining has hard alloy layer 300 and metal substrate
It is first micro- to constitute impression block 300,400 for 400 impression block 300,400, the micro-structure 310 on the hard alloy layer 300
Structure.
Of the invention one is characterized by: there is the impression block of micro-structure to contact coating in the metal of conductive terminal for application
(gold, silver, tin and its alloy layer) is imprinted out micro-structure (referred to as nanometer embossing) directly on a surface, thus, gold
The complete micro-structure of pattern is prepared on the metal contact coating of conductive terminal, for improving the surface of conductive terminal
Contact performance, including surface contact contact and surface friction property etc..In addition, in the present invention, it can using nanometer embossing
To prepare the smaller micro-structure of precision, the size of micro-structure can from tens nanometers to several hundred ruler microns, in addition for
The shape of micro-structure can also be controlled effectively.The table of coating is contacted in the metal of conductive terminal using nanometer embossing
Micro-structure is prepared on face can substantially reduce preparation cost, simultaneously effective improve the precision of micro-structure.In the present invention, application
Impression block with micro-structure is straight on the surface of metal contact coating (gold, silver, tin and its alloy layer) of conductive terminal
Row is tapped into imprint out the nanometer embossing of micro-structure to have the advantages that 1 excellent nanometer embossing can be prepared finer
Micro-structure, precision can achieve tens nanometers；2, the micro-structure of nanometer embossing preparation can be diversified, and be prepared into
To the more complete knot 3 of micro structured pattern, nanometer embossing can use roll-to-roll process carry out large-scale continuous production, and
Cost is relatively low；4, nanometer embossing process controllability is good, easy to operate, environmentally friendly.
It will be understood to those skilled in the art that embodiment described above is all exemplary, and this field
Technical staff can make improvements, the rushing in terms of not recurring structure or principle of structure described in various embodiments
It can be freely combined in the case where prominent.
Although in conjunction with attached drawing, the present invention is described, and embodiment disclosed in attached drawing is intended to preferred to the present invention
Embodiment illustrates, and should not be understood as to a kind of limitation of the invention.
Although some embodiments of this present general inventive concept have been shown and have illustrated, those of ordinary skill in the art will be managed
Solution can make a change these embodiments in the case where the principle and spirit without departing substantially from this present general inventive concept, of the invention
Range is limited with claim and their equivalent.
It should be noted that word " comprising " is not excluded for other element or steps, word "a" or "an" is not excluded for multiple.Separately
Outside, the range that any element label of claim should not be construed as limiting the invention.
Claims (15)
1. a kind of method for forming micro-structure on the coating of conductive terminal, comprising the following steps:
S100: manufacturing an impression block (300,400), and it is micro- to be formed with first on the surface of the impression block (300,400)
Structure；With
S200: it is imprinted with coating (510) of the impression block (400) to conductive terminal (500), so as in the coating
(510) second micro-structure (501) complementary with the first micro-structure on the impression block (300,400) is formed on surface,
The step S100 the following steps are included:
S110: a silicon template (100) is provided, is formed with micro-structure (110) on the surface of the silicon template (100)；
S120: with the silicon template (100) for mold, a polymer template (200) is manufactured, thus by the silicon template
(100) micro-structure (110) on is transferred on the surface of the polymer template (200)；
S130: the polymer template (200) formation have micro-structure (210) surface on formed one layer of hard alloy layer
(300), so that the micro-structure (210) on the polymer template (200) is transferred on the hard alloy layer (300)；
S140: the polymer template (200) for being formed with the hard alloy layer (300) is immersed into metal plating liquid and carries out electricity
Casting, to power on cast into a metal substrate (400) in the hard alloy layer (300)；With
S150: removing the polymer template (200), so that obtaining has the hard alloy layer (300) and the Metal Substrate
The impression block (300,400) of plate (400), the micro-structure (310) on the hard alloy layer (300) constitute the impression block
First micro-structure of (300,400).
2. according to the method described in claim 1, it is characterized by: micro-structure (110) on the surface of the silicon template (100)
It is formed using photoetching process.
3. according to the method described in claim 1, it is characterized by:
It is formed the polymer template (200) on the silicon template (100) using spin coating proceeding, or is existed using molding process
The polymer template (200) are formed on the silicon template (100).
4. according to the method described in claim 1, it is characterized by: the polymer template (200) is by dimethyl silicone polymer
It is made.
5. according to the method described in claim 1, it is characterized by:
It is formed on the surface of the polymer template (200) using physical gas-phase deposition the hard alloy layer (300).
6. according to the method described in claim 5, it is characterized by:
The thickness of the hard alloy layer (300) is uniform, and the hard alloy layer (300) is received with a thickness of 20 nanometers to 50
Rice.
7. according to the method described in claim 1, it is characterized by: the hard alloy layer (300) include bianry alloy or
Ternary alloy three-partalloy.
8. according to the method described in claim 7, it is characterized by: the hard alloy layer includes Ti-W alloy, Cr-W alloy
Or Ti-Cr-W alloy.
9. according to the method described in claim 1, it is characterized by: the metal plating liquid is nickel electroforming solution, so that electroforming shape
At metal substrate (400) be ni substrate.
10. according to the method described in claim 1, it is characterized by:
When being imprinted with coating (510) of the impression block (400) to conductive terminal (500), the impression block
(400) being applied to pressure on the coating (510) of conductive terminal (500) is 50Mpa to 200Mpa, and keep the pressure when
Between be 5s to 300s.
11. a kind of impression block, it is characterised in that:
Be formed with the first micro-structure on the surface of the impression block (300,400), thus be suitable for the impression block (300,
400) second micro-structure (501) complementary with first micro-structure is imprinted out on the coating (510) of conductive terminal (500),
The impression block (300,400) includes:
Metal substrate (400) is formed with micro-structure (410) on surface；With
Hard alloy layer (300) is formed on the surface with the micro-structure (410) of the metal substrate (400),
Wherein, the hard alloy layer (300) has micro- knot corresponding with micro-structure (410) on the metal substrate (400)
Structure (310), first micro- knot of the micro-structure (310) as the impression block (300,400) on the hard alloy layer (300)
Structure.
12. impression block according to claim 11, it is characterised in that:
The hardness of the hard alloy layer (300) is greater than the hardness of the metal substrate (400), and the metal substrate
(400) hardness is greater than the hardness of the coating (510) of the conductive terminal (500).
13. impression block according to claim 12, it is characterised in that:
The metal substrate (400) is made of nickel, and the hard alloy layer (300) is made of the hard alloy that hardness is greater than nickel.
14. impression block according to claim 13, it is characterised in that: the hard alloy includes bianry alloy or three
First alloy.
15. impression block according to claim 14, it is characterised in that: the hard alloy includes Ti-W alloy, Cr-W
Alloy or Ti-Cr-W alloy.
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| CN201610327026.6A CN107394558B (en) | 2016-05-17 | 2016-05-17 | Impression block and the method that micro-structure is formed on the coating of conductive terminal |
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| CN201610327026.6A CN107394558B (en) | 2016-05-17 | 2016-05-17 | Impression block and the method that micro-structure is formed on the coating of conductive terminal |
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| CN108563099A (en) * | 2018-01-18 | 2018-09-21 | 中国科学院上海光学精密机械研究所 | A kind of nano-imprint stamp preparation method |
| CN108732863A (en) * | 2018-05-24 | 2018-11-02 | 南方科技大学 | A kind of flexible nano impression block and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3842610C1 (en) * | 1988-12-17 | 1990-06-21 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | |
| JP2005129428A (en) * | 2003-10-27 | 2005-05-19 | Sumitomo Electric Ind Ltd | Manufacturing method for telescopic contact, contact manufactured by the method and inspection device or electronic instrument provided with the contact |
| CN101177237A (en) * | 2006-11-07 | 2008-05-14 | 财团法人工业技术研究院 | Nanometer array and method for forming the same |
| CN101311828A (en) * | 2007-05-24 | 2008-11-26 | 东捷科技股份有限公司 | Viscous microstructure preparation method |
| CN102107564A (en) * | 2009-12-25 | 2011-06-29 | 鸿富锦精密工业（深圳）有限公司 | Impressing component, preparation method thereof and impressing forming method of light guide plate |
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