CN102107564A

CN102107564A - Impressing component, preparation method thereof and impressing forming method of light guide plate

Info

Publication number: CN102107564A
Application number: CN2009103122584A
Authority: CN
Inventors: 林大为; 吴锡章
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2009-12-25
Filing date: 2009-12-25
Publication date: 2011-06-29

Abstract

An impressing component comprises a drum and an impressing layer which is formed through electrotyping, wherein, the impressing layer is reeled and bonded with the circumference surface of the drum, and an impressing structure is formed by the outer surface of the impressing layer. A preparation method of the impressing component comprises the steps as follows: a pre-arranged structure is formed on the surface of substrates which can be used as an electrotyping master mould, the substrates are taken as the electrotyping master mould, the impressing layer provided with the impressing structure is formed through electrotyping, the impressing layer is peeled off, and the drum is provided to reel the impressing layer so as to lead the impressing layer to be bonded with the circumference surface of the drum. The impressing structure with a complicated structure can be formed by utilizing the preparation method of the impressing component.

Description

Platen assembly and preparation method thereof and LGP imprinting moulding method

Technical field

The present invention relates to a kind of platen assembly and preparation method thereof, and the LGP imprinting moulding method of using this platen assembly.

Background technology

Module backlight is the significant components of the liquid crystal display module of employings such as LCD display, mobile phone, PDA, digital camera.Along with showing developing rapidly of industry, the module backlight of light-type, ultrathin type, low energy consumption becomes the development trend of this area research.LGP is an optical element important in the module backlight, and the quality of its structure and performance directly affects the quality of backlight quality.A kind of traditional light conducting board processing method is: adopt micro-cutting processing earlier, promptly use cutting element, cut micro-structural as diamond on mould; Obtain LGP through ejection formation again.Adopt this method can produce the stub bar of some ejaculations inevitably, cause the waste of material, and its shaping efficiency is lower.

Rolling being rolled into type method (roll-to-roll process) is to have flexible soft board (perhaps film), after material cylindraceous rolls out, be processed to form preset structure on the soft board surface, and then once soft board be rolled into cylindric or direct finished product and cut.Employing is rolled being rolled into type method formed light conductive plate, can improve usefulness, low cost, realizes the continuous mode of production, also can reduce the waste of material.Wherein, the processing method of preset structure mainly is accurate stamped method, and soon the stamping structure on the impression cylinder circumferential surface is stamped in the surface of soft board.Existing method is by cylinder being carried out machining, forming this stamping structure.Yet, when the micro-structural on LGP surface is comparatively complicated, on the circumferential surface of impression cylinder, process corresponding stamping structure and become very difficult, cost of processing is higher.

Summary of the invention

In view of above-mentioned condition, be necessary to provide a kind of preparation method who forms the platen assembly of complicated stamping structure, the platen assembly that utilizes this method to make, and the LGP imprinting moulding method that utilizes this platen assembly to impress.

A kind of platen assembly comprises that cylinder reaches the embossed layer by electrotyping forming, and this embossed layer is reeled and also is incorporated into the roll circumference face, and the outer surface of this embossed layer forms stamping structure.

A kind of preparation method of platen assembly, it may further comprise the steps: form preset structure at the substrate surface that can be used as the electroforming grand master pattern; With this base material is the electroforming grand master pattern, forms the embossed layer with stamping structure by electroforming; Peel off this embossed layer; One cylinder is provided; This embossed layer is reeled and be incorporated into the roll circumference face.

A kind of LGP imprinting moulding method, it adopts to roll and carries out moulding to being rolled into type technology, and adopts above-mentioned platen assembly to carry out stamp.

The preparation method of above-mentioned platen assembly forms the embossed layer with stamping structure by electroforming, and this embossed layer is wound in the roll circumference face forms platen assembly, thereby need not promptly process stamping structure on the periphery directly at cylinder surface, can be convenient to form baroque stamping structure.

Description of drawings

Fig. 1 is the schematic perspective view of the platen assembly of embodiment of the present invention.

Fig. 2 is the preparation method's of a platen assembly shown in Figure 1 flow chart.

Fig. 3 is the preparation process schematic diagram of platen assembly shown in Figure 2.

The main element symbol description

Platen assembly	100
		Cylinder	11
Embossed layer	12
		Stamping structure	121
Base material	21
		The surface	212
Preset structure	213
		Electroforming solution	311
Electrotyping bath	312

The specific embodiment

Below in conjunction with the drawings and the specific embodiments platen assembly of the present invention and preparation method thereof and LGP forming method are described in further detail.

See also Fig. 1, the platen assembly 100 of embodiment of the present invention comprises cylinder 11 and coiling and is incorporated into the embossed layer 12 of cylinder 11 peripheries.Embossed layer 12 is by electrotyping forming, and its outer surface is formed with stamping structure 121.Stamping structure 121 can be complicated micro-structural, any one or a few combination in projection of extending or the groove structure as droplet-shaped micro-structural, pyramid micro-structural and along curve, adopt this platen assembly 100 to carry out stamp, can impress the micro-structural that forms with stamping structure 121 shape complementarities.

Cylinder 11 can be formed by conductive of material, as metallic aluminium, copper, zinc, nickel, iron, titanium, cobalt etc., perhaps any alloy or stainless steel in the aforementioned metal.The material of embossed layer 12 can be electroforming materials such as nickel, platinum nickel cobalt (alloy), cobalt tungsten alloy, gold or silver.

Be example with preparation platen assembly 100 below, the preparation method of the platen assembly of embodiment of the present invention is described.Please consult Fig. 2 and Fig. 3 simultaneously, the preparation method of this platen assembly may further comprise the steps:

S21: the surface 212 at the base material 21 that can be used as the electroforming grand master pattern forms preset structure 213.

Base material 21 is made by the material that plastics, stainless steel, wax or aluminium etc. can be used as the electroforming grand master pattern.Preferable, for ease of the moulding of preset structure 213, base material 21 is tabular, and its surface 212 is the plane, thereby is convenient to locate and process on surface 212.

Preset structure 213 can be droplet-shaped micro-structural, pyramid micro-structural and the projection of extending along curve or groove structure in any one or a few combination, identical with the structure that forms with platen assembly 100 impressions.Preset structure 213 can form by the gang tool machining, is processed to form as carrying out the plane by the multiaxis planer.Preset structure 213 also can form by cast, engraving or photomechanical production.Because of preset structure 213 can be processed to form in the plane, its processing is more or less freely, and is convenient to form complex-shaped structure.

S23: with this base material 21 is the electroforming grand master pattern, forms the embossed layer 12 with stamping structure 121 by electroforming.

Place the electrotyping bath 312 that fills electroforming solution 311 to carry out electroforming the base material 21 of moulding preset structure 213.The surface 212 of base material 21 deposits gradually and forms the metal plating layer, and promptly embossed layer 12.While embossed layer 12 forms stamping structure 121 with the surface that the surface 212 of base material 21 is pressed close to.This stamping structure 121 and preset structure 213 complementations.The material of embossed layer 12 is electroforming materials such as nickel, platinum nickel cobalt (alloy), cobalt tungsten alloy, gold or silver.Embossed layer 12 thickness should be thinner, so that it can be Texturized smoothly.

S25: peel off this embossed layer 12.

Embossed layer 12 and base material 21 are separated.For ease of peeling off of embossed layer 12, can before electroforming, form oxide-film or graphitization powder in the surface 212 at base material 21.

S27 a: cylinder 11 is provided.

S29: this embossed layer 12 is reeled and be incorporated into cylinder 11 peripheries.

Cylinder 11 has a default external diameter, and embossed layer 12 joins end to end after being wound in cylinder 11 just, and combines closely with cylinder 11 and to form platen assembly 100.Cylinder 11 can be welding, riveted joint etc. with the combination of embossed layer 12.

The LGP forming method of embodiment of the present invention adopts to roll and carries out moulding to being rolled into type technology, and it comprises the following steps: the LGP substrate is rolled out material from material; On the LGP substrate, form thermoplastic resin; Utilize platen assembly 100 to carry out hot stamp-printing, on the thermoplastic resin of LGP substrate, to form micro-structural; Solidify micro-structural, as utilize the UV drying device that micro-structural is carried out dry solidification; And continuous LGP substrate cut, to obtain having the LGP of required size.Above-mentioned LGP forming method can be produced continuously, and usefulness is higher, and can realize slimming.Compare with ejection formation, can also reduce the generation of stub bar, thereby reduce the waste of material.Platen assembly 100 is easy to form baroque stamping structure 121, and correspondingly, it can impress out baroque micro-structural on LGP, thereby promotes the optical characteristics of LGP.

In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included in the present invention's scope required for protection.

Claims

1. platen assembly, comprise cylinder, it is characterized in that: this platen assembly also comprises the embossed layer by electrotyping forming, this embossed layer is reeled and also is incorporated into the roll circumference face, and the outer surface of this embossed layer forms stamping structure.

2. platen assembly as claimed in claim 1 is characterized in that: this stamping structure comprise droplet-shaped micro-structural, pyramid micro-structural and the projection of extending along curve or groove structure in any one or a few combination.

3. platen assembly as claimed in claim 1 is characterized in that: this embossed layer material is nickel, platinum nickel cobalt (alloy), cobalt tungsten alloy, gold or silver-colored.

4. the preparation method of a platen assembly, it may further comprise the steps:

Form preset structure at the substrate surface that can be used as the electroforming grand master pattern;

With this base material is the electroforming grand master pattern, forms the embossed layer with stamping structure by electroforming;

Peel off this embossed layer;

One cylinder is provided;

This embossed layer is reeled and be incorporated into the roll circumference face.

5. the preparation method of platen assembly as claimed in claim 4 is characterized in that: the surface that this base material forms preset structure is the plane.

6. as the preparation method of claim 4 or 5 described platen assemblies, it is characterized in that: the preset structure of this base material forms by the gang tool machining.

7. as the preparation method of claim 4 or 5 described platen assemblies, it is characterized in that: the preset structure of this base material forms by cast, engraving or photomechanical production.

8. the preparation method of platen assembly as claimed in claim 4, it is characterized in that: this base material is plastics, stainless steel, wax or aluminium.

9. a LGP imprinting moulding method adopts to roll and carries out moulding to being rolled into type technology, it is characterized in that: this forming method adopts the described platen assembly of claim 1 to carry out stamp.

10. LGP imprinting moulding method as claimed in claim 9, it is characterized in that: this LGP surface forms the micro-structural with the stamping structure shape complementarity of this embossed layer, this micro-structural comprise droplet-shaped micro-structural, pyramid micro-structural and the projection of extending along curve or groove structure in any one or a few combination.