CN107394558A - Impression block and the method that micro-structural is formed on the coating of conducting terminal - Google Patents
Impression block and the method that micro-structural is formed on the coating of conducting terminal Download PDFInfo
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- CN107394558A CN107394558A CN201610327026.6A CN201610327026A CN107394558A CN 107394558 A CN107394558 A CN 107394558A CN 201610327026 A CN201610327026 A CN 201610327026A CN 107394558 A CN107394558 A CN 107394558A
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- micro
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- impression block
- hard alloy
- alloy layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of method that micro-structural is formed on the coating of conducting terminal, comprise the following steps：An impression block is manufactured, formed with the first micro-structural on the surface of the impression block；The coating of conducting terminal is imprinted with the impression block, to form second micro-structural complementary with the first micro-structural on the impression block on the surface of the coating.In addition, the invention also discloses a kind of impression block, formed with the first micro-structural on the surface of the impression block, so as to suitable for imprinting out second micro-structural complementary with first micro-structural on the coating of conducting terminal with the impression block.In the present invention, micro-structural is directly imprinted out on the coating of conducting terminal by impression block, it is easy to operate, moreover, the impression block can be very cheap with Reusability, cost.
Description
Technical field
The present invention relates to a kind of impression block and use plating of the impression block in conducting terminal
The method that micro-structural is formed on layer.
Background technology
In the prior art, in order to improve the electric property of the conducting terminal of electric connector, typically
Need to electroplate one layer of gold, silver, tin or its alloy layer on the surface of conducting terminal.For tin
And tin alloy coat, in actual application, oxide layer can be formed on the surface of coating,
The oxide layer can reduce the electric property of conducting terminal, for example, can increase the surface of conducting terminal
Contact resistance.Therefore, in actual applications, it is necessary to apply larger forward direction on conducting terminal
Pressure removes the oxide layer on the surface of tin and tin alloy coat.But with electric connector
Miniaturization, the conducting terminal of connector is less and less, it is difficult to obtain enough positive pressures,
So that the application of tin and tin alloy coat have received very big limitation.
In the prior art, in order to reduce the surface contacted resistance of conducting terminal and reduce conducting end
The contact engaging and separating force (positive pressure being applied on conducting terminal is bigger, and contact engaging and separating force is bigger) of son, need
The surface of tin and tin alloy coat is modified, for example, using laser in tin and tin alloy
Micro-structural is processed on the surface of coating, this surface that can meet to reduce conducting terminal simultaneously connects
The requirement of the contact engaging and separating force of electric shock resistance and reduction conducting terminal.
But laser processing technology is complex, it is difficult to control, and the micro- knot processed
The dimensional accuracy and form accuracy of structure are poor, and cost is higher.
The content of the invention
The purpose of the present invention aims to solve the problem that the above-mentioned problems in the prior art and defect extremely
Few one side.
Exist it is an object of the present invention to provide a kind of impression block and with the impression block
The method that micro-structural is formed on the coating of conducting terminal, it can be by impression block in conducting end
Micro-structural is directly imprinted out on the coating of son, easy to operate, cost is cheap.
According to an aspect of the present invention, there is provided a kind of that micro- knot is formed on the coating of conducting terminal
The method of structure, comprises the following steps：
S100：An impression block is manufactured, it is micro- formed with first on the surface of the impression block
Structure；With
S200：The coating of conducting terminal is imprinted with the impression block, so as to described
The second micro- knot complementary with the first micro-structural on the impression block is formed on the surface of coating
Structure.
According to the embodiment of an example of the present invention, the step S100 includes following step
Suddenly：
S110：A silicon template is provided, formed with micro-structural on the surface of the silicon template；
S120：Using the silicon template as mould, a polymer template is manufactured, so as to by described in
Microstructure transfer printing in silicon template is on the surface of the polymer template；
S130：Have in the formation of the polymer template and one layer of hard is formed on the surface of micro-structural
Alloy-layer, so as to by the microstructure transfer printing on the polymer template to the hard alloy layer
On；
S140：Polymer template formed with the hard alloy layer is immersed into metal plating liquid
Middle carry out electroforming, so that electroforming forms a metal substrate on the hard alloy layer；With
S150：The polymer template is removed, so as to obtain with the hard alloy layer and institute
State the impression block of metal substrate, the micro-structural on the hard alloy layer forms the making ide
First micro-structural of plate.
It is micro- on the surface of the silicon template according to the embodiment of another exemplary of the present invention
Structure is formed using photoetching process.
According to the embodiment of another exemplary of the present invention, using spin coating proceeding in the silicon mould
The polymer template is formed on plate, or institute is formed in the silicon template using molding process
State polymer template.
According to the embodiment of another exemplary of the present invention, the polymer template is by poly- diformazan
Radical siloxane is made.
According to the embodiment of another exemplary of the present invention, existed using physical gas-phase deposition
The hard alloy layer is formed on the surface of the polymer template.
It is equal according to the embodiment of another exemplary of the present invention, the thickness of the hard alloy layer
It is even, and the thickness of the hard alloy layer is 20 nanometers to 50 nanometers.
According to the embodiment of another exemplary of the present invention, the hard alloy layer includes binary
Alloy or ternary alloy three-partalloy.
According to the embodiment of another exemplary of the present invention, the hard alloy layer includes
Ti-W alloys, Cr-W alloys or Ti-Cr-W alloys.
According to the embodiment of another exemplary of the present invention, the metal plating liquid is nickel electroforming
Liquid so that the metal substrate that electroforming is formed is ni substrate.
According to the present invention another exemplary embodiment, with the impression block to conduction
When the coating of terminal is imprinted, the impression block is applied to the pressure on the coating of conducting terminal
It is by force 50Mpa to 200Mpa, and it is 5s to 300s to be kept for time of the pressure.
According to another aspect of the present invention, there is provided a kind of impression block, it is characterised in that：
Formed with the first micro-structural on the surface of the impression block, so as to suitable for being imprinted with this
Template imprints out the second micro- knot complementary with first micro-structural on the coating of conducting terminal
Structure.
According to the embodiment of an example of the present invention, the impression block includes：Metal Substrate
Plate, formed with micro-structural on its surface；And hard alloy layer, formed in the metal substrate
On surface with the micro-structural, wherein, the hard alloy layer has and the Metal Substrate
Micro-structural corresponding to micro-structural on plate, the micro-structural on the hard alloy layer is as the pressure
First micro-structural of die plate.
It is big according to the embodiment of another exemplary of the present invention, the hardness of the hard alloy layer
In the hardness of the metal substrate, and the hardness of the metal substrate is more than the conducting terminal
Coating hardness.
According to the embodiment of another exemplary of the present invention, the metal substrate is made up of nickel,
The hard alloy that the hard alloy layer is more than nickel by hardness is made.
According to the embodiment of another exemplary of the present invention, the hard alloy closes including binary
Gold or ternary alloy three-partalloy.
According to the embodiment of another exemplary of the present invention, the hard alloy includes Ti-W
Alloy, Cr-W alloys or Ti-Cr-W alloys.
In the embodiment of foregoing each exemplary according to the present invention, led by impression block
Micro-structural is directly imprinted out on the coating of electric terminal, it is easy to operate, moreover, the impression block can
It is very cheap with Reusability, cost.
By the description made for the present invention of below with reference to accompanying drawing, other purposes of the invention and
Advantage will be evident, and can help that complete understanding of the invention will be obtained.
Brief description of the drawings
Fig. 1 is shown to be shown according to the solid of the silicon template of the embodiment of an example of the present invention
It is intended to；
Fig. 2 shows the silicon template sectional view shown in Fig. 1；
Fig. 3 was shown using silicon template the showing as Making mold polymer template shown in Fig. 1 and Fig. 2
It is intended to；
Fig. 4 shows the sectional view of manufactured polymer template in Fig. 3；
The formation that Fig. 5 is shown in the polymer template shown in Fig. 4 has and formed on the surface of micro-structural
Into the schematic diagram of hard alloy layer；
Fig. 6 is shown in the signal that electroforming on the hard alloy layer shown in Fig. 4 forms metal substrate
Figure；
Fig. 7 shows the signal of the impression block of the embodiment according to an example of the present invention
Figure；
Fig. 8 is shown imprints micro-structural with the impression block shown in Fig. 7 on the coating of conducting terminal
Schematic diagram；
Fig. 9 shows the sectional view for the conducting terminal that micro-structural is had been imprinted with coating；With
Figure 10 shows the schematic perspective view for the conducting terminal that micro-structural is had been imprinted with coating.
Embodiment
Below by embodiment, and with reference to accompanying drawing, make further tool to technical scheme
The explanation of body.In the description, same or analogous drawing reference numeral indicates same or analogous portion
Part.It is following that the explanation of embodiment of the present invention is intended to overall invention of the invention referring to the drawings
Design explains, and is not construed as limiting a kind of of the present invention.
In addition, in the following detailed description, for ease of explaining, elaborate many specific thin
Save to provide the comprehensive understanding to present disclosure embodiment.It should be apparent, however, that one or more implement
Example can also be carried out in the case of these no details.In other cases, it is known
Construction and device diagrammatically embody to simplify accompanying drawing.
Conceived according to the general technical of the present invention, there is provided a kind of on the coating of conducting terminal
The method for forming micro-structural, comprises the following steps：Manufacture an impression block, the making ide
Formed with the first micro-structural on the surface of plate；With the coating with the impression block to conducting terminal
Imprinted, it is micro- with first on the impression block to be formed on the surface of the coating
Second micro-structural of complementary structure.
Conceived according to another general technical of the present invention, there is provided a kind of impression block, described
Formed with the first micro-structural on the surface of impression block, so as to be suitable to the impression block in conduction
Second micro-structural complementary with first micro-structural is imprinted out on the coating of terminal.
Fig. 7 shows the impression block 300,400 according to the embodiment of an example of the present invention
Schematic diagram.
As shown in fig. 7, in the illustrated embodiment, on the surface of impression block 300,400
On formed with the first micro-structural 310.
Fig. 8 shows the plating in conducting terminal 500 with the impression block 300,400 shown in Fig. 7
The schematic diagram of micro-structural is imprinted on layer 510.Fig. 9 is shown has been imprinted with micro-structural on coating 510
The sectional view of 501 conducting terminal 500；With Figure 10 show coating 510 on have been imprinted with it is micro-
The schematic perspective view of the conducting terminal 500 of structure 501.
As shown in Figure 7 to 10, the impression block 300,400 shown in Fig. 7 can be utilized to exist
The impressing directly on a surface of the coating 510 of conducting terminal 500 is gone out and foregoing first micro-structural
310 the second complementary micro-structurals 501.
In the embodiment of an example of the present invention, coating 510 can be to be formed in conduction
Gold, silver or tin coating on terminal 500 or the alloy layer comprising gold, silver or tin.
In the illustrated embodiment, first formed on the surface of impression block 300,400
Micro-structural 310 is bulge-structure, and second be stamped on the coating 510 of conducting terminal 500 is micro-
Structure 501 is bowl configurations.But the present invention is not limited to the embodiment of diagram, for example,
In the embodiment of another exemplary of the present invention, formed in impression block 300,400
The first micro-structural 310 on surface can be bowl configurations, be stamped in the plating of conducting terminal 500
The second micro-structural 501 on layer 510 can be bulge-structure.
In the embodiment of an example of the present invention, as Fig. 7 and Fig. 8 are clearly illustrated,
The impression block 300,400 mainly includes metal substrate 400 and hard alloy layer 300.
Formed with micro-structural 410 on the surface of metal substrate 400.Hard alloy layer 300 is formed in gold
On the surface with micro-structural 410 for belonging to substrate 400.So, hard alloy layer 300 just has
There is micro-structural 310 corresponding with the micro-structural 410 on metal substrate 400.Hard alloy layer 300
On foregoing first micro-structural of the micro-structural 310 as impression block 300,400.
Typically, the material price of hard alloy layer 300 is significantly larger than metal substrate 400
Material price, therefore, in order to reduce cost, only form one on the surface of metal substrate 400
Coating cemented carbide layer 300.In the embodiment of an example of the present invention, metal substrate
400 can be made up of cheap and higher hardness metal, for example, nickel.Hard alloy layer
300 can be made up of the alloy of hard metal substrate 400, for example, can be more than nickel by hardness
Hard alloy be made.
In the embodiment of an example of the present invention, foregoing hard alloy layer 300 can be by
Bianry alloy or ternary alloy three-partalloy are made, for example, Ti-W alloys, Cr-W alloys or Ti-Cr-W
Alloy.
In the embodiment of an example of the present invention, the thickness of hard alloy layer 300 is equal
It is even, and the thickness of hard alloy layer 300 is 20 nanometers to 50 nanometers.
In the embodiment of an example of the present invention, the hardness of hard alloy layer 300 should
Hardness more than the hardness of metal substrate 400, and metal substrate 400 should be more than conducting end
The hardness of the coating 510 of son 500.So, can be in the coating 510 of conducting terminal 500
On easily imprint out the second micro-structural 501.
Illustrate leading using aforementioned impression template 300,400 below with reference to Fig. 7 to Figure 10
On the coating 510 of electric terminal 500 formed micro-structural 501 method, this method mainly include with
Lower step：
S100：Manufacture an impression block 300,400, the surface of impression block 300,400
On formed with the first micro-structural 310, as shown in Figure 7；With
S200：The coating 510 of conducting terminal 500 is imprinted with impression block 400, with
Just formed on the surface of coating 510 and the first micro-structural 310 on impression block 300,400
The second complementary micro-structural 501, as shown in Fig. 8 to Figure 10.
In the embodiment of an example of the present invention, with impression block 400 to conducting end
When the coating 510 of son 500 is imprinted, impression block 400 is applied to conducting terminal 500
Pressure on coating 510 can be 50Mpa to 200Mpa, and kept for the time of the pressure
Can be 5s to 300s.It note that the pressure that impressing is and the time needs for keeping the pressure
Adjusted according to actual conditions.In addition, it is necessary to explanation, aforementioned impression can be in normal temperature or room
Temperature is lower to be carried out, and without being heated to conducting terminal 500, therefore, operation is very easy.
Illustrate the mistake for manufacturing aforementioned impression template 300,400 below with reference to Fig. 1 to Fig. 7
Journey.
First, as depicted in figs. 1 and 2, there is provided a silicon template as depicted in figs. 1 and 2
100, formed with micro-structural 110 on the surface of the silicon template 100.At one of the present invention
In the embodiment of exemplary, the micro-structural 110 on the surface of silicon template 100 can use photoetching
Technique is formed.In the illustrated embodiment, the micro-structural 110 on the surface of silicon template 100 is
Bulge-structure, still, the present invention are not limited to the embodiment of diagram, the surface of silicon template 100
On micro-structural 110 can also be sunk structure.
Then, as shown in Figure 3 and Figure 4, it is mould with silicon template 100, manufactures a polymerization
Thing template 200, so as to which the micro-structural 110 in silicon template 100 is transferred into polymer template 200
Surface on.So, as shown in Figure 3 and Figure 4, it is possible in the table of polymer template 200
The micro-structural 210 complementary with the micro-structural 110 in silicon template 100 is formed on face.
In the embodiment of an example of the present invention, spin coating proceeding can be used in silicon template
Polymer template 200 is formed on 100, or molding process can be used in silicon template 100
Form polymer template 200.
In the embodiment of an example of the present invention, aforementioned polymer template 200 can be by
Dimethyl silicone polymer or other any suitable polymeric materials are made.
Then, as shown in figure 5, the formation in polymer template 200 has the table of micro-structural 210
One layer of hard alloy layer 300 is formed on face, so as to by the micro-structural 210 on polymer template 200
It is transferred on hard alloy layer 300.In this manner it is possible on hard alloy layer 300 formed with
The micro-structural 310 of the complementation of micro-structural 210 on polymer template 200.
In the embodiment of an example of the present invention, physical gas-phase deposition can be used
Hard alloy layer 300 is formed on the surface of polymer template 200.
In the embodiment of an example of the present invention, the thickness of hard alloy layer 300 is equal
It is even, and the thickness of hard alloy layer 300 is 20 nanometers to 50 nanometers.Hard alloy layer 300
It can be made up of bianry alloy or ternary alloy three-partalloy, for example, hard alloy layer can be by Ti-W
Alloy, Cr-W alloys or Ti-Cr-W alloys are made.
Then, the polymer template 200 formed with hard alloy layer 300 is immersed into metal electricity
Electroforming is carried out in casting liquid, so that electroforming forms a metal substrate on hard alloy layer 300
400, as shown in Figure 6.
In the embodiment of an example of the present invention, aforementioned metal electroforming solution can be nickel electricity
Liquid is cast, so, the metal substrate 400 that electroforming is formed can be ni substrate.
Finally, as shown in fig. 7, removing polymer template 200, closed so as to obtain with hard
The impression block 300,400 of layer gold 300 and metal substrate 400, the hard alloy layer 300
On micro-structural 310 form impression block 300,400 the first micro-structural.
One of the present invention is characterized by：Using the impression block with micro-structural in conducting terminal
Metal contact coating (gold, silver, tin and its alloy layer) imprinted directly on a surface
Go out micro-structural (being referred to as nanometer embossing), so as to metal contact plating of the gold in conducting terminal
A complete micro-structural of pattern is prepared on layer, the surface for improving conducting terminal contacts
Performance, including surface contact contact and surface friction property etc..In addition, in the present invention, adopt
The smaller micro-structural of precision can be prepared with nanometer embossing, and the size of micro-structural can be with
From tens nanometers to hundreds of chi microns, the shape for micro-structural can also be carried out effectively in addition
Control.Contacted in the metal of conducting terminal using nanometer embossing and prepared on the surface of coating
Micro-structural can substantially reduce preparation cost, simultaneously effective improve the precision of micro-structural.This
In invention, using the impression block with micro-structural conducting terminal metal contact coating (gold,
Silver, tin and its alloy layer) the nano impression skill for carrying out imprinting out micro-structural directly on a surface
Art has the following advantages that：1 excellent nanometer embossing can prepare finer micro-structural, precision
Tens nanometers can be reached；2nd, nanometer embossing prepare micro-structural can be it is diversified,
And the more complete knot 3 of the micro structured pattern being prepared, nanometer embossing can utilize volume pair
Roll up technique and carry out large-scale continuous production, and cost is relatively low；4th, nanometer embossing technique can
Control property is good, simple to operate, environmentally friendly.
It will be understood to those skilled in the art that embodiment described above is all exemplary
, and those skilled in the art can make improvements, described in various embodiments
Structure free group can be carried out in the case of the conflict in terms of not recurring structure or principle
Close.
Although with reference to accompanying drawing, the present invention is described, the embodiment purport disclosed in accompanying drawing
Illustrative to the preferred embodiment for the present invention, and it is not intended that to the present invention's
One kind limitation.
Although some embodiments of this present general inventive concept are shown and illustrated, this area is common
Technical staff will be understood that, in the case of without departing substantially from the principle of this present general inventive concept and spirit,
These embodiments can be made a change, the scope of the present invention is with claim and their equivalent
Limit.
It should be noted that word " comprising " is not excluded for other element or steps, word " one " or " one
It is individual " be not excluded for it is multiple.In addition, any element label of claim should not be construed as limitation originally
The scope of invention.
Claims (17)
1. a kind of method that micro-structural is formed on the coating of conducting terminal, comprises the following steps：
S100：Manufacture an impression block (300,400), the impression block (300,400)
Surface on formed with the first micro-structural；With
S200：Coating (510) with the impression block (400) to conducting terminal (500)
Imprinted, so as on the surface of the coating (510) formed with the impression block (300,
400) the second micro-structural (501) of the first micro-structural complementation on.
2. according to the method for claim 1, it is characterised in that the step S100 bags
Include following steps：
S110：A silicon template (100) is provided, shape on the surface of the silicon template (100)
Into there is micro-structural (110)；
S120：With the silicon template (100) for mould, a polymer template (200) is manufactured,
So as to which the micro-structural (110) on the silicon template (100) is transferred into the polymer template
(200) on surface；
S130：There is the surface of micro-structural (210) in the formation of the polymer template (200)
One layer of hard alloy layer (300) of upper formation, so as to by the polymer template (200)
Micro-structural (210) is transferred on the hard alloy layer (300)；
S140：Polymer template (200) that will be formed with the hard alloy layer (300) soaks
It is less than in metal plating liquid and carries out electroforming, so as to the electroforming on the hard alloy layer (300)
Form a metal substrate (400)；With
S150：The polymer template (200) is removed, so as to obtain with the hard alloy
The impression block (300,400) of layer (300) and the metal substrate (400) is described hard
Micro-structural (310) on matter alloy-layer (300) forms the impression block (300,400)
The first micro-structural.
3. according to the method for claim 2, it is characterised in that：The silicon template (100)
Surface on micro-structural (110) formed using photoetching process.
4. according to the method for claim 2, it is characterised in that：
The polymer template (200) is formed on the silicon template (100) using spin coating proceeding,
Or the polymer template (200) is formed on the silicon template (100) using molding process.
5. according to the method for claim 2, it is characterised in that：The polymer template
(200) it is made up of dimethyl silicone polymer.
6. according to the method for claim 2, it is characterised in that：
Formed using physical gas-phase deposition on the surface of the polymer template (200)
The hard alloy layer (300).
7. according to the method for claim 6, it is characterised in that：
The thickness of the hard alloy layer (300) is uniform, and the hard alloy layer (300)
Thickness be 20 nanometers to 50 nanometers.
8. according to the method for claim 2, it is characterised in that：The hard alloy layer
(300) bianry alloy or ternary alloy three-partalloy are included.
9. according to the method for claim 8, it is characterised in that：The hard alloy layer
Including Ti-W alloys, Cr-W alloys or Ti-Cr-W alloys.
10. according to the method for claim 2, it is characterised in that：The metal plating liquid
For nickel electroforming solution so that the metal substrate (400) that electroforming is formed is ni substrate.
11. according to the method for claim 2, it is characterised in that：
The coating (510) of conducting terminal (500) is being entered with the impression block (400)
During row impressing, the impression block (400) is applied to the coating (510) of conducting terminal (500)
On pressure be 50Mpa to 200Mpa, and it is 5s to 300s to be kept for time of the pressure.
A kind of 12. impression block, it is characterised in that：
Formed with the first micro-structural on the surface of the impression block (300,400), so that
Suitable for the impression block (300,400) on the coating (510) of conducting terminal (500)
Imprint out second micro-structural (501) complementary with first micro-structural.
13. impression block according to claim 12, it is characterised in that：
The impression block (300,400) includes：
Metal substrate (400), formed with micro-structural (410) on its surface；With
Hard alloy layer (300), formed has institute in the metal substrate (400)
On the surface for stating micro-structural (410),
Wherein, the hard alloy layer (300) have with the metal substrate (400)
Micro-structural (310) corresponding to micro-structural (410), it is micro- on the hard alloy layer (300)
First micro-structural of the structure (310) as the impression block (300,400).
14. impression block according to claim 13, it is characterised in that：
The hardness of the hard alloy layer (300) is more than the hardness of the metal substrate (400),
And the hardness of the metal substrate (400) is more than the coating (510) of the conducting terminal (500)
Hardness.
15. impression block according to claim 14, it is characterised in that：
The metal substrate (400) is made up of nickel, and the hard alloy layer (300) is by hardness
Hard alloy more than nickel is made.
16. impression block according to claim 15, it is characterised in that：The hard
Alloy includes bianry alloy or ternary alloy three-partalloy.
17. impression block according to claim 16, it is characterised in that：The hard
Alloy includes Ti-W alloys, Cr-W alloys or Ti-Cr-W alloys.
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| CN201610327026.6A CN107394558B (en) | 2016-05-17 | 2016-05-17 | Impression block and the method that micro-structure is formed on the coating of conductive terminal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108563099A (en) * | 2018-01-18 | 2018-09-21 | 中国科学院上海光学精密机械研究所 | A kind of nano-imprint stamp preparation method |
| WO2019223109A1 (en) * | 2018-05-24 | 2019-11-28 | 南方科技大学 | Flexible nanoimprint template and manufacturing method therefor |
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| CN101177237A (en) * | 2006-11-07 | 2008-05-14 | 财团法人工业技术研究院 | Nanometer array and method for forming the same |
| CN101311828A (en) * | 2007-05-24 | 2008-11-26 | 东捷科技股份有限公司 | Viscous microstructure preparation method |
| CN102107564A (en) * | 2009-12-25 | 2011-06-29 | 鸿富锦精密工业（深圳）有限公司 | Impressing component, preparation method thereof and impressing forming method of light guide plate |
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| CN108563099A (en) * | 2018-01-18 | 2018-09-21 | 中国科学院上海光学精密机械研究所 | A kind of nano-imprint stamp preparation method |
| WO2019223109A1 (en) * | 2018-05-24 | 2019-11-28 | 南方科技大学 | Flexible nanoimprint template and manufacturing method therefor |
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