CN103813641A - Manufacturing method of conductor track on non-conductive carrier - Google Patents
Manufacturing method of conductor track on non-conductive carrier Download PDFInfo
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- CN103813641A CN103813641A CN201210457667.5A CN201210457667A CN103813641A CN 103813641 A CN103813641 A CN 103813641A CN 201210457667 A CN201210457667 A CN 201210457667A CN 103813641 A CN103813641 A CN 103813641A
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- conductive carrier
- conductor rail
- manufacture method
- ink layer
- laser
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Abstract
The invention provides a manufacturing method of a conductor track on a non-conductive carrier. The manufacturing method comprises the following steps of (a) selecting the non-conductive carrier, (b) forming an ink layer on the surface of the non-conductive carrier; (c) performing laser etching on the ink layer and the surface of the non-conductive carrier, utilizing laser to divide the ink layer into a plurality of different continuous or non-continuous blocks, and then vaporizing and removing the ink layers of the non-continuous blocks to enable the non-conductive carrier where the non-continuous blocks are located to be shown; (d) enabling the surface f the shown non-conductive carrier to form a metal layer in a transfer printing mode; (e) removing residual ink layers, enabling the metal layer to expose on the surface of the non-conductive carrier so as to form the conductor track and finishing manufacture of the conductor track on the non-conductive carrier. Due to the fact that the transfer printing is adopted, the thickness of the metal layer is easily ensured, a plating thickening step is omitted, a technological process is short and simple, the manufacturing efficiency is high, and cost reduction is facilitated.
Description
Technical field
The present invention relates to the manufacture method of the conductor rail on a kind of non-conductive carrier.
Background technology
Due to the fast development of scientific and technological communications industry, the application of information products is also healed thereupon and is become universal, the such as communications electronics product such as mobile phone, E-book reader goods mobile computer, appear at continually daily arround among.And this not only significantly promotes convenience in life, also in the time and space, formed especially compression, make no longer to limit between men and restrict in geographic boundary, and can make the interchange of the interactive and a large amount of message knowledge of combination more closely to each other, make pursuit reach common interests happiness optimization.Hereat, in radio communication, antenna is just like brought into play critical function between two parties, makes information transmission and exchange of knowledge more convenient, without hindrance.
But at present relevant manufacturer adopts following steps to carry out the selected ceramic substrate of the manufacture of antenna: a.; B. utilize spraying, wire mark or roller coating, form ink layer at ceramic base plate surface; C. via the mode of laser radium carving the part ink layer of vaporizing, make part ceramic substrate out exposed; D. at ceramic substrate exposed region jet-plating metallization layer; E. remove residual ink layer; E. layer on surface of metalization plating thickening, the metal level after thickening becomes final needed antenna, and antenna manufacture completes.The manufacturing step long flow path of above-mentioned antenna, loaded down with trivial details, to manufacture efficiency lower, is unfavorable for saving cost.
In view of this, be necessary to provide a kind of manufacture method to solve the technical problem.
Summary of the invention
The object of the present invention is to provide a kind of flow process short, simply, the manufacture method of the conductor rail on non-conductive carrier cheaply.
For realizing aforementioned object, the present invention adopts following technical scheme: the manufacture method of the conductor rail on a kind of non-conductive carrier, and it comprises the steps: that a. selectes a non-conductive carrier; B. form ink layer at non-conductive carrier surface; C. carve the surface of ink layer and non-conductive carrier via laser radium, utilize after ink layer is divided into some continuous or discrete different blocks by laser, and the ink layer vaporization of discontinuous block is removed, the non-conductive carrier at discontinuous block place is displayed; D. the non-conductive carrier surface displaying described in forms by metal level via the mode of bat printing; E. remove residual ink layer, metal level is exposed to non-conductive carrier surface and forms conductor rail, and the manufacture of the conductor rail on non-conductive carrier completes.
The manufacture method of the conductor rail on the non-conductive carrier of the present invention is owing to adopting bat printing mode to form metal level on non-conductive carrier, metal layer thickness is easily guaranteed, meet the functional requirement of product, omit the step of thickeningization plating, manufacturing process is short, simple, manufacture efficiency is high, is conducive to reduce costs.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the conductor rail on the non-conductive carrier of the present invention.
Fig. 2 is the schematic diagram of the non-conductive carrier before the conductor rail on the non-conductive carrier of the present invention.
Fig. 3 covers ink layer schematic diagram afterwards on non-conductive carrier shown in Fig. 2.
Fig. 4 be ink layer shown in Fig. 3 by the schematic diagram after partly removing, manifest part non-conductive carrier.
Fig. 5 is the schematic diagram that forms metal level on the non-conductive carrier that manifests part shown in Fig. 4, and this metal level is conductor rail.
Fig. 6 is the schematic diagram after the residual ink layer shown in Fig. 4 is removed.
Embodiment
For ease of further the object, technical solutions and advantages of the present invention being had to clear and definite, the full and accurate awareness and understanding of darker one deck, describe the present invention below in conjunction with the drawings and specific embodiments.
Shown in please refer to the drawing 1 to Fig. 6, on non-conductive substrate 10 of the present invention, form the manufacture method of conductor line 30, comprise the steps:
A. a selected non-conductive substrate 10, the one that this non-conductive substrate 10 is insulation plastic cement, pottery or glass material, the present invention for the material of non-conductive substrate 10 without specific (special) requirements.
B. utilize the modes such as spraying, wire mark or roller coating, form an ink layer 20 on non-conductive carrier 10 surfaces, the ink that ink layer 20 adopts is for possessing certain flexible smooth insulating paint.
C. carve the surface of ink layer 20 and non-conductive carrier 10 via laser radium, utilizing wavelength is after ink layer 20 is divided into some continuous or discrete different blocks by the laser of 355 ~ 1064 nanometers, and by the ink layer of discontinuous block 20 removal of vaporizing, the non-conductive carrier 10 at discontinuous block place is displayed, described laser radium carving is that the figure at required conductor rail 30 places is manipulated by computer software, make the control of the accuracy to size that needs the conductor rail 30 forming become easy, easy, by digital control lower pilot point laser focusing bundle, the ink layer 20 in conductor rail 30 regions is vaporized, the ink layer 20 in conductor rail 30 regions that need exposes non-conductive carrier 10 after being vaporized by radium carving, non-conductive carrier 10 is under laser radium carving effect, its surface roughening, form deep mixed small rut to strengthen the adhesive force of conductor rail 30, simultaneously, because laser uses computer 3D program control, can realize the process requirement of the non-conductive carrier 10 of 3D structure except 2D.The non-conductive carrier 10 of the present invention is by electrolysis or chemistry or the direct adhesion metal layer of splash mode, without laser drilling or increase through hole, more than metal layer thickness can disposablely be increased to 50um simultaneously, without follow-up increase copper metal layer thickness, in necessary situation, can increase and be easy to the pre-treating technology that metal level adheres to.Utilize more ripe metal attach process of modern times, adhesive force of metal layer is reliable, and the simple cost of processing procedure is controlled.
In track graphic making, use laser radium carving mode to make figure, by three-dimensional software control track figure, can meet the different structure demand of two-dimensional/three-dimensional product, processing procedure is without the press mold using in PCB printing process simultaneously, exposure imaging, with etch process, can make the features such as manufacturing process, the construction cycle is little, adhesive force of metal layer is strong, cost is low.Without using the pollutants such as photoresist, developer solution, be conducive to environmental protection simultaneously, realize sustainable green production.
D. non-conductive carrier 10 surfaces that display described in form the metal level 30 of 10 microns ~ 15 micron thickness through bat printing mode, bat printing technique is very simple, adopt steel (or copper, thermoplastic plastic) intaglio plate, the Curved pad printing head that utilizes silastic material to make, metal slurry (as copper, silver slurry) is coated in after intaglio plate, dip in again the surface of bat printing head, then toward non-conductive carrier 10 surface pressure that display once, print off metal level 30, the conductor rail 30 of the track that this metal level 30 forms for finally forming.Convex-concave close structure combination on conductor rail 30 and non-conductive carrier 10, thus tear-proof and bonding strength between non-conductive carrier 10 and conductor rail 30 effectively promoted, further strengthen overall structural strength.
E. directly peel off residual ink layer 20 or remove residual ink layer 20 under acid or alkaline liquid (as NaOH) effect, conductor rail 30 has been manufactured.
The present invention is owing to adopting bat printing mode to form metal level 30 on non-conductive carrier 10, metal level 30 thickness are easily guaranteed, meet the functional requirement of product, omit the step of thickeningization plating, manufacturing process is short, simple, manufacture efficiency is high, be conducive to reduce costs, if this conductor rail 30 uses as antenna, there is stable, reliable function, performance.
In sum, these are only preferred embodiment of the present invention, should not limit the scope of the invention with this, i.e. every simple equivalence of doing according to the claims in the present invention book and description of the invention content changes and modifies, and all should still remain within the scope of the patent.
Claims (10)
1. a manufacture method for the conductor rail on non-conductive carrier, it comprises the steps:
A. a selected non-conductive carrier;
B. form ink layer at non-conductive carrier surface;
C. carve the surface of ink layer and non-conductive carrier via laser radium, utilize after ink layer is divided into some continuous or discrete different blocks by laser, and the ink layer vaporization of discontinuous block is removed, the non-conductive carrier at discontinuous block place is displayed;
D. the non-conductive carrier surface displaying described in forms by metal level via the mode of bat printing;
E. remove residual ink layer, metal level is exposed to non-conductive carrier surface and forms conductor rail, and the manufacture of the conductor rail on non-conductive carrier completes.
2. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: described non-conductive carrier is that a kind of non-conducting material of insulation plastic cement, pottery or glass is made.
3. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: the ink that described ink layer adopts is for possessing certain flexible smooth insulating paint.
4. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: described ink layer is directly to peel off or remove under acid or alkaline liquid effect.
5. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, it is characterized in that: described non-conductive carrier, at laser radium carving effect lower surface roughening, forms deep mixed small rut to strengthen the adhesive force of conductor rail on non-conductive carrier.
6. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, it is characterized in that: described ink surface layer is to be divided into continuous or discontinuous some regions by laser emission, described sharp light wavelength is 355 ~ 1064 nanometers, and described laser is that figure by three-dimensional software control conductor rail is to form the conductor rail of two dimension or three-dimensional structure.
7. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: it is to be divided into continuous or discrete several regions by digital control lower pilot point laser focusing bundle that described non-conductive carrier surface adheres to ink.
8. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: described conductor rail is single track structure or some three-dimensional conductor circuit structures that is distributed in zones of different.
9. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: the material of described metalized is the wherein a kind of of fine copper or copper alloy layer.
10. the manufacture method of the conductor rail on non-conductive carrier as claimed in claim 1, is characterized in that: described ink layer is to utilize the mode of spraying, wire mark or roller coating to be formed on non-conductive carrier surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210457667.5A CN103813641A (en) | 2012-11-14 | 2012-11-14 | Manufacturing method of conductor track on non-conductive carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210457667.5A CN103813641A (en) | 2012-11-14 | 2012-11-14 | Manufacturing method of conductor track on non-conductive carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103813641A true CN103813641A (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210457667.5A Pending CN103813641A (en) | 2012-11-14 | 2012-11-14 | Manufacturing method of conductor track on non-conductive carrier |
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| CN (1) | CN103813641A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470235A (en) * | 2014-11-28 | 2015-03-25 | 昆山联滔电子有限公司 | Method for manufacturing antenna circuit |
| CN108156764A (en) * | 2017-12-21 | 2018-06-12 | 维沃移动通信有限公司 | Metallic circuit production method, transparent shell and mobile terminal on transparent shell |
| CN113394555A (en) * | 2020-03-13 | 2021-09-14 | 昆山哈勃电波电子科技有限公司 | Method for preparing antenna by adopting TDP silver paste transfer printing process |
| WO2024021438A1 (en) * | 2022-07-26 | 2024-02-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus |
Citations (4)
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| US20020003127A1 (en) * | 2000-07-07 | 2002-01-10 | Katsuya Sakayori | Method of manufacturing wireless suspension blank |
| CN101522408A (en) * | 2006-08-07 | 2009-09-02 | 印可得株式会社 | Manufacturing methods for metal clad laminates |
| CN102083280A (en) * | 2009-11-30 | 2011-06-01 | Lg伊诺特有限公司 | Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof |
| CN102548229A (en) * | 2010-12-29 | 2012-07-04 | 陆富强 | Embedded type circuit distribution method and structure |
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2012
- 2012-11-14 CN CN201210457667.5A patent/CN103813641A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020003127A1 (en) * | 2000-07-07 | 2002-01-10 | Katsuya Sakayori | Method of manufacturing wireless suspension blank |
| CN101522408A (en) * | 2006-08-07 | 2009-09-02 | 印可得株式会社 | Manufacturing methods for metal clad laminates |
| CN102083280A (en) * | 2009-11-30 | 2011-06-01 | Lg伊诺特有限公司 | Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof |
| CN102548229A (en) * | 2010-12-29 | 2012-07-04 | 陆富强 | Embedded type circuit distribution method and structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470235A (en) * | 2014-11-28 | 2015-03-25 | 昆山联滔电子有限公司 | Method for manufacturing antenna circuit |
| CN108156764A (en) * | 2017-12-21 | 2018-06-12 | 维沃移动通信有限公司 | Metallic circuit production method, transparent shell and mobile terminal on transparent shell |
| CN108156764B (en) * | 2017-12-21 | 2019-10-29 | 维沃移动通信有限公司 | Metallic circuit production method, transparent shell and mobile terminal on transparent shell |
| CN113394555A (en) * | 2020-03-13 | 2021-09-14 | 昆山哈勃电波电子科技有限公司 | Method for preparing antenna by adopting TDP silver paste transfer printing process |
| WO2024021438A1 (en) * | 2022-07-26 | 2024-02-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus |
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Application publication date: 20140521 |
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