JP2006140359A5 - - Google Patents

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Publication number
JP2006140359A5
JP2006140359A5 JP2004329658A JP2004329658A JP2006140359A5 JP 2006140359 A5 JP2006140359 A5 JP 2006140359A5 JP 2004329658 A JP2004329658 A JP 2004329658A JP 2004329658 A JP2004329658 A JP 2004329658A JP 2006140359 A5 JP2006140359 A5 JP 2006140359A5
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Japan
Prior art keywords
interposer
base
side terminal
electronic component
adhesive
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JP2004329658A
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Japanese (ja)
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JP4628067B2 (en
JP2006140359A (en
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Priority to JP2004329658A priority Critical patent/JP4628067B2/en
Priority claimed from JP2004329658A external-priority patent/JP4628067B2/en
Priority to PCT/JP2005/020654 priority patent/WO2006051885A1/en
Priority to TW094139662A priority patent/TW200628035A/en
Publication of JP2006140359A publication Critical patent/JP2006140359A/en
Publication of JP2006140359A5 publication Critical patent/JP2006140359A5/ja
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Publication of JP4628067B2 publication Critical patent/JP4628067B2/en
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Claims (12)

シート状のチップ保持部材の表面にインターポーザ側端子が形成されたインターポーザを、シート状のベース部材の表面にベース側端子が形成されたベース回路シートに接合するインターポーザの接合方法において、
上記ベース回路シートにおける少なくとも上記ベース側端子の表面に、電気的絶縁性を有する絶縁性接着材よりなる接着材配設層を設ける接着剤塗付工程と、
上記ベース側端子と上記インターポーザ側端子とが上記接着材配設層を介設して対面するように、上記ベース回路シートの表面に上記インターポーザを配置するインターポーザ配置工程と、
相互に対面する一対のプレス型を用いて上記ベース回路シートと上記インターポーザとを加圧する加圧プレス工程とを行い、
上記ベース部材及び上記チップ保持部材の少なくとも一方は可塑性材料よりなり、上記ベース部材及び上記チップ保持部材のうち、上記可塑性材料よりなるものに隣接する上記一対のプレス型の少なくとも一方のプレス型は、上記インターポーザ側端子あるいは上記ベース側端子の裏面に対面する加圧表面に、他方のプレス型に向けて突出する凸部を設けてなることを特徴とするインターポーザの接合方法。 In the interposer joining method for joining the interposer in which the interposer side terminals are formed on the surface of the sheet-like chip holding member to the base circuit sheet in which the base side terminals are formed on the surface of the sheet-like base member,
An adhesive coating step of providing an adhesive disposing layer made of an insulating adhesive material having electrical insulation on at least the surface of the base-side terminal in the base circuit sheet;
An interposer arrangement step of arranging the interposer on the surface of the base circuit sheet so that the base side terminal and the interposer side terminal face each other with the adhesive material arrangement layer interposed therebetween;
A pressure pressing step of pressing the base circuit sheet and the interposer using a pair of press dies facing each other;
At least one of the base member and the tip holding member is made of a plastic material, and at least one press die of the pair of press dies adjacent to the base member and the tip holding member made of the plastic material is: A method of joining an interposer, characterized in that a convex surface protruding toward the other press die is provided on a pressing surface facing the back surface of the interposer side terminal or the base side terminal. 請求項１において、上記絶縁性接着剤は、熱可塑性のものであり、上記凸部を設けた上記プレス型は、その上記加圧表面を加熱するための加熱ヒータを有してなることを特徴とするインターポーザの接合方法。   2. The insulating adhesive according to claim 1, wherein the insulating adhesive is thermoplastic, and the press die provided with the convex portion includes a heater for heating the pressure surface. Interposer joining method. 請求項２において、上記絶縁性接着剤は、湿気硬化型のものであることを特徴とするインターポーザの接合方法。   3. The interposer joining method according to claim 2, wherein the insulating adhesive is of a moisture curing type. 請求項１〜３のいずれか1項において、上記加圧プレス工程では、上記インターポーザ側端子と、上記ベース側端子との間に、超音波振動を作用することを特徴とするインターポーザの接合方法。   4. The interposer joining method according to claim 1, wherein in the pressure pressing step, ultrasonic vibration is applied between the interposer-side terminal and the base-side terminal. 請求項１〜４のいずれか１項において、上記接着剤塗付工程において上記接着剤配設層を形成する接着剤配設領域は、上記インターポーザ配置工程において上記インターポーザを配置するインターポーザ配置領域を包含することを特徴とするインターポーザの接合方法。   5. The adhesive disposing region for forming the adhesive disposing layer in the adhesive applying step according to claim 1 includes an interposer disposing region for disposing the interposer in the interposer disposing step. An interposer joining method characterized in that: 請求項１〜５のいずれか１項において、上記ベース回路シートは、上記ベース部材の表面に、導電パターンよりなる無線通信用のアンテナパターンを形成してなり、上記インターポーザは、上記チップ保持部材の表面にＲＦ−ＩＤ用のＩＣチップを実装してなることを特徴とするインターポーザの接合方法。 6. The base circuit sheet according to claim 1, wherein the base circuit sheet is formed with an antenna pattern for wireless communication made of a conductive pattern on a surface of the base member, and the interposer is formed of the chip holding member. An interposer joining method comprising mounting an RF-ID IC chip on a surface . インターポーザ側端子を備えたインターポーザをベース回路シートの表面に接合した電子部品であって、An electronic component in which an interposer having interposer-side terminals is joined to the surface of a base circuit sheet,
上記ベース回路シートは、複数の突出変形部が形成されたベース側端子をシート状のベース部材の表面である端子形成面に有しており、  The base circuit sheet has a base side terminal on which a plurality of projecting deformed portions are formed on a terminal forming surface which is a surface of a sheet-like base member,
上記電子部品では、上記突出変形部が上記インターポーザ側端子に接触して該インターポーザ側端子と上記ベース側端子との間の電気的な導通が確保されていると共に、上記インターポーザ側端子と上記ベース側端子との間に形成された隙間に電気的な絶縁性を呈する絶縁性接着剤の接着剤配設層が形成されていることを特徴とする電子部品。  In the electronic component, the projecting deformable portion contacts the interposer side terminal to ensure electrical continuity between the interposer side terminal and the base side terminal, and the interposer side terminal and the base side An electronic component, wherein an adhesive disposition layer of an insulating adhesive exhibiting electrical insulation is formed in a gap formed between the terminals. インターポーザ側端子を備えたインターポーザを、ベース側端子を備えたベース回路シートの表面に接合した電子部品であって、  An electronic component in which an interposer having an interposer-side terminal is joined to the surface of a base circuit sheet having a base-side terminal,
上記インターポーザの表面である端子形成面に形成された上記インターポーザ側端子には、複数の突出変形部が形成され、  The interposer-side terminal formed on the terminal forming surface which is the surface of the interposer is formed with a plurality of projecting deformed portions,
上記電子部品では、上記突出変形部が上記ベース側端子に接触して該ベース側端子と上記インターポーザ側端子との間の電気的な導通が確保されていると共に、上記インターポーザ側端子と上記ベース側端子との間に形成された隙間に電気的な絶縁性を呈する絶縁性接着剤の接着剤配設層が形成されていることを特徴とする電子部品。  In the electronic component, the projecting deformable portion contacts the base side terminal to ensure electrical continuity between the base side terminal and the interposer side terminal, and the interposer side terminal and the base side An electronic component, wherein an adhesive disposition layer of an insulating adhesive exhibiting electrical insulation is formed in a gap formed between the terminals. 請求項７又は８において、上記突出変形部は、上記端子形成面の裏面側から上記端子形成面側に向かう突出変形により形成されていることを特徴とする電子部品。  9. The electronic component according to claim 7, wherein the projecting deformed portion is formed by projecting deformation from the back surface side of the terminal forming surface toward the terminal forming surface side. 請求項７〜９のいずれか１項において、上記ベース側端子又は上記インターポーザ側端子では、上記突出変形部が散点状に配置されていることを特徴とする電子部品。  10. The electronic component according to claim 7, wherein the projecting deformed portions are arranged in a dotted pattern in the base-side terminal or the interposer-side terminal. 11. 請求項７〜１０のいずれか１項において、上記インターポーザの外周側面と上記ベース回路シートの表面との間には、上記絶縁性接着剤よりなる法面が形成されていることを特徴とする電子部品。  11. The electron according to claim 7, wherein a slope made of the insulating adhesive is formed between an outer peripheral side surface of the interposer and a surface of the base circuit sheet. parts. 請求項７〜１１のいずれか１項に記載された電子部品であって、
請求項１〜６のいずれか１項のインターポーザの接合方法を用いて製造したことを特徴とする電子部品。 The electronic component according to any one of claims 7 to 11,
An electronic component manufactured using the interposer joining method according to claim 1.
JP2004329658A 2004-11-12 2004-11-12 Interposer joining method and electronic component. Active JP4628067B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004329658A JP4628067B2 (en) 2004-11-12 2004-11-12 Interposer joining method and electronic component.
PCT/JP2005/020654 WO2006051885A1 (en) 2004-11-12 2005-11-10 Bonding method of interposer, and electronic component manufactured by utilizing such method
TW094139662A TW200628035A (en) 2004-11-12 2005-11-11 Interposer bonding method and electronic component manufactured using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004329658A JP4628067B2 (en) 2004-11-12 2004-11-12 Interposer joining method and electronic component.

Publications (3)

Publication Number Publication Date
JP2006140359A JP2006140359A (en) 2006-06-01
JP2006140359A5 true JP2006140359A5 (en) 2008-09-11
JP4628067B2 JP4628067B2 (en) 2011-02-09

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JP2004329658A Active JP4628067B2 (en) 2004-11-12 2004-11-12 Interposer joining method and electronic component.

Country Status (3)

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JP (1) JP4628067B2 (en)
TW (1) TW200628035A (en)
WO (1) WO2006051885A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4855849B2 (en) * 2006-06-30 2012-01-18 富士通株式会社 RFID tag manufacturing method and RFID tag
JP5171405B2 (en) * 2008-06-05 2013-03-27 株式会社 ハリーズ Interposer joining method
JP5437623B2 (en) * 2008-11-27 2014-03-12 株式会社 ハリーズ IC tag
US8584331B2 (en) * 2011-09-14 2013-11-19 Xerox Corporation In situ flexible circuit embossing to form an electrical interconnect
JP5889718B2 (en) * 2012-05-30 2016-03-22 アルプス電気株式会社 Electronic component mounting structure and input device, and method of manufacturing the mounting structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186697A (en) * 1990-11-19 1992-07-03 Alps Electric Co Ltd Connection method of flexible printed board
JP3763607B2 (en) * 1996-04-10 2006-04-05 セイコーエプソン株式会社 Method for manufacturing liquid crystal display device and liquid crystal display device
JP2003069216A (en) * 2001-08-29 2003-03-07 Toppan Forms Co Ltd Method for connecting conductive connectors to each other
JP2004111993A (en) * 2003-12-02 2004-04-08 Hitachi Chem Co Ltd Method for connecting electrode and connecting member for use in the same

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