JP2006111973A5 - - Google Patents

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Publication number
JP2006111973A5
JP2006111973A5 JP2005296615A JP2005296615A JP2006111973A5 JP 2006111973 A5 JP2006111973 A5 JP 2006111973A5 JP 2005296615 A JP2005296615 A JP 2005296615A JP 2005296615 A JP2005296615 A JP 2005296615A JP 2006111973 A5 JP2006111973 A5 JP 2006111973A5
Authority
JP
Japan
Prior art keywords
groove
heat sink
substrate support
support
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005296615A
Other languages
English (en)
Japanese (ja)
Other versions
JP4817791B2 (ja
JP2006111973A (ja
Filing date
Publication date
Priority claimed from US10/965,601 external-priority patent/US20060075970A1/en
Application filed filed Critical
Publication of JP2006111973A publication Critical patent/JP2006111973A/ja
Publication of JP2006111973A5 publication Critical patent/JP2006111973A5/ja
Application granted granted Critical
Publication of JP4817791B2 publication Critical patent/JP4817791B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005296615A 2004-10-13 2005-10-11 加熱基板支持体及びその製造方法 Expired - Fee Related JP4817791B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/965,601 US20060075970A1 (en) 2004-10-13 2004-10-13 Heated substrate support and method of fabricating same
US10/965,601 2004-10-13
US11/115,575 US7674338B2 (en) 2004-10-13 2005-04-26 Heated substrate support and method of fabricating same
US11/115,575 2005-04-26

Publications (3)

Publication Number Publication Date
JP2006111973A JP2006111973A (ja) 2006-04-27
JP2006111973A5 true JP2006111973A5 (fr) 2011-08-04
JP4817791B2 JP4817791B2 (ja) 2011-11-16

Family

ID=36380726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005296615A Expired - Fee Related JP4817791B2 (ja) 2004-10-13 2005-10-11 加熱基板支持体及びその製造方法

Country Status (3)

Country Link
JP (1) JP4817791B2 (fr)
KR (1) KR20060052233A (fr)
TW (1) TWI289610B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009535801A (ja) * 2006-04-28 2009-10-01 ダンスン エレクトロン カンパニー リミテッド サセプタの製造方法、及び、この方法によって製造されたサセプタ
US11694879B2 (en) * 2018-12-07 2023-07-04 Applied Materials, Inc. Component, method of manufacturing the component, and method of cleaning the component
JP2023166746A (ja) * 2022-05-10 2023-11-22 東京エレクトロン株式会社 加熱装置及び基板処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2222192A (en) * 1938-10-12 1940-11-19 Westinghouse Electric & Mfg Co Flatiron
US2389588A (en) * 1942-10-29 1945-11-27 Westinghouse Electric Corp Heating apparatus
US2541118A (en) * 1945-04-11 1951-02-13 Birtman Electric Co Resistance element for electric irons
US5104459A (en) * 1989-11-28 1992-04-14 Atlantic Richfield Company Method of forming aluminum alloy sheet
US5844205A (en) * 1996-04-19 1998-12-01 Applied Komatsu Technology, Inc. Heated substrate support structure
JP3345852B2 (ja) * 1998-06-18 2002-11-18 古河電気工業株式会社 半導体製造装置の基盤ホルダー及びその製造方法
US6376815B1 (en) * 1998-01-12 2002-04-23 Furukawa Electric Co., Ltd. Highly gas tight substrate holder and method of manufacturing the same
JP2000243542A (ja) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd ヒータユニット及びその製造方法
US6897411B2 (en) * 2002-02-11 2005-05-24 Applied Materials, Inc. Heated substrate support
US7154070B2 (en) * 2004-10-08 2006-12-26 Furukawa-Sky Aluminum Corp. Heater plate and a method for manufacturing the heater plate

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