JP2006108279A5 - - Google Patents

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Publication number
JP2006108279A5
JP2006108279A5 JP2004291238A JP2004291238A JP2006108279A5 JP 2006108279 A5 JP2006108279 A5 JP 2006108279A5 JP 2004291238 A JP2004291238 A JP 2004291238A JP 2004291238 A JP2004291238 A JP 2004291238A JP 2006108279 A5 JP2006108279 A5 JP 2006108279A5
Authority
JP
Japan
Prior art keywords
lead frame
forming
die pad
smooth
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004291238A
Other languages
English (en)
Japanese (ja)
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JP2006108279A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004291238A priority Critical patent/JP2006108279A/ja
Priority claimed from JP2004291238A external-priority patent/JP2006108279A/ja
Publication of JP2006108279A publication Critical patent/JP2006108279A/ja
Publication of JP2006108279A5 publication Critical patent/JP2006108279A5/ja
Pending legal-status Critical Current

Links

JP2004291238A 2004-10-04 2004-10-04 リードフレームとその製造方法 Pending JP2006108279A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004291238A JP2006108279A (ja) 2004-10-04 2004-10-04 リードフレームとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004291238A JP2006108279A (ja) 2004-10-04 2004-10-04 リードフレームとその製造方法

Publications (2)

Publication Number Publication Date
JP2006108279A JP2006108279A (ja) 2006-04-20
JP2006108279A5 true JP2006108279A5 (cg-RX-API-DMAC7.html) 2007-02-01

Family

ID=36377666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004291238A Pending JP2006108279A (ja) 2004-10-04 2004-10-04 リードフレームとその製造方法

Country Status (1)

Country Link
JP (1) JP2006108279A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6236484B2 (ja) * 2016-02-24 2017-11-22 シャープ株式会社 発光装置
CN112805814A (zh) * 2018-10-16 2021-05-14 三菱电机株式会社 电力用半导体装置及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63115232U (cg-RX-API-DMAC7.html) * 1987-01-22 1988-07-25
JPH0775251B2 (ja) * 1988-01-25 1995-08-09 三菱伸銅株式会社 リードフレーム材の製造方法
JPH03222465A (ja) * 1990-01-29 1991-10-01 Mitsubishi Electric Corp リードフレームおよびその製造方法
JPH10270622A (ja) * 1997-03-25 1998-10-09 Matsushita Electron Corp リードフレーム
JP4237851B2 (ja) * 1998-10-26 2009-03-11 大日本印刷株式会社 樹脂封止型半導体装置用の回路部材およびその製造方法
JP2000133763A (ja) * 1998-10-26 2000-05-12 Dainippon Printing Co Ltd 樹脂封止型半導体装置用の回路部材およびその製造方法
JP3566269B2 (ja) * 2002-06-07 2004-09-15 富士通株式会社 リードフレーム及びその製造方法、及び半導体装置。

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