JP2006108279A5 - - Google Patents
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- Publication number
- JP2006108279A5 JP2006108279A5 JP2004291238A JP2004291238A JP2006108279A5 JP 2006108279 A5 JP2006108279 A5 JP 2006108279A5 JP 2004291238 A JP2004291238 A JP 2004291238A JP 2004291238 A JP2004291238 A JP 2004291238A JP 2006108279 A5 JP2006108279 A5 JP 2006108279A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- forming
- die pad
- smooth
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Claims (4)
前記リードフレーム表面が平滑面に形成され、かつ前記リードフレーム表面の平滑面にアルカリ金属を含む水酸基を含有する皮膜からなる表面改質層が形成されていることを特徴とするリードフレーム。 In a lead frame including one or both of a die pad part and a lead, the flat surface of the die pad and its end surface, the flat surface of the lead and its end surface are constituted by a continuous surface,
A lead frame, wherein the lead frame surface is formed on a smooth surface, and a surface modification layer made of a coating containing a hydroxyl group containing an alkali metal is formed on the smooth surface of the lead frame surface.
前記リードフレームの平坦面から端面にかけて連続した面を形成する連続面形成工程と、前記リードフレーム表面を算術平均粗さＲａで３０ｎｍ以上５０ｎｍ以下の範囲に平滑処理する平滑処理工程と、
前記リードフレーム表面の平滑面にアルカリ金属を含む水酸基を含有する皮膜からなる表面改質層を形成する表面改質層形成工程を含むことを特徴とするリードフレームの製造方法。 In a method for manufacturing a lead frame including a die pad portion and leads,
A continuous surface forming step of forming a continuous surface from a flat surface to an end surface of the lead frame; and a smoothing step of smoothing the lead frame surface in a range of 30 nm to 50 nm in terms of arithmetic average roughness Ra;
A method for producing a lead frame, comprising a step of forming a surface modification layer comprising a coating containing a hydroxyl group containing an alkali metal on a smooth surface of the lead frame surface .
前記リードフレームの平坦面から端面にかけて連続した面を形成すると同時に前記リードフレーム表面を算術平均粗さＲａで３０ｎｍ以上５０ｎｍ以下の範囲に平滑処理する連続面形成平滑処理工程と、
前記リードフレーム表面にアルカリ金属を含む水酸基を含有する皮膜からなる表面改質層を形成する表面改質層形成工程とを含むことを特徴とするリードフレームの製造方法。 In a method for manufacturing a lead frame including a die pad portion and leads,
Forming a continuous surface from the flat surface to the end surface of the lead frame, and at the same time smoothing the surface of the lead frame with an arithmetic average roughness Ra in a range of 30 nm to 50 nm,
And a surface modified layer forming step of forming a surface modified layer comprising a film containing a hydroxyl group containing an alkali metal on the surface of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004291238A JP2006108279A (en) | 2004-10-04 | 2004-10-04 | Lead frame and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004291238A JP2006108279A (en) | 2004-10-04 | 2004-10-04 | Lead frame and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006108279A JP2006108279A (en) | 2006-04-20 |
| JP2006108279A5 true JP2006108279A5 (en) | 2007-02-01 |
Family
ID=36377666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004291238A Pending JP2006108279A (en) | 2004-10-04 | 2004-10-04 | Lead frame and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006108279A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6236484B2 (en) * | 2016-02-24 | 2017-11-22 | シャープ株式会社 | Light emitting device |
| EP3869540A4 (en) * | 2018-10-16 | 2021-11-17 | Mitsubishi Electric Corporation | Power semiconductor device, and method for manufacturing same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63115232U (en) * | 1987-01-22 | 1988-07-25 | ||
| JPH0775251B2 (en) * | 1988-01-25 | 1995-08-09 | 三菱伸銅株式会社 | Lead frame material manufacturing method |
| JPH03222465A (en) * | 1990-01-29 | 1991-10-01 | Mitsubishi Electric Corp | Lead frame and its manufacture |
| JPH10270622A (en) * | 1997-03-25 | 1998-10-09 | Matsushita Electron Corp | Lead frame |
| JP2000133763A (en) * | 1998-10-26 | 2000-05-12 | Dainippon Printing Co Ltd | Circuit member for resin-sealing semiconductor device and manufacture thereof |
| JP4237851B2 (en) * | 1998-10-26 | 2009-03-11 | 大日本印刷株式会社 | Circuit member for resin-encapsulated semiconductor device and manufacturing method thereof |
| JP3566269B2 (en) * | 2002-06-07 | 2004-09-15 | 富士通株式会社 | Lead frame, manufacturing method thereof, and semiconductor device. |
-
2004
- 2004-10-04 JP JP2004291238A patent/JP2006108279A/en active Pending
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