JP2006103207A - Resin mold device - Google Patents

Resin mold device Download PDF

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Publication number
JP2006103207A
JP2006103207A JP2004294188A JP2004294188A JP2006103207A JP 2006103207 A JP2006103207 A JP 2006103207A JP 2004294188 A JP2004294188 A JP 2004294188A JP 2004294188 A JP2004294188 A JP 2004294188A JP 2006103207 A JP2006103207 A JP 2006103207A
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mold
resin
cavity
upper mold
air
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JP2004294188A
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JP4695863B2 (en
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Kunihiro Aoki
邦弘 青木
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Apic Yamada Corp
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Apic Yamada Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0613—Square or rectangular array
    • H01L2224/06134—Square or rectangular array covering only portions of the surface to be connected
    • H01L2224/06136—Covering only the central area of the surface to be connected, i.e. central arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To make a resin molding without causing flashes and allowing deformation of the molding when an easily-deformable molding object such as a film substrate used for manufacturing a semiconductor device of a BOC (board on chip) type is clamped by a mold to make the resin molding. <P>SOLUTION: The resin mold device comprises an upper mold 30 and a lower mold 40 one of which molds is provided with air suction holes 45 and 46. The molding object 20 is sucked on the mold face through the air suction holes 45 and 46, the molding object 20 is clamped by the mold 30 and the mold 40, and in this state, a resin is filled into cavities 32a and 42a formed in the mold 30 and the mold 40 from a pot 41 to make the resin molding. The air suction hole 46 opposed in a region of the cavity 32a of the other mold of the mold 30 and the mold 40 communicates with an air suction device, and a suction pin 47 is inserted in an air hole formed in a single hole shape opened in a mold face to suck and retain the molding object 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は樹脂モールド装置に関し、より詳細には被成形品を金型にエア吸着により支持して樹脂モールドする樹脂モールド装置に関する。   The present invention relates to a resin molding apparatus, and more particularly to a resin molding apparatus that molds a molded product by supporting a molded product on a mold by air adsorption.

図１１は樹脂モールドにより形成されたＢＯＣ（Board On Chip)型の半導体装置１０の構成を示す断面図である。この半導体装置１０はフィルム基板１２の一方の面に半導体チップ１４が接合され、フィルム基板１２の他方の面に形成された配線パターン１５と半導体チップ１４のパッド１４ａとがワイヤボンディングによって接続されて形成されたもので、パッド１４ａとボンディングワイヤ１６との接合部および半導体チップ１４が樹脂１８によって封止されている。この製品では、配線パターン１５と半導体チップ１４のパッド１４ａとをワイヤボンディングによって接続するため、パッド１４ａの配置に合わせてフィルム基板１２にスリット状の開口孔１２ａが設けられている。   FIG. 11 is a cross-sectional view showing a configuration of a BOC (Board On Chip) type semiconductor device 10 formed by resin molding. The semiconductor device 10 is formed by bonding a semiconductor chip 14 to one surface of a film substrate 12 and connecting a wiring pattern 15 formed on the other surface of the film substrate 12 and a pad 14a of the semiconductor chip 14 by wire bonding. Thus, the joint between the pad 14 a and the bonding wire 16 and the semiconductor chip 14 are sealed with a resin 18. In this product, in order to connect the wiring pattern 15 and the pad 14a of the semiconductor chip 14 by wire bonding, a slit-like opening hole 12a is provided in the film substrate 12 in accordance with the arrangement of the pad 14a.

図１２に、半導体チップ１４を搭載したフィルム基板１２を樹脂モールド金型の上型２２と下型２４とでクランプして樹脂モールドする状態を示す。フィルム基板１２には複数個の半導体チップ１４がマトリクス配置で整列して搭載され、フィルム基板１２の半導体チップ１４が搭載されている面を封止する上型２２には複数個の半導体チップ１４を一括して樹脂封止するためのキャビティ２６ａが設けられ、フィルム基板１２の他方の面（ボンディング部）を封止する下型２４には個々のボンディング部に合わせてキャビティ２６ｂが設けられている。   FIG. 12 shows a state where the film substrate 12 on which the semiconductor chip 14 is mounted is clamped by the upper mold 22 and the lower mold 24 of the resin mold and resin molded. A plurality of semiconductor chips 14 are arranged and arranged in a matrix arrangement on the film substrate 12, and a plurality of semiconductor chips 14 are mounted on the upper mold 22 that seals the surface of the film substrate 12 on which the semiconductor chips 14 are mounted. A cavity 26a is provided for collectively sealing the resin, and the lower mold 24 for sealing the other surface (bonding part) of the film substrate 12 is provided with a cavity 26b corresponding to each bonding part.

これらのキャビティ２６ａ、２６ｂにポットから樹脂を充填して樹脂封止した後、基板に外部接続端子を接合し、単一の半導体装置ごとに成形品をダイシングすることによって、図１１に示すようなＢＯＣ型の半導体装置が得られる。
このようなＢＯＣ型の半導体装置等の製造に用いられるフィルム基板は、樹脂フィルム等の変形しやすい材質からなるため、樹脂モールド金型に被成形品をセットした際に、位置ずれしたりしないように、金型に被成形品をエア吸着して支持するといったことがなされている（たとえば、特許文献１参照）。図１２に示す樹脂モールド金型では、下型２４にエア吸着孔２５が設けられ、エア流路２５ａを介してエア吸着孔２５によりフィルム基板１２を下型２４の金型面にエア吸着して支持している。
特開２００１−２７７３０６号公報 After these cavities 26a and 26b are filled with resin from the pot and sealed with resin, external connection terminals are joined to the substrate, and a molded product is diced for each single semiconductor device, as shown in FIG. A BOC type semiconductor device is obtained.
Since the film substrate used for manufacturing such a BOC type semiconductor device is made of a material that is easily deformed such as a resin film, the film substrate is not misaligned when the molded product is set in the resin mold. In addition, the object to be molded is supported on the mold by air adsorption (for example, see Patent Document 1). In the resin mold shown in FIG. 12, an air suction hole 25 is provided in the lower mold 24, and the film substrate 12 is air-adsorbed to the mold surface of the lower mold 24 through the air flow path 25a. I support it.
JP 2001-277306 A

ところで、図１２に示すように、フィルム基板１２を挟んで上型２２と下型２４の双方にキャビティ２６ａ、２６ｂが設けられている場合には、下型２４に設けられているキャビティ２６ｂの外周部分に樹脂モールド時の樹脂圧によって樹脂ばりが生じるという問題がある。これは、フィルム基板１２の周縁部は上型２２と下型２４とで強固にクランプされるものの、キャビティ２６ａの内側領域では、被成形品２０が下型２４の金型面にエア吸着作用のみによって支持され、金型によってクランプされていないためである。図１３に、フィルム基板１２の表面を保護する保護膜１３の表面上に樹脂ばり１８ａが生じた状態を示す。フィルム基板１２上に生じた樹脂ばり１８ａが、外部接続端子を接合する領域にまで達すると、外部接続端子と半導体チップ１４との電気的接続が不確実となり不良品になるという問題がある。   By the way, as shown in FIG. 12, when cavities 26a and 26b are provided in both the upper mold 22 and the lower mold 24 with the film substrate 12 interposed therebetween, the outer periphery of the cavity 26b provided in the lower mold 24 is provided. There is a problem in that resin flash is generated due to the resin pressure during resin molding. This is because the peripheral portion of the film substrate 12 is firmly clamped by the upper mold 22 and the lower mold 24, but in the inner region of the cavity 26 a, the molded product 20 only has an air adsorption action on the mold surface of the lower mold 24. This is because it is supported by the mold and not clamped by the mold. FIG. 13 shows a state in which a resin beam 18 a is generated on the surface of the protective film 13 that protects the surface of the film substrate 12. When the resin beam 18a generated on the film substrate 12 reaches a region where the external connection terminals are joined, there is a problem that the electrical connection between the external connection terminals and the semiconductor chip 14 becomes uncertain and becomes a defective product.

また、フィルム基板１２上に樹脂ばりが生じないように、フィルム基板１２を下型２４に強くエア吸着して支持する方法も考えられるが、フィルム基板１２を強くエア吸引すると、フィルム基板１２自体がエア吸着孔２５に引き込まれて変形してしまい、これによってフィルム基板が損傷するという問題がある。
そこで、本発明はこれらの課題を解決すべくなされたものであり、ＢＯＣ型の半導体装置の製造に用いられるフィルム基板のように、容易に変形する被成形品を金型によりクランプして樹脂モールドする際に、樹脂ばりを生じさせず、被成形品を変形させずに樹脂モールドすることができる樹脂モールド装置を提供することを目的とする。 In addition, a method of supporting the film substrate 12 by strongly adsorbing air to the lower mold 24 so as not to cause resin flash on the film substrate 12 is also conceivable. However, if the film substrate 12 is strongly aspirated, the film substrate 12 itself There is a problem that the film substrate is damaged by being drawn into the air suction holes 25 and deformed.
Accordingly, the present invention has been made to solve these problems, such as a film substrate used in the manufacture of a BOC type semiconductor device, a product to be easily deformed is clamped by a mold and a resin mold. An object of the present invention is to provide a resin molding apparatus capable of performing resin molding without causing resin burrs and without deforming a molded product.

本発明は、上記目的を達成するため次の構成を備える。
すなわち、上型と下型の一方に設けたエア吸着孔を介して被成形品を金型面にエア吸着し、上型と下型とで前記被成形品をクランプした状態でポットから前記上型と下型の双方に設けたキャビティに樹脂を充填して樹脂モールドする樹脂モールド装置において、前記上型と下型の一方に設けられたキャビティの縁部に沿って、被成形品をクランプした際にキャビティよりも肉薄に樹脂が充填される空隙部が形成される、薄肉部が設けられていることを特徴とする。 The present invention has the following configuration in order to achieve the above object.
That is, the molded product is air-adsorbed on the mold surface through an air suction hole provided in one of the upper mold and the lower mold, and the upper mold and the lower mold are clamped to the molded product from the pot. In a resin molding apparatus that fills a resin in a cavity provided in both a mold and a lower mold and molds the resin, the product to be molded is clamped along the edge of the cavity provided in one of the upper mold and the lower mold In this case, a thin-walled portion is provided in which a void portion is formed which is filled with resin thinner than the cavity.

また、上型と下型の他方に設けられたキャビティが、複数個の半導体チップあるいはダイシングされることによって複数個に分離される半導体チップを一括して樹脂モールドする大きさに形成され、前記上型と下型の一方に設けられたキャビティが、前記複数個の半導体チップあるいは複数個に分離される半導体チップの各々の配置位置に対応して、分離されたキャビティに形成されていることにより、半導体チップがマトリクス状に配置された被成形品の両面を容易にかつ確実に樹脂モールドすることが可能になる。   Further, the cavity provided in the other of the upper mold and the lower mold is formed to have a size capable of collectively resin-molding a plurality of semiconductor chips or semiconductor chips separated into a plurality by dicing. A cavity provided in one of the mold and the lower mold is formed in a separated cavity corresponding to the arrangement position of each of the plurality of semiconductor chips or the plurality of semiconductor chips separated, It becomes possible to easily and reliably resin-mold both surfaces of a molded product in which semiconductor chips are arranged in a matrix.

また、上型と下型の一方に設けたエア吸着孔を介して被成形品を金型面にエア吸着し、上型と下型とで前記被成形品をクランプした状態でポットから前記上型と下型の双方に設けたキャビティに樹脂を充填して樹脂モールドする樹脂モールド装置において、前記上型と下型の他方に設けられたキャビティの平面領域内に対向して配置されるエア吸着孔が、エアの吸引装置に連通するとともに被成形品をエア吸着する金型面で開口する単穴形状に形成された通気孔に吸着ピンを内挿して形成されていることを特徴とする。   In addition, the molded product is air adsorbed on the mold surface through an air suction hole provided in one of the upper mold and the lower mold, and the upper mold and the lower mold are clamped to the molded product from the pot. In a resin molding apparatus that fills a resin in a cavity provided in both a mold and a lower mold and molds the resin, an air adsorption disposed opposite to the plane area of the cavity provided in the other of the upper mold and the lower mold The holes are formed by inserting suction pins into air holes formed in a single hole shape that communicates with an air suction device and opens at a mold surface that air-sucks the molded product.

また、前記被成形品の周縁部を吸着する位置に設けられるエア吸着孔が、エアの吸引装置に連通するとともに被成形品をエア吸着する金型面で開口する単穴形状の通気孔として形成されていることを特徴とする。被成形品の周縁部を吸着する位置に設けられるエア吸着孔については、単穴形状の通気孔として形成することで、成形品に悪影響を与えることなく被成形品をエア吸着して樹脂モールドすることができる。
また、前記被成形品の周縁部を吸着する位置に設けられるエア吸着孔が、樹脂モールド領域の外部に配置されていることにより、製品に悪影響を及ぼさずに樹脂モールドすることができる。 In addition, an air suction hole provided at a position for sucking the peripheral portion of the molded product is formed as a single hole-shaped vent hole that communicates with an air suction device and opens on a mold surface that air-sucks the molded product. It is characterized by being. About the air suction hole provided in the position which adsorbs the peripheral part of a molded product, by forming it as a single hole-shaped air hole, the molded product is air-adsorbed and resin molded without adversely affecting the molded product. be able to.
Further, since the air suction hole provided at the position for sucking the peripheral edge of the molded product is disposed outside the resin mold region, the resin molding can be performed without adversely affecting the product.

また、前記上型と下型の一方に設けられたキャビティの縁部に沿って、被成形品をクランプした際にキャビティよりも肉薄に樹脂が充填される空隙部が形成される、薄肉部が設けられていることにより、樹脂ばりを生じさせずに樹脂モールドすることが可能になる。
また、前記上型と下型の他方に設けられたキャビティが、複数個の半導体チップあるいはダイシングされることによって複数個に分離される半導体チップを一括して樹脂モールドする大きさに形成され、前記上型と下型の一方に設けられたキャビティが、前記複数個の半導体チップあるいは複数個に分離される半導体チップの各々の配置位置に対応して、分離されたキャビティに形成されていることにより、半導体チップがマトリクス状に配置された被成形品を好適に樹脂モールドすることが可能になる。 Further, along the edge of the cavity provided in one of the upper mold and the lower mold, when the molded product is clamped, a void portion that is filled with resin thinner than the cavity is formed. By being provided, it becomes possible to perform resin molding without causing resin flash.
Further, the cavity provided in the other of the upper mold and the lower mold is formed to have a size capable of collectively resin-molding a plurality of semiconductor chips or semiconductor chips separated into a plurality by dicing, A cavity provided in one of the upper mold and the lower mold is formed in a separated cavity corresponding to the arrangement position of each of the plurality of semiconductor chips or the plurality of separated semiconductor chips. The molded product in which the semiconductor chips are arranged in a matrix can be suitably resin-molded.

本発明に係る樹脂モールド装置によれば、キャビティの縁部に沿って薄肉部を設けることにより、樹脂モールド時にキャビティから樹脂が漏出して樹脂ばりが生じることを防止し、信頼性の高い樹脂モールドが可能になる。また、上型あるいは下型に設けられるキャビティの平面領域内に対向して配置されるエア吸着孔が、単穴形状に形成された通気孔に吸着ピンを内挿して形成したことにより、被成形品をエア吸着した際に被成形品が変形することを防止し、これによって成形不良を防止するとともに、被成形品の表面に樹脂ばりが生じることを防止することが可能になる。   According to the resin mold apparatus according to the present invention, by providing the thin wall portion along the edge of the cavity, it is possible to prevent the resin from leaking out from the cavity during the resin molding and to generate a resin flash, and to provide a highly reliable resin mold. Is possible. In addition, the air suction holes that are arranged opposite to each other in the plane area of the cavity provided in the upper mold or the lower mold are formed by inserting the suction pins into the air holes formed in a single hole shape. It is possible to prevent the molded product from being deformed when the product is adsorbed with air, thereby preventing molding defects and preventing the occurrence of resin flash on the surface of the molded product.

以下、本発明の好適な実施の形態を添付図面に基づいて詳細に説明する。図１、２は前述したＢＯＣ型の半導体装置の製造に用いられる被成形品２０を樹脂モールドする樹脂モールド金型の上型３０と下型４０の構成を示す平面図である。
上型３０には複数個の半導体チップ１４を一括して樹脂封止するキャビティ凹部３２が設けられ、下型４０には個々の半導体チップ１４の配置位置に合わせてボンディング部を樹脂封止するキャビティ凹部４２が設けられている。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings. 1 and 2 are plan views showing configurations of an upper mold 30 and a lower mold 40 of a resin mold for resin molding a molded product 20 used for manufacturing the BOC type semiconductor device described above.
The upper mold 30 is provided with a cavity recess 32 for collectively resin-sealing a plurality of semiconductor chips 14, and the lower mold 40 is a cavity for resin-sealing bonding portions in accordance with the arrangement positions of the individual semiconductor chips 14. A recess 42 is provided.

図１に示すように、上型３０は、金型面の中央に形成された金型カル３１を挟む両側位置に各々４個のキャビティ凹部３２が設けられ、一度に２枚の被成形品２０を樹脂モールドすることができるように構成されている。
本実施形態の樹脂モールド装置によるモールド対象品であるフィルム基板１２は短冊状に形成されたものであり、キャビティ凹部３２はフィルム基板１２に搭載されている半導体チップ１４を一括して樹脂モールドする４つの樹脂モールド部に対応している。図１で、フィルム基板１２の金型でのセット位置を二点鎖線Ａで示す。金型カル３１は下型４０に設けられたポット４１の配置に対応して設けられ、ランナー３４を介してキャビティ凹部３２に連通する。 As shown in FIG. 1, the upper mold 30 is provided with four cavity recesses 32 at both sides of a mold cull 31 formed at the center of the mold surface, and two molded articles 20 at a time. It is comprised so that resin molding can be carried out.
The film substrate 12 which is a product to be molded by the resin molding apparatus of the present embodiment is formed in a strip shape, and the cavity recess 32 collectively resin molds the semiconductor chips 14 mounted on the film substrate 12 4. It corresponds to one resin mold part. In FIG. 1, the set position of the film substrate 12 in the mold is indicated by a two-dot chain line A. The mold cull 31 is provided corresponding to the arrangement of the pot 41 provided in the lower mold 40, and communicates with the cavity recess 32 via the runner 34.

下型４０には、図２に示すように、金型面の中央に所定間隔をあけて一列状に４個のポット４１が設けられ、各々のポット４１に片側で６個ずつキャビティ凹部４２が連通する。フィルム基板１２には一つの樹脂モールド部ごとに６個の半導体チップ１４が搭載され、キャビティ凹部４２はこれらの半導体チップ１４の配置位置に合わせて配置されている。ポット４１とキャビティ凹部４２とはポット４１から上型３０に設けられたランナー３４を介して接続する。   As shown in FIG. 2, the lower mold 40 is provided with four pots 41 in a row at a predetermined interval in the center of the mold surface, and each pot 41 has six cavity recesses 42 on one side. Communicate. Six semiconductor chips 14 are mounted on the film substrate 12 for each resin mold portion, and the cavity recesses 42 are arranged in accordance with the arrangement positions of these semiconductor chips 14. The pot 41 and the cavity recess 42 are connected from the pot 41 via a runner 34 provided on the upper mold 30.

また、下型４０には被成形品２０を下型４０の金型面にエア吸着して支持するエア吸着孔が設けられている。これらのエア吸着孔は、被成形品２０の周縁部をエア吸着するエア吸着孔４５と、上型３０に設けられているキャビティ凹部３２の領域内で被成形品２０をエア吸着するエア吸着孔４６からなる。
エア吸着孔４５、４６は下型４０内に設けられたエア流路４８、４８ａを介して金型外に設けられた吸引装置７０に連通する。エア流路４８はポット４１の両側に設けられている被成形品２０のセット位置の幅方向の中央部をセット位置の長手方向の略全長にわたって直線的に連通するように設けられ、エア流路４８ａはこのエア流路４８から分岐してセット位置の幅方向にセット位置の側縁位置まで延出するように設けられている。 The lower mold 40 is provided with an air suction hole that supports the molded product 20 by air suction on the mold surface of the lower mold 40. These air adsorbing holes include an air adsorbing hole 45 that adsorbs air to the periphery of the molded product 20 and an air adsorbing hole that adsorbs the molded product 20 in the area of the cavity recess 32 provided in the upper mold 30. 46.
The air suction holes 45, 46 communicate with a suction device 70 provided outside the mold via air flow paths 48, 48 a provided in the lower mold 40. The air flow path 48 is provided so as to linearly communicate the center portion in the width direction of the set position of the molding 20 provided on both sides of the pot 41 over substantially the entire length in the longitudinal direction of the set position. 48a is provided so as to branch from the air flow path 48 and extend to the side edge position of the set position in the width direction of the set position.

図３に、図２に示した下型４０におけるキャビティ凹部４２、エア吸着孔４５、４６およびエア流路４８、４８ａ等の配置を拡大して示す。
キャビティ凹部４２が長手方向の向きを互いに平行にして２列のマトリクス状に設けられていること、隣接するキャビティ凹部４２の中間にエア流路４８、４８ａが設けられていることを示す。二点鎖線Ａが被成形品２０のセット位置を示し、上述したように、エア吸着孔４５は被成形品２０の周縁部に配置され、エア吸着孔４６は半導体チップ１４が一括して樹脂モールドされる樹脂モールド領域内に配置される。具体的には、エア吸着孔４６はキャビティ凹部４２の側縁の中間位置、すなわち各々のキャビティ凹部４２の間に配置される。 FIG. 3 shows an enlarged arrangement of the cavity recess 42, the air suction holes 45 and 46, the air channels 48 and 48a, etc. in the lower mold 40 shown in FIG.
It shows that the cavity recesses 42 are provided in a matrix of two rows with their longitudinal directions parallel to each other, and that air flow paths 48 and 48 a are provided between the adjacent cavity recesses 42. An alternate long and two short dashes line A indicates a set position of the molded product 20, and as described above, the air suction holes 45 are arranged at the peripheral edge of the molded product 20. Placed in the resin mold region. Specifically, the air suction hole 46 is disposed at an intermediate position of the side edge of the cavity recess 42, that is, between each cavity recess 42.

本実施形態の樹脂モールド装置に用いられる樹脂モールド金型において特徴的な構成の一つは、被成形品２０のボンディング部を樹脂封止するためのキャビティ凹部４２の形状にある。すなわち、本実施形態の樹脂モールド金型では、下型４０に設けるキャビティ凹部４２として、キャビティ凹部４２の長手方向の側縁に沿って薄肉部４３を設けたことを特徴とする。
前述したように、被成形品２０のフィルム基板１２には半導体チップ１４のパッド１４ａを露出させるため、スリット状の開口孔１２ａが形成されている。キャビティ凹部４２はこの開口孔１２ａの形状に合わせて、平面形状が細長く形成される。薄肉部４３はこの細長に形成されているキャビティ凹部４２の側縁に沿って設けられる。 One of the characteristic structures of the resin mold used in the resin mold apparatus of this embodiment is the shape of the cavity recess 42 for resin-sealing the bonding portion of the molded product 20. In other words, the resin mold according to this embodiment is characterized in that the thin portion 43 is provided along the side edge in the longitudinal direction of the cavity recess 42 as the cavity recess 42 provided in the lower die 40.
As described above, the slit-shaped opening 12a is formed in the film substrate 12 of the molded product 20 in order to expose the pad 14a of the semiconductor chip 14. The cavity recess 42 is formed to have an elongated planar shape in accordance with the shape of the opening hole 12a. The thin-walled portion 43 is provided along the side edge of the cavity recess 42 formed in this elongated shape.

図４に、側縁に薄肉部４３を設けたキャビティ凹部４２を備えた下型４０により被成形品２０をクランプして樹脂モールドする状態の断面図を示す。図４は、上型３０と下型４０とで被成形品２０をクランプした状態を示す。被成形品２０を上型３０と下型４０とでクランプしたことにより、上型３０にはキャビティ凹部３２によるキャビティ３２ａが形成され、下型４０にはキャビティ凹部４２によるキャビティ４２ａが形成される。   FIG. 4 is a cross-sectional view showing a state where the molded product 20 is clamped and resin-molded by the lower mold 40 provided with the cavity concave portion 42 provided with the thin wall portion 43 on the side edge. FIG. 4 shows a state in which the molded product 20 is clamped by the upper mold 30 and the lower mold 40. By clamping the molded product 20 with the upper mold 30 and the lower mold 40, a cavity 32 a is formed by the cavity recess 32 in the upper mold 30, and a cavity 42 a is formed by the cavity recess 42 in the lower mold 40.

本実施形態では、キャビティ凹部４２の側縁に沿って薄肉部４３を設けたことにより、上型３０と下型４０とで被成形品２０をクランプすると、キャビティ４２ａの側縁に沿って、薄く樹脂が充填される空隙部が形成されるようになる。このようにキャビティ４２ａの側縁に沿って空隙部を形成すると、ポット４１からキャビティ４２ａに樹脂を圧送して充填する際に、薄肉部４３に充填された樹脂については、金型からの熱伝導によってキャビティ４２ａの中心部に充填される樹脂よりもより速く硬化する。薄肉部４３で硬化した樹脂は、樹脂圧を受けてキャビティ４２ａに充填される樹脂がキャビティ４２ａから漏出しようとする際に、これを抑えるダムとして作用し、キャビティ４２ａから樹脂が漏出することを防止する作用をなし、フィルム基板１２上に樹脂ばりが生じることを防止することができる。   In the present embodiment, by providing the thin wall portion 43 along the side edge of the cavity recess 42, when the molded product 20 is clamped by the upper mold 30 and the lower mold 40, the thin section 43 is thinned along the side edge of the cavity 42a. A gap filled with the resin is formed. When the gap is formed along the side edge of the cavity 42a as described above, when the resin is pumped and filled from the pot 41 to the cavity 42a, the heat conduction from the mold is performed for the resin filled in the thin portion 43. This cures faster than the resin filled in the center of the cavity 42a. The resin cured in the thin-walled portion 43 acts as a dam to prevent the resin filled in the cavity 42a from being leaked from the cavity 42a by receiving the resin pressure, thereby preventing the resin from leaking out of the cavity 42a. It is possible to prevent the occurrence of resin flash on the film substrate 12.

図４では、説明上、薄肉部４３を強調して描いているが、薄肉部４３はフィルム基板１２上で外部接続端子を接合する領域と重複しないように設ければよい。ＢＯＣ型の半導体装置の場合は、キャビティ凹部４２は細長の平面形状に形成されること、外部接続端子はキャビティ凹部４２を挟んだ両側に配置されることから、キャビティ凹部４２の長手方向に平行となる側縁に沿って薄肉部４３を設けることで樹脂ばりの発生を効果的に抑えることができ、外部接続端子と配線パターンとの電気的接続についての悪影響を抑えることができる。もちろん、薄肉部４３をキャビティ凹部４２の縁部に沿って一周するように設けてもよい。   In FIG. 4, for the sake of explanation, the thin portion 43 is drawn with emphasis, but the thin portion 43 may be provided so as not to overlap the region where the external connection terminals are joined on the film substrate 12. In the case of a BOC type semiconductor device, the cavity recess 42 is formed in an elongated planar shape, and the external connection terminals are arranged on both sides of the cavity recess 42, so that the cavity recess 42 is parallel to the longitudinal direction of the cavity recess 42. By providing the thin portion 43 along the side edge, it is possible to effectively suppress the occurrence of resin burrs, and to suppress the adverse effect of electrical connection between the external connection terminal and the wiring pattern. Of course, the thin portion 43 may be provided so as to make a round along the edge of the cavity recess 42.

図５に本実施形態の樹脂モールド装置を用いてフィルム基板１２を樹脂モールドして形成した半導体装置の構成を示す。本実施形態の樹脂モールド装置では、キャビティ凹部４２の長手方向に沿って形成された薄肉部４３で硬化した樹脂を薄肉硬化部４３ａとしてキャビティの側縁に沿って形成され、薄肉硬化部４３ａによりキャビティから樹脂が漏出することが防止されて、保護膜１３の表面上に樹脂ばりが生じることが抑えられている。   FIG. 5 shows a configuration of a semiconductor device formed by resin-molding the film substrate 12 using the resin mold device of this embodiment. In the resin mold apparatus of the present embodiment, the resin cured at the thin portion 43 formed along the longitudinal direction of the cavity recess 42 is formed as a thin cured portion 43a along the side edge of the cavity, and the cavity is formed by the thin cured portion 43a. It is possible to prevent the resin from leaking from the surface of the protective film 13 and prevent the resin flash from being generated on the surface of the protective film 13.

また、本実施形態の樹脂モールド金型において特徴的な他の構成は、エア吸着孔４５、４６の構成にある。すなわち、被成形品２０のフィルム基板１２の周縁部をエア吸着するエア吸着孔４５については、エア流路４８、４８ａに連通する単穴形状の通気孔として形成するのに対して、樹脂モールド領域内に配置されるエア吸着孔４６については単穴形状に形成した通気孔内に吸着ピンを装着して形成したことを特徴とする。   Another characteristic configuration of the resin mold of this embodiment is the configuration of the air suction holes 45 and 46. That is, the air adsorbing hole 45 for air adsorbing the peripheral portion of the film substrate 12 of the molded product 20 is formed as a single hole-shaped vent hole communicating with the air flow paths 48 and 48a, whereas the resin mold region The air adsorbing hole 46 disposed inside is formed by attaching an adsorbing pin in a vent hole formed in a single hole shape.

図６は、上型３０と下型４０とで被成形品２０をクランプした状態を、図２におけるＢ−Ｂ線位置で見た断面図、図７は図２におけるＣ−Ｃ線位置で見た断面図を示す。
図２に示すように、本実施形態の樹脂モールド金型では、上型３０と下型４０とで被成形品２０をクランプして形成される上型側のキャビティ３２ａの平面範囲内には、下型４０に６個ずつエア吸着孔４６が配置されている。これらのエア吸着孔４６は下型４０に設けられたエア流路４８を介して吸引装置７０に連通する。
また、被成形品２０の周縁部をエア吸着するエア吸着孔４５は、図７に示すように、被成形品２０の長手方向に所定間隔をあけて配置されている。エア吸着孔４５はエア流路４８ａに連通して、金型面で開口する通気孔に形成したものである。 6 is a cross-sectional view of the state in which the molded product 20 is clamped by the upper mold 30 and the lower mold 40 at the position of the line BB in FIG. 2, and FIG. 7 is the position of the line CC in FIG. FIG.
As shown in FIG. 2, in the resin mold mold according to the present embodiment, the upper mold side cavity 32a formed by clamping the molded article 20 with the upper mold 30 and the lower mold 40 is within a plane range. Six air suction holes 46 are arranged in the lower die 40. These air suction holes 46 communicate with the suction device 70 through an air flow path 48 provided in the lower mold 40.
Further, as shown in FIG. 7, the air suction holes 45 that air-suck the peripheral portion of the molded product 20 are arranged at predetermined intervals in the longitudinal direction of the molded product 20. The air adsorbing hole 45 communicates with the air flow path 48a and is formed in a vent hole that opens on the mold surface.

図８は、被成形品２０を上型３０と下型４０とでクランプし、エア吸着孔４５、４６の配置および構成を被成形品２０の幅方向の端面から見た状態を示す。上型３０側にキャビティ３２ａが形成され、下型４０側にキャビティ４２ａが形成されている。
下型４０に形成されたエア流路４８ａは吸引装置７０に接続するエア流路４８から被成形品２０の幅方向に延出し、被成形品２０の側縁部（周縁部）で単穴形状に形成されたエア吸着孔４５の下端に接続する。エア吸着孔４５は被成形品２０の樹脂モールド領域の外側に位置している。 FIG. 8 shows a state in which the molded product 20 is clamped by the upper mold 30 and the lower mold 40 and the arrangement and configuration of the air suction holes 45 and 46 are viewed from the end surface in the width direction of the molded product 20. A cavity 32a is formed on the upper mold 30 side, and a cavity 42a is formed on the lower mold 40 side.
The air flow path 48a formed in the lower mold 40 extends from the air flow path 48 connected to the suction device 70 in the width direction of the molded product 20, and has a single hole shape at the side edge (peripheral portion) of the molded product 20. It connects with the lower end of the air suction hole 45 formed in this. The air suction hole 45 is located outside the resin mold region of the molded product 20.

樹脂モールド領域（キャビティ３２ａ）の平面領域内に配置されるエア吸着孔４６は、下端でエア流路４８に連通し、上部側は下型４０の金型面で開口する単穴形状に形成された通気孔に吸着ピン４７のピン本体を内挿して形成されている。吸着ピン４７は通気孔と同芯に、かつピン本体の端面の高さ位置が下型４０の金型面の高さ位置と一致するように下型４０に固定される。実施形態では、ピン本体の下部をピン本体よりも若干大径に形成して通気孔に抜け止めして吸着ピン４７を取り付けている。また、通気孔は下部側で上部側よりも拡径して形成され、通気孔の内周面とピン本体の外周面との間に形成される吸引路とエア流路４８とが通気孔の拡径部分を経由して連通するように設けている。   The air suction hole 46 disposed in the planar area of the resin mold area (cavity 32a) is formed in a single hole shape communicating with the air flow path 48 at the lower end and opening on the mold surface of the lower mold 40 on the upper side. It is formed by inserting the pin body of the suction pin 47 into the vent hole. The suction pin 47 is fixed to the lower mold 40 so as to be concentric with the vent hole and so that the height position of the end surface of the pin body coincides with the height position of the mold surface of the lower mold 40. In the embodiment, the lower portion of the pin main body is formed to have a slightly larger diameter than the pin main body, and the suction pin 47 is attached by being prevented from being removed from the vent hole. The vent hole is formed on the lower side with a larger diameter than the upper side, and a suction path and an air channel 48 formed between the inner peripheral surface of the vent hole and the outer peripheral surface of the pin body are the vent holes. It is provided so as to communicate via the enlarged diameter portion.

図９(a)はエア吸着孔４６の被成形品２０を吸着する吸着面での平面図を示す。図９(b)はエア吸着孔４６と吸着ピン４７の断面図を示す（ｄ−ｄ線断面）。エア吸着孔４６は下型４０に設けた通気孔４６ａに吸着ピン４７を内挿する配置としたことにより、通気孔４６ａの内周面と吸着ピン４７のピン本体４７ａの外周面との間に形成されるリング状の隙間部分がエアの吸引路となる。一例として吸着ピン４７ａの外周面に突起４７ｂを複数本設け、吸着ピン４７ａが一方に傾くことを防止して、通気孔４６ａの隙間を均一にしている。   FIG. 9A shows a plan view of the suction surface for sucking the molded product 20 in the air suction hole 46. FIG. 9B shows a sectional view of the air suction hole 46 and the suction pin 47 (cross section taken along the line dd). Since the air suction hole 46 is arranged so that the suction pin 47 is inserted into the vent hole 46a provided in the lower mold 40, the air suction hole 46 is provided between the inner peripheral surface of the vent hole 46a and the outer peripheral surface of the pin main body 47a of the suction pin 47. The formed ring-shaped gap portion serves as an air suction path. As an example, a plurality of protrusions 47b are provided on the outer peripheral surface of the suction pin 47a to prevent the suction pin 47a from being tilted in one direction and to make the gaps of the vent holes 46a uniform.

本実施形態の樹脂モールド金型を用いて被成形品２０を樹脂モールドする際には、型開きした状態で被成形品２０を下型４０のセット位置に位置合わせしてセットし、吸引装置７０を作動させて被成形品２０を下型４０にエア吸着して支持した後、上型３０と下型４０とで被成形品２０をクランプし、ポット４１からキャビティ３２ａ、４２ａに樹脂を充填して樹脂モールドする。吸引装置７０を作動させて下型４０に被成形品２０をエア吸引すると、被成形品２０はその周縁部についてはエア吸着孔４５によってエア吸着され、樹脂が充填される樹脂モールド領域内にあるエア吸着孔４６については、通気孔４６ａに吸着ピン４７を内挿することによって形成された吸引路を介してエア吸着される。   When the molded product 20 is resin-molded using the resin mold mold of the present embodiment, the molded product 20 is positioned and set at the set position of the lower mold 40 in a state where the mold is opened, and the suction device 70 is set. , The molded product 20 is supported by adsorbing air to the lower mold 40, and then the molded product 20 is clamped by the upper mold 30 and the lower mold 40, and the cavities 32a and 42a are filled with resin from the pot 41. Resin mold. When the molded product 20 is sucked into the lower mold 40 by operating the suction device 70, the molded product 20 is air-adsorbed by the air suction holes 45 at the periphery thereof and is in the resin mold region where the resin is filled. The air suction hole 46 is air-sucked through a suction path formed by inserting the suction pin 47 into the vent hole 46a.

被成形品２０の周縁部についてエア吸引するエア吸着孔４５については、エア吸着孔４５が樹脂モールド領域の外側に位置しているから、通気孔によって被成形品２０をエア吸引してフィルム基板１２が凹むような変形が生じたとしても製品外の部分であることから半導体装置製品に悪影響が及ぶことがない。また、被成形品２０を上型３０と下型４０とでクランプする範囲内にエア吸着孔４５が配置されていることで、樹脂モールド時に被成形品２０の変形が問題となることはない。
一方、樹脂モールド領域内に配置されているエア吸着孔４６については、上記のように端面形状がリング状の吸引路を介してエア吸引するから、エア吸引した際にフィルム基板１２が凹んだりする変形が起きにくく、変形を生じさせずにフィルム基板１２を金型面にエア吸着することが可能となる。 The air suction hole 45 that sucks air about the peripheral portion of the molded product 20 is positioned outside the resin mold region. Even if a deformation such as a dent occurs, the semiconductor device product is not adversely affected because it is a portion outside the product. Further, since the air suction holes 45 are disposed within a range in which the molded product 20 is clamped by the upper mold 30 and the lower mold 40, deformation of the molded product 20 does not become a problem during resin molding.
On the other hand, since the air suction holes 46 arranged in the resin mold region are sucked through the suction passage having the end face shape as described above, the film substrate 12 is recessed when the air is sucked. It is difficult for deformation to occur, and the film substrate 12 can be air adsorbed to the mold surface without causing deformation.

このように、本実施形態の樹脂モールド金型によれば、エア吸着孔４６では細幅に形成された吸引路を介してフィルム基板１２をエア吸引するから、樹脂フィルムのような変形しやすいフィルム基板１２が被成形品２０である場合でも被成形品２０を変形させることなく支持できる。
また、前述したキャビティ凹部４２の側縁に薄肉部４３を設ける構成と、各々のキャビティ凹部の中間位置にエア吸着孔４６を配置する構成とを組み合わせることによって、被成形品２０を変形させることなく、樹脂ばりの発生を確実に抑えて樹脂モールドすることが可能となる。 As described above, according to the resin mold of this embodiment, the air suction hole 46 sucks the film substrate 12 through the narrow suction path, so that the film easily deforms like a resin film. Even when the substrate 12 is the molded product 20, the molded product 20 can be supported without being deformed.
Further, by combining the above-described configuration in which the thin wall portion 43 is provided on the side edge of the cavity recess 42 and the configuration in which the air suction hole 46 is disposed at an intermediate position of each cavity recess, the molded product 20 is not deformed. Thus, resin molding can be performed while reliably preventing the occurrence of resin flash.

なお、上記実施形態においては、樹脂モールド金型の上型３０に半導体チップ１４を一括して樹脂モールドするキャビティ凹部３２を設け、下型４０に被成形品２０のボンディング部を樹脂モールドするキャビティ凹部４２を設ける構成としたが、これとはキャビティ配置を上下逆配置とし、上型３０に被成形品２０のボンディング部を樹脂モールドするキャビティ凹部を設け、下型４０に半導体チップ１４を一括して樹脂モールドするキャビティ凹部を設ける構成とすることもできる。   In the above-described embodiment, the cavity recess 32 for resin-molding the semiconductor chips 14 in a lump is provided in the upper mold 30 of the resin mold, and the cavity recess for resin-molding the bonding portion of the molded product 20 in the lower mold 40. 42, but the cavity is placed upside down, and the upper die 30 is provided with a cavity recess for resin-molding the bonding portion of the molded product 20, and the semiconductor die 14 is collectively placed on the lower die 40. It can also be set as the structure which provides the cavity recessed part which carries out resin molding.

図１０は、上型５０にボンディング部を樹脂封止するキャビティ凹部５２を設け、下型６０に半導体チップ１４を樹脂モールドするキャビティ凹部６２を設けた例を示す。この場合には、上型５０に被成形品２０を金型面にエア吸着するためのエア吸着孔５５、５６を設け、これらのエア吸着孔５５、５６に連通させて吸引装置に接続するエア流路５８を設けるようにする。エア吸着孔５６に吸着ピン５７を内挿する構成とすることも上記実施形態と同様である。また、キャビティ凹部５２の側縁に沿って薄肉部を設けるようにする構成についても上記実施形態と同様に適用することができる。   FIG. 10 shows an example in which a cavity recess 52 for resin-sealing the bonding portion is provided in the upper mold 50 and a cavity recess 62 for resin-molding the semiconductor chip 14 is provided in the lower mold 60. In this case, the upper mold 50 is provided with air suction holes 55 and 56 for air-adsorbing the molded product 20 to the mold surface, and is connected to the suction device by communicating with these air suction holes 55 and 56. A flow path 58 is provided. The configuration in which the suction pin 57 is inserted into the air suction hole 56 is the same as in the above embodiment. The configuration in which the thin portion is provided along the side edge of the cavity recess 52 can also be applied in the same manner as in the above embodiment.

なお、上記実施形態では、ＢＯＣ型の半導体装置を形成するフィルム基板１２に半導体チップ１４を搭載した被成形品２０をモールド対象品として樹脂モールドする例について説明したが、本発明に係る樹脂モールド金型はＢＯＣ型の半導体装置を製造する場合に限らず、フィルム基板のような変形しやすい基板で、基板の両面を樹脂モールドするような場合で、樹脂モールド領域内での被成形品の支持部で樹脂ばりが生じるといった製品を樹脂モールドする場合には同様に適用することが可能である。また、吸着ピンやエア吸着孔の径を変えることによって、金型全体の吸着力のバランスを調節することも可能である。   In the above embodiment, the example in which the molded product 20 having the semiconductor chip 14 mounted on the film substrate 12 forming the BOC type semiconductor device is molded as a molding target product has been described. The mold is not limited to the case of manufacturing a BOC type semiconductor device, but is a substrate that is easily deformed, such as a film substrate, and a case where both surfaces of the substrate are resin-molded. In the case of resin molding of a product in which resin flash occurs, it can be similarly applied. It is also possible to adjust the balance of the suction force of the entire mold by changing the diameters of the suction pins and air suction holes.

樹脂モールド金型の上型の構成例を示す平面図である。It is a top view which shows the structural example of the upper mold | type of a resin mold metal mold | die. 樹脂モールド金型の下型の構成例を示す平面図である。It is a top view which shows the structural example of the lower mold | type of a resin mold metal mold | die. 下型の構成を拡大して示す説明図である。It is explanatory drawing which expands and shows the structure of a lower mold | type. キャビティ凹部に設けた薄肉部の構成を示す金型の断面図である。It is sectional drawing of the metal mold | die which shows the structure of the thin part provided in the cavity recessed part. 本実施形態の樹脂モールド装置を用いて形成した半導体装置の構成を示す断面図である。It is sectional drawing which shows the structure of the semiconductor device formed using the resin mold apparatus of this embodiment. 吸着ピンを設けたエア吸着孔の構成を示す金型の断面図である。It is sectional drawing of the metal mold | die which shows the structure of the air suction hole which provided the suction pin. 被成形品の周縁部をエア吸引するエア吸着孔の構成を示す金型の断面図である。It is sectional drawing of the metal mold | die which shows the structure of the air suction hole which air-sucks the peripheral part of a to-be-molded product. 吸着ピンを設けたエア吸着孔と被成形品の周縁部をエア吸引するエア吸着孔の構成を示す金型の断面図である。It is sectional drawing of the metal mold | die which shows the structure of the air suction hole which provided the suction pin, and the air suction hole which air-sucks the peripheral part of a to-be-molded product. 吸着ピンを設けたエア吸着孔の平面図および断面図である。It is the top view and sectional drawing of the air suction hole which provided the suction pin. 吸着ピンを設けたエア吸着孔と被成形品の周縁部をエア吸引するエア吸着孔の他の構成を示す金型の断面図である。It is sectional drawing of the metal mold | die which shows the air suction hole which provided the suction pin, and the other structure of the air suction hole which air-sucks the peripheral part of a to-be-molded product. ＢＯＣ型の半導体装置の構成を示す断面図である。It is sectional drawing which shows the structure of a BOC type semiconductor device. 樹脂モールド金型の従来の構成を示す断面図である。It is sectional drawing which shows the conventional structure of a resin mold metal mold | die. 従来の半導体装置において保護膜の表面に樹脂ばりが生じた状態を示す断面図である。It is sectional drawing which shows the state in which the resin flash produced on the surface of the protective film in the conventional semiconductor device.

符号の説明Explanation of symbols

１０ 半導体装置
１２ フィルム基板
１２ａ 開口孔
１４ 半導体チップ
１４ａ パッド
１６ ボンディングワイヤ
１８ 樹脂
１８ａ 樹脂ばり
２０ 被成形品
３０、５０ 上型
３２、４２、５２、６２ キャビティ凹部
３２ａ、４２ａ キャビティ
３４ ランナー
４０、６０ 下型
４１ ポット
４３ 薄肉部
４３ａ 薄肉硬化部
４５、４６、５５、５６ エア吸着孔
４６ａ 通気孔
４７、５７ 吸着ピン
４７ａ ピン本体
４８、４８ａ、５８ エア流路
７０ 吸引装置 DESCRIPTION OF SYMBOLS 10 Semiconductor device 12 Film substrate 12a Opening hole 14 Semiconductor chip 14a Pad 16 Bonding wire 18 Resin 18a Resin beam 20 Molded product 30, 50 Upper mold 32, 42, 52, 62 Cavity recessed part 32a, 42a Cavity 34 Runner 40, 60 Bottom Mold 41 Pot 43 Thin part 43a Thin cured part 45, 46, 55, 56 Air adsorption hole 46a Vent hole 47, 57 Adsorption pin 47a Pin body 48, 48a, 58 Air flow path 70 Suction device

Claims (7)

上型と下型の一方に設けたエア吸着孔を介して被成形品を金型面にエア吸着し、上型と下型とで前記被成形品をクランプした状態でポットから前記上型と下型の双方に設けたキャビティに樹脂を充填して樹脂モールドする樹脂モールド装置において、
前記上型と下型の一方に設けられたキャビティの縁部に沿って、被成形品をクランプした際にキャビティよりも肉薄に樹脂が充填される空隙部が形成される、薄肉部が設けられていることを特徴とする樹脂モールド装置。 The product to be molded is air-adsorbed on the mold surface through an air suction hole provided in one of the upper mold and the lower mold, and the upper mold and the upper mold are clamped between the upper mold and the lower mold. In a resin molding apparatus that fills a resin in a cavity provided on both lower molds and performs resin molding,
A thin-walled portion is formed along the edge of the cavity provided in one of the upper mold and the lower mold, so that when the product is clamped, a void is formed that is filled with resin thinner than the cavity. A resin molding apparatus characterized by comprising: 上型と下型の他方に設けられたキャビティが、複数個の半導体チップあるいはダイシングされることによって複数個に分離される半導体チップを一括して樹脂モールドする大きさに形成され、
前記上型と下型の一方に設けられたキャビティが、前記複数個の半導体チップあるいは複数個に分離される半導体チップの各々の配置位置に対応して、分離されたキャビティに形成されていることを特徴とする請求項１記載の樹脂モールド装置。 The cavity provided in the other of the upper mold and the lower mold is formed in a size that allows resin molding of a plurality of semiconductor chips or semiconductor chips separated into a plurality by dicing,
A cavity provided in one of the upper mold and the lower mold is formed in a separated cavity corresponding to the arrangement position of each of the plurality of semiconductor chips or the plurality of semiconductor chips separated. The resin molding apparatus according to claim 1. 上型と下型の一方に設けたエア吸着孔を介して被成形品を金型面にエア吸着し、上型と下型とで前記被成形品をクランプした状態でポットから前記上型と下型の双方に設けたキャビティに樹脂を充填して樹脂モールドする樹脂モールド装置において、
前記上型と下型の他方に設けられたキャビティの平面領域内に対向して配置されるエア吸着孔が、エアの吸引装置に連通するとともに被成形品をエア吸着する金型面で開口する単穴形状に形成された通気孔に吸着ピンを内挿して形成されていることを特徴とする樹脂モールド装置。 The product to be molded is air-adsorbed on the mold surface through an air suction hole provided in one of the upper mold and the lower mold, and the upper mold and the upper mold are clamped between the upper mold and the lower mold. In a resin molding apparatus that fills a resin in a cavity provided on both lower molds and performs resin molding,
An air suction hole disposed opposite to the plane area of the cavity provided in the other of the upper mold and the lower mold communicates with an air suction device and opens on a mold surface that air-sucks the workpiece. A resin molding apparatus, wherein a suction pin is inserted into a vent hole formed in a single hole shape. 前記被成形品の周縁部を吸着する位置に設けられるエア吸着孔が、エアの吸引装置に連通するとともに被成形品をエア吸着する金型面で開口する単穴形状の通気孔として形成されていることを特徴とする請求項３記載の樹脂モールド装置。   An air suction hole provided at a position for sucking the peripheral edge of the molded product is formed as a single-hole-shaped vent hole that communicates with an air suction device and opens at a mold surface that air-sucks the molded product. The resin molding apparatus according to claim 3, wherein 前記被成形品の周縁部を吸着する位置に設けられるエア吸着孔が、樹脂モールド領域の外部に配置されていることを特徴とする請求項４記載の樹脂モールド装置。   The resin molding apparatus according to claim 4, wherein an air suction hole provided at a position for sucking a peripheral portion of the molded product is disposed outside the resin mold region. 前記上型と下型の一方に設けられたキャビティの縁部に沿って、被成形品をクランプした際にキャビティよりも肉薄に樹脂が充填される空隙部が形成される、薄肉部が設けられていることを特徴とする請求項３、４または５記載の樹脂モールド装置。   A thin-walled portion is formed along the edge of the cavity provided in one of the upper mold and the lower mold, so that when the product is clamped, a void is formed that is filled with resin thinner than the cavity. The resin molding apparatus according to claim 3, 4 or 5. 上型と下型の他方に設けられたキャビティが、複数個の半導体チップあるいはダイシングされることによって複数個に分離される半導体チップを一括して樹脂モールドする大きさに形成され、
前記上型と下型の一方に設けられたキャビティが、前記複数個の半導体チップあるいは複数個に分離される半導体チップの各々の配置位置に対応して、分離されたキャビティに形成されていることを特徴とする請求項６記載の樹脂モールド装置。 The cavity provided in the other of the upper mold and the lower mold is formed in a size that allows resin molding of a plurality of semiconductor chips or semiconductor chips separated into a plurality by dicing,
A cavity provided in one of the upper mold and the lower mold is formed in a separated cavity corresponding to the arrangement position of each of the plurality of semiconductor chips or the plurality of semiconductor chips separated. The resin molding apparatus according to claim 6.
JP2004294188A 2004-10-06 2004-10-06 Resin molding equipment Expired - Fee Related JP4695863B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101120677B1 (en) * 2010-01-11 2012-03-22 스테코 주식회사 Apparatus for clamping film
JP2013229452A (en) * 2012-04-25 2013-11-07 Towa Corp Molding tool, substrate absorption mold, resin sealing apparatus, and manufacturing method of resin sealing electronic component

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56141445U (en) * 1980-03-24 1981-10-26
JP2004050738A (en) * 2002-07-23 2004-02-19 Apic Yamada Corp Equipment and mold for sealing with resin
JP2004096094A (en) * 2003-07-28 2004-03-25 Apic Yamada Corp Molding die used for manufacture bga package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56141445U (en) * 1980-03-24 1981-10-26
JP2004050738A (en) * 2002-07-23 2004-02-19 Apic Yamada Corp Equipment and mold for sealing with resin
JP2004096094A (en) * 2003-07-28 2004-03-25 Apic Yamada Corp Molding die used for manufacture bga package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101120677B1 (en) * 2010-01-11 2012-03-22 스테코 주식회사 Apparatus for clamping film
JP2013229452A (en) * 2012-04-25 2013-11-07 Towa Corp Molding tool, substrate absorption mold, resin sealing apparatus, and manufacturing method of resin sealing electronic component

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