JP2006100417A - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP2006100417A JP2006100417A JP2004282461A JP2004282461A JP2006100417A JP 2006100417 A JP2006100417 A JP 2006100417A JP 2004282461 A JP2004282461 A JP 2004282461A JP 2004282461 A JP2004282461 A JP 2004282461A JP 2006100417 A JP2006100417 A JP 2006100417A
- Authority
- JP
- Japan
- Prior art keywords
- motor
- main body
- motor main
- bonding apparatus
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Vibration Prevention Devices (AREA)
- Wire Bonding (AREA)
- Manipulator (AREA)
Abstract
【解決手段】ワイヤボンディング装置10において、XYテーブル用基部14の上にXテーブル18がX方向に移動可能なように案内され、モータ用基部16の上に駆動モータ20が搭載される。駆動モータ20の可動子22はXテーブル18に接続される。モータ本体部24は、一対のモータ案内部26により、積層体40を介してX方向に移動可能に案内される。積層体40は、ばね要素とダンピング要素とを有する粘弾性扁平ゴム板と、扁平剛性板とを交互に配置して積層したもので、積層面に垂直な方向には剛性が大きく、積層面に平行な方向には剛性が小さくて粘弾性による復元力と減衰力とを有する。
【選択図】図1
Description
Claims (6)
- 可動子とモータ本体部とを有するボンディング用モータを架台に設け、可動子を駆動したときにモータ本体部を可動子と反対方向に移動可能とし、可動子の駆動による架台に対する反力を打ち消すようにするボンディング装置において、
モータ本体部の移動を案内する案内部と、
モータ本体部と案内部との間に設けられ、ばね要素とダンピング要素とを有する粘弾性扁平ゴム板と、扁平剛性板とを交互に配置し、向かい合う面同士を固着して複数段積層した積層体であって、積層体の最外側の一方の面と他方の面との間に外力が加わったときに、積層面に垂直な方向には剛性が大きく、積層面に平行な方向には剛性が小さくて粘弾性による復元力と減衰力とを有し、モータ本体部の移動方向に平行に積層面を配置して、一方の面がモータ本体部に、他方の面が案内部に、それぞれ取り付けられる複数の積層体と、
を備えることを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
モータ本体部は、両側面のそれぞれに、その移動方向と平行な壁面を含むモータ側取付部を有し、
案内部は、モータ本体部の両側面のそれぞれに向かい合う部分に、モータ側取付部に対応し、モータ本体部の移動方向と平行な壁面を含む案内側取付部を有し、
各積層体は、一方の面がモータ側取付部に、他方の面が案内側取付部に、それぞれ取り付けられることを特徴とするボンディング装置。 - 請求項1又は請求項2に記載のボンディング装置において、
積層体をモータ本体部に押し付け、積層面に垂直な方向の剛性をさらに大きくする付勢手段を備えることを特徴とするボンディング装置。 - 請求項1又は請求項2に記載のボンディング装置において、
粘弾性ゴム板は、シリコーン系ゴム又はスチレン系ゴムのゲル材から構成されることを特徴とするボンディング装置。 - 請求項2に記載のボンディング装置において、
複数の積層体は、モータ本体部の両側面上でモータ本体部の重心を含む水平面内の位置、かつ重心を含むモータ本体部の移動方向と一致する軸に対し対称の位置に配置されることを特徴とするボンディング装置。 - 請求項1又は請求項2に記載のボンディング装置において、
架台に設けられ、モータ本体部を支持して移動させる複数の転がり体を備えることを特徴とするボンディング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282461A JP4071227B2 (ja) | 2004-09-28 | 2004-09-28 | ボンディング装置 |
TW094127067A TW200627568A (en) | 2004-09-28 | 2005-08-10 | Bonding device |
KR1020050083974A KR100672241B1 (ko) | 2004-09-28 | 2005-09-09 | 본딩 장치 |
US11/237,450 US7405500B2 (en) | 2004-09-28 | 2005-09-28 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282461A JP4071227B2 (ja) | 2004-09-28 | 2004-09-28 | ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006100417A true JP2006100417A (ja) | 2006-04-13 |
JP4071227B2 JP4071227B2 (ja) | 2008-04-02 |
Family
ID=36097678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004282461A Expired - Fee Related JP4071227B2 (ja) | 2004-09-28 | 2004-09-28 | ボンディング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7405500B2 (ja) |
JP (1) | JP4071227B2 (ja) |
KR (1) | KR100672241B1 (ja) |
TW (1) | TW200627568A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103594403B (zh) * | 2012-08-15 | 2016-06-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 片盒传输装置及具有其的半导体设备 |
US11205937B2 (en) * | 2018-07-18 | 2021-12-21 | Asm Technology Singapore Pte Ltd | Driving system having reduced vibration transmission |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728831A (en) * | 1984-09-07 | 1988-03-01 | Magnetic Peripherals Inc. | Damped voice coil actuator |
GB2186946A (en) * | 1986-02-25 | 1987-08-26 | Rank Taylor Hobson Ltd | Vibration isolation means |
FR2623583B2 (fr) * | 1987-06-23 | 1990-04-20 | Hutchinson | Supports elastiques |
EP0393994B1 (en) * | 1989-04-17 | 1994-06-15 | SHARP Corporation | A linear driving apparatus |
US4978050A (en) * | 1989-09-06 | 1990-12-18 | Texas Instruments Incorporated | Damped optics tube assembly |
FR2689196B1 (fr) * | 1992-03-31 | 1995-08-04 | Hutchinson | Dispositif de filtrage des vibrations et systeme de fixation d'une charge sur un support comportant une pluralite de tels dispositifs. |
JPH07196992A (ja) * | 1993-12-28 | 1995-08-01 | Nippon Autom Kk | 制振シート |
US5528118A (en) * | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
US5874820A (en) * | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
JPH0834089A (ja) * | 1994-07-25 | 1996-02-06 | Lintec Corp | 制振シート |
US5573220A (en) * | 1995-05-30 | 1996-11-12 | Unisorb Inc. | Adjustable vibration absorbing machinery foundation mount and method for tuning the same |
US5902656A (en) * | 1996-06-21 | 1999-05-11 | Minnesota Mining And Manufacturing Company | Dampers for internal applications and articles damped therewith |
US6170622B1 (en) * | 1997-03-07 | 2001-01-09 | Canon Kabushiki Kaisha | Anti-vibration apparatus and anti-vibration method thereof |
JP2001271868A (ja) * | 2000-03-24 | 2001-10-05 | Canon Inc | 除振装置 |
US6524692B1 (en) * | 2000-05-02 | 2003-02-25 | Structured Composites, Lp | Energy absorbing structural laminate |
US7303184B1 (en) * | 2001-07-02 | 2007-12-04 | Bruce Bower | Isolator mount for shock and vibration mitigation |
US6861771B2 (en) * | 2003-03-26 | 2005-03-01 | Asm Technology Singapore Pte. Ltd. | Active vibration attenuation |
JP4722400B2 (ja) * | 2004-01-26 | 2011-07-13 | 株式会社ミツトヨ | ガイドレールの支持装置、ガイドレール装置、駆動装置および測定機 |
-
2004
- 2004-09-28 JP JP2004282461A patent/JP4071227B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-10 TW TW094127067A patent/TW200627568A/zh not_active IP Right Cessation
- 2005-09-09 KR KR1020050083974A patent/KR100672241B1/ko not_active IP Right Cessation
- 2005-09-28 US US11/237,450 patent/US7405500B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20060051134A (ko) | 2006-05-19 |
TW200627568A (en) | 2006-08-01 |
US7405500B2 (en) | 2008-07-29 |
JP4071227B2 (ja) | 2008-04-02 |
KR100672241B1 (ko) | 2007-01-22 |
TWI335057B (ja) | 2010-12-21 |
US20060065372A1 (en) | 2006-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004223647A (ja) | 位置決め装置 | |
JP4545697B2 (ja) | ステージ装置 | |
WO2005122369A1 (ja) | ムービングマグネット形リニアスライダ | |
WO2016098448A1 (ja) | 実装装置 | |
JP4684679B2 (ja) | リニアモータを内蔵したスライド装置 | |
TW200925815A (en) | Reactive force processing device | |
JP4759094B1 (ja) | Xyテーブル | |
JP4071227B2 (ja) | ボンディング装置 | |
KR20100098605A (ko) | 리니어 모터 및 부품 이송 장치 | |
JP5242218B2 (ja) | Xyステージ装置 | |
JP2005311157A (ja) | 電子部品実装用装置の直動機構 | |
JP5431295B2 (ja) | Xyステージ | |
WO2021199912A1 (ja) | 昇降装置 | |
JP3732763B2 (ja) | ステージ装置 | |
JP6186053B2 (ja) | 実装装置 | |
JP5271966B2 (ja) | リニアモータを内蔵した立型xzスライド装置 | |
JP3797670B2 (ja) | 静圧ステージ及び走査型露光装置 | |
JP3603615B2 (ja) | Xy軸ヘッド位置決め装置 | |
JP2005311158A (ja) | 電子部品実装用装置の直動機構 | |
JP2006034016A (ja) | 工作機械用リニアモータ | |
JP5138443B2 (ja) | Xyステージ装置 | |
JP2002315297A (ja) | リニアモータシステムおよび移動体システム | |
JP2009017693A (ja) | リニアアクチュエータ | |
JP2007334978A (ja) | 光学系駆動装置 | |
JPH0817150A (ja) | 光学式情報記録再生装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061031 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070131 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071218 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080116 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110125 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120125 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |