JP2006098496A - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP2006098496A JP2006098496A JP2004281667A JP2004281667A JP2006098496A JP 2006098496 A JP2006098496 A JP 2006098496A JP 2004281667 A JP2004281667 A JP 2004281667A JP 2004281667 A JP2004281667 A JP 2004281667A JP 2006098496 A JP2006098496 A JP 2006098496A
- Authority
- JP
- Japan
- Prior art keywords
- input
- driving
- electrode
- control circuit
- signal control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims description 68
- 239000004973 liquid crystal related substance Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
Abstract
【解決手段】
本発明は、表示制御を行うフリップチップ方式の駆動用IC7を有する表示装置であり、駆動用IC7は、入力用配線導体81に接続する突出した入力電極72と、出力用配線導体に接続する突出した出力電極73を具備し、且つ入力電極72の近傍に形成された入力信号制御回路部75と、出力電極73の近傍に形成された出力信号制御回路部76とを具備するとともに、前記入力信号制御回路部75と出力信号制御回路部76との間に、ダミーバンプ74を設けた。
【選択図】 図7
Description
2・・・第2の基板
3・・・表示部材層(液晶層)
4・・・シール部材
7・・・駆動用IC
71・・バンプ
72・・入力電極
73・・出力電極
74・・ダミーバンプ
75・・入力信号制御回路部
76・・出力信号制御回路部
81、82・・・配線導体
9・・・異方性導電樹脂部材
10・・・保護樹脂
Claims (5)
- 表示電極が形成された一対の透明基板と、該一対の透明基板間に介在された表示部材層と、前記透明基板の一方の基板の主面端部に前記表示電極に接続される出力用配線導体及び外部制御回路の信号が供給される入力用配線導体と、前記入力用配線導体及び出力用配線導体の一部にバンプを介して接合される駆動用ICとから成る表示装置において、
前記駆動用ICは、入力用配線導体に接続する突出した入力電極と、出力用配線導体に接続する突出した出力電極とを具備し、且つ入力電極の近傍に形成された入力信号制御回路部と、出力電極の近傍に形成された出力信号制御回路部とを具備するとともに、前記入力信号制御回路部と出力信号制御回路部との間に、突出したダミーバンプを設けたことを特徴とする表示装置。 - 前記駆動用ICの出力電極は、該駆動用ICの下面の一対の辺の一方辺に沿って配列されているとともに、入力電極は、前記一方辺に対向する他方辺に沿って配列されていることを特徴とする請求項1記載の表示装置。
- 前記入力信号制御回路部は、他方辺に沿って配列された入力電極を、分断するようには配置されていることを特徴とする請求項1記載の表示装置。
- 前記入力電極及びバンプの平面状の面積の合計は、前記出力電極の面積に対して、70〜130%に設定したことを特徴とする請求項1記載の表示装置。
- 複数のダミーバンプは、隣接するダミーバンプとの間隔が1mm以下となるように設定したことを特徴とする請求項1記載の表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004281667A JP4748963B2 (ja) | 2004-09-28 | 2004-09-28 | 表示装置 |
CN2008101441468A CN101329483B (zh) | 2004-09-28 | 2005-09-26 | 驱动用集成电路、显示面板以及显示装置 |
CNB2005101249169A CN100416351C (zh) | 2004-09-28 | 2005-09-26 | 显示装置 |
KR1020050090421A KR101056031B1 (ko) | 2004-09-28 | 2005-09-28 | 표시장치 |
KR1020110045941A KR101100091B1 (ko) | 2004-09-28 | 2011-05-16 | 구동용 집적회로, 표시패널 및 표시장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004281667A JP4748963B2 (ja) | 2004-09-28 | 2004-09-28 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006098496A true JP2006098496A (ja) | 2006-04-13 |
JP4748963B2 JP4748963B2 (ja) | 2011-08-17 |
Family
ID=36238412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004281667A Expired - Fee Related JP4748963B2 (ja) | 2004-09-28 | 2004-09-28 | 表示装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4748963B2 (ja) |
KR (2) | KR101056031B1 (ja) |
CN (2) | CN101329483B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229584A (ja) * | 2012-03-28 | 2013-11-07 | Semiconductor Energy Lab Co Ltd | 駆動回路、駆動回路を備える信号処理装置、信号処理装置の作製方法および表示装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120080789A1 (en) * | 2009-06-16 | 2012-04-05 | Sharp Kabushiki Kaisha | SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended) |
JP2014053597A (ja) * | 2012-08-09 | 2014-03-20 | Hitachi Chemical Co Ltd | チップ型電子部品及び接続構造体 |
KR102540732B1 (ko) | 2018-07-20 | 2023-06-08 | 주식회사 엘엑스세미콘 | 소스 드라이브 ic 및 이를 포함하는 디스플레이 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06342166A (ja) * | 1993-06-01 | 1994-12-13 | Casio Comput Co Ltd | 液晶表示装置 |
JPH0968715A (ja) * | 1995-09-01 | 1997-03-11 | Hitachi Ltd | 液晶表示装置 |
JPH1116948A (ja) * | 1997-06-24 | 1999-01-22 | Seiko Epson Corp | 半導体装置 |
JPH11274232A (ja) * | 1998-03-25 | 1999-10-08 | Sharp Corp | 半導体チップおよびそれを備えるテープキャリアパッケージ |
JP2002278494A (ja) * | 2001-03-14 | 2002-09-27 | Texas Instr Japan Ltd | 駆動回路 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3482826B2 (ja) * | 1997-08-01 | 2004-01-06 | セイコーエプソン株式会社 | Ic実装方法、液晶表示装置および電子機器並びに液晶表示装置の製造装置 |
JP2002217237A (ja) * | 2001-01-17 | 2002-08-02 | Toshiba Corp | 平面表示装置 |
KR100857494B1 (ko) * | 2002-04-30 | 2008-09-08 | 삼성전자주식회사 | 구동 집적 회로 패키지 및 이를 이용한 칩 온 글래스액정표시장치 |
-
2004
- 2004-09-28 JP JP2004281667A patent/JP4748963B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-26 CN CN2008101441468A patent/CN101329483B/zh active Active
- 2005-09-26 CN CNB2005101249169A patent/CN100416351C/zh active Active
- 2005-09-28 KR KR1020050090421A patent/KR101056031B1/ko active IP Right Grant
-
2011
- 2011-05-16 KR KR1020110045941A patent/KR101100091B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06342166A (ja) * | 1993-06-01 | 1994-12-13 | Casio Comput Co Ltd | 液晶表示装置 |
JPH0968715A (ja) * | 1995-09-01 | 1997-03-11 | Hitachi Ltd | 液晶表示装置 |
JPH1116948A (ja) * | 1997-06-24 | 1999-01-22 | Seiko Epson Corp | 半導体装置 |
JPH11274232A (ja) * | 1998-03-25 | 1999-10-08 | Sharp Corp | 半導体チップおよびそれを備えるテープキャリアパッケージ |
JP2002278494A (ja) * | 2001-03-14 | 2002-09-27 | Texas Instr Japan Ltd | 駆動回路 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229584A (ja) * | 2012-03-28 | 2013-11-07 | Semiconductor Energy Lab Co Ltd | 駆動回路、駆動回路を備える信号処理装置、信号処理装置の作製方法および表示装置 |
US9812217B2 (en) | 2012-03-28 | 2017-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, signal processing unit having the driver circuit, method for manufacturing the signal processing unit, and display device |
Also Published As
Publication number | Publication date |
---|---|
KR101056031B1 (ko) | 2011-08-10 |
KR20060051747A (ko) | 2006-05-19 |
CN1758096A (zh) | 2006-04-12 |
KR20110057115A (ko) | 2011-05-31 |
CN101329483A (zh) | 2008-12-24 |
CN100416351C (zh) | 2008-09-03 |
KR101100091B1 (ko) | 2011-12-29 |
JP4748963B2 (ja) | 2011-08-17 |
CN101329483B (zh) | 2012-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9360719B2 (en) | Display device | |
CN100511364C (zh) | 电光装置、其检查方法及电子装置 | |
US20200320939A1 (en) | Liquid crystal display | |
JP2008177170A (ja) | バックライトアセンブリ及びこれを備えた表示装置 | |
US20210294137A1 (en) | Display device comprising a flip chip film connected to a connecting surface of a plurality of bonding pins and manufacturing method thereof | |
WO2021027007A1 (zh) | 一种液晶显示面板及其制备方法 | |
CN104345491B (zh) | 用于显示器的光单元和包括该光单元的液晶显示器 | |
US10768495B2 (en) | Display device having a first electrode with an opening overlapping with a second electrode | |
US8355087B2 (en) | Pixel array substrate, conductive structure and display panel | |
KR101100091B1 (ko) | 구동용 집적회로, 표시패널 및 표시장치 | |
JP2008177456A (ja) | 電気光学装置、電気光学装置用基板、及び実装構造体、並びに電子機器 | |
US20190162994A1 (en) | Electronic device | |
JPH11288001A (ja) | 液晶表示装置 | |
KR20130024163A (ko) | 기판에 발광소자가 부착된 액정표시소자 | |
US8773630B2 (en) | Display device | |
JP2008203484A (ja) | 電気光学装置、フレキシブル回路基板の実装構造体及び電子機器 | |
KR102102703B1 (ko) | Led 패키지, 그 제조 방법, led 패키지를 포함하는 백라이트 유닛 및 액정표시장치 | |
JP2007256586A (ja) | 表示装置及び電子機器 | |
KR102544404B1 (ko) | 백라이트 유닛 및 이를 포함하는 액정표시장치 | |
US20240160062A1 (en) | Display panel and electronic device | |
KR20210036687A (ko) | 가이드 패널 및 이를 포함하는 표시장치 | |
JP4036004B2 (ja) | 電気光学パネル、電気光学パネルの製造方法、表示装置及び電子機器 | |
KR20100072970A (ko) | 백라이트 및 이를 구비한 액정표시소자 | |
JP2008026771A (ja) | 電気光学装置及び電子機器 | |
JP2005049567A (ja) | 液晶表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070820 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100728 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100810 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100930 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110419 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110517 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4748963 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140527 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |