JP2006093421A - High-frequency device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency device which improves adhesiveness between a shield case and a high-frequency circuit board, prevents the deterioration of isolation between the transmission side and the reception side, and prevents unnecessary signal emission to the outside. <P>SOLUTION: The high-frequency device comprises a metal case 2, the high-frequency circuit board 3 placed on the metal case 2, and the shield case 1 which has partitions 4 forming inner spaces 9 and covers the high-frequency circuit board 3. The partitions 4 have through-holes 5 which penetrate the partitions 4 to reach the metal case 2 and are filled with solder 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high-frequency device including a metal body, a high-frequency circuit board placed on the metal body, and a shield housing having a wall forming an internal space and covering the high-frequency circuit board. .

  Conventionally, as a high-frequency device, a shield cover is fixed to a conductive shield housing having a wall that divides a space in which a high-frequency circuit board is stored with a plurality of fastening screws so as not to cause a gap therebetween. , It prevents leaking from the transmission line of each functional circuit to another functional circuit through the gap and worsening the isolation between transmission and reception, and also prevents high-frequency signals from leaking outside as unnecessary radiation Those are known (for example, see Patent Document 1).

Japanese Patent Laid-Open No. 10-322076 (FIG. 4)

In conventional high-frequency equipment, the shield cover is brought into contact with the end surface of the wall, and the shield cover is fixed to the shield housing with a plurality of fastening screws. However, depending on the strength of the fastening screws, However, there is a problem in that the shield housing is inclined and a gap may be formed between the end face and the shield cover.
In addition, in the case of a high-frequency device having a structure in which a high-frequency circuit board is sandwiched between a shield cover and a shield housing, if the high-frequency circuit board is warped, the ground pattern of the high-frequency circuit board and the wall are contacted. There was a problem that a part that did not contact was generated.
In order to eliminate these gaps, it is conceivable to increase the number of fastening screws, but this greatly increases the manufacturing time and increases the size of the product due to the increased space for screw fastening. There was a problem of end.

  An object of the present invention is to solve such a problem, and eliminates a gap between the shield housing, the high-frequency circuit board, and the metal body to prevent deterioration of isolation, and An object of the present invention is to obtain a high-frequency device that prevents a high-frequency signal from leaking to the outside as unnecessary radiation.

  In the high-frequency device according to the present invention, the high-frequency device includes a metal body, a high-frequency circuit board provided on the metal body, and a shield housing having a wall forming an internal space and covering the high-frequency circuit board. In the device, a through-hole penetrating the wall toward the metal body side and filled with a brazing material is formed.

  In the high-frequency device according to the present invention, it is possible to prevent the deterioration of the isolation by eliminating the gap between the shield housing, the high-frequency circuit board, and the metal body, and the high-frequency signal is emitted as unnecessary radiation to the outside. Leakage can be prevented.

Hereinafter, each embodiment of the present invention will be described. In each figure, the same or corresponding members and parts will be described with the same reference numerals.
Embodiment 1 FIG.
FIG. 1 is a front sectional view showing a main part of a high-frequency device according to Embodiment 1 of the present invention, FIG. 2 is a view of the shield casing 1 of FIG. 1 viewed from the inside, and FIG. 3 is a high-frequency circuit board 3 of FIG. FIG. 3 is a cross-sectional view of the high-frequency circuit board 3 in FIG. 1.
The high-frequency device includes a metal housing 2 that is a metal body, a high-frequency circuit board 3 provided on the metal housing 2, and a wall that forms a space 9 therein and partitions each functional circuit of the high-frequency circuit board 3. And a shield housing 1 that covers the high-frequency circuit board 3.
The partition 4 of the shield housing 1 is formed with a through-hole 5 that penetrates to the high-frequency circuit board 3 and is filled with solder 7 that is a brazing material.
A ground pattern 6 is formed on the surface of the high-frequency circuit board 3. A plurality of elements 8 constituting each functional circuit are mounted at a location corresponding to the space 9 in a region where the ground pattern 6 is not formed.

  In the high-frequency device having the above configuration, the high-frequency circuit board 3 fixed on the metal casing 2 is covered with the shield casing 1. At this time, the lower end surface of the partition 4 of the shield housing 1 is in surface contact with the ground pattern 6 of the high-frequency circuit board 3. Thereafter, solder 7 is poured into the through-hole 5 from the upper end surface of the partition 4, and the shield housing 1 is fixed to the high-frequency circuit board 3 with the solder 7.

According to this high-frequency device, no gap is generated at the contact portion between the shield housing 1 and the ground pattern 6, and the contact portion is completely metal-bonded by the solder 7 poured from the through hole 5.
Further, even when the high-frequency circuit board 3 is warped and there is a gap between the shield housing 1 and the high-frequency circuit board 3, the solder 7 flows into the gap and no gap is generated.

Therefore, it is possible to prevent the deterioration of isolation between transmission and reception, and it is possible to prevent unnecessary radiation to the outside of the high-frequency device.
In addition, the fastening screws required conventionally are unnecessary, and the production time and the number of production steps can be reduced.
Note that solder 7 is used as the brazing material, which is inexpensive and excellent in corrosion resistance, and the high-frequency circuit board 3 and the shield casing 1 are firmly coupled.

Embodiment 2. FIG.
4 is a front cross-sectional view showing a high-frequency device according to Embodiment 2 of the present invention, FIG. 5 is a view of the shield housing 1 of FIG. 4 as viewed from the inside, and FIG. 6 is a high-frequency circuit board 3 of FIG. FIG. 6 is a cross-sectional view of the high-frequency circuit board 3 in FIG. 4 along the IV-IV line.

In this embodiment, the shield casing 1 is formed with an outer frame 10 that is a wall over the entire circumference. The lower end surface of the outer frame 10 is in surface contact with the metal housing 2. The outer frame 10 is formed with a through hole 15 that penetrates to the metal housing 2 and is filled with solder 7 that is a brazing material.
Other configurations are the same as those in the first embodiment.

In the high-frequency device configured as described above, the outer frame 10 that is metal-bonded to the metal casing 2 so as to surround the entire periphery of the high-frequency circuit board 3 has a double shielding property as compared with that of the first embodiment. Secured.
Therefore, the deterioration of isolation between transmission and reception is further prevented, and unnecessary radiation to the outside of the high frequency device can be further prevented.

Embodiment 3 FIG.
FIG. 7 is a front sectional view showing a high-frequency device according to Embodiment 3 of the present invention, FIG. 8 is a view of the shield housing 1 of FIG. 7 viewed from the inside, and FIG. 9 is a high-frequency circuit board 3 of FIG. FIG.
9 is a cross-sectional view of the high-frequency circuit board 3 in FIG. 7 along a line VII-VII.

In this embodiment, pins 11 are formed at two locations at the corners of the partition 4 of the shield housing 1, which are walls. Opposing to the pin 11, a pin hole 12 into which the pin 1 is inserted is formed in the high-frequency circuit board 3. Here, the pin 11 and the pin hole 12 constitute positioning means for determining the relative position between the shield housing 1 and the high-frequency circuit board 3.
Other configurations are the same as those in the second embodiment.

According to this high-frequency device, since the positioning means is provided, the partition 4 of the shield housing 1 can come into contact with the ground pattern 6 at a predetermined position, and the shield housing 1 and the high-frequency circuit board 3 can be contacted. Can be brought into contact with each other with high precision, and the solder 7 comes into contact with the element 8 at the contact portion, and the shield housing 1, the high-frequency circuit board 3 and the metal housing 2 do not face each other correctly. It is possible to prevent the occurrence of inconveniences such as
Moreover, the pin 11 and the pin hole 12 which are positioning means are provided on the diagonal line, and the mistake of attaching to the high frequency circuit board 3 of the shield housing | casing 1 accidentally is also prevented.

In the above-described embodiment, the pin 11 and the pin hole 12 are provided at two locations. However, of course, only one location or three or more locations may be provided.
Further, pins may be provided on the high-frequency circuit board 3 and pin holes may be provided on the partition 4 of the shield housing 1.
Furthermore, the form of the positioning means is not limited to the pin and the pin hole, and may be, for example, a concave portion and a convex portion fitted into the concave portion.
Furthermore, positioning means for determining the relative positions of the shield housing 1 and the metal housing 2 may be provided in the shield housing 1 and the metal housing 2.
Further, by providing positioning means in each of the shield housing 1, the metal housing 2, and the high-frequency circuit board 3, the relative positions between the members may be accurately positioned.

In each of the above embodiments, the case where solder is used as the brazing material has been described. However, the present invention is not limited to this, and may be, for example, silver brazing or aluminum brazing.
In each of the above embodiments, the case where the high-frequency circuit board 3 is provided on the metal casing 2 has been described. However, the metal casing 2 may be a metal flat plate as a metal body.
Furthermore, although the through holes 5 and 15 are formed continuously, a plurality of through holes 5 and 15 may be formed at intervals.
Furthermore, in the present invention, the end face of the partition 4 of the shield housing 1 has been described with respect to the high frequency device in which the end face of the high frequency circuit board 3 is in contact with the ground pattern 6. The present invention can also be applied to a high-frequency device that is not in contact with the pattern.

It is a front principal part sectional view which shows the high frequency apparatus of Embodiment 1 of this invention. It is a figure when the shield housing | casing of FIG. 1 is seen from the inner side. It is a top view which shows the high frequency circuit board of FIG. It is front principal part sectional drawing which shows the high frequency apparatus of Embodiment 2 of this invention. It is a figure when the shield housing | casing of FIG. 4 is seen from an inner side. It is a top view which shows the high frequency circuit board of FIG. It is a front principal part sectional drawing which shows the high frequency apparatus of Embodiment 3 of this invention. It is a figure when the shield housing | casing of FIG. 7 is seen from an inner side. It is a top view which shows the high frequency circuit board of FIG.

Explanation of symbols

  1 shield housing, 2 metal housing (metal body), 3 high-frequency circuit board, 4 partition (wall), 5,15 through hole, 6 ground pattern, 7 solder (brazing material), 8 elements, 9 space, 10 outside Frame (wall), 11 pins, 12 pin holes.

Claims (6)

In a high-frequency device comprising a metal body, a high-frequency circuit board provided on the metal body, and a shield housing having a wall forming an internal space and covering the high-frequency circuit board,
A high-frequency equipment casing, wherein the wall is formed with a through-hole penetrating to the metal body side and filled with a brazing material.   The high-frequency device according to claim 1, wherein the wall is in contact with a ground pattern of the high-frequency circuit board.   3. The high-frequency device according to claim 1, wherein the wall surrounds the entire periphery of the high-frequency circuit board, is formed at an outer peripheral edge of the shield housing, and is in contact with the metal body.   The positioning means which determines a mutual relative position is provided in at least two of the said metal body, the said high frequency circuit board, and the said shield housing | casing. High frequency equipment.   The high-frequency device according to claim 4, wherein the positioning unit includes a pin and a hole into which the pin is inserted.   The high-frequency device according to any one of claims 1 to 5, wherein the brazing material is solder.

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