JP2008263014A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device having a shielding structure which achieves a desired shielding effect, is small-sized and small-footprint and whose shield covers can be easily removed. <P>SOLUTION: A shield frame 2 which encloses a first group 5A of components and a second group 5B of components which need to be electromagnetically isolated in their entirety and has a barrier 22 at the boundary of the first group 5A of components and the second group 5B of components. Also, the shield cover 3a covering the first group 5A of components and the shield cover 3b covering the second group 5B of components are provided and are fitted to the shield frame 2 while being engaged in each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device having a shield structure.

  For example, an electronic device such as a mobile phone is mounted with an electronic component that radiates electromagnetic waves during operation and adversely affects the operation of other electronic components. On the other hand, electronic components whose performance is deteriorated by electromagnetic waves from the electronic components or external electromagnetic waves are also mounted. Therefore, a shield case is used to avoid the influence of electromagnetic waves. Some shield cases include a shield frame and a shield cover made of sheet metal such as stainless steel (SUS) or white and white.

  The shield frame has a frame shape, is arranged so as to surround the periphery of the electronic component, and is connected to a ground pattern provided on the substrate. The shield cover is detachably attached to the opening of the shield frame and has a structure that covers the upper part of the electronic component. A hole for assembling the shield cover is formed in the frame portion of the shield frame. On the other hand, a projection is formed on the shield cover. When the shield cover is attached to the opening of the shield frame, the projection of the shield cover engages with the hole of the shield frame, so that the shield frame and the shield cover are electrically connected. Made.

  In this way, the shield case connected to the ground pattern accommodates the electronic components, thereby blocking electromagnetic waves. In the case where there are a plurality of electronic components that are to be arranged electromagnetically separated from each other as described above, there is a method in which a plurality of shield cases are provided and housed in separate shield cases to eliminate the adverse effects of electromagnetic waves.

  FIG. 21 is an exploded perspective view of a shield case when a plurality of such shield cases are arranged adjacent to each other. As shown in FIG. 21, when the shield cases are arranged adjacent to each other, there is a problem that a space 907 in which an electronic component cannot be mounted exists in an adjacent portion between the two shield cases 901. FIG. 22 is a cross-sectional view of the space 907 when the shield cover 903 is attached to the shield frame 902. The space 907 is generated by the thickness of the two shield frames 902, the thickness of the two shield covers 903, and a gap for attaching and detaching the shield cover 903. Further, when the solders 908 for fixing the two shield frames 902 to the substrate 906 are close to each other, it is necessary to ensure the distance.

  In order to solve this problem, a method of forming a shield frame having a plurality of sections by a partition as shown in FIG. 23 and attaching a shield cover that integrally covers the plurality of sections may be considered. However, in this method, the partition portion of the shield frame cannot be provided with an engagement portion formed by a hole and a projection like the side plate of the shield frame. Therefore, the conduction between the partition portion and the frame cover is not maintained, and electromagnetic waves are not generated. There is not enough blocking.

Therefore, the shield space can be mounted separately on each of the two shield frames while the mounting space is widened by sharing the opposing side plates of two adjacent shield frames as one. A structure has been proposed (see, for example, Patent Document 1).
JP 2006-269542 A

  In Patent Document 1, since the shield cover that covers the upper part of the electronic component that radiates electromagnetic waves and the shield cover that covers the upper part of the electronic component that is affected by the electromagnetic wave are not integrated, one shield cover as shown in FIG. 23 is attached. Compared with the method, the shielding effect can be maintained. In addition, an electronic component that radiates electromagnetic waves is surrounded by a frame-shaped shield frame, and the periphery of the electronic component that is affected by the electromagnetic waves is surrounded by a shield frame that is cut off from the side facing the shield frame that surrounds the electronic component that radiates electromagnetic waves. As a result, a part of the space occupied by the shield frame on the electronic component side that is easily affected by the outside can be used for mounting the component.

  However, even if the above method is used, in the side plate portion shared by the two shield frames, the shield cover that engages with the shared side plate and the shield cover that does not engage with the shared side plate are adjacent to each other. For this reason, it is necessary to provide the thickness for two shield covers and a clearance for attaching the shield cover to the shared side plate, and the space is not reduced sufficiently. Furthermore, since the shield case from which a part of the shield frame is deleted does not conduct the shield frame and the shield cover at the deleted part, the shielding effect is reduced. In addition, since there is a gap for attaching and detaching the shield cover to the shield frame that surrounds the electronic components that are affected by electromagnetic waves, there is a risk of being affected by electromagnetic waves from other electronic devices.

  Moreover, when an extension part is provided in one shield cover and it installs so that it may mutually overlap, a shield effect will improve, but manufacture of the shield cover which has an extension part is complicated. In addition, when repairing the electronic parts covered by the shield case, even when repairing only the electronic parts covered by the shield cover previously mounted, both of the shield covers need to be removed, which complicates the work. There is a problem.

  SUMMARY OF THE INVENTION An object of the present invention is to realize an electronic device having a shield structure that achieves a desired shielding effect, is small and excellent in space saving, and can be easily attached and detached.

  In order to achieve the above object, an electronic apparatus according to the present invention is provided on a wiring board on which a first electronic component and a second electronic component are mounted, and the first electronic component and A shield frame surrounding a periphery of the second electronic component and partitioning a first area where the first electronic component is disposed by a partition wall and a second area where the second electronic component is disposed; A first shield cover that is attached to a shield frame and covers the first area; and a second shield cover that is attached to the shield frame and covers the second area. The top plate and the top plate of the second shield cover are characterized in that opposing edges are formed in an uneven shape, and engage with the shield frame in a state where the unevenness is meshed.

  According to the present invention, it is possible to realize an electronic apparatus having a shield structure that achieves a desired shielding effect, is small and excellent in space saving, and can be easily attached and detached.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is an exploded perspective view showing a shield case mounting structure according to the first embodiment of the present invention. The shield case 1 of the mounting structure of the present embodiment is constituted by a shield frame 2, a shield cover 3a, and a shield cover 3b formed from a sheet metal such as stainless steel or white and white. An electronic component group 5A composed of electronic components 5a, 5a,... And an electronic component group 5B composed of electronic components 5b, 5b,.

  The shield frame 2 has a frame shape and is soldered on the substrate 6 so as to surround the electronic component groups 5A and 5B. At this time, the shield frame 2 is electrically connected to a ground pattern (not shown) provided on the substrate 6. Shield covers 3 a and 3 b are attached to the upper surface opening of the shield frame 2. In the mounted state, the shield cover 3a covers the upper part of the electronic component group 5A, and the shield cover 3b covers the upper part of the electronic component group 5B. FIG. 2 is an overall perspective view of the shield case 1 fixed on the substrate 6. The electronic component groups 5A and 5B are shielded by the shield case 1 to eliminate the emission of electromagnetic waves to the outside and the influence of electromagnetic waves from the outside.

  The configuration of such a shield frame 2 will be described with reference to FIGS. 1 and 3. As shown in FIG. 1, the shield frame 2 has a frame-shaped outer casing 21 that is attached to the substrate 6 so as to surround the four sides of the electronic component groups 5A and 5B. The outer shell 21 has its opening edge bent inward so that the cross section has a substantially L shape. A partition wall 22 connecting the two surfaces is provided inside the outer shell 21. The partition wall 22 is arranged so as to partition an area where the electronic component group 5A is arranged from an area where the electronic component group 5B is arranged.

  FIG. 3 is a plan view of a sheet metal forming the shield frame 2. The sheet metal of FIG. 3A is cut at the solid line portion and bent at the dotted line portion to form the outer shell 21. Similarly, the partition wall 22 is formed from the sheet metal of FIG. The partition wall 22 is bent at the dotted line portion to form joint surfaces at both ends. This joining surface is joined to the outer shell 21 by a method such as spot welding.

  In FIG. 1, the joint between the outer shell 21 and the partition wall 22 is indicated by hatching. The lower end on the substrate side of the outer shell 21 and the partition wall 22 bonded together is soldered to a ground pattern provided on the substrate 6 at a predetermined portion and fixed. The outer shell 21 and the partition wall 22 are provided with a necessary number of holes 41 for assembling the shield covers 3a and 3b. By the method as described above, the shield frame 2 in which adjacent portions of the frame surrounding each of the electronic component groups 5A and 5B are integrated is formed.

  Next, the configuration of the shield covers 3a and 3b attached to the shield frame 2 will be described with reference to FIGS. 1 and 4 to 6. FIG. As shown in FIG. 1, the shield cover 3a has a top plate 31a, the edge of the top plate 31a facing the top plate 31b when mounted on the shield frame 2 is formed in an uneven shape, and the locking piece 32a is formed from the convex portion. Is formed. A side plate 33a is formed on the edge that is not opposed to the top plate 31b. Similarly, the shield cover 3b has a top plate 31b. When the shield cover 3b is attached to the shield frame 2, the edge of the top plate 31b facing the top plate 31a is formed in a concavo-convex shape, and a locking piece 32b is formed from the convex portion. . A side plate 33b is formed on the edge that is not opposed to the top plate 31a.

  FIG. 1 shows a configuration in which the shield cover 3a has one locking piece 32a and the shield cover 3b has two locking pieces 32b. However, the locking pieces 32a and 32b have fewer configurations. It can also be made, and it can also be set as many structures.

  FIG. 4 shows an example in which the number of locking pieces 32a attached to the top plate 31a and the number of locking pieces 32b attached to the top plate 31b is smaller than that of the shield case 1 shown in FIG. In this case, it is easy to attach the shield covers 3a and 3b, and the gap between the shield frame 2 and the shield covers 3a and 3b is small. On the other hand, FIG. 5 shows an example in which the number of locking pieces 32a attached to the top plate 31a and the number of locking pieces 32b attached to the top plate 31b are larger than the shield case 1 shown in FIG. Yes. In this case, the rigidity and electrical resistance of the shield case 1 can be kept uniform.

  The top plate 31a, the locking piece 32a, and the side plate 33a of the shield cover 3a are manufactured by integral molding. The same applies to the shield cover 3b. FIG. 6 is a plan view of a sheet metal for forming the shield covers 3a and 3b shown in FIG. The shield covers 3a and 3b are formed by cutting at the solid line portion of the sheet metal shown in FIG. 6 and bending at the dotted line portion. The locking piece 32a and the side plate 33a are provided with a projection 42a for assembly. Further, the locking piece 32b and the side plate 33b are provided with a projection 42b for assembly. The projection 42a of the locking piece 32a is engaged with the hole 41 provided in the partition wall 22, and the projection 42a of the side plate 33a is engaged with the hole 41 provided in the outer shell 21, whereby the shield cover 3a is attached to the shield frame 2. Installed.

Further, the projection 42 b of the locking piece 32 b engages with the hole 41 provided in the partition wall 22, and the projection 42 b of the side plate 33 b engages with the hole 41 provided in the outer shell 21, so that the shield frame 2 has a shield cover. 3b is mounted. In this way, shield covers 3a and 3b that cover the electronic component groups 5A and 5B as a whole, instead of covering them as a whole, are formed.

  FIG. 7 is an exploded perspective view of the shield case 1 showing a state in which the shield cover 3 a having the above-described configuration is attached to the shield frame 2. In the shield cover 3a, the top plate 31a covers the upper part of the electronic component group 5A, and the locking piece 32a engages with the partition wall 22 from the electronic component group 5B side. At this time, a gap is formed between the top plate 31a and the partition wall 22 so that the locking piece 32b can be inserted from above toward the substrate. The shield cover 3b is engaged with the engaging piece 32b inserted through the gap and sandwiching the partition wall 22 between the engaging piece 32a and the engaging piece 32b. The state where both the shield covers 3a and 3b are mounted is as shown in FIG.

  8 is a cross-sectional view taken along line XX in FIG. 2, and FIG. 9 is a cross-sectional view taken along line YY in FIG. The XX line is a line segment passing through a portion where the locking piece 32a of the shield cover 3a is engaged with the partition wall 22. The Y-Y line is a line segment passing through a portion where the locking piece 32b of the shield cover 3b is engaged with the partition wall 22. In the shield cover 3a in FIG. 8, the side wall 33a is engaged with the outer shell 21, the electronic component group 5A is covered by the top plate 31a, and the locking piece 32a is engaged with the partition wall 22 from the side where the electronic component group 5B is arranged. Match. On the other hand, the shield cover 3b does not reach the partition wall 22 although the side wall 33b engages with the outer shell 21 and the top plate 31b covers the electronic component group 5B. On the other hand, in the shield cover 3b in FIG. 9, the side wall 33b engages with the outer shell 21, the electronic component group 5B is covered by the top plate 31b, and the locking piece 32b is the partition wall 22 from the side where the electronic component group 5A is disposed. Is engaged. On the other hand, the shield cover 3a does not reach the partition wall 22 although the side wall 33a engages with the outer shell 21 and the top plate 31a covers the electronic component group 5A.

  In this way, by providing the shield case 1 that integrally surrounds the adjacent electronic component groups 5A and 5B, dead space in which components cannot be mounted is reduced, and the mounting area of the electronic component groups 5A and 5B is effectively utilized. be able to. In addition, since the shield frame 2 and the shield covers 3a and 3b are connected by the engagement of the hole 41 and the protrusions 42a and 42b, the shield frame 2 and the shield covers 3a and 3b can be easily attached and detached when repairing or inspecting the electronic component groups 5A and 5B. is there. Furthermore, in repairing only one of the electronic component groups 5A or 5B, it is only necessary to remove the shield cover to be repaired from the shield case 1, so that the work efficiency at the time of repair is not reduced.

  FIG. 10 is an exploded perspective view showing the mounting structure of the shield case according to the second embodiment of the present invention. In addition, since this Embodiment is similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted. The shield frame 102 constituting the shield case 101 of the second embodiment includes a partition wall 122 and a bar 123 instead of the partition wall 22 of the shield frame 2 of the first embodiment.

  In the second embodiment, a bar 123 is provided between two sides of the opening edge of the outer shell 21. Two partition walls 122 extend from the two sides of the bar 123 not connected to the outer shell 21 toward the substrate 6. The partition walls 122 and 122 are arranged so as to partition the electronic component group 5A and the electronic component group 5B, and the lower end on the substrate side is soldered to the ground pattern of the substrate 6. The outer shell 21, the bar 123, and the partition walls 122 and 122 are manufactured by integral molding.

  FIG. 11 is a plan view of a sheet metal for forming the shield frame 102 shown in FIG. The sheet metal in FIG. 11 is cut at the solid line portion, bent vertically at the dotted line portion, and formed into the shield frame 102. The bending directions at the dotted line are all the same direction. The outer shell 21 and the partition walls 122 and 122 are provided with holes 41 for assembling the shield covers 3a and 3b. The lengths of W1 and W2 corresponding to the height of the partition walls 122 and 122 when molded are equal to the length of W3 corresponding to the height of the outer shell 21.

  Thus, the shield frame 102 can be formed from a single sheet metal. In the shield frame 2 of the first embodiment, molding is much easier than it is necessary to join the outer shell 21 and the partition wall 22 by spot welding or the like.

  FIG. 12 is an exploded perspective view of the shield case 101 showing a state in which the shield cover 3 a is attached to the shield frame 102. The top plate 31a of the shield cover 3a covers the upper part of the electronic component group 5A. Further, a part of the top plate 31a passes over the bar 123 and reaches the upper part of the area of the electronic component group 5B, and the locking piece 32a engages with the partition wall 122 arranged on the electronic component group 5B side. At this time, a gap is formed between the top plate 31a and the partition wall 122 arranged on the electronic component group 5A side so that the locking piece 32b can be inserted from above toward the substrate. The shield cover 3b is engaged with the partition wall 122 on the electronic component group 5A side by inserting the locking piece 32b through this gap. Thereby, it engages in the shape which pinches | interposes the partition wall 122 with the locking piece 32a and the locking piece 32b.

  FIG. 13 shows a cross-sectional view of the shield case 101 with both the shield covers 3a and 3b attached, cut at the same position as the line XX in FIG. Further, FIG. 14 shows a cross-sectional view cut at the same position as the YY line of FIG. As shown in FIG. 13 and FIG. 14, in the second embodiment, the opposing partition walls 122, 122 are provided as a pair, so that the rigidity is higher than that of the first embodiment. However, space is required due to the thickness of the sheet metal forming the partition walls 122 and 122 and the width of the bar 123.

  Therefore, it is conceivable to modify the shield case 101 of the second embodiment as shown in FIG. The partition wall 122 provided in the shield frame 102 in FIG. 15 is obtained by providing a notch in a part of the partition wall 122 shown in FIG. The shield frame 102 of this form is formed from a sheet metal as shown in FIG. A partition wall 122 is formed on a part of two sides of the bar 123 from the sheet metal of FIG. FIG. 17 is a cross-sectional view of the shield case 101 having the shield frame 102 cut at the same position as the XX line, and FIG. 18 is a cross-sectional view cut at the same position as the Y-Y line. As shown in FIGS. 17 and 18, since the portion of the partition wall 122 that does not engage with the locking piece 32 is cut away, it is possible to prevent the mounting space of the parts from being narrowed.

  FIG. 19 is an exploded perspective view showing a shield case mounting structure according to the third embodiment of the present invention. In addition, since 3rd Embodiment is similar to 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

  The shield case 1 described as the first embodiment covers the upper parts of the electronic component groups 5A and 5B because the electronic component groups 5A and 5B may be repaired or inspected after the shield frame 2 is soldered. The shield covers 3 a and 3 b have a form that is detachably attached to the shield frame 2. Thus, when the electronic component group 5A (or 5B) needs to be repaired or inspected, the shield cover 3a (or 3b) can be removed, and the repair or inspection can be performed from the opening of the shield frame 2. On the other hand, the shield case 201 according to the third embodiment has a possibility that, for example, the electronic component group 5B has no possibility of repair or inspection, and the electronic component group 5A has a possibility of repair or inspection. It is a case. The upper part of the electronic component group 5B that is not repaired or inspected may not be removable. Therefore, the shield frame 202 constituting the shield case 201 of the third embodiment has an outer shell 221 instead of the outer shell 21 of the shield frame 2 of the first embodiment, and has a barrier rib 222 instead of the barrier rib 22. Furthermore, the top plate 223 which covers the upper part of the electronic component group 5B is provided.

  In the third embodiment, the outline 221 of the shield frame 202 is arranged so as to surround the periphery of the electronic component groups 5A and 5B, and the partition 222 is installed so as to partition the boundary between the electronic component groups 5A and 5B. At this time, the upper part of the electronic component group 5 </ b> B is covered with the top plate 223 provided on the shield frame 202. A slit 224 is provided in a part of the top plate 223.

The shield cover 3 a inserts the locking piece 32 a through the slit 224 and engages the locking piece 32 a with the partition wall 222. Except for this engaging portion, the boundary between the electronic component groups 5A and 5B is separated only by the partition wall 222, so that the mounting space for the components can be widened.

  Further, since the shield frame 202 using the third embodiment is formed by cutting and bending from the sheet metal shown in FIG. 20, the work for forming is easy. Furthermore, since the outer shell 221, the partition 222, and the top plate 223 that shield the electronic component group 5B that is not likely to be repaired or inspected are formed integrally, there is no electrical resistance. For this reason, the shield case 201 of the third embodiment has a higher shielding effect than the first and second embodiments in which the shield frame is covered with two shield covers.

  As described above, in the present invention, the adjacent surfaces of two shield frames that have been provided adjacent to each other are integrated, and the two shield covers are engaged with each other so that the mounting area of the component is effectively utilized. can do.

  In addition, it is not limited to the said embodiment, You may change suitably in the range which does not deviate from the summary of this invention.

The disassembled perspective view of the shield case which concerns on the 1st Embodiment of this invention. 1 is an overall perspective view of a shield case according to a first embodiment of the present invention. The top view of the sheet metal which forms the shield frame which concerns on the 1st Embodiment of this invention. The modification of the shield case which concerns on the 1st Embodiment of this invention. The modification of the shield case which concerns on the 1st Embodiment of this invention. The top view of the sheet metal which forms the shield cover which concerns on the 1st Embodiment of this invention. The disassembled perspective view of the shield case which concerns on the 1st Embodiment of this invention. Sectional drawing of the shield case which concerns on the 1st Embodiment of this invention. Sectional drawing of the shield case which concerns on the 1st Embodiment of this invention. The disassembled perspective view of the shield case which concerns on the 2nd Embodiment of this invention. The top view of the sheet metal which forms the shield frame which concerns on the 2nd Embodiment of this invention. The disassembled perspective view of the shield case which concerns on the 2nd Embodiment of this invention. Sectional drawing of the shield case which concerns on the 2nd Embodiment of this invention. Sectional drawing of the shield case which concerns on the 2nd Embodiment of this invention. The disassembled perspective view which shows the modification of the shield case which concerns on the 2nd Embodiment of this invention. The top view of the sheet metal which forms the shield case of FIG. FIG. 16 is a cross-sectional view of the shield case of FIG. 15. FIG. 16 is a cross-sectional view of the shield case of FIG. 15. The disassembled perspective view of the shield case which concerns on the 3rd Embodiment of this invention. The top view of the sheet metal which forms the shield frame which concerns on the 3rd Embodiment of this invention. The exploded perspective view of the conventional shield case. Sectional drawing of the conventional shield case. The disassembled perspective view which shows an example of the solution to the problem of the conventional shield case.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Shield case, 2 Shield frame, 21 Outline, 22 Bulkhead, 3a 3b Shield cover, 31a 31b Top plate, 32a 32b Locking piece, 33a 33b Side plate, 41 hole, 42a 42b Protrusion, 5a 5b Electronic component, 5A 5B Electronic component Group, 6 substrates, 101 shield case, 102 shield frame, 122 partition wall, 123 bar, 201 shield case, 202 shield frame, 221 outline, 222 partition wall, 223 top plate, 224 slit, 901 shield case, 902 shield frame, 903 shield Cover, 905 electronic components, 906 board, 907 space

Claims (5)

A wiring board for mounting the first electronic component and the second electronic component;
A first area installed on the wiring board, surrounding the first electronic component and the second electronic component by an outer shell, and the first electronic component being disposed by a partition; A shield frame that partitions a second area in which electronic components are placed;
A first shield cover attached to the shield frame and covering the first area; and a second shield cover attached to the shield frame and covering the second area;
The top plate of the first shield cover and the top plate of the second shield cover have opposite edges formed in a concavo-convex shape, and engage with the shield frame in a state where the concavo-convex portions are engaged with each other. Electronic equipment. A wiring board for mounting the first electronic component and the second electronic component;
A first area installed on the wiring board, surrounding the first electronic component and the second electronic component by an outer shell, and the first electronic component being disposed by a partition; A shield frame that partitions a second area in which electronic components are placed;
A first shield cover attached to the shield frame and covering the first area; and a second shield cover attached to the shield frame and covering the second area;
The first shield cover and the second shield cover sandwich the partition between the first locking portion of the first shield cover and the second locking portion of the second shield cover. The electronic device is attached to the shield frame. A wiring board for mounting the first electronic component and the second electronic component;
A first area installed on the wiring board, surrounding the first electronic component and the second electronic component by an outer shell, and the first electronic component being disposed by a partition; A shield frame separating the second area where the electronic components are arranged;
A first shield cover that is engaged with the shield frame so as to cover the first area by a first top plate and has a first locking portion extending from an edge of the first top plate;
A second shield cover having a second locking portion that is engaged with the shield frame so as to cover the second area by a second top plate and extends from an edge of the second top plate; Prepared,
The first locking portion of the first shield cover is engaged with the partition from the second area side, and the second locking portion of the second shield cover is from the first area side. An electronic device that engages with the partition wall. A wiring board;
A first electronic component and a second electronic component mounted on the wiring board;
An outer shell installed on the wiring board and surrounding the first electronic component and the second electronic component; a first area where the first electronic component is disposed; and the second electronic component A shield frame having a bar that divides the second area in which is disposed, and a partition wall that is formed from two sides of the bar toward the wiring board,
A first shield cover attached to the shield frame and covering the first area; and a second shield cover attached to the shield frame and covering the second area;
The first top plate of the first shield cover and the second top plate of the second shield cover are formed with a concavo-convex shape so as to mesh with each other, and the first top plate protrudes from the convex portion of the first top plate. A locking portion is provided, and a second locking portion is provided from the convex portion of the second top plate, and the first locking portion engages with the partition wall on the second area side, 2. The electronic apparatus according to claim 1, wherein the second locking portion is engaged with the partition wall on the first area side. A wiring board on which the first electronic component and the second electronic component are mounted adjacent to each other;
A shield frame disposed on the wiring board;
An electronic device comprising a shield cover mounted on the shield frame and disposed on top of the second electronic component;
The shield frame is a frame that is disposed so as to surround the first electronic component and the second electronic component, and a first top plate that covers an upper portion of an area where the first electronic component is disposed. And a partition that separates the first area where the first electronic component is disposed and the second area where the second electronic component is disposed is formed by integral molding,
The shield cover includes a second top plate that covers the second area, and a locking portion that extends from the second top plate is inserted into a slit provided in the first top plate. The electronic device is engaged with a surface of the partition wall on the second area side.

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