JP2010103447A - Case for housing electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a case for housing an electronic circuit board capable of changing the amount of an adhesive according to a disposition environment, or the like while having a simple structure, and improving waterproofness and dustproofness. <P>SOLUTION: The case for housing the electronic circuit board includes: a pedestal 26 that is formed in a case body 12 and supports the electronic circuit board 16; a locking section 40 that is formed in a cover 14 and locks the electronic circuit board from an opposite side; a recess (a recess for a cover) 30 formed near the pedestal in the case body; a protrusion (a cover-side protrusion) 42 formed at a position corresponding to the recess in the cover; and an adhesion means (an adhesive) 32 disposed in the recess. The cover 14 is mounted to the case body 12 by inserting the protrusion 42 into the recess 30 for adhering by the adhesion means 32. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic circuit board housing case, and more particularly to an electronic circuit board housing case that houses an electronic circuit board in a space formed by a case body and a cover.

  Electronic circuit board storage cases are used in environments where there is a possibility of moisture and oil splashing and adhering or in dusty environments. There is a need to improve. Therefore, conventionally, a technique for sealing the space by bonding the case main body and the cover using an adhesive (adhesive means) is widely known.

  By the way, the amount of the adhesive used for bonding the case main body and the cover differs depending on the environment in which the housing case is arranged, the type of adhesive, and the like. In other words, when the storage case is placed in an environment where relatively large amounts of moisture, for example, are scattered, it is necessary to increase the amount of adhesive to further improve waterproofness, etc. If done, a small amount of adhesive is sufficient.

Therefore, it is desirable that the electronic circuit board housing case be configured to change the amount of the adhesive according to the environment in which it is placed and to improve the waterproof property. Therefore, in the technique described in Patent Document 1 below, a pedestal that supports the electronic circuit board is provided in the case body, and the height of the pedestal is set according to the environment (a gap for sealing). ) Is made variable so that the amount of the adhesive is changed.
JP 2003-258451 A

  However, in the technique described in Patent Document 1, the height of the pedestal of the electronic circuit board can only be adjusted by the thickness of the electronic circuit board. In other words, the amount of adhesive (sealing gap) is set to the electronic level. Since only the thickness of the circuit board can be changed, for example, when the waterproofness is further improved by using a relatively large amount of adhesive, there is a possibility that the circuit board cannot be sufficiently handled. Further, when the height of the pedestal of the electronic circuit board is adjusted, it is necessary to adjust the height of positioning pins for positioning the electronic circuit board, and there is a problem that the structure becomes complicated.

  Therefore, the object of the present invention is to solve the above-mentioned problems, and while having a simple structure, the amount of the adhesive can be changed according to the environment in which it is placed, and the waterproof and dustproof properties are improved. The object is to provide a housing case for a circuit board.

  In order to achieve the above object, in claim 1, in an electronic circuit board housing case for housing an electronic circuit board in a space formed by a case body and a cover attached to the case body, A pedestal that is formed on the case body and supports the electronic circuit board; a locking part that is formed at a position facing the pedestal in the cover and that locks the electronic circuit board from the opposite side; and A concave portion formed in the vicinity of the pedestal, a convex portion formed at a position corresponding to the concave portion in the cover, and an adhesive means disposed in the concave portion, so that the convex portion is inserted into the concave portion. The cover is attached to the case body by bonding with the bonding means.

  The electronic circuit board housing case according to claim 2 is provided with a movement restricting portion that is formed on the cover and restricts movement of the electronic circuit board.

  In the electronic circuit board housing case according to claim 3, the movement restricting portion is positioned between the locking portion and the convex portion of the cover and is in contact with the electronic circuit substrate. Thus, a gap is formed between the inclined surface, the electronic circuit board, and the case body.

  In the electronic circuit board housing case according to a fourth aspect of the present invention, the recess is configured such that the opening end is formed lower than the base by a predetermined amount.

  In the electronic circuit board housing case according to claim 5, the electronic circuit board is provided with fixing means for fixing the electronic circuit board between the pedestal and the locking portion.

  In the electronic circuit board housing case according to claim 1, the base of the electronic circuit board formed on the case body, a locking part formed on the cover for locking the electronic circuit board from the opposite side, and the case A concave portion formed in the main body, a convex portion formed in the cover, and an adhesive means disposed in the concave portion, so that the cover is attached to the case main body by inserting the convex portion into the concave portion and bonding with the adhesive means Since it is configured as described above, the amount of the adhesive (adhesive means) can be changed according to the environment in which it is arranged while having a simple structure, that is, the dimensions (width and depth) of the recesses where the adhesive means are arranged. It is possible to change the amount of adhesive (adhesive means) simply by changing it according to the environment, etc., and to attach the cover to the case body by inserting the convex part into the concave part and adhering with the adhesive means, Electronic circuit board accommodated That space can be reliably sealed, thereby improving the waterproof and dustproof properties.

  The electronic circuit board housing case according to claim 2 is formed on the cover and includes a movement restricting portion that restricts movement of the electronic circuit board. The movement of the electronic circuit board due to the above can be restricted, and thus the bending or the like occurring in the electronic circuit board can be effectively prevented.

  In the electronic circuit board housing case according to claim 3, the movement restricting portion is positioned between the locking portion of the cover and the convex portion, and is inclined at a portion in contact with the electronic circuit substrate. Since a gap is formed between the inclined surface, the electronic circuit board, and the case body, in addition to the effect described in claim 2, the formation of the convex portion (drawing process) is facilitated. In addition, for example, by allowing the adhesive means (adhesive) overflowing from the recess to flow out (flow) into the gap, the gap can be sealed, and the waterproofness and dustproofness can be further improved.

  In the electronic circuit board housing case according to claim 4, since the recess is configured such that the opening end is formed by a predetermined amount lower than the pedestal, in addition to the above-described effects, the recess of the case main body is provided with the pedestal. It is possible to form the housing case close to the housing case, and thus the entire housing case can be reduced in size.

  In the electronic circuit board housing case according to claim 5, the electronic circuit board is configured to be fixed between the pedestal and the locking portion, that is, the electronic circuit board is configured to be difficult to move. Even when vibration from the outside to the housing case or thermal stress is generated in the electronic circuit board, it is possible to prevent the electronic circuit board from being bent.

  The best mode for carrying out the electronic circuit board housing case according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is an exploded perspective view generally showing an electronic circuit board housing case according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a state (assembled state) in which the electronic circuit board housing case shown in FIG. 1 is completed.

  1 and 2, reference numeral 10 denotes an electronic circuit board storage case (hereinafter simply referred to as “storage case”). The housing case 10 is mounted at an appropriate position of a vehicle (not shown), for example, and includes a case main body 12 and a cover 14 attached thereto, as shown well in FIG. The electronic circuit board 16 (hereinafter simply referred to as “substrate”) is accommodated in the space formed by the above.

  In FIG. 1, for convenience of understanding, the cover 14 can be seen on the inner surface, specifically, the inner surface (ie, the surface facing the case body 12) when the housing case 10 is completed. Show. For simplification of illustration, the electronic components mounted on the board 16 are not shown except for the connector 20.

  The case body 12 and the cover 14 are formed by pressing or cutting a metal material having thermal conductivity, for example, a metal material such as zinc, aluminum, copper, or iron, or die casting. The case body 12 includes a bottom surface 12B that has a substantially rectangular shape (rectangular shape) in a plan view, and a side surface (side wall) 12S that protrudes upward (in the direction of the cover 14) from the edge of the bottom surface 12B.

  A rectangular opening 22 is provided on the bottom surface 12 </ b> B of the case body 12. As described later, since the connector 20 is inserted into the opening 22, the opening 22 is hereinafter referred to as “connector opening”. A recess 24 (groove; hereinafter referred to as “connector recess”) having a predetermined width and depth is formed over the entire periphery of the outer periphery of the connector opening 22, specifically, the outer periphery on the side facing the substrate 16. .

  A plurality of, specifically seven, pedestals 26 that support the edge 16a of the substrate 16 locally (partially) are formed on the bottom surface 12B of the case body 12 and adjacent to the side surface 12S. More specifically, the pedestal 26 is formed in the vicinity of the corners of the four corners of the bottom surface 12B of the case main body 12 and the midpoint of each side of the bottom surface 12B (the midpoint of the side close to the long side of the connector opening 22). Except). As a result, the edge portion 16a of the substrate 16 is locally supported by the base 26 in the vicinity of the corner portion 16a1 and the midpoint 16a2 of the side.

  A recess 30 (groove, hereinafter referred to as “cover recess”) having a predetermined width and depth is provided at the upper end of the side surface 12S (contact portion with the cover 14) in the vicinity of the pedestal 26 of the case body 12 and the entire circumference. Formed over.

  3 is a cross-sectional view taken along the line III-III in FIG. 2, and FIG. 4 is an enlarged cross-sectional view showing the vicinity of the contact portion between the case main body 12 and the cover 14 shown in FIG.

  As shown in FIG. 4, the cover concave portion 30 has an arc shape (U shape) having a convex portion on the lower side in a cross-sectional view, and is formed so as to be continuous in the vicinity of the pedestal 26. Further, the opening 30a of the cover recess 30 has a predetermined amount (for example, about 1 to 2 mm, which is indicated by a symbol L1 in FIG. 4) than the base 26 (more precisely, the contact surface 26a in contact with the substrate 16 in the base 26). Only lower (in other words, on the bottom surface 12B side). Note that an adhesive (bonding means) 32 for bonding the cover 14 is disposed in the cover recess 30 configured as described above, which will be described later. The width and depth of the cover recess 30 can be changed according to the environment in which the housing case 10 is disposed, the type of the adhesive 32, and the like.

  Returning to the description of FIG. 1, a plurality of (two) positioning pins 34 for positioning the substrate 16 are provided in an appropriate position on the case body 12, specifically, in the vicinity of the connector opening 22. The The positioning pin 34 is formed so as to be reduced in diameter toward the tip and to have a tapered shape. Furthermore, screws (fixing means) 36 for fixing the cover 14 to the case main body 12 and fixing the substrate 16 between the base 26 and a locking portion (described later) of the cover 14 are provided at the four corners of the case main body 12. A screw hole (fixing means) 38 to be screwed (not shown in FIG. 1; shown in FIG. 2 or the like) is provided.

  Next, the cover 14 will be described. The cover 14 can be elastically deformed, and is formed to have a substantially square shape (rectangular shape) in plan view. In the cover 14, the substrate 16 is placed at a position facing the above-described pedestal 26 when attached to the case body 12, that is, near the corners of the four corners of the cover 14 and near the midpoint of each side (four sides). A plurality (specifically, eight) of locking portions 40 that are locked from the opposite side (upper side in the figure) of H.26 are formed.

  Note that the number of the bases 26 of the case main body 12 is seven, whereas the number of the locking portions 40 formed on the cover 14 is eight to facilitate the attachment of the cover 14 to the case main body 12. It is. That is, by providing the locking portions 40 at the four corners of the cover 14 and the midpoints of the respective sides, the shape of the cover 14 can be configured to be symmetrical in the front-rear and left-right directions in plan view, thereby considering the orientation of the cover 14. It is because it can be easily attached to the case main body 12 without.

  Further, in a state where the housing case 10 is completed (in other words, a state where the cover 14 is attached to the case body 12), the separation distance L2 (shown in FIG. 4) between the base 26 and the locking portion 40 is the substrate 16. It is comprised so that it may become the same or substantially the same as thickness T.

  A convex portion 44 (hereinafter referred to as a “cover-side convex portion”) to be inserted into the cover concave portion 30 is formed at the edge portion of the cover 14 and in contact with the case main body 12 (projected). Is done. That is, a cover side convex portion (convex portion) 44 is formed at a position corresponding to the cover concave portion 30 in the cover 14. As shown well in FIG. 4, the cover-side convex portion 44 is formed so as to exhibit an arc shape (U-shape) having a convex portion below in a cross-sectional view.

  Further, as shown in FIGS. 1 and 4, the cover 14 is formed with a movement restricting portion 46 that restricts the movement of the substrate 16. The movement restricting portion 46 is formed continuously from the locking portion 40 of the cover 14 and the cover-side convex portion 44, as well shown in FIG. The movement restricting portion 46 is positioned between the locking portion 40 of the cover 14 and the cover-side convex portion 44, and includes an inclined surface 46 a that has a tapered shape and is formed at a portion that contacts the substrate 16. .

  Thereby, for example, even when the substrate 16 moves rightward in FIG. 4 due to external vibration or the like, the edge portion 16a of the substrate 16 comes into contact with the inclined portion 46a of the movement restricting portion 46 and stops. The movement restriction unit 46 restricts the movement. In addition, since the movement restricting portion 46 includes the inclined surface 46 a, a gap 48 is formed between the inclined surface 46 a, the substrate 16, and the case body 12 in a state where the housing case 10 is completed.

  As shown in FIG. 1, screw insertion holes (fixing means) 50 through which the above-described screws 36 can be inserted are formed in the four corners of the cover 14. Near the center of the cover 14, a water-repellent filter (a water- and oil-repellent filter that allows air to pass but does not allow liquid to pass) 52 is attached to the vent hole 54 so as to ensure the breathability of the housing case 10. However, since they do not have a direct relationship with the gist of the present application, a detailed description is omitted.

  As described above, a plurality of electronic components including the connector 20 are mounted on the substrate 16 by soldering. The connector 20 is specifically composed of three blocks, and their outer walls are formed of an elastically deformable resin material such as polybutylene terephthalate (PBT).

  5 is a cross-sectional view taken along the line V-V in FIG.

  As shown in FIGS. 1 and 5, a protrusion 56 (hereinafter referred to as “connector-side protrusion”) to be inserted into the connector recess 24 described above is provided around the connector 20 and in contact with the case body 12. ) Is formed. More specifically, the connector-side convex portion 56 is provided so as to be continuous with the outer walls of the three blocks constituting the connector 20 and to surround all of them. Thus, the connector-side convex portion 56 is formed at a position corresponding to the connector concave portion 24 in the connector 20.

  As can be seen from FIG. 5, the connector recess 24 is formed so as to exhibit an arcuate shape (U-shape) having a projecting portion below in a cross-sectional view, like the cover recess 30. An adhesive 32 for bonding the connector 20 is disposed in the connector recess 24 (described later).

  As shown in FIG. 1, there are a plurality of positioning holes 60 through which the positioning pins 34 should be inserted (2) at appropriate positions on the substrate 16, more precisely in the vicinity of the connector 20 and corresponding to the positioning pins 34 described above. Perforated). The diameter of the positioning hole 60 is set to be larger than the diameter of the positioning pin 34.

  Next, assembly of the storage case 10 configured as described above will be described. First, the substrate 16 is attached to the case body 12. Specifically, an adhesive 32 having elasticity (low hardness after curing), for example, a silicon-based adhesive, is disposed (applied) in an appropriate amount in the connector recess 24 of the case body 12. Thereafter, the substrate 16 is arranged such that the component surface side (surface on which the electronic component is mounted) is in contact with the pedestal 26 of the case body 12 and is supported by the pedestal 26. At this time, the edge portion 16a of the substrate 16 is supported by the base 26 locally as described above (specifically, near the corner portion 16a1 and the midpoint 16a2 of the side).

  When the substrate 16 is arranged on the pedestal 26, the substrate 16 can be easily positioned with respect to the case body 12 by inserting the positioning pins 34 of the case body 12 into the positioning holes 60 of the substrate 16. .

  When the board 16 is supported by the pedestal 26, the connector 20 mounted on the board 16 is projected outward from the case body 12 through the connector opening 22 of the case body 12 and is used for the connector. The connector-side convex portion 56 is inserted into the concave portion 24. That is, as shown in FIG. 5, the connector recess 24 and the connector-side protrusion 56 are brought into close contact with each other via the adhesive 32, whereby the connector opening 22 is sealed.

  After the substrate 16 is attached to the case body 12, the cover 14 is then attached to the case body 12. More specifically, an appropriate amount of adhesive 32 is disposed (applied) in the cover recess 30 of the case body 12. The amount of the adhesive 32 disposed in the cover recess 30 is changed according to the dimensions (width and depth) of the cover recess 30 and the type of adhesive.

  After the adhesive 32 is disposed in the cover recess 30, as shown in FIG. 4 and the like, the cover-side protrusion 44 is inserted into the cover recess 30. As a result, the cover concave portion 30 and the cover-side convex portion 44 are brought into close contact with each other via the adhesive 32, and the space in which the substrate 16 is accommodated is sealed.

  Note that when the cover-side convex portion 44 is inserted into the cover concave portion 30, the adhesive 32 disposed in the cover concave portion 30 may overflow beyond the opening end 30a. Is caused to flow out into a gap 48 formed between the inclined surface 46a, the substrate 16 and the case body 12, and thus the gap 48 is sealed. Thereby, the inside of the space in which the substrate 16 is accommodated can be further sealed.

  After the cover 14 is attached to the case body 12 as described above, the cover 14 is fastened and fixed to the case body 12 by inserting the screw 36 through the screw insertion hole 50 and the screw hole 38. At this time, the distance L2 between the base 26 of the case body 12 and the locking portion 40 of the cover 14 is configured to be the same as or substantially the same as the thickness T of the substrate 16 as described above. The edge portion 16a is fixed (clamped) between the base 26 and the locking portion 40 locally (specifically, at the corner portion 16a1 and the midpoint 16a2 of the side).

  In this manner, the cover 14 is inserted between the cover concave portion 30 and bonded with the adhesive 32 while fixing the substrate 16 between the base 26 and the locking portion 40, and the cover 14 is bonded to the case main body 12. Thus, the storage case 10 is completed.

  As described above, in the electronic circuit board housing case 10 according to the first embodiment, the base 26 formed on the case body 12 and supporting the board 16 and the cover 14 formed on the cover 14 are engaged with the board 16 from the opposite side. The locking part 40 to stop, the cover recessed part 30 formed in the case main body 12, the cover side convex part 44 formed in the cover 14, and the adhesive agent 32 arrange | positioned at a recessed part are provided, Therefore convex part 44 Since the cover 14 is attached to the case main body 12 by inserting it into the recess 30 and adhering with the adhesive 32, the amount of the adhesive 32 can be adjusted according to the environment in which it is arranged, while having a simple structure. That is, it is possible to change the amount of the adhesive 32 simply by changing the dimensions (width and depth) of the cover recess 30 in which the adhesive 32 is disposed according to the environment.

  Specifically, when the storage case 10 is disposed in an environment where, for example, a relatively large amount of moisture is scattered, the depth of the cover recess 30 is increased and the amount of the adhesive 32 is increased as shown by an imaginary line in FIG. Further, waterproofness and the like can be further improved. On the other hand, when the storage case 10 is placed in an environment where the scattering of moisture and the like is relatively small, although not shown in the drawing, the depth of the cover recess 30 is reduced to reduce the amount of the adhesive 32, and a structure such as waterproofness is provided. It can be simplified and can be advantageous in terms of cost.

  Further, since the cover 14 is attached to the case body 12 by inserting the cover-side convex portion 44 into the cover concave portion 30 and bonding with the adhesive 32, the space in which the substrate 16 is accommodated can be securely sealed, Dustproofness can be improved.

  In addition, since it is formed on the cover 14 and includes the movement restricting portion 46 that restricts the movement of the substrate 16, the movement of the substrate 16 due to vibration or the like can be restricted, so that the bending that occurs in the substrate 16 is effective. Can be prevented.

  Further, the movement restricting portion 46 is positioned between the locking portion 40 of the cover 14 and the cover-side convex portion 44, and includes an inclined surface 46a formed at a portion in contact with the substrate 16, and thus the inclined surface 46a. Since the gap 48 is formed between the substrate 16 and the case body 12, the cover-side convex portion 44 can be easily formed (drawing) and overflows from the cover concave portion 30, for example. By allowing the adhesive 32 that has come out to flow out (flow into) the gap 48, the gap 48 can be sealed, and the waterproofness and dustproofness can be further improved.

  Further, since the cover recess 30 is configured such that the opening end 30a is formed lower than the pedestal 26 by a predetermined amount L1, the cover recess 30 of the case body 12 can be formed close to the pedestal 26. Therefore, the entire housing case 10 can be reduced in size.

  In addition, since the substrate 16 is configured to be fixed between the pedestal 26 and the locking portion 40 using screws 36 or the like, that is, the substrate 16 is configured to be difficult to move. Even when vibration or thermal stress is generated on the substrate 16, it is possible to prevent the substrate 16 from being bent.

  Next, an electronic circuit board housing case 10 according to a second embodiment of the present invention will be described.

  FIG. 6 is an enlarged cross-sectional view similar to FIG. 4, showing the vicinity of the contact portion between the case body 12 and the cover 14 of the housing case 10 of the electronic circuit board according to the second embodiment. In addition, about the structure common to 1st Example, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The description will focus on the differences from the first embodiment. In the second embodiment, as shown in FIG. 6, the cover recess 130 is formed in a substantially rectangular shape in cross-sectional view and further moved. An end portion of the restricting portion 46 (more precisely, an end portion on the opposite side of the end portion continuous with the locking portion 40) is extended downward to be an end edge (terminal) of the cover 14, and the cover 14 The end edge is made to be the cover side convex portion 144 to be inserted into the cover concave portion 130 described above. That is, the edge of the cover 14 is configured to function as the cover-side convex portion 144.

  Since the electronic circuit board housing case 10 according to the second embodiment is configured as described above, the cover-side convex portion 144 and the cover concave portion 130 can have a simpler structure. The remaining configuration and effects are not different from those of the first embodiment.

  As described above, in the first and second embodiments of the present invention, the electronic circuit board (substrate) 16 is accommodated in the space formed by the case main body 12 and the cover 14 attached to the case main body. In the electronic circuit board housing case 10, a pedestal 26 formed on the case body and supporting the electronic circuit board is formed at a position facing the pedestal in the cover, and the electronic circuit board is locked from the opposite side. The locking portion 40, concave portions (cover concave portions) 30, 130 formed in the vicinity of the pedestal in the case body, and convex portions (cover side convex portions) formed at positions corresponding to the concave portions in the cover. 44 and 144, and an adhesive means (adhesive) 32 disposed in the concave portion, so that the convex portions 44 and 144 are inserted into the concave portions 30 and 130 and the adhesion is performed. And configured to attach the cover 14 to the case body 12 by bonding with at stage 32.

  In addition, a movement restricting portion 46 that restricts the movement of the electronic circuit board 16 is provided along with the cover 14.

  The movement restricting portion 46 is located between the locking portion 40 of the cover 14 and the convex portion (cover-side convex portion) 44 and is formed at a portion that contacts the electronic circuit board 16. Thus, a gap 48 is formed between the inclined surface 46a, the electronic circuit board 16 and the case body 12.

  The recesses (cover recesses) 30 and 130 are configured such that the open ends 30a and 130a are formed lower than the pedestal 26 by a predetermined amount L1.

  The electronic circuit board 16 is provided with fixing means (screws 36, screw holes 38, screw insertion holes 50) for fixing the electronic circuit board 16 between the base 26 and the locking portion 40.

  In the above, expressions such as “bottom surface”, “side surface”, “upper” and “lower” are used, but these expressions are based on the vertical and horizontal directions on the drawing, and the housing case 10 is attached in real space. It does not define the direction (orientation).

  Moreover, although the material of the case main body 12 and the cover 14, the predetermined amount L1, etc. were shown concretely, they are illustrations and are not limited.

It is a disassembled perspective view which shows the accommodation case of the electronic circuit board based on 1st Example of this invention entirely. It is a perspective view which shows the state which the accommodation case of the electronic circuit board shown in FIG. 1 was completed. It is the III-III sectional view taken on the line of FIG. FIG. 4 is an enlarged cross-sectional view showing an enlarged vicinity of a contact portion between a case main body and a cover of the housing case shown in FIG. 3. It is the VV sectional view taken on the line of FIG. FIG. 5 is an enlarged cross-sectional view similar to FIG. 4, showing an enlarged vicinity of a contact portion between a case main body and a cover of an electronic circuit board housing case according to a second embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Storage case, 12 Case main body, 14 Cover, 16 Board | substrate (electronic circuit board), 26 Base, 30, 130 Recessed part for recessed part (recessed part), 30a, 130a (recessed part for cover), 32 Adhesive (adhesive means) ), 36 Screw (fixing means), 38 Screw hole (fixing means), 40 Locking portion, 44, 144 Cover side convex portion (convex portion), 46 Movement restricting portion, 46a Inclined surface, 48 gap, 50 Screw insertion hole (Fixing means)

Claims (5)

  In a housing case for an electronic circuit board that houses an electronic circuit board in a space formed by a case body and a cover attached to the case body, a base that is formed on the case body and supports the electronic circuit board, Corresponding to the recess in the cover body, formed in a position facing the pedestal and locking the electronic circuit board from the opposite side, a recess formed in the case body near the pedestal, and the cover A convex portion formed at a position to be attached, and an adhesive means disposed in the concave portion, so that the cover is attached to the case body by inserting the convex portion into the concave portion and bonding with the adhesive means A housing case for an electronic circuit board, characterized by comprising:   The housing case for an electronic circuit board according to claim 1, further comprising a movement restricting portion that is formed on the cover and restricts movement of the electronic circuit board.   The movement restricting portion is positioned between the locking portion of the cover and the convex portion, and includes an inclined surface formed at a portion that comes into contact with the electronic circuit board, and thus the inclined surface and the electron 3. The electronic circuit board housing case according to claim 2, wherein a gap is formed between the circuit board and the case body.   4. The electronic circuit board housing case according to claim 1, wherein the recess has an opening end formed lower than the pedestal by a predetermined amount. 5.   5. The electronic circuit board housing case according to claim 1, further comprising fixing means for fixing the electronic circuit board between the pedestal and the locking portion. 6.

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