JP2003347834A - Antenna integrated high-frequency circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize, properly maintaining antenna efficiency and circuit efficiency. <P>SOLUTION: Radial electrodes 4, 5 are formed on a surface of a dielectric substrate 2 and a penetration portion 10 formed on the dielectric substrate portion 2 avoiding a formation area of the radial electrode 4, 5. It is provided with a circuit board 3 covering an opening portion of a surface side of the penetration portion 10; a high-frequency circuit connecting to the radiating electrodes 4, 5 in the circuit board 3; a ground electrode 11 on the surface of the circuit board 3. The dielectric substrate 2 has a certain thickness to improve an antenna efficiency, and the thickness of the circuit board 3 is made thinner than that of dielectric substrate 2. The radiating electrodes 4, 5 are made smaller by comprising the dielectric substrate 2 with a dielectric material of a high dielectric constant, such that the dielectric constant is, for example, larger than 10, and also can make a smaller thickness of the dielectric substrate 2. Therefore, the antenna associated high-frequency circuit module 1 can be made smaller in size and in thickness. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna-integrated high-frequency circuit module in which an antenna and a high-frequency circuit connected to the antenna are integrated.

[0002]

2. Description of the Related Art FIG. 12 shows an example of an antenna-integrated high-frequency circuit module described in JP-A-6-152236. In the antenna-integrated high-frequency circuit module 30, a disk-shaped radiation electrode 32 that performs an antenna operation is formed on the surface of a ceramic dielectric 31. A concave portion 33 is formed on the bottom surface side of the ceramic dielectric 31, and the bottom surface 33a of the concave portion 33 and the curved inner wall surface 33b are formed.
Is formed with a ground electrode 34. In addition, an amplifier circuit 35 is provided in the concave bottom surface portion 33a. Further, a shield substrate 36 for closing the opening of the recess 33 is provided. On the surface of the shield substrate 36, a metal film 37 is formed. Further, the radiation electrode 32 and the amplifier circuit 35 are connected by a lead wire 38.

[0003]

In the high frequency circuit module 30 with an integrated antenna, the ceramic dielectric 31 has a shape in which a concave portion 33 is formed on the bottom surface. It is not easy to manufacture the ceramic dielectric 31 having such a shape, and the productivity is low.

In order to increase the radiation efficiency of the radiation electrode 32, the ceramic dielectric portion sandwiched between the radiation electrode 32 and the ground electrode 34 needs to have a certain thickness D. Further, the concave portion 33 of the ceramic dielectric 31
Need to have a depth that can accommodate the components of the amplifier circuit 35. Considering these facts, the thickness of the ceramic dielectric 31 becomes large, and the antenna-integrated high-frequency circuit module 30 becomes tall.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an antenna-integrated high-frequency device having good antenna efficiency and circuit efficiency, high productivity, and easy to make small and thin. It is to provide a circuit module.

[0006]

In order to achieve the above-mentioned object, the present invention has the following structure to solve the above-mentioned problem. That is, the present invention provides an antenna-integrated high-frequency circuit module in which an antenna and a high-frequency circuit connected to the antenna are integrated, including a dielectric substrate, and an antenna on a surface portion of the dielectric substrate. The radiation electrode to be formed is formed, and a penetrating portion penetrating from the surface to the bottom surface is formed in the dielectric substrate portion avoiding the radiation electrode forming region, and a circuit board closing the opening on the surface side of the penetrating portion is formed. , Fit into the penetration,
Or, it is mounted on the dielectric substrate surface portion of the penetrating portion,
This circuit board is made of a dielectric material thinner than the dielectric substrate, and is characterized in that a high-frequency circuit is formed on the circuit board.

[0007]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an antenna-integrated high-frequency circuit module according to a first embodiment. The antenna-integrated high-frequency circuit module 1 according to the first embodiment has a dielectric substrate 2 and a circuit board 3. FIG. 2 shows the dielectric substrate 2 and the circuit board 3 separated from each other. In FIG. 2, the circuit board 3 is shown in an upside down posture. Also, in FIG.
A cross-sectional view taken along the line AA in FIG. 1 is schematically shown.

In the first embodiment, the dielectric substrate 2
Is made of a dielectric material having a relative dielectric constant of 10 or more. The constituent material of the dielectric substrate 2 is not particularly limited as long as the relative dielectric constant is 10 or more. As an example, for example, there is a ceramic having a relative dielectric constant εr of about 20.

A plurality of radiation electrodes 4 and 5 are formed on the surface of the dielectric substrate 2 at a distance. In addition, ground electrodes 8 and 9 (see FIG. 3) are formed on the bottom surface of the dielectric substrate 2 at least at portions facing the radiation electrodes 4 and 5. The radiation electrode 4, the ground electrode 8 facing the radiation electrode 4, and the dielectric base between the radiation electrode 4 and the ground electrode 8 form a microstrip antenna 6.
Similarly, the radiation electrode 5, the ground electrode 9 facing the radiation electrode 5, and the dielectric base portion between the radiation electrode 5 and the ground electrode 9 form the microstrip antenna 7.

In the first embodiment, one of the microstrip antennas 6 and 7 serves as a receiving antenna, and the other serves as a transmitting antenna. Here, the microstrip antenna 6 is used for reception and the other microstrip antenna 7 is used for transmission for easy understanding.

The distance between the radiation electrode 4 and the radiation electrode 5 is
The microstrip antennas 6 and 7 have a distance enough to ensure isolation.

In the dielectric substrate 2, a through hole 10 which is a penetrating portion penetrating from the surface to the bottom surface is provided in a region between the radiation electrodes 4 and 5.
Are formed. This through hole 10 is also involved in preventing mutual interference of antennas.

The circuit board 3 is mounted on the surface of the dielectric substrate 2 so as to cover the opening on the surface side of the through hole 10. The circuit board 3 is made of a dielectric material having a relative dielectric constant lower than that of the dielectric substrate 2. One of the constituent materials of the circuit board 3 is, for example, glass epoxy. As a constituent material of the circuit board 3, it is inexpensive and easy to process (excellent in processability).
It is preferable to use one.

On the front surface 3a of the circuit board 3, a ground electrode 11 is formed, and on the back surface 3b of the circuit board 3, components 12 (for example, a transistor, a diode, a resistor, a capacitor, etc.) and a wiring pattern are formed. (Not shown) are formed. In the first embodiment, the component 12 on the back surface 3 b of the circuit board 3 is accommodated and arranged in the through hole 10 of the dielectric base 2. The wiring pattern and the ground electrode 11
And a circuit board portion (dielectric) between the wiring pattern and the ground electrode 11 forms a microstrip line. In this first embodiment, the component 12 and the microstrip line constitute a receiving circuit 13 and a transmitting circuit 14 which are high-frequency circuits.

By the way, the thickness of the dielectric constituting the microstrip antennas 6 and 7 (that is, the dielectric substrate 2)
Has an appropriate value for improving the radiation efficiency. The appropriate thickness of the dielectric varies depending on the relative permittivity of the dielectric and the frequency band of transmission / reception radio waves, but specific examples include, for example, the relative permittivity of the dielectric (dielectric substrate 2). 20, when the frequency band of the radio wave is the microwave band, the appropriate thickness D of the dielectric of the microstrip antennas 6 and 7 (the appropriate thickness of the dielectric substrate 2) may be about 3 mm. preferable.

The thickness of the dielectric (ie, the thickness of the circuit board 3) d of the microstrip line constituting the high-frequency circuit includes electromagnetic radiation from the wiring pattern and the microstrip line of the receiving circuit 13 and the transmitting circuit 14 There is an appropriate value for suppressing unnecessary coupling with the microstrip line. The appropriate value d varies depending on the constituent material of the circuit board 3, but when the circuit board 3 is formed of a material such as glass epoxy which is often used as a constituent material of the circuit board 3, the dielectric base 2 Is smaller than the appropriate thickness D.

In the first embodiment, the dielectric substrate 2 and the circuit board 3 have the appropriate thicknesses D and d, respectively, and the circuit board 3 is thinner than the dielectric substrate 2. . As described above, since the thickness d of the circuit board 3 is small, the ground electrode 11 of the circuit board 3 is arranged at substantially the same height as the height at which the radiation electrodes 4 and 5 are formed. Therefore, the ground electrode 11 can contribute to suppressing unnecessary coupling of the radiation electrodes 4 and 5.

The antenna-integrated high-frequency circuit module 1 according to the first embodiment is mounted on a board 15 to be mounted, for example, as shown in FIG. The mounting board 1
In order to connect the ground electrode 11 of the circuit board 3 to the ground 5, the dielectric substrate 2 has a ground connection pattern 16.
Are formed. Further, the circuit formed on the mounting board 15 and the receiving circuit 13 and the transmitting circuit 1 of the circuit board 3
A circuit connection pattern 17 for connecting the circuit board 4 to the circuit board 4 is formed on the dielectric substrate 2. Further, the dielectric substrate 2 includes
An antenna connection pattern 18 for connecting the reception-side radiation electrode 4 to the reception circuit 13 of the circuit board 3 and an antenna connection pattern for connecting the transmission-side radiation electrode 5 to the transmission circuit 14 of the circuit board 3 A pattern 19 is formed.

On the back surface 3b of the circuit board 3, there are formed electrode pads 20 corresponding to the ground connection pattern 16, the circuit connection pattern 17, and the antenna connection patterns 18 and 19, respectively. When the circuit board 3 is mounted on the surface of the dielectric substrate 2, the electrode pads 20 are placed in a state where they are aligned with the corresponding connection patterns 16 to 19, respectively. 16 to 19 are connected by, for example, solder. This allows
The receiving circuit 13 can be connected to the radiating electrode 4 and the transmitting circuit 14 can be connected to the radiating electrode 5. By mounting the dielectric substrate 2 (that is, the antenna-integrated high-frequency circuit module 1) to which the circuit board 3 is connected in such a manner at a set position of the mounting board 15, the ground electrode 1 of the circuit board 3
1 is a mounting substrate 15 via a ground connection pattern 16
And the receiving circuit 1 of the circuit board 3
3 and the transmission circuit 14 can be connected to the circuit of the mounting board 15 via the circuit connection pattern 17, respectively.

As described above, in the first embodiment, since the connection patterns 16 and 17 are provided on the dielectric substrate 2,
The antenna-integrated high-frequency circuit module 1 is mounted
Is mounted on the ground electrode 1 on the circuit board 3.
1, the receiving circuit 13 and the transmitting circuit 14 can be connected to the ground and the circuit of the mounting board 15. As a result, a lead wire for connecting the ground electrode 11, the receiving circuit 13, and the transmitting circuit 14 of the circuit board 3 to the ground and the circuit of the mounting board 15 becomes unnecessary, and the wiring work of the lead wire can be omitted. The manufacturing process can be simplified.

When the antenna-integrated high-frequency circuit module 1 according to the first embodiment is mounted on a mounting substrate 15, the mounting substrate 15 has a region S (see FIG. 3), there is a space in which components can be mounted. For example, a circuit 21 (for example, an IF circuit or a baseband circuit) connected to the receiving circuit 13 or the transmitting circuit 14 may be provided by forming a component or a wiring pattern in the space S. Thereby, the mounting density of the mounting board 15 can be improved.

In the first embodiment, the dielectric forming the microstrip antennas 6 and 7 and the dielectric forming the high-frequency circuit are separate members, that is, the dielectric substrate 2
And the circuit board 3. Therefore, the thickness D of the dielectric constituting the microstrip antennas 6 and 7 and the thickness d of the dielectric constituting the microstrip line of the high-frequency circuit
Can be easily set to have appropriate thicknesses different from each other. That is, by designing the thickness D of the dielectric substrate 2, the thickness of the dielectric of the microstrip antennas 6, 7 can be set to an appropriate value that can improve the antenna efficiency, and the thickness d of the circuit board 3 can be improved. Makes it easy to set the thickness of the dielectric of the microstrip line of the high-frequency circuit to an appropriate value that can suppress electromagnetic radiation from the wiring pattern.

Further, in the first embodiment, since a material having a high relative dielectric constant is employed as a dielectric material constituting the dielectric substrate 2, the dielectric substrate 2 capable of improving the antenna efficiency can be used appropriately. Thickness D can be reduced, and the radiation electrodes 4, 5
Can be reduced. Therefore, the dielectric substrate 2 can be reduced in size and thickness, and accordingly, the reduction in size and thickness of the antenna-integrated high-frequency circuit module 1 can be promoted.

Further, in the manufacturing process of the antenna-integrated high-frequency circuit module 1 of the first embodiment, the microstrip antennas 6 and 7 were formed on the dielectric substrate 2 and the high-frequency circuit was formed on the circuit board 3. Thereafter, the dielectric base 2 and the circuit board 3 are connected to manufacture the antenna-integrated high-frequency circuit module 1. The productivity can be improved as compared with the case where the high-frequency circuit is provided directly on the dielectric substrate 2. The dielectric substrate 2 has
A through hole 10 is provided instead of a concave portion. Dielectric substrate 2
Since the operation of forming the through hole 10 is easier than the case of forming a concave portion in the dielectric substrate 2, this configuration is also a configuration for improving productivity.

Further, in the first embodiment, the shape of the dielectric substrate 2, the arrangement positions of the radiation electrodes 4 and 5 formed on the dielectric substrate 2 and the formation positions of the patterns 16 to 19 are determined by the radiation. It is symmetrical with respect to the center line O (see FIG. 2) of the dielectric substrate 2 orthogonal to the arrangement direction of the electrodes 4 and 5. For this reason, when connecting the circuit board 3 to the dielectric substrate 2, it is not necessary to worry about the left and right directions of the dielectric substrate 2. This eliminates any mistakes, and reduces mistakes in the connection work between the dielectric substrate 2 and the circuit board 3. Thereby, the yield can be improved.

Hereinafter, a second embodiment will be described. In the description of the second embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the overlapping description of the common portions will be omitted.

FIG. 4 is a schematic perspective view showing an antenna-integrated high-frequency circuit module according to a second embodiment.
FIG. 5 schematically shows an exploded view of the antenna-integrated high-frequency circuit module of the second embodiment. FIG.
In the figure, the circuit board 3 is shown in an upside down posture.

In the second embodiment, the dielectric substrate 2 is provided with hollow portions 24a and 24b as through portions. The hollow portions 24a and 24b are provided in a region between the region where the radiation electrode 4 is formed and the region where the radiation electrode 5 is formed, and the center of the dielectric substrate 2 along the direction in which the radiation electrodes 4 and 5 are arranged. It is formed symmetrically with respect to the line O ′.
Due to the hollow portions 24a and 24b, the central portion of the dielectric substrate 2 is thinner than the region where the radiation electrodes 4 and 5 are formed.

The circuit board 3 has hollow portions 24a and 24b.
Is mounted on the surface of the dielectric substrate 2 so as to cover the opening on the front side. When the circuit board 3 is mounted on the surface of the dielectric substrate 2, a high-frequency circuit is formed on the back surface of the circuit board 3 facing the hollow portions 24a and 24b. This second
In the embodiment, since the central portion of the back surface of the circuit board 3 abuts on the narrow portion of the dielectric substrate 2, the circuit formation region on the back surface of the circuit board 3 depends on the portion of the thin portion of the dielectric substrate 2 which abuts. It is divided into two. In the second embodiment, a receiving circuit 13 that is a high-frequency circuit is formed in one circuit forming area, and a transmitting circuit 14 that is a high-frequency circuit is formed in the other circuit forming area.

A ground electrode 11 is formed on the surface of the circuit board 3. In the second embodiment, the ground connection pattern 16
A through hole 25 is formed in the center of the circuit board 3 to connect the ground connection pattern 16 to the ground electrode 11 on the surface of the circuit board 3.

The configuration other than the above is substantially the same as that of the first embodiment. In the configuration of the second embodiment, the first
The same effect as that of the embodiment can be obtained.

In the structure of the second embodiment as well, when the antenna-integrated high-frequency circuit module 1 is mounted on the mounting substrate 15, the surface of the mounting substrate 15 facing the hollow portions 24a and 24b is provided. , A space in which a circuit can be formed is generated.
A circuit such as an F circuit or a baseband circuit may be provided.

The present invention is not limited to the first and second embodiments, but can take various embodiments. For example, in each of the first and second embodiments, the circuit board 3 is provided on the surface of the dielectric substrate 2 so as to cover the through-hole 10 which is a through-hole and the opening on the surface side of the hollows 24a and 24b. Although mounted, for example, as shown in the cross-sectional view of FIG. 6, the circuit board 3 may be configured to be fitted inside the through hole 10 and the hollow portions 24a and 24b. When a plurality of penetrating portions are provided as in the second embodiment, when a circuit board is fitted into these penetrating portions, the number of circuit boards is plural.

In the first and second embodiments, the ground electrode 11 is formed on the surface of the circuit board 3, and the wiring pattern and components constituting the high-frequency circuit are provided on the back of the circuit board 3. Conversely, a wiring pattern and components may be provided on the front surface of the circuit board 3 and the ground electrode 11 may be formed on the back surface of the circuit board 3. Furthermore, the circuit board 3 may be a multilayer board, the ground electrode 11 may be formed on an intermediate layer of the circuit board 3, and a wiring pattern and components may be provided on both front and back surfaces of the circuit board 3.

Further, in each of the first and second embodiments,
Although the dielectric substrate 2 has a rectangular parallelepiped shape, as shown in FIG. 7, the dielectric substrate 2 may have a cylindrical shape, and the shape of the dielectric substrate 2 is not particularly limited. FIG.
(A) is an antenna-integrated high-frequency circuit module 1 of FIG.
8 (b) shows the front side of the circuit board 3 of the antenna integrated high-frequency circuit module 1 of FIG. 7, and FIG. 8 (c) shows the back side of the circuit board 3. Represents. 7 and 8, the same components as those of the first and second embodiments are denoted by the same reference numerals.

Further, in each of the first and second embodiments,
One of the microstrip antennas 6 and 7 forms a receiving antenna and the other forms a transmitting antenna. For example, both may be receiving antennas, or both may be receiving antennas. Both may be transmission antennas. Furthermore, microstrip antennas 6, 7
May be a transmitting / receiving antenna.

Further, in each of the first and second embodiments,
The circuit board 3 is provided with a reception circuit and a transmission circuit as high-frequency circuits. For example, only the reception circuit is formed on the circuit board 3 according to the type of the antenna provided on the dielectric substrate 2. Alternatively, only the transmission circuit may be formed.

Further, in each of the first and second embodiments,
Although two microstrip antennas 6 and 7 are formed on the dielectric substrate 2, the number of antennas formed on the dielectric substrate 2 is not limited, and may be three or more. One may be sufficient. FIGS. 9 and 10 each show an example in which one antenna is provided.
9 and 10, (a) is a perspective view,
(B) is an exploded view of the antenna-integrated high-frequency circuit module 1 shown in (a), and in (b), the circuit board 3 is shown in an upside down posture.

Further, in each of the first and second embodiments,
Although the radiation electrodes 4 and 5 are square, the shapes of the radiation electrodes 4 and 5 are not particularly limited, and may be other shapes such as a meander shape or a circular shape. Further, in the first embodiment, one through hole 10 is formed as a through portion,
In the second embodiment, two hollow portions 24a and 24b are formed as the penetrating portions. However, the shape and number of the penetrating portions formed on the dielectric substrate 2 are the first and second. The present invention is not limited to the above embodiment, and may be appropriately set in consideration of, for example, the strength of the dielectric substrate 2 and the arrangement of components and wiring patterns of a high-frequency circuit formed on the circuit board 3. Things.

Further, in each of the first and second embodiments,
The circuit board 3 is made of a dielectric material having a relative permittivity lower than the relative permittivity of the dielectric substrate 2, but the circuit board 3 is made of a dielectric material having the same relative permittivity as that of the dielectric substrate 2. It may be made of a material. Further, in each of the first and second embodiments, the dielectric substrate 2 is made of a dielectric material having a relative permittivity of 10 or more. However, for example, the size of the dielectric substrate 2 is loosely regulated. When the dielectric substrate 2 can be formed slightly larger, for example, the dielectric substrate 2 may be made of a dielectric material having a relative permittivity of less than 10.

Further, in the first and second embodiments, the ground connection pattern 1 formed on the dielectric substrate 2 is used.
6 and the circuit connection pattern 17 are formed from the surface of the dielectric substrate 2 to the bottom surface via the side surfaces.
The patterns 16 and 17 are not formed on the side surface of the dielectric substrate 2, and the patterns 16 and 17 formed on the surface of the dielectric substrate 2 and the bottom surface of the dielectric substrate 2 are formed as shown in FIG. The patterned patterns 16 and 17 may be connected by through holes 26 formed inside the dielectric substrate 2.

[0043]

According to the present invention, the radiation electrode forming the antenna is formed on the dielectric substrate, and the high-frequency circuit is formed on the circuit board. That is, the radiation electrode and the high frequency circuit are formed on different dielectrics. For this reason, the thickness of the dielectric substrate on which the radiation electrode is formed can be set to an appropriate thickness in consideration of the improvement of the antenna characteristics without substantially considering the high-frequency circuit. Further, the thickness of the circuit board on which the high-frequency circuit is formed can be set to an appropriate thickness in consideration of suppression of electromagnetic radiation from the circuit without substantially considering the antenna. For this reason, it is possible to provide an antenna-integrated high-frequency circuit module having both good antenna efficiency and good circuit efficiency.

Further, by forming the dielectric substrate from a high dielectric material having a relative dielectric constant of, for example, 10 or more, the radiation electrode can be reduced due to the wavelength shortening effect of the high dielectric constant. In addition, since the appropriate thickness of the dielectric substrate for improving the radiation efficiency by the high dielectric constant is reduced, the thickness of the dielectric substrate can be reduced. This makes it easy to reduce the size and thickness of the antenna-integrated high-frequency circuit module.

Further, by providing the structure of the present invention, for example, in a manufacturing process, a radiation electrode or the like is formed on a dielectric substrate, and after forming a high-frequency circuit on a circuit board, the dielectric substrate and the circuit board are formed. Are connected to form an antenna-integrated high-frequency circuit module. Since forming a high-frequency circuit on a circuit board is easier than forming a high-frequency circuit on a dielectric substrate,
Productivity can be increased. Further, according to the present invention, the dielectric base is formed with a penetrating portion instead of a concave portion. Since the formation of the penetrating portion in the dielectric substrate is easier than the formation of the concave portion, the productivity of the dielectric substrate can be improved as compared with the case where the concave portion is formed in the dielectric substrate. This also contributes to increasing the productivity of the antenna-integrated high-frequency circuit module.

Further, since the above-described manufacturing process can be adopted, the antenna formed on the dielectric substrate and the high-frequency circuit of the circuit substrate must be separated before connecting the dielectric substrate and the circuit substrate. Inspection is possible. For this reason, it is possible to individually select a defect between the antenna and the high-frequency circuit. This can prevent the following problems. For example, when the inspection is performed after the antenna and the high-frequency circuit are connected, if one of the antenna and the high-frequency circuit is good, and if the other is bad, both the antenna and the high-frequency circuit are defective. The problem is that the better one is wasted.

According to the configuration of the present invention, the antenna and the high-frequency circuit can be inspected separately, so that the problem that the antenna is treated as defective despite being good can be avoided. Can be eliminated.

Further, according to the present invention, since the through-hole is formed in the dielectric base portion where the high-frequency circuit is to be disposed, for example, the antenna is placed on the mounting substrate with the bottom surface of the dielectric base facing the mounting substrate. When the body-type high-frequency circuit module is mounted, a space in which components can be mounted is formed in a surface region of the mounting substrate facing the through portion of the dielectric substrate. For this reason, by forming a circuit in the space of the mounting board by the penetrating portion, the mounting density of the mounting board can be improved.

Further, in the case where a plurality of radiation electrodes are formed separately from each other on the dielectric substrate, and the circuit board is disposed between the radiation electrodes, the circuit substrate is thinner than the dielectric substrate. The ground electrode to be formed is arranged at the same height as the height of the radiation electrode. Therefore, the effect of suppressing the coupling between the radiation electrodes by the ground electrode of the circuit board is increased. Thus, the distance between the radiation electrodes can be reduced while preventing antenna interference, as compared with a case where the circuit board is not disposed between the plurality of radiation electrodes. Therefore, the configuration of the present invention is very effective for downsizing an antenna-integrated high-frequency circuit module having a plurality of antennas.

Further, in the manufacturing process, since a plurality of radiation electrodes can be simultaneously formed on the dielectric substrate, the distance between the radiation electrodes can be made constant. For example, if the spacing between the radiation electrodes varies from product to product, the variation in the spacing causes variations in the interaction between antennas, resulting in a large characteristic deviation between products. On the other hand, according to the present invention, since the variation in the interval between the radiation electrodes can be suppressed, such a characteristic deviation between products can be suppressed to a small value. Therefore,
The reliability of the performance of the antenna-integrated high-frequency circuit module can be improved.

Further, when a plurality of radiation electrodes are formed on the dielectric substrate, a gap for suppressing mutual interference between antennas is indispensable between the radiation electrodes. Since the high-frequency circuit is arranged in an indispensable space, the space between the radiation electrodes is not wasted and can be effectively used.

Further, in the case where a wiring pattern or a component constituting a high-frequency circuit is formed on the back surface of the circuit board, the component on the back surface of the circuit board is accommodated and arranged inside the through portion of the dielectric substrate. Can protect the components, and since the components do not protrude upward,
The thickness of the antenna-integrated high-frequency circuit module can be reduced.

Further, the circuit board is a multilayer board,
In the case where the ground electrode is formed on the intermediate layer of the circuit board and the components and wiring patterns that constitute the high-frequency circuit are formed on both the front and back surfaces of the circuit board, it is possible to effectively use both the front and back surfaces of the circuit board it can.

Further, when the dielectric substrate is made of a dielectric material having a relative dielectric constant higher than that of the circuit board, as described above, the dielectric substrate has a high dielectric constant. In addition, the radiation efficiency of the antenna can be increased, and the size and thickness of the dielectric substrate can be reduced. Further, by making the relative permittivity of the circuit board lower than that of the dielectric substrate, the parasitic component of the wiring pattern formed on the circuit board can be reduced. As a result, the loss due to the parasitic component of the high-frequency circuit formed on the circuit board can be suppressed, and the circuit efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an antenna-integrated high-frequency circuit module according to a first embodiment.

FIG. 2 is an exploded view of the antenna-integrated high-frequency circuit module according to the first embodiment.

FIG. 3 is a schematic sectional view taken along the line AA of FIG. 1;

FIG. 4 is a perspective view schematically showing an antenna-integrated high-frequency circuit module according to a second embodiment.

FIG. 5 is an exploded view of an antenna-integrated high-frequency circuit module according to a second embodiment.

FIG. 6 is a schematic sectional view showing another embodiment of the antenna-integrated high-frequency circuit module according to the present invention.

FIG. 7 is a perspective view showing an example of an embodiment of an antenna-integrated high-frequency circuit module in a case where a dielectric substrate has a cylindrical shape.

8 is an exploded view of the antenna integrated high-frequency circuit module of FIG. 7;

FIG. 9 is a diagram for explaining an example of an embodiment of an antenna-integrated high-frequency circuit module when there is one radiation electrode.

FIG. 10 is a view for explaining another embodiment of the antenna-integrated high-frequency circuit module when the number of radiation electrodes is one;

FIG. 11 is a view for explaining another embodiment of the antenna-integrated high-frequency circuit module according to the present invention.

FIG. 12 is a diagram for explaining a conventional example of an antenna-integrated high-frequency circuit module.

[Explanation of symbols]

1 High frequency circuit module with integrated antenna 2 Dielectric substrate 3 circuit board 4,5 radiation electrode 10 Through hole 13 Receiver circuit 14 Transmission circuit 24a, 24b hollow

Continuation of front page    (72) Inventor Ken Okada             Stock, 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto             Murata Manufacturing Co., Ltd. (72) Inventor Atsushi Yuasa             Stock, 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto             Murata Manufacturing Co., Ltd. (72) Inventor Yasuaki Saito             Stock, 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto             Murata Manufacturing Co., Ltd. (72) Inventor Kazuya Kawabata             Stock, 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto             Murata Manufacturing Co., Ltd. F term (reference) 5J021 AA02 AB06 CA06 FA26 FA32                       GA03 HA10 JA07 JA08                 5J045 AA05 AA21 AB05 DA10 EA08                       HA03 JA11 LA07 MA07                 5J046 AA04 AA07 AA19 AB13 PA07                       UA02 UA03

Claims (5)

[Claims] 1. An antenna-integrated high-frequency circuit module in which an antenna and a high-frequency circuit connected to the antenna are integrated, a dielectric base is provided, and an antenna is formed on a surface of the dielectric base. A radiation electrode is formed, and a penetrating portion penetrating from the surface to the bottom is formed in the dielectric substrate portion avoiding the radiation electrode formation region,
A circuit board that covers the opening on the surface side of the penetrating part is fitted into the penetrating part or mounted on the surface of the dielectric base of the penetrating part, and the circuit board is made of a dielectric thinner than the dielectric base. An antenna-integrated high-frequency circuit module, comprising a high-frequency circuit formed on the circuit board. 2. A plurality of radiation electrodes are separately formed on the surface of the dielectric substrate, and a through portion is formed in a portion of the dielectric substrate between these radiation electrode forming regions. 2. The antenna integrated high frequency circuit module according to claim 1, wherein a high frequency circuit formed on the circuit board is arranged. A ground electrode is formed on the front side of the circuit board, and a wiring pattern and components constituting a high-frequency circuit are provided on the back side of the circuit board. 3. The antenna-integrated high-frequency circuit module according to claim 1, wherein the antenna-integrated high-frequency circuit module is accommodated and arranged in a through portion of the base. 4. The circuit board is a multi-layer board, a ground electrode is formed on an intermediate layer of the circuit board, and wiring patterns and components constituting a high-frequency circuit are provided on both front and back surfaces of the circuit board. The antenna-integrated high-frequency circuit module according to claim 1 or 2, wherein 5. The dielectric substrate according to claim 1, wherein the dielectric substrate is made of a dielectric material having a relative dielectric constant higher than that of the circuit board. Antenna integrated high frequency circuit module.