JP4186166B2 - High frequency circuit module and communication device - Google Patents

Description

  The present invention relates to a module and a communication device using a high-frequency circuit such as a monolithic high-frequency integrated circuit or a hybrid microwave integrated circuit in which circuit elements are mounted on a circuit substrate provided with a dielectric.

  Conventionally, there is a high-frequency integrated circuit module on which a circuit element such as an active element such as a transistor or a diode, a passive element such as a resistor or an inductor, and a wiring that interconnects them are mounted. When high-frequency integrated circuit modules are connected to each other, a highly shielded transmission line such as a coaxial line is often used between the transmission and reception terminals.

  FIG. 16A is a perspective view conceptually showing the vicinity of a transmission / reception terminal of a conventional high-frequency integrated circuit module. FIG.16 (b) is sectional drawing of the coaxial line direction of Fig.16 (a). In FIG. 16B, a high-frequency integrated circuit on which a multilayer circuit board 2001 is mounted, in which an inner conductor 2002 on which circuit elements are mounted is sandwiched between first and second grounds 2003 and 2004 to form a strip line 2005. Shows the module.

  The inner conductor 2002 is led via a via (through hole) 2006 to a pad 2007 which is a transmission / reception terminal having a certain area provided in the uppermost layer or the lowermost layer, and the central conductor 2009 of the coaxial line 2008 is connected to the pad 2007. The adhesive is fixed by solder 2010. Further, the first and second grounds 2003 and 2004 are electrically connected by a via 2011, and the outer conductor 2012 of the coaxial line 2008 is bonded and fixed to the first ground 2003 by solder 2013.

  The high-frequency integrated circuit module configured as described above can input and output high-frequency signals in a state where circuit elements and the like are integrated.

  However, in the conventional high-frequency integrated circuit module, since the central conductor of the coaxial line to be shielded is exposed at the connection portion with the pad, the central conductor is mounted in the vicinity of the circuit element, wiring, etc. It is easy to be affected by electromagnetic waves emitted from the outside or external electromagnetic noise.

  Further, for example, the central conductor of the coaxial line may be pulled from the outside and the multilayer circuit board may be bent, or stress may be applied from the enclosed cabinet to the coaxial line. In this case, the solder may be peeled off from the pad or the ground, or the metal pattern may be peeled off from the multilayer circuit board, resulting in disconnection and poor connection, which may deteriorate the electrical connection state.

  Further, there is a problem that providing a via for connecting the inner conductor increases unnecessary inductance components and degrades high frequency characteristics. In addition, since the central conductor and the inner conductor of the coaxial line are not three-dimensionally connected linearly, the electromagnetic field in the vicinity of the via may be disturbed and the transmission characteristics of the high-frequency signal may deteriorate.

  Therefore, an object of the present invention is to provide a high-frequency integrated circuit module and a communication device equipped with a high-frequency integrated circuit that is not easily affected by electromagnetic waves and does not deteriorate the electrical connection state.

In order to solve the above problems, the present invention has a multilayer circuit base comprising a dielectric and an inner conductor sandwiched between the dielectrics, and a coaxial line electrically connected to the inner conductor, In the high-frequency circuit module in which the circuit element connected to the inner conductor is mounted on the multilayer circuit substrate, by removing a part of the dielectric, a first exposed portion where an end portion of the inner conductor is exposed; A second exposed portion on which the coaxial line electrically connected to the exposed end portion of the inner conductor is placed on an exposed surface;
A step is provided between the exposed surface of the first exposed portion and the exposed surface of the second exposed portion, and the exposed end portion of the inner conductor and the center of the coaxial line are exposed at the first exposed portion. The conductor is electrically connected.

  In the present invention, it is desirable that the first exposed portion is provided at a position that is not easily affected by electromagnetic waves from the circuit element. Moreover, it is desirable to cover the connection part of the exposed end part of the inner conductor and the central conductor of the coaxial line with a conductive case provided with a hole through which the coaxial line can be taken out. Furthermore, the inner conductor is preferably formed in a tapered shape toward a connection portion between the exposed end portion of the inner conductor and the central conductor of the coaxial line. The dielectric may be ceramic or alumina.

Further, it is desirable that a part of the exposed surface of the second exposed portion is a ground surface, and the outer conductor of the coaxial line is electrically connected to the ground. Furthermore, the distance between the conductive case and the exposed end portion of the inner conductor and the connection portion of the central conductor of the coaxial line is changed, or the first exposed portion is sandwiched between the connection portion of the inner conductor and the coaxial line. It is also desirable to match the characteristic impedance at the connecting portion by changing the thickness of the dielectric of the multilayer circuit substrate facing the portion.
The high-frequency circuit module according to the present invention includes a multilayer circuit base including a dielectric and an inner conductor sandwiched between the dielectrics, and a coaxial line electrically connected to the inner conductor. In a high-frequency circuit module for mounting a circuit element connected to the inner conductor on a circuit substrate,
By removing a part of the dielectric, an exposed portion in which an end portion of the inner conductor is exposed is provided at an end portion of the multilayer circuit base, and the exposed portion is coaxial with the exposed end portion of the inner conductor. The center conductor of the track is electrically connected,
A conductor case that includes a hole that penetrates the coaxial line and that covers at least a connection portion between the exposed end portion of the inner conductor and the central conductor of the coaxial line;
The conductor case is electrically connected to the outer conductor of the coaxial line in the hole and electrically connected to a conductor sandwiching the dielectric of the multilayer circuit base,
The distance between the conductive case and the connection portion matches the characteristic impedance of the connection portion, the characteristic impedance of the coaxial line, and the characteristic impedance of the strip line having the inner conductor sandwiched between the dielectrics. It is set as follows.
The communication device of the present invention is characterized in that the high-frequency circuit module is mounted on a high-frequency signal processing unit.

  In the high-frequency circuit module of the present invention, the multilayer circuit base is composed of at least three layers including the first layer to the Nth (N ≧ 3) layer, and the inner conductor provided in any one of the inner layers, In the strip line sandwiched between the first and second grounds, an exposure formed by removing a dielectric layer, a metal layer, or the like on one of the upper and lower sides of the inner conductor at the end of the strip line The strip line and the coaxial line have the same characteristic impedance by connecting the central conductor of the coaxial line to the inner conductor exposed at the bottom of the exposed part in a straight line.

  ADVANTAGE OF THE INVENTION According to this invention, the transmission characteristic of the connection part of the inner conductor in a multilayer circuit board and a coaxial line can be improved, reflection loss and radiation loss can be reduced, and highly reliable signal transmission can be performed. Also, by providing a step between the exposed surface of the first exposed portion and the exposed surface of the second exposed portion, the exposed end portion of the inner conductor and the central conductor of the coaxial line are linearly connected. Can be. In addition, shielding performance at the connection between the inner conductor and the coaxial line can be improved, unnecessary electromagnetic waves are not emitted to the surroundings, interference with surrounding electromagnetic noise is suppressed, and reliable signal transmission is achieved. It can be carried out.

  In addition, the mechanical strength at the connection part between the inner conductor and the coaxial line in the multilayer circuit board can be increased, and the disconnection, connection failure, signal deterioration, etc. caused by the deformation of the connection part are prevented, and the reliability is high. Signal transmission can be performed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 1 of the present invention. FIG.1 (b) is sectional drawing of the coaxial line direction of Fig.1 (a). FIG. 1B shows, for example, a two-layer structure in which a strip line 105 formed by sandwiching an inner conductor 102, which is a conductor line, with a dielectric provided with first and second grounds 103 and 104 is formed. 1 shows a high-frequency integrated circuit module on which a multilayer circuit board 101 is mounted.

  A cavity-shaped exposed connection portion 106 is provided on the first ground 103 side of the multilayer circuit board 101. The exposed connection portion 106 is not provided with a dielectric layer, a metal layer, or the like, and the exposed portion of the central conductor 108 of the semi-rigid coaxial line (hereinafter referred to as “coaxial line”) 107 is mounted on the periphery. It is formed so as not to be affected by electromagnetic waves generated from the circuit elements.

  Although FIG. 1 shows a state in which the square exposed connecting portion 106 is formed, it may be formed, for example, in a round shape, and the shape is not limited to a square. The exposed connecting portion 106 can be formed by, for example, etching or mechanically cutting.

  In other words, the exposed connection portion 106 is provided at a position where the exposed portion of the central conductor 108 of the coaxial line 107 is not affected by electromagnetic waves generated from circuit elements mounted around the coaxial line 107. There, the exposed central conductor 108 and the exposed portion 109 of the inner conductor 102 are bonded and fixed using solder 110 so that they are substantially linear.

  Further, the first ground 103 and the second ground 104 are electrically connected by a via 111 provided in the vicinity of the end of the strip line 105. Further, the outer conductor 112 is bonded and fixed to the first ground 103 with solder 113. Incidentally, the solders 110 and 113 may contain lead or may not contain lead.

  The dielectric may be ceramic or alumina, but here the ceramic is used. The dielectric has a relative dielectric constant of 7.1, for example, and the dielectric has a thickness of the first and second ground sides. For example, 0.12 mm. Further, the width and thickness of the inner conductor 102 are, for example, 0.05 mm and 0.01 mm, respectively. Thus, the characteristic impedance of the exposed connection portion 106 is set to about 50Ω, which is the characteristic impedance of the strip line 105 and the coaxial line 107.

  By the way, the use of ceramic as the dielectric material increases the manufacturing accuracy and improves the reliability of the transmission characteristics especially in the high frequency band of the GHz order, compared with the FR4 multilayer circuit board that is generally widely used. it can.

  By the way, the exposed portion 109 is made large enough to bond the central conductor 108 of the coaxial line 107, which is a transmission line, and the exposed portion 109 with the solder 110, and the inner conductor 102 is shown in FIG. As shown, it is preferably formed in a tapered shape toward the exposed portion 109.

  FIG. 11 is a top view conceptually showing the vicinity of the exposed connection portion of the inner conductor 102. This is because, in general, a line whose conductor width changes abruptly is difficult to achieve matching in a high frequency band, and thus unnecessary reflection or the like may occur, which may cause deterioration in high frequency reflection characteristics.

  Specifically, for example, when the width of the inner conductor 102 is about 0.1 mm, the width is gradually increased from the position of about 1.5 mm from the exposed portion 109, and the width of the exposed portion 109 becomes about 0.5 mm. I am doing so. When the width of the inner conductor 102 is wider than the exposed portion 109, the width of the inner conductor 102 may be gradually narrowed from the position of about 1.5 mm from the exposed portion 109 to be tapered.

  In the present embodiment, the exposed connection portion 106 is provided so that a circuit element is not formed in the vicinity of the central conductor 108 of the coaxial line 107 so that the exposed portion of the central conductor 108 is hardly affected by electromagnetic waves. Moreover, since the solder 110 is provided in the exposed connection part 106, the situation where it peels off by applying a force from the outside is eliminated.

  Further, since the inner conductor 102 and the center conductor 108 of the coaxial line 107 are fixed so as to be linear, the center conductor 108 can be conducted to the end of the inner conductor 102. Further, since the inner conductor 102 and the central conductor 108 of the coaxial line 107 are directly connected, a high frequency integrated circuit module can be configured without impeding impedance matching.

  In the present embodiment, the outer conductor 112 and the first ground 103 are bonded at three locations by the solder 113, so that they can be directly and firmly connected.

(Embodiment 2)
FIG. 2A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 2 of the present invention. FIG. 2B is a cross-sectional view in the direction of the coaxial line in FIG. In FIG. 2, reference numeral 204 denotes an exposed connection portion provided to make it difficult to structurally apply a load to the coaxial line 107. In FIG. 2, the same parts as those shown in FIG.

  In the present embodiment, the step between the exposed connecting portion 106 and the exposed connecting portion 204 is, for example, the radius of the outer conductor 112. As a result, stress due to bending of the coaxial line 107 is eliminated, and consequently, the load applied to the solder 113 can be reduced, and the solder 113 can be made difficult to peel from the first ground 103. Therefore, it is possible to prevent the electrical connection state from further deteriorating as compared with the high-frequency integrated circuit module shown in FIG. 1, and the reliability of microwave transmission characteristics is also improved.

(Embodiment 3)
FIG. 3A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 3 of the present invention. FIG.3 (b) is sectional drawing of the coaxial line direction of Fig.3 (a). In the present embodiment, a multilayer circuit board 301 having a five-layer structure is used.

  In FIG. 3, reference numerals 307, 308 and 311 denote third to fifth grounds, and 309 provides two-dimensionally high density to connect the first, third, second and fourth grounds. Vias 317 are solders that connect the outer conductor 112 and the fifth ground 311.

  In FIG. 3, the same parts as those shown in FIG. In this embodiment, the case where the fifth ground 311 is provided has been described as an example. However, the outer conductor 112 and the second ground 104 may be directly connected by the solder 317.

  As in the present embodiment, for example, even when a multi-layer circuit board 301 having a five-layer structure is used, the electrical connection state can be prevented from being deteriorated, and the reliability of microwave transmission characteristics is also improved, as in the second embodiment. improves.

(Embodiment 4)
FIG. 4A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 4 of the present invention. FIG. 4B is a cross-sectional view in the direction of the coaxial line in FIG. FIG.4 (c) is sectional drawing in the AA 'surface of FIG.4 (b). FIG. 4D is a cross-sectional view taken along the plane BB ′ of FIG. In FIG. 4, reference numeral 403 denotes an end portion of the multilayer circuit board 301. In FIG. 4, the same parts as those shown in FIG.

  In the present embodiment, the side surface of the exposed connection portion 204 is provided so as to be positioned at the end portion 403 of the multilayer circuit board 301, and the central conductor 108 and the inner conductor 102 of the coaxial line 107 are exposed at the end portion 403 of the high-frequency integrated circuit module. Part 109 is connected. Accordingly, the coaxial line 107 is not bent, and the load applied to the solder 113 can be further reduced as compared with the high-frequency integrated circuit module shown in FIG.

  In the high-frequency integrated circuit module shown in FIGS. 1 to 3, the exposed connection portion 106 may be formed at the end of the high-frequency integrated circuit module.

(Embodiment 5)
FIG. 5A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 5 of the present invention. FIG.5 (b) is sectional drawing of the coaxial line direction of Fig.5 (a). FIG.5 (c) is sectional drawing in the AA 'surface of FIG.5 (b). FIG.5 (d) is sectional drawing in the BB 'surface of FIG.5 (b). FIG.5 (e) is sectional drawing in CC 'surface of FIG.5 (b).

  In FIG. 5, reference numeral 505 denotes a cutout of the end 403. In FIG. 5, the same parts as those shown in FIG. In the present embodiment, by providing the notch 505, the fourth ground 308 and the outer conductor 112 can be fixed with the solder 317 as shown in FIG. 5C, and the high-frequency integration shown in FIG. A mechanically stronger connection than that of the circuit module can be achieved.

(Embodiment 6)
FIG. 6A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 6 of the present invention. FIG. 6B is a cross-sectional view in the direction of the coaxial line in FIG. In the present embodiment, the width W of the multilayer circuit board 301 and the width of the exposed connection portions 106 and 204 are made to coincide. In FIG. 6, the same parts as those shown in FIG. Incidentally, the width W is, for example, about 2 mm here.

  When the exposed connection portions 106 and 204 of the high-frequency integrated circuit module as shown in FIG. 6 are formed by mechanical cutting, it is easier than the exposed connection portion 106 and the like shown in FIGS.

(Embodiment 7)
FIG. 7A is a perspective view of the metal case made of copper or the like as a conductor covering the vicinity of the high-frequency integrated circuit module shown in FIG. 5 and its transmission / reception terminal. FIG.7 (b) is sectional drawing of the coaxial line direction of Fig.7 (a). FIG. 7C is a diagram showing a state in which the metal case 701 is mounted on the high frequency integrated circuit module from the state of FIG. 7A and these are bonded and fixed by soldering.

  In FIG. 7, a metal case 701 includes two parallel metal flat plates 702 and a metal flat plate 709 provided with a hole 711 through which the coaxial line 107 passes. The interval between the two metal flat plates 702 is a multilayer. The thickness is approximately the same as the thickness of the circuit board 301. Further, the width of the metal flat plate 702 is larger than the width of the exposed connection portions 106 and 204. It should be noted that a conductive resin such as a conductive plastic other than metal or a resin whose surface is metal-plated can be used as the case 701. Incidentally, in FIG. 7, the same parts as those shown in FIG.

  As shown in FIG. 7C, in the present embodiment, the coaxial case 107 is passed through the hole 711, and then the metal case 701 is attached to the high-frequency integrated circuit module, and the third and fourth grounds 307 and 308 and the metal are attached. The flat plate 702 is bonded and fixed with solder 708, and the coaxial line 107 and the hole 711 are bonded and fixed with solder 713.

  As a result, since the coaxial line 107 is fixed to the metal case 701, it is difficult for the force to be directly transmitted to the solders 110 and 113 when a force is applied from the outside to the cabinet containing the high-frequency integrated circuit module. 110, 113 and the metal pattern are difficult to peel off.

  Furthermore, the metal case 701 electromagnetically shields the inner conductor 102 and the central conductor 108 of the coaxial line 107, so that the high-frequency signal is less likely to receive electromagnetic noise from the outside, and is difficult to give electromagnetic noise to the outside. can do. Furthermore, it does not contact the central conductor 108 of the coaxial line 107 where fine powder or the like is exposed.

  In FIG. 7, the metal case 701 has a U-shape. However, as shown in FIG. 8, it may have a bowl shape, and as shown in FIG. You may combine this and the bowl-shaped metal case 701 using what was shown. Incidentally, the metal case 701 shown in FIG. 7 is suitable when the width of the high-frequency integrated circuit module is long.

  On the other hand, since the metal case 701 shown in FIGS. 8 and 9 can surround the exposed portion 109 and the central conductor 108 of the coaxial line 107, the metal case 701 can be surrounded from the outside more than when the metal case 701 shown in FIG. 7 is used. It is possible to make it difficult to receive electromagnetic noise and to make it difficult to give electromagnetic noise to the outside.

  Also, the high frequency integrated circuit module shown in FIGS. 1 to 6 may be configured to be covered with the metal case 701.

(Embodiment 8)
FIG. 10 is a perspective view showing a state in which the upper part of the exposed connection portion 106 of the high-frequency integrated circuit module shown in FIG. The metal flat plate 901 is provided with a hole 905 having a diameter approximately the same as the outer diameter of the coaxial line 107. Further, the metal flat plate 901 and the high frequency integrated circuit module are bonded and fixed with solder 907.

  According to the present embodiment, as in the seventh embodiment, it is possible to ensure good conduction between the first and second grounds 103 and 104 and the outer conductor 112. Further, it is possible to make it difficult to receive electromagnetic noise from the outside.

  Note that the high-frequency integrated circuit module shown in FIGS. 1 to 6 may be configured to be covered with the metal flat plate 901.

(Embodiment 9)
FIG. 12A is a perspective view conceptually showing the high-frequency integrated circuit module according to Embodiment 9 of the present invention. FIG.12 (b) is sectional drawing of the coaxial line direction of Fig.12 (a). In the present embodiment, a method for setting the characteristic impedance of the normally used strip line 105 and coaxial line 107 to about 50Ω will be described.

  As described in the first embodiment, the characteristic impedance of the strip line 105 can be adjusted by changing the relative permittivity and thickness of the dielectric and the width and thickness of the inner conductor 102.

  However, since there is a case where the thickness of the dielectric cannot be changed due to a request for miniaturization of the high-frequency integrated circuit module, the characteristic impedance in the section 1102 where the exposed connection portion 106 exists is the characteristic of the strip line 105 and the coaxial line 107. The second ground 104 in the section 1102 is removed so as to be equal to the impedance, and the width of the inner conductor 102 and the thickness of the dielectric in contact with the inner conductor in the section 1102 are changed.

  For this reason, in this embodiment, even when the thickness of the dielectric cannot be changed, the characteristic impedances of the strip line 105 and the coaxial line 107 can be matched, and impedance matching at the design stage is easy. Become. In addition, the distributed constant design of each ground is facilitated. Thereby, unnecessary reflection and radiation can be suppressed, and the reliability of transmission characteristics can be improved.

(Embodiment 10)
FIG. 13 is a perspective view of a metal case made of copper or the like covering the high-frequency integrated circuit module shown in FIG. FIG.13 (b) is sectional drawing of the coaxial line direction of Fig.13 (a). FIG. 13C is a diagram showing a state in which the metal case 1201 is attached to the high frequency integrated circuit module from the state of FIG. 13A and these are bonded and fixed by soldering.

  In the present embodiment, the shape of the metal case 1201 is different from that of the metal case 701 shown in FIG. 7, for example. Even if the thickness of the dielectric cannot be changed by adjusting the distance between the metal flat plate 1216 of the metal case 1201 and the strip line 105 and the coaxial line 107, as in the ninth embodiment. This is because the characteristic impedances of the strip line 105 and the coaxial line 107 can be matched.

  Next, the principle of matching the characteristic impedances of the strip line 105 and the coaxial line 107 by using the metal case 1201 will be described. First, the transmission mode in the section where the exposed connection portion 106 exists is considered to be a quasi-TEM (transverse electro-magnetic) mode, and the characteristic impedance changes depending on the following parameters.

  That is, the characteristic impedance changes by changing any of the width of the exposed portion 109, the thickness of the dielectric, and the interval between the exposed portion 109 and the metal case 701. The method for obtaining the characteristic impedance when these parameters are changed is shown below.

  FIG. 14 is a cross-sectional view in a section where the exposed connection portion 106 exists. In FIG. 14, w is the width of the exposed portion 109, h is the thickness of the dielectric, and s is the distance between the exposed portion 109 and the metal case 1201. FIG. 15A is a graph of the normalized characteristic impedance Z0 with respect to the width w of the exposed portion 109 / the thickness h of the dielectric. FIG. 15B is a graph of the normalized characteristic impedance Z0 with respect to the distance s between the exposed portion 109 and the metal case 1201 / the thickness h of the dielectric.

  It can be seen that by changing any of the three parameters w, h, and s shown in FIG. 14, the characteristic impedance can be matched as shown in FIGS. 15 (a) and 15 (b). Further, as shown in FIG. 15A, for example, when [w / h≈0.6], the characteristic impedance Z0 becomes 1, and as shown in FIG. 15B, for example, [s / h≈0. .9], the characteristic impedance Z0 is 1.

  Note that the normalized characteristic impedance Z0 is normalized with a certain value, and it is considered that the basic mode of the transmission line having a cross section as shown in FIG. 14 is the quasi-TEM mode. What is necessary is just to obtain | require easily by analyzing a field with a commercially available electromagnetic field simulator.

  Here, as in the ninth embodiment, the second ground 104 is removed, and the width of the inner conductor 102 and the thickness of the dielectric in contact with the inner conductor in this section 1102 are changed. The characteristic impedance in the existing section 1102 is made equal to the characteristic impedance of the strip line 105 and the coaxial line 107. As a result, an optimum matching state can be achieved, unnecessary reflection or the like can be suppressed, and the reliability of the transmission characteristics can be improved.

  As described above, in each embodiment, the high-frequency integrated circuit in which the strip line is formed is described as an example. However, for example, if the metal 113 701 or the metal flat plate 901 covers the solder 113 or the like, the solder 113 or the like is hardly peeled off. Therefore, the present invention can also be applied to a high-frequency integrated circuit in which a coplanar line formed by sandwiching a high-frequency signal transmission line between grounds is formed.

  In addition, communication devices such as mobile phones and optical communication devices include a high-frequency signal processing unit that modulates audio signals and optical signals into high-frequency signals and transmits them to other communication devices. If the high-frequency integrated circuit module described in each embodiment is mounted on a high-frequency signal processing unit of a communication device, it is possible to provide a communication device that is not easily affected by electromagnetic waves and whose electrical connection state does not deteriorate.

It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 1 of this invention. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 2 of this invention. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 3 of this invention. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 4 of this invention. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 5 of this invention. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 6 of this invention. FIG. 6 is a perspective view and a cross-sectional view of the U-shaped metal case covering the high-frequency integrated circuit module shown in FIG. 5 and the vicinity of its transmission / reception terminal. FIG. 6 is a perspective view and a cross-sectional view of a bowl-shaped metal case covering the high-frequency integrated circuit module shown in FIG. 5 and the vicinity of its transmission / reception terminal. FIG. 7 is a perspective view and a sectional view of a bowl-shaped metal case covering the high-frequency integrated circuit module shown in FIG. 6 and the vicinity of its transmission / reception terminal. It is a perspective view which shows the state which covered the upper part of the exposed connection part of the high frequency integrated circuit module shown in FIG. 3 with the metal flat plate. It is a top view which shows a taper-shaped inner conductor. It is the perspective view and sectional drawing of the high frequency integrated circuit module of Embodiment 9 of this invention. It is the perspective view and sectional drawing of the metal case which covers the high frequency integrated circuit module shown in FIG. 12, and its transmission-and-reception terminal vicinity. It is sectional drawing in the area where an exposure connection part exists. It is a figure which shows the normalized characteristic impedance Z0 with respect to the width w of the exposed part / thickness h of the dielectric and the normalized characteristic impedance Z0 with respect to the distance s between the exposed part and the metal case / thickness h of the dielectric. It is the perspective view and sectional drawing of the transmission-and-reception terminal vicinity of the high frequency integrated circuit module of a prior art.

Explanation of symbols

101 multilayer circuit board 102 inner conductor 103 first ground 104 second ground 105 strip line 106, 204 exposed connection 107 coaxial line 108 central conductor 109 exposed 110, 113, 317 solder 111 via 112 outer conductor 307 third Ground 308 Fourth ground 309 Via 311 Fifth ground 403 End 505 Notch 701 Metal case 702 Metal flat plate 709 Metal flat plate 711 Hole

Claims (8)

A multilayer circuit board having a dielectric and an inner conductor sandwiched between the dielectrics, and a coaxial line electrically connected to the inner conductor, and connected to the inner conductor on the multilayer circuit board In a high-frequency circuit module for mounting circuit elements,
By removing a part of the dielectric, the first exposed portion where the end portion of the inner conductor is exposed, and the coaxial line electrically connected to the exposed end portion of the inner conductor on the exposed surface A second exposed portion to be placed;
A step is provided between the exposed surface of the first exposed portion and the exposed surface of the second exposed portion, and the exposed end portion of the inner conductor and the center of the coaxial line are exposed at the first exposed portion. A high-frequency circuit module, wherein the conductor is electrically connected. The high-frequency circuit module according to claim 1, wherein a conductive case provided with a hole through which the coaxial line can be taken out covers a connection portion between the exposed end portion of the inner conductor and the central conductor of the coaxial line. . 3. The high-frequency circuit module according to claim 1, wherein the inner conductor is formed in a tapered shape toward a connection portion between the exposed end portion of the inner conductor and a central conductor of the coaxial line. Said second portion of the exposed surface of the exposed portion to a surface of the ground, the outer conductor of the coaxial line to any one of claims 1 to 3, characterized in that it is electrically connected to the ground The high-frequency circuit module described. The interval between the exposed end portion of the inner conductor and the central conductor of the coaxial line and the conductive case on the connection portion is set so that the characteristic impedance in the connection portion matches. The high-frequency circuit module according to claim 2. By changing the thickness of the dielectric of the multilayer circuit substrate facing the first exposed portion across the connecting portion between the exposed end portion of the inner conductor and the central conductor of the coaxial line, the characteristic in the connecting portion high-frequency circuit module according to claim 1, any one of 5, characterized in that to match the impedance. The dielectric high-frequency circuit module according to any one of claims 1 6, characterized in that a ceramic or alumina. Communication equipment characterized by mounting a high-frequency circuit module according to the high frequency signal processing unit to any one of claims 1 to 7.

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