JP2006041017A - Electronic component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component assuring low resistance, heavier current and less variations in characteristics. <P>SOLUTION: A first groove 52 is formed to a first green sheet 42 by irradiating the upper surface 42a of the first green sheet 42 with the laser beam. A second groove 54 is formed to a second green sheet 46 by irradiating an upper surface 46a of the second green sheet 46 with the laser beam. A first electrode 24 is formed by filling the first groove 52 of the first green sheet 42 with a conductive paste, and a second electrode 26 is formed by filling the second groove 54 of the second green sheet 46 with the conductive paste. A laminate 62 is manufactured by providing in opposition the upper surface 42a of the first green sheet 42 and the upper surface 46a of the second green sheet 46, and then providing the third green sheet 50 between the first and second green sheets 42, 46. The laminate 62 is baked to manufacture an electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a dielectric substrate, an electronic component having a first electrode and a second electrode facing each other with a dielectric sandwiched in the dielectric substrate, and a method for manufacturing the electronic component.

  Recently, market demand for small-sized, high-current electronic components (particularly, couplers, baluns, etc.) has increased.

  In order to manufacture a small, high-current electronic component, it is necessary to reduce the conductor resistance. To lower the conductor resistance, there are (1) application of a low conductivity material and (2) enlargement of the conductor cross-sectional area (increase in conductor thickness, etc.). Among these, since it takes time to develop the low conductor material (such as superconducting material) of (1), it is common to cope with the expansion of the conductor sectional area of (2), for example, the increase of the conductor thickness. .

  By the way, in an electronic component configured by laminating dielectric layers on which conductors are formed, there are a screen printing method and a grooving hole filling method as methods for forming conductors on the dielectric layer.

  First, in the screen printing method, first, a ceramic green sheet is produced, and a conductor paste is formed on the ceramic green sheet by a screen printing method. Thereafter, a plurality of ceramic green sheets are laminated and pressure-bonded to produce a laminate, and the laminate is fired to obtain an electronic component.

  On the other hand, in the grooving hole filling method, first, a ceramic green sheet is produced. Thereafter, the ceramic green sheet is irradiated with, for example, laser light to form a groove, and the groove formed in the ceramic green sheet is filled with a conductive paste. And a some ceramic green sheet is laminated | stacked and crimped | bonded, a laminated body is produced, and it is set as an electronic component by baking this laminated body (for example, refer patent documents 1-3).

Japanese Patent Laid-Open No. 11-58343 Japanese Patent Laid-Open No. 10-41138 JP-A-6-275453

  However, in the screen printing method, when the thickness of the conductor to be formed is increased, for example, the upper dielectric layer is raised by the conductor even though the lower dielectric layer is flat. The laminated shape becomes asymmetric in the vertical direction. Therefore, internal stress is generated when the dielectric layer is laminated and pressure-bonded. (1) When the stacking direction is the Z-axis direction, stacking displacement occurs in the plane direction including the X-axis and the Y-axis when stacking and pressure-bonding. 2) There is a problem that delamination (delamination) occurs during firing of the laminate.

  On the other hand, in the grooving hole filling method, a galvano scan mirror is usually installed almost at the center of the ceramic green sheet, and laser light is scanned by the galvano scan mirror to perform grooving. For example, as shown in FIG. 19, a laser beam 104 is two-dimensionally scanned on the upper surface 102a of the ceramic green sheet 102 held by the carrier film 100 to form grooves 106 in the ceramic green sheet 102. is there. When the groove 106 is formed in the ceramic green sheet 102 by the laser beam 104, the shape of the groove 106 tends to be narrowed gradually in the depth direction. That is, the cross section is substantially trapezoidal.

  Then, in the conventional method for manufacturing an electronic component, first, as shown in FIG. 20, the upper surface 110a of the first ceramic green sheet 110 is irradiated with a laser beam to form a groove 112 on the upper surface 110a, Thereafter, the groove 112 is filled with a conductive paste to form the first electrode 114. On the other hand, as shown in FIG. 21, the upper surface 116a of the second ceramic green sheet 116 is irradiated with laser light to form a groove 118 in the upper surface 116a, and then the groove 118 is filled with a conductive paste. Thus, the second electrode 120 is obtained.

  Next, as shown in FIG. 22, the lower surface 110b of the first ceramic green sheet 110 is laminated on the upper surface 116a of the second ceramic green sheet 116 so as to face the second ceramic green sheet 116, and By stacking several ceramic green sheets (not shown) on each of the first ceramic green sheet 110 and the second ceramic green sheet 116, a multilayer body is produced, and the multilayer body is fired to produce an electronic structure. Make a part.

  However, for example, as shown in FIG. 19, when the ceramic green sheet 102 is irradiated with the laser light 104 reflected by the galvano scan mirror, the laser light 104 is emitted from the ceramic green sheet 102 at the central portion of the ceramic green sheet 102. Although the light is incident substantially perpendicular to the upper surface 102a (grooved surface), the light is incident at a certain angle θ in the peripheral portion of the ceramic green sheet 102.

  When the incident angle θ of the laser beam 104 with respect to the upper surface 102 a of the ceramic green sheet 102 is different, the shape (cross-sectional shape) of the groove 106 formed by the laser beam 104 is also different.

  The shape of the groove 106 depends on the incident angle θ of the laser beam 104, the energy of the laser beam 104, the density of the ceramic particles in the ceramic green sheet 102, the particle size of the ceramic particles, and the like, for example, as shown in FIG. With respect to the shape of the upper groove 130, as indicated by broken lines 132 and 134, the width of the bottom of the groove 130 becomes wider or narrower, and the depth of the groove 130 becomes shallower than a prescribed depth. Or deepen. In particular, the change in the shape of the groove 130 due to the incident angle θ of the laser beam 104 becomes significant in the depth of the groove 130.

  The electrical characteristics of a multilayer dielectric electronic component, such as a coupler, is determined by the electromagnetic coupling between the electrodes. However, in an electronic component manufactured by the conventional manufacturing method described above, as shown in FIG. Since the distance d1 between the first electrode 114 and the second electrode 120 and the distance d2 between the first electrode 114 and the second electrode 120 in the peripheral portion change depending on the shapes of the grooves 112 and 118, respectively. A change in the shape of the groove formed by the laser beam appears as a change in electrical characteristics as it is.

  As described above, in the conventional groove processing embedding method, the distance between the upper and lower conductors differs between the central portion and the peripheral portion of the ceramic green sheet, and in an electronic component that places importance on the degree of electromagnetic coupling such as a coupler, There is a problem in that the degree of coupling differs depending on the position (center portion / peripheral portion), which affects the product yield.

  In addition, since the conventional groove processing embedding method relieves internal stress in the vertical direction, the problems caused by the above-described clean printing method, that is, laminating displacement and delamination in the surface direction during laminating and pressing are not generated. The initial deviation of the ceramic green sheet at the time of lamination has a problem of affecting the degree of coupling between the upper and lower conductors after the product is completed.

  Therefore, conventionally, there has been no means for constructing an electronic component that is low resistance, capable of handling a large current, and has little characteristic fluctuation.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an electronic component that has low conductor resistance, can handle a large current, and has little characteristic fluctuation.

  Another object of the present invention is to provide a method of manufacturing an electronic component that can easily manufacture an electronic component that is low in conductor resistance, can handle a large current, and has little characteristic fluctuation.

  An electronic component according to the present invention includes a dielectric substrate, and a first electrode and a second electrode that are opposed to each other with a dielectric having a predetermined thickness interposed therebetween. The width of the surface in contact with the dielectric is Wa, the width of the first electrode opposite to the surface in contact with the dielectric is Wb, and the width of the second electrode in the second electrode is 3/7 ≦ Wb / Wa <1 and 3/7 ≦ Wd, where Wc is the width of the surface in contact and Wd is the width of the second electrode opposite to the surface in contact with the dielectric. / Wc <1 is satisfied.

  First, since a dielectric with a constant thickness is interposed between the first electrode and the second electrode, the distance between the first electrode and the second electrode is governed by the thickness of the dielectric, and in this case, the constant thickness It becomes.

  In addition, since the first electrode and the second electrode have a trapezoidal shape in which the surfaces having a large width face each other, for example, from the side surface of the first electrode to the upper surface of the second electrode or the second electrode The electric lines of force that run on the side surfaces of the electrodes are negligible compared to the strength of the electric lines of force between the large upper surfaces of the first electrode and the second electrode facing each other. Therefore, the electrical signal coupling degree between the first electrode and the second electrode is determined only by the areas of the first electrode and the second electrode having a large width and the thickness of the dielectric.

  Thus, the distance between the first and second electrodes is not affected by the shape of the groove, can reduce the variation in the electrical characteristics of the electronic component, is low conductor resistance, can handle a large current, And it can be set as an electronic component with few characteristic fluctuations.

  And in the said structure, you may make it satisfy 7/15 <= Wc / Wa <1 or 7/15 <= Wa / Wc <1. In this case, the width of the surface of the first electrode in contact with the dielectric is larger or smaller than the width of the surface of the second electrode in contact with the dielectric. It is possible to reduce the fluctuation of the electrical characteristics due to.

  Next, a method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component having a dielectric substrate, and a first electrode and a second electrode facing each other with the dielectric interposed in the dielectric substrate. The step of filling the groove portion of the first green sheet having the groove portion with the first conductive paste for forming the first electrode, and the step of filling the groove portion of the second green sheet having the groove portion with the second And filling the second conductive paste for forming the electrode, the grooved surface of the first green sheet, and the grooved surface of the second green sheet so as to face each other. And a step of producing a laminate by sandwiching another green sheet between the two green sheets, and a step of firing the laminate.

  As a result, first, another green sheet is interposed between the first green sheet and the second green sheet, so that the grooves in the first green sheet were filled by subsequent firing. After the conductive paste becomes the first electrode and the conductive paste filled in the grooves of the second green sheet becomes the second electrode, a dielectric having a constant thickness is formed between the first electrode and the second electrode. Will intervene.

  In addition, since the grooved surface of the first green sheet is opposed to another green sheet, and the grooved surface of the second green sheet is opposed to the other green sheet, The electrode and the second electrode face each other with a large width.

  As described above, in the manufacturing method according to the present invention, it is possible to easily manufacture an electronic component that is low resistance, can handle a large current, and has little characteristic variation.

  That is, the manufacturing method according to the present invention improves the defects caused by the groove processing embedding method, and therefore does not cause the defects in the screen printing method.

  Assuming that the groove part of the green sheet is formed by irradiating laser light, for example, the distance between the upper and lower electrodes is constant even if the shape of the groove part by laser light irradiation differs between the central part and the peripheral part of the green sheet. Therefore, the degree of coupling between the upper and lower electrodes can be made constant. As a result, the product yield can be greatly improved.

  As described above, the distance between the upper and lower electrodes can be kept constant even if the shape of the groove by laser light irradiation differs between the central part and the peripheral part of the green sheet. The size can be increased, and the production efficiency can be greatly improved.

  In the manufacturing method, the groove portion of the first green sheet is formed through the first green sheet, and the groove portion of the second green sheet is penetrated through the second green sheet. You may make it form.

  Alternatively, the groove portion of the first green sheet is formed so that the depth is smaller than the thickness of the first green sheet, and the groove portion of the second green sheet is The depth may be set to be smaller than the thickness of the second green sheet.

  Alternatively, the groove portion of the first green sheet is formed through the first green sheet, and the depth of the groove portion of the second green sheet is determined by the thickness of the first green sheet. You may make it set so that it may become smaller than this.

  Alternatively, the groove portion of the first green sheet is formed such that the depth thereof is smaller than the thickness of the first green sheet, and the groove portion of the second green sheet is You may make it form penetrating the 2nd green sheet.

  Moreover, in the said manufacturing method, when the width in the said grooved surface of the said groove part of the said 1st green sheet is set to Wa, and the width in the said grooved surface of the said groove part of the said 2nd green sheet is set to Wc , Wa> Wc, or Wa <Wc, the groove may be formed.

  As a result, the degree of coupling can be kept substantially constant even with respect to the initial stacking deviation of the green sheets, and the product yield can be further improved.

  In addition, you may make it form the said groove part by irradiation of the laser beam to the said grooved surface.

  As described above, according to the electronic component according to the present invention, it is possible to provide an electronic component that has low conductor resistance and a large current and that has little characteristic variation.

  In addition, according to the method for manufacturing an electronic component according to the present invention, it is possible to easily manufacture an electronic component that has a low conductor resistance and a large current and that has little characteristic variation.

  Hereinafter, an embodiment in which an electronic component and a method for manufacturing the electronic component according to the present invention are applied to, for example, a coupler will be described with reference to FIGS.

  As shown in FIG. 1, an electronic component 10 according to the present embodiment has a dielectric substrate 12 in which a plurality of dielectric layers are laminated and integrated by firing. Among the four side surfaces of the dielectric substrate 12, the input terminal 16 and the isolated terminal 18 are formed on the first side surface 14a, and the output terminal is disposed on the second side surface 14b opposite to the first side surface 14a. 20 and a coupled terminal 22 are formed.

  In the dielectric substrate 12, as shown in FIG. 2, two electrodes (first electrode 24 and second electrode 26) are formed. The first electrode 24 is formed to meander from one end 28 to the other end 30 on one forming surface, the one end 28 is connected to the input terminal 16 (see FIG. 1), and the other end 30 is connected to the output terminal 20. (See FIG. 1). The second electrode 26 is formed to meander from one end 32 to the other end 34 on the other formation surface, the one end 32 is connected to the isolated terminal 18 (see FIG. 1), and the other end 34 is coupled to the other end 34. Terminal 22 (see FIG. 1).

  In this embodiment, a dielectric 36 having a constant thickness is interposed between the formation surface of the first electrode 24 and the formation surface of the second electrode 26.

  Here, a method for manufacturing the electronic component 10 according to the present embodiment will be described with reference to FIGS.

  First, in the first manufacturing method, first, as shown in FIG. 3A, the first ceramic green sheet 42 held on the first carrier film 40 and the second carrier as shown in FIG. 3B are used. A second ceramic green sheet 46 held on the film 44 and a third ceramic green sheet 50 held on the third carrier film 48 are prepared as shown in FIG. 3C. The first to third carrier films 40, 44 and 48 are made of, for example, PET (polyethylene terephthalate material).

  Thereafter, as shown in FIG. 4A, a laser beam (not shown) reflected by a galvano scan mirror (not shown) is irradiated on the upper surface 42a (grooved surface) of the first ceramic green sheet 42, and the first A first groove 52 penetrating the ceramic green sheet 42 is formed.

  On the other hand, as shown in FIG. 4B, a laser beam (not shown) reflected by a galvano scan mirror (not shown) is applied to the upper surface 46a (grooved surface) of the second ceramic green sheet 46, and the second A second groove 54 penetrating the ceramic green sheet 46 is formed.

  Since the first groove 52 and the second groove 54 are formed by laser light, the width tends to be gradually reduced in the depth direction, and the cross section is substantially trapezoidal. In this embodiment, the maximum width W1 of the first groove 52 (width on the extension line of the upper surface 42a) is smaller than the maximum width W2 of the second groove 54 (width on the extension line of the upper surface 46a). However, the width W1 and the width W2 may be substantially the same, or the width W1 may be larger than the width W2.

  Thereafter, as shown in FIG. 5A, the first groove 52 formed in the upper surface 42 a of the first ceramic green sheet 42 is filled with a conductive paste to form the first electrode 24. Filling the first groove 52 with the conductive paste can be easily performed, for example, by printing. On the other hand, as shown in FIG. 5B, a conductive paste is filled into the second groove 54 formed on the upper surface 46a of the second ceramic green sheet 46 by, for example, printing to form the second electrode 26.

  Thereafter, as shown in FIG. 6, the upper surface 42a of the first ceramic green sheet 42 and the upper surface 46a of the second ceramic green sheet 46 are opposed to each other, and the third ceramic green sheet 50 is interposed therebetween. For example, the upper surface 42a of the first ceramic green sheet 42 and the end surface 48a of the third carrier film 48 are opposed to each other, and the upper surface 46a of the second ceramic green sheet 46 and the upper surface 50a of the third ceramic green sheet 50 are Make them face each other.

  Thereafter, the first to third ceramic green sheets 42, 46 and 50 are laminated, while the first to third carrier films are removed or laminated from the first to third ceramic green sheets before lamination. The first to third carrier films are removed.

  Then, as shown in FIG. 7, the first to third ceramic green sheets 42, 46 and 50 are laminated, and further, the fourth ceramic green sheet 58 is laminated on the first ceramic green sheet 42. A fifth ceramic green sheet 60 is laminated under the second ceramic green sheet 46 to produce a laminate 62. At this time, the surface with the large width of the first electrode 24 contacts the upper surface 50a of the third ceramic green sheet 50, and the surface with the large width of the second electrode 26 is the third ceramic green sheet 50. Will come into contact with the lower surface 50b. Thereafter, the laminated body 62 is fired to complete the electronic component 10 shown in FIGS. 1 and 2.

  As described above, in the electronic component 10 according to the present embodiment, the third ceramic green sheet 50 is interposed between the first ceramic green sheet 42 and the second ceramic green sheet 46. Then, at a stage where the dielectric substrate 12 is fabricated by subsequent firing, a dielectric 36 having a constant thickness is interposed between the first electrode 24 and the second electrode 26 as shown in FIG. Thus, the distance between the first electrode 24 and the second electrode 26 is governed by the thickness of the dielectric 36, and in this case, the thickness is constant.

  Further, the upper surface 42a (grooved surface) of the first ceramic green sheet 42 is opposed to the third ceramic green sheet 50, and the upper surface 46a (grooved surface) of the second ceramic green sheet 46 is made third. The ceramic green sheet 50 is opposed to the ceramic green sheet 50. In this case, since the first electrode 24 and the second electrode 26 have a trapezoidal shape whose surfaces having a large width face each other, for example, from the side surface of the first electrode 24 to the upper surface of the second electrode 26. Alternatively, the electric lines of force that run on the side surfaces of the second electrode 26 are negligible compared to the strength of the electric lines of force between the large upper surfaces of the first electrode 24 and the second electrode 26 facing each other. Therefore, the degree of electrical signal coupling between the first electrode 24 and the second electrode 26 is determined only by the area of the first electrode 24 and the second electrode 26 having a large width and the thickness of the dielectric 36. become.

  Accordingly, the distance between the first electrode 24 and the second electrode 26 does not depend on the shape of the first groove 52 or the second groove 54, and is low in conductor resistance, capable of handling a large current, and has characteristics. It can be set as the electronic component 10 with few fluctuations.

  In the above example, the first electrode 24 is formed by filling the first groove 52 penetrating the first ceramic green sheet 42 to form the first electrode 24. However, as shown in FIG. A groove 52a having a depth h1 smaller than the thickness t1 of the first ceramic green sheet 42 is formed in the first ceramic green sheet 42, and a conductive paste is filled in the groove 52a to form the first electrode. 24 may be formed.

  Similarly, as shown in FIG. 9, a groove 54a having a depth h2 smaller than the thickness t2 of the second ceramic green sheet 46 is formed in the second ceramic green sheet 46, and the groove 54a is formed in the groove 54a. The second electrode 26 may be formed by filling a conductive paste.

  Then, as shown in the electronic component 10a according to the first modification of FIG. 10, the first ceramic green sheet 42 in which the first electrode 24 is formed in the first groove 52 penetrating, and the depth The second ceramic green sheet 46 in which the second electrode 26 is formed in the shallow groove 54a may be laminated with the third ceramic green sheet 50 interposed therebetween.

  Alternatively, as shown in the electronic component 10b according to the second modified example of FIG. 11, the first ceramic green sheet 42 in which the first electrode 24 is formed in the shallow groove 52a and the penetrating second The second ceramic green sheet 46 in which the second electrode 26 is formed in the groove 54 may be laminated with the third ceramic green sheet 50 interposed therebetween.

  Alternatively, as shown in the electronic component 10c according to the third modified example of FIG. 12, the first ceramic green sheet 42 in which the first electrode 24 is formed in the shallow groove 52a and the shallow groove. The second ceramic green sheet 46 in which the second electrode 26 is formed in 54 a may be laminated with the third ceramic green sheet 50 interposed therebetween.

  Also in these first to third modifications, since the first electrode 24 and the second electrode 26 face each other with the third ceramic green sheet 50 interposed therebetween, the grooves 52, 52 a, 54 are provided. Even if the depths 54a and 54a are different from each other, the distance d between the first electrode 24 and the second electrode 26 can be kept constant.

  Next, two experimental examples (first and second examples) showing how the electrical characteristics, particularly, the degree of coupling with respect to a signal with a frequency of 2.4 GHz change depending on the cross-sectional shape of the second electrode 26. Will be described with reference to FIGS. 13 to 18.

  First, the first experimental example is a change in the degree of coupling when only the width of the second electrode 26 is changed (Examples 1 to 5). As shown in FIG. 13, in the first electrode 24, the width Wa of the surface facing the second electrode 26 is 150 μm, the width Wb of the opposite surface is 110 μm, and the thickness t1 is 80 μm. Further, the distance d between the first electrode 24 and the second electrode 26 was set to 100 μm.

  The breakdown of Examples 1 to 5 will be described. In Example 1, the width Wc of the surface of the second electrode 26 facing the first electrode 24 is 230 μm, and the width Wd of the opposite surface is 190 μm. . In Example 2, the width Wc was 190 μm and the width Wd was 150 μm. In Example 3, the width Wc was 150 μm and the width Wd was 110 μm. In Example 4, the width Wc was 110 μm and the width Wd was 70 μm. In Example 5, the width Wc was 70 μm and the width Wd was 30 μm. Note that the thickness t2 of the second electrode 26 was set to 80 μm in all of Examples 1 to 5.

  The results of this first experimental example are shown in FIGS. The binding degrees of Examples 1 to 5 are 3.14 in Example 1, 3.25 in Example 2, 3.35 in Example 3, 3.41 in Example 4, and 3.80 in Example 5. there were.

  From this, the degree of coupling changes almost linearly by changing the width Wc of the surface of the second electrode 26 facing the first electrode 24 (and the width Wd of the surface on the opposite side). I understand. Therefore, the widths Wc and Wd of the second electrode 26 may be appropriately selected according to the degree of coupling required by the design specifications, and the degree of coupling can be easily adjusted. The same applies to the first electrode 24.

  The ratio (Wd / Wc) between the width Wc of the surface of the second electrode 26 facing the first electrode 24 and the width Wd of the opposite surface is 190/230 (= 19/23) in the first embodiment. ), 150/190 (= 15/19) in Example 2, 110/150 (= 11/15) in Example 3, 70/110 (= 7/11) in Example 4, 30 / in Example 5 70 (= 3/7).

  Therefore, it is understood that the ratio (Wd / Wc) only needs to satisfy 3/7 ≦ Wd / Wc <1. The same applies to the first electrode 24, and the ratio (Wb / Wa) between the width Wa of the surface of the first electrode 24 facing the second electrode 26 and the width Wb of the opposite surface. May satisfy 3/7 ≦ Wb / Wa <1.

  Next, in the second experimental example, the change in the degree of coupling due to the stacking deviation is such that the width Wa of the surface of the first electrode 24 facing the second electrode 26 and the first electrode 24 in the second electrode 26. It is seen how it changes depending on the ratio with the width Wc of the surface facing each other (Examples 6 to 8). As shown in FIG. 16, the stacking deviation amount δ was measured by measuring the positional shift between the center in the width direction of the first electrode 24 and the center in the width direction of the second electrode 26.

  The ratio of the widths Wa and Wc (Wa / Wc) is 150/230 (= 15/23) in Example 6, 150/150 (= 1) in Example 7, and 150/70 (= 15/15) in Example 8. 7). The stacking deviation amount δ was set to three types of 0 μm, 20 μm, and 40 μm.

  The results of this second experimental example are shown in FIGS. In Examples 6 to 8, the variation in the degree of coupling due to the stacking deviation amount δ is as follows. Note that the degree of coupling when the stacking deviation amount δ is 0 μm is used as a reference.

  In Example 6, when the stacking deviation amount δ was 20 μm, the fluctuation was about 3%, and when the stacking deviation amount δ was 40 μm, the fluctuation was about 4%. In Example 7, when the stacking deviation amount δ was 20 μm, the fluctuation was about 1%, and when the stacking deviation amount δ was 40 μm, the fluctuation was about 2%. In Example 8, when the stacking deviation amount δ was 20 μm, the fluctuation was about 0.8%, and when the stacking deviation amount δ was 40 μm, the fluctuation was about 1%.

  Thus, it can be seen that when the ratio (Wa / Wc) of the width Wa to the width Wc is larger or smaller than 1, the variation in the coupling degree due to the stacking deviation amount δ is small. However, even if the ratio of the width Wa to the width Wc (Wa / Wc) is 1, the fluctuation of the coupling degree due to the stacking deviation amount δ is about 4%, which is a practical level.

  Therefore, 7/15 ≦ Wc / Wa <1 is satisfied when the width Wc <width Wa, or 7/15 ≦ Wa / Wc <1 when the width Wa <width Wc.

  As described above, from the first and second experimental examples, the electronic component 10 according to the present embodiment has the width Wa of the surface facing the second electrode 26 in the first electrode 24 and the surface on the opposite side thereof. The difference between the widths Wb, the difference between the width Wc of the surface of the second electrode 26 facing the first electrode 24 and the width Wd of the opposite surface, the width Wa of the first electrode 24 and the second width Wd Almost constant coupling regardless of the difference between the widths Wc of the electrodes 26, the misalignment of the second electrode 26 with respect to the first electrode 24, and the distance d between the first electrode 24 and the second electrode 26. You can get a degree.

  That is, since the manufacturing method according to the present embodiment improves the defects due to the groove processing embedding method, the defects in the screen printing method do not occur.

  Since the distance d between the first electrode 24 and the second electrode 26 can be kept constant even if the shape of the groove 52 by laser light irradiation differs between the central portion and the peripheral portion of the ceramic green sheet, The degree of coupling between the first electrode 24 and the second electrode 26 can be made constant. As a result, the product yield can be greatly improved.

  As described above, the distance d between the first electrode 24 and the second electrode 26 is kept constant even when the shape of the groove 52 by laser light irradiation differs between the central portion and the peripheral portion of the ceramic green sheet. Therefore, the size of one unit of the ceramic green sheet can be increased, and the production efficiency can be greatly improved.

  As described above, the electronic component 10 according to the present embodiment can sufficiently cope with the low conductor resistance and the large current, and can also improve the yield, improve the productivity, and reduce the product cost. Can be realized.

  In the above-described example, the case where the electronic component is applied to a coupler is shown. However, the present invention can be applied to a balun, and can also be applied to various passive components including a coupler and a balun.

  It should be noted that the electronic component and the method for manufacturing the electronic component according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

It is a perspective view which shows the electronic component which concerns on this Embodiment. It is a see-through | perspective perspective view which shows the electronic component which concerns on this Embodiment. 3A is a cross-sectional view showing the first ceramic green sheet held on the first carrier film, FIG. 3B is a cross-sectional view showing the second ceramic green sheet held on the second carrier film, FIG. 3C is a cross-sectional view showing a third ceramic green sheet held on a third carrier film. FIG. 4A is a cross-sectional view showing a state in which the first groove is formed by irradiating the first ceramic green sheet with laser light, and FIG. 4B shows the second state by irradiating the second ceramic green sheet with laser light. It is sectional drawing which shows the state in which the groove | channel was formed. FIG. 5A is a cross-sectional view showing a state where the first groove formed in the first ceramic green sheet is filled with a conductive paste to form a first electrode, and FIG. 5B is formed on the second ceramic green sheet. It is sectional drawing which shows the state which filled the electrically conductive paste in the made 2nd groove | channel, and was set as the 2nd electrode. It is sectional drawing which shows the laminated body produced by the 1st manufacturing method. It is sectional drawing which shows the laminated body produced by the 2nd manufacturing method. It is sectional drawing which shows the example which formed the groove | channel where shallow depth was formed in the 1st ceramic green sheet, and was filled with the electrically conductive paste in this groove | channel, and was set as the 1st electrode. It is sectional drawing which shows the example which formed the groove | channel where the depth was shallow in the 2nd ceramic green sheet, and was filled with the electrically conductive paste in this groove | channel, and was set as the 2nd electrode. It is sectional drawing which shows the laminated body of the electronic component which shows a 1st modification. It is sectional drawing which shows the laminated body of the electronic component which shows a 2nd modification. It is sectional drawing which shows the laminated body of the electronic component which shows a 3rd modification. It is explanatory drawing which shows the structure of Examples 1-5 used in a 1st experiment example. It is a table | surface figure which shows the 1st experiment example. It is a characteristic view which shows the 1st experiment example. It is explanatory drawing which shows the structure of Examples 6-8 used by the 2nd experiment example. It is a table | surface figure which shows the 2nd experiment example. It is a characteristic view which shows the 2nd experiment example. It is explanatory drawing which shows the state which formed the groove | channel in the ceramic green sheet with the laser beam reflected from a galvano scan mirror. It is sectional drawing which shows the state which filled with the electrically conductive paste in the 1st groove | channel formed by irradiating a 1st ceramic green sheet with a laser beam, and was set as the 1st electrode. It is sectional drawing which shows the state which filled with the electrically conductive paste in the 2nd groove | channel formed by irradiating a 2nd ceramic green sheet with a laser beam, and was set as the 2nd electrode. It is sectional drawing which shows the state which laminated | stacked the 1st and 2nd ceramic green sheet. It is explanatory drawing which shows the condition of the change of the shape of a groove | channel by various factors.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electronic component 12 ... Dielectric board | substrate 24 ... 1st electrode 26 ... 2nd electrode 42 ... 1st ceramic green sheet 42a ... Upper surface (grooved surface)
46: Second ceramic green sheet 46a: Upper surface (grooved surface)
50 ... 3rd ceramic green sheet 52 ... 1st groove | channel 54 ... 2nd groove | channel 58 ... 4th ceramic green sheet 60 ... 5th ceramic green sheet

Claims (9)

A dielectric substrate;
The dielectric substrate has a first electrode and a second electrode facing each other with a dielectric having a constant thickness in between,
Of the first electrode, the width of the surface in contact with the dielectric is Wa, and in the first electrode, the width of the surface opposite to the surface in contact with the dielectric is Wb,
When the width of the surface in contact with the dielectric of the second electrode is Wc, and the width of the surface of the second electrode opposite to the surface in contact with the dielectric is Wd,
3/7 ≦ Wb / Wa <1, and
3/7 ≦ Wd / Wc <1
An electronic component characterized by satisfying The electronic component according to claim 1,
When Wc <Wa, 7/15 ≦ Wc / Wa <1
Or when Wa <Wc, 7/15 ≦ Wa / Wc <1
An electronic component characterized by satisfying In a method of manufacturing an electronic component having a dielectric substrate and a first electrode and a second electrode facing each other with the dielectric sandwiched in the dielectric substrate,
Filling the groove portion of the first green sheet having the groove portion with a first conductive paste for forming the first electrode;
Filling the groove portion of the second green sheet having the groove portion with a second conductive paste for forming the second electrode;
A laminated body in which the grooved surface of the first green sheet and the grooved surface of the second green sheet are opposed to each other, and another green sheet is sandwiched between the first and second green sheets. A step of producing
And a step of firing the laminated body. In the manufacturing method of the electronic component of Claim 3,
The groove portion of the first green sheet is formed through the first green sheet,
The method of manufacturing an electronic component, wherein the groove portion of the second green sheet is formed so as to penetrate the second green sheet. In the manufacturing method of the electronic component of Claim 3,
The groove portion of the first green sheet is formed with a depth set smaller than the thickness of the first green sheet,
The method of manufacturing an electronic component, wherein the groove portion of the second green sheet is formed with a depth smaller than a thickness of the second green sheet. In the manufacturing method of the electronic component of Claim 3,
The groove portion of the first green sheet is formed through the first green sheet,
The method of manufacturing an electronic component, wherein the groove portion of the second green sheet is formed with a depth smaller than a thickness of the second green sheet. In the manufacturing method of the electronic component of Claim 3,
The groove portion of the first green sheet is formed with a depth set smaller than the thickness of the first green sheet,
The method of manufacturing an electronic component, wherein the groove portion of the second green sheet is formed so as to penetrate the second green sheet. In the manufacturing method of the electronic component of any one of Claims 3-7,
When the width of the grooved surface of the groove portion of the first green sheet is Wa and the width of the grooved surface of the groove portion of the second green sheet is Wc,
Wa> Wc, or Wa <Wc
The method of manufacturing an electronic component is characterized in that the groove is formed so as to be In the manufacturing method of the electronic component of any one of Claims 3-8,
The groove part is formed by irradiating the grooved surface with a laser beam.

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