JP7272790B2 - Laminated coil parts - Google Patents

Description

The present invention relates to laminated coil components.

BACKGROUND ART Conventionally, there has been known a laminated coil component including a base portion made of a magnetic material such as ferrite, a plurality of conductor layers embedded in the base portion, and an insulator layer disposed between the plurality of conductor layers. It is One example of a laminated coil component is a laminated inductor. Stacked inductors are passive devices used in electronic circuits. Laminated inductors are used, for example, to remove noise in power supply lines and signal lines. Such a laminated coil component is described in Patent Document 1, for example.

JP 2018-121023 A

By the way, along with the sophistication of electronic devices, there is a demand for sophistication of the laminated coil components as described above, including the capability of increasing the current capacity. In order to realize a high-current laminated coil component, it is necessary to reduce the resistivity (that is, the resistance per unit length) of the conductor layers. As a method for reducing the resistivity of the conductor layer, for example, increasing the width of the conductor layer is conceivable. However, from the viewpoint of preventing a short circuit between insulator layers adjacent in the vertical direction, the width of the conductor layer is limited to the width of the insulator layer or less.

One of the objects of the present invention is to provide a laminated coil component capable of reducing the resistivity of the conductor layers while suppressing short circuits between the conductor layers. Other objects of the present invention will become apparent throughout the specification.

A laminated coil component according to an embodiment of the present invention includes a first conductor layer extending along a cross direction crossing the vertical direction, an insulator layer laminated on the upper end of the first conductor layer, and an insulator layer. A second conductor layer laminated on the upper end of the and extending along the cross direction, and a base portion covering the first conductor layer, the insulator layer, and the second conductor layer, wherein the first conductor The dimension of the upper end of the layer is larger than the dimension of the insulator layer, and the dimension of the lower end of the second conductor layer is smaller than or equal to the dimension of the insulator layer.

In this laminated coil component, the dimension of the upper end of the first conductor layer is larger than the dimension of the insulator layer, and the dimension of the lower end of the second conductor layer is smaller than or equal to the dimension of the insulator layer in the cross direction. In this way, since the dimension of the top end of the first conductor layer is larger than the dimension of the insulator layer, the first The cross-sectional area of the conductor layer is large. Therefore, the resistivity of the first conductor layer can be reduced. Further, since the dimension of the lower end of the second conductor layer is equal to or less than the dimension of the insulator layer, the insulator layer is interposed between the first conductor layer and the second conductor layer. A short circuit with the conductor can be suppressed. Therefore, it is possible to reduce the resistance in the conductor layers while suppressing the short circuit between the conductor layers.

In one embodiment of the present invention, the dimension of the bottom edge of the second conductor layer may be smaller than the dimension of the insulator layer in the cross direction. According to this configuration, it is possible to more reliably suppress a short circuit between the first conductor layer and the second conductor layer.

In one embodiment of the present invention, each of the first conductor layer and the second conductor layer has two side surfaces facing the base portion when viewed from a cross section along the vertical direction, and has two side surfaces when viewed from the cross direction. At least one of the side surfaces may be inclined with respect to the vertical direction.

In one embodiment of the present invention, the first inclination angle at which one side surface of the first conductor layer and the second conductor layer is inclined with respect to the vertical direction when viewed from the cross direction is The other side surface of the layer may be greater than the second tilt angle with respect to the vertical direction. According to this configuration, the cross-sectional areas of the first conductor layer and the second conductor layer are larger on one side surface side than on the other side surface side of the first conductor layer and the second conductor layer. Therefore, even if the dimension is restricted on the other side (that is, the other side surface side) in the intersecting direction of the laminated coil component, it is possible to reduce the resistivity of the conductor layers.

In one embodiment of the present invention, the side surfaces of the first conductor layer and the second conductor layer may be curved so as to project toward the base when viewed from the cross direction. According to this configuration, the cross-sectional areas of the first conductor layer and the second conductor layer can be further increased compared to the case where the side surfaces of the first conductor layer and the second conductor layer are flat. Therefore, it is possible to further reduce the resistivity in the conductor layer.

One embodiment of the present invention relates to a circuit board including the laminated coil component described above.

One embodiment of the present invention relates to an electronic component comprising the circuit board described above.

ADVANTAGE OF THE INVENTION According to this invention, the laminated coil component which can reduce the resistivity in a conductor layer is provided, suppressing the short circuit between conductor layers.

1 is a perspective view of a coil component according to one embodiment of the present invention; FIG. FIG. 2 is an exploded perspective view of the coil component of FIG. 1; FIG. 2 is a diagram schematically showing a cross section of the coil component along line II in FIG. 1; FIG. 2 is a cross-sectional view showing an enlarged part of the laminated structure in the laminated body of the coil component of FIG. 1 ; FIG. 11 is a cross-sectional view showing an enlarged part of a laminated structure in a laminated body of coil components according to a modification; FIG. 11 is a cross-sectional view showing an enlarged part of a laminated structure in a laminated body of coil components according to a modification; FIG. 11 is a cross-sectional view showing an enlarged part of a laminated structure in a laminated body of coil components according to a modification;

Various embodiments of the present invention will now be described with reference to the drawings as appropriate. Components common to a plurality of drawings are denoted by the same reference numerals throughout the plurality of drawings. Please note that each drawing is not necessarily drawn to an exact scale for convenience of explanation.

FIG. 1 is a perspective view of a coil component 1 according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view of the coil component 1 shown in FIG. FIG. 3 is a diagram schematically showing a cross section of the coil component 1 along line I--I of FIG. In FIG. 3, each magnetic layer included in a laminate 10, which will be described later, is omitted.

These figures show, as an example of the coil component 1, a laminated inductor that is used as a passive element in various circuits. A laminated inductor is an example of a laminated coil component to which the present invention can be applied. INDUSTRIAL APPLICABILITY The present invention can be applied to power inductors incorporated in power supply lines and various other laminated coil components.

The coil component 1 in the illustrated embodiment includes a laminate 10 in which magnetic layers made of a magnetic material are laminated, conductor patterns C11 to C16 embedded in the laminate 10, one end of the conductor pattern C11 and an electrical and an external electrode 22 electrically connected to one end of the conductor pattern C16. Each of the conductor patterns C11 to C16 is electrically connected to the adjacent conductor pattern via vias V1 to V5, which will be described later. The conductor pattern C11 is connected to the external electrode 21 via a lead conductor 23 described later, and the conductor pattern C16 is connected to the external electrode 22 via a lead conductor 24 described later.

As shown, in one embodiment of the invention, laminate 10 is formed in a generally rectangular parallelepiped shape. The laminate 10 has a first main surface 10e, a second main surface 10f, a first end surface 10a, a second end surface 10c, a first side surface 10b, and a second side surface 10d. Laminate 10 is defined on its outer surface by these six faces. The first main surface 10e and the second main surface 10f face each other, the first end face 10a and the second end face 10c face each other, and the first side face 10b and the second side face 10d face each other. facing each other. When the laminate 10 is formed in a rectangular parallelepiped shape, the first main surface 10e and the second main surface 10f are parallel, the first end surface 10a and the second end surface 10c are parallel, The first side 10b and the second side 10d are parallel.

In the embodiment of FIG. 1, the first major surface 10e is on the upper side of the laminate 10, so the first major surface 10e is sometimes referred to herein as the "upper surface." Similarly, the second major surface 10f may be called the "lower surface". Since the coil component 1 is arranged so that the second main surface 10f faces the circuit board (not shown), the second main surface 10f is sometimes called a "mounting surface" in this specification. When referring to the vertical direction of the coil component 1, the vertical direction in FIG. 1 is used as a reference.

In this specification, the "length" direction, the "width" direction, and the "thickness" direction of the coil component 1 are respectively the "L" direction and the "W ” direction, and the “T” direction. Also, the "T direction", the "vertical direction", and the "stacking direction" are the same direction.

In one embodiment of the present invention, the coil component 1 has a length dimension (L-axis direction dimension) of 0.2 to 6.0 mm, a width dimension (W-axis direction dimension) of 0.1 to 4.5 mm, The thickness dimension (the dimension in the T-axis direction) is formed to be 0.1 to 4.0 mm. These dimensions are merely examples, and the coil component 1 to which the present invention can be applied can have arbitrary dimensions as long as they do not violate the gist of the present invention. In one embodiment, the coil component 1 is formed with a low profile. For example, the coil component 1 is formed so that its width dimension is larger than its thickness dimension.

2 is an exploded perspective view of the coil component 1 of FIG. 1. FIG. In FIG. 2, the external electrodes 21 and 22 are omitted for convenience of illustration. As illustrated, the laminate 10 includes a base portion 20 , an upper cover layer 18 provided on the upper surface of the base portion 20 , and a lower cover layer 19 provided on the lower surface of the base portion 20 . The base portion 20 includes laminated magnetic layers 11 to 16 . In this laminated body 10, from top to bottom in FIG. 2, an upper cover layer 18, magnetic layer 11, magnetic layer 12, magnetic layer 13, magnetic layer 14, magnetic layer 15, magnetic layer 16, a magnetic layer 17, and a lower cover layer 19 are laminated in this order.

The upper cover layer 18 includes four magnetic layers 18a-18d. In the upper cover layer 18, a magnetic layer 18a, a magnetic layer 18b, a magnetic layer 18c, and a magnetic layer 18d are laminated in this order from bottom to top in FIG.

The lower cover layer 19 includes four magnetic layers 19a-19d. In the lower cover layer 19, a magnetic layer 19a, a magnetic layer 19b, a magnetic layer 19c, and a magnetic layer 19d are laminated in this order from top to bottom in FIG.

As will be described later, the corresponding conductor patterns C11 to C16 are embedded in the magnetic layers 11 to 16, respectively. Before laminating the magnetic layers 11 to 16, the upper surfaces of the conductor patterns C11 to C16 are exposed from the upper surfaces of the magnetic layers 11 to 16, respectively. A coil conductor 25 is composed of these conductor patterns C11 to C16 and lead conductors 23 and 24. As shown in FIG. This coil conductor 25 has a coil axis A. As shown in FIG. Each conductor pattern C11 to C16 is formed to extend around the coil axis A. As shown in FIG. In the illustrated embodiment, the coil axis A extends in the T-axis direction and coincides with the stacking direction of the magnetic layers 11 to 16 .

Insulator layers IS11 to IS16 corresponding to the conductor patterns C11 to C16 are embedded in the magnetic layers 11 to 16, respectively. The insulator layers IS11-IS16 are arranged under the conductor patterns C11-C16, respectively. Each of the insulator layers IS11 to IS16 is formed to be one size larger than the conductor patterns C11 to C16 in the direction crossing the T-axis direction (laminating direction). Before the magnetic layers 11 to 16 are laminated, the insulating layers IS11 to IS16 are exposed at the lower surfaces of the magnetic layers 11 to 16, respectively. As the insulating material forming the insulating layers IS11 to IS16, for example, oxides containing iron such as alumina, silica, zirconia, and iron oxide can be used.

In another embodiment of the present invention, the magnetic layers 11 to 16 may be stacked in the L-axis direction. In this case, by forming the conductor patterns C11 to C16 on the surfaces of the magnetic layers 11 to 16, the coil axis A faces the same L-axis direction as the stacking direction of the magnetic layers 11 to 16. . In another embodiment of the present invention, the magnetic layers 11 to 16 may be stacked in the W-axis direction. In this case, by forming the conductor patterns C11 to C16 on the surfaces of the magnetic layers 11 to 16, the coil axis A faces the same W-axis direction as the stacking direction of the magnetic layers 11 to 16. .

The resin contained in the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d is made of an insulating material. In one embodiment, the insulating material is a resin material with excellent insulating properties. As this resin material, for example, polyvinyl butyral (PVB) resin, ethyl cellulose resin, polyvinyl alcohol resin, or acrylic resin can be used. The resin contained in the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d may be a thermosetting resin having excellent insulating properties. . Examples of the thermosetting resin include epoxy resin, polyimide resin, polystyrene (PS) resin, high density polyethylene (HDPE) resin, polyoxymethylene (POM) resin, polycarbonate (PC) resin, polyvinylidene fluoride (PVDF) resin, Phenolic resin, polytetrafluoroethylene (PTFE) resin, or polybenzoxazole (PBO) resin can be used. The resin contained in each non-magnetic layer and each sheet may be the same or different from the resin contained in the other magnetic layers and other sheets.

When the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d are made of a resin material, these magnetic layers are made of filler particles. may include The filler particles are, for example, ferrite material particles, soft magnetic metal particles, inorganic material particles such as SiO ₂ and Al ₂ O ₃ , or glass particles. Particles of ferrite material applicable to the present invention are, for example, particles of Ni--Zn ferrite or particles of Ni--Zn--Cu ferrite. Soft magnetic metal particles that can be applied to the present invention are materials that exhibit magnetism in the non-oxidized metal portions, such as particles containing non-oxidized metal particles or alloy particles. Soft magnetic metal particles applicable to the present invention include, for example, alloy-based Fe--Si--Cr, Fe--Si--Al, or Fe--Ni, amorphous Fe--Si--Cr--BC, or Particles of Fe--Si--B--Cr, Fe, or mixed materials thereof are included.

The magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d are formed by bonding a large number of soft magnetic metal particles each having an insulating film formed on its surface. may be formed. This insulating coating is, for example, an oxide coating formed by oxidizing the surface of the soft magnetic metal. A magnetic layer composed of a large number of soft magnetic metal particles bonded together may not contain a resin. Soft magnetic metal particles applicable to the present invention include, for example, alloy-based Fe--Si--Cr, Fe--Si--Al, or Fe--Ni, amorphous Fe--Si--Cr--BC, or Particles of Fe--Si--B--Cr, Fe, or mixed materials thereof are included. Structures made of soft magnetic metal particles that can be used as the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d are disclosed in, for example, Japanese Unexamined Patent Application Publications. It is disclosed in JP 2013-153119.

In addition to the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d, the coil component 1 may include any number of magnetic bodies as necessary. It can contain layers. Part of the magnetic layers 11 to 16, the magnetic layers 18a to 18d, and the magnetic layers 19a to 19d can be omitted as appropriate.

The conductor patterns C11 to C16 and the insulating layers IS11 to IS16 are embedded in the corresponding magnetic layers 11 to 16, respectively. The conductor patterns C11 to C16 and the insulating layers IS11 to IS16 are formed using printing such as screen printing, plating, etching, or any other known technique.

Vias V1 to V5 are formed at predetermined positions of the magnetic layers 11 to 15, respectively. The vias V1 to V5 are formed by forming through holes penetrating the insulating layers IS11 to IS16 in the T-axis direction at predetermined positions of the insulating layers IS11 to IS16, and filling the through holes with a metal material.

Conductive patterns C11 to C16 and vias V1 to V5 are formed to contain a highly conductive metal, such as Ag, Pd, Cu, Al, or alloys thereof.

Specific materials described in this specification are examples, and materials not illustrated in this specification can also be used as materials for constituent elements of the coil component 1 as appropriate.

In one embodiment, the external electrode 21 is provided on the first end surface 10 a of the laminate 10 and the external electrode 22 is provided on the second end surface 10 c of the laminate 10 . The external electrodes 21 and 22 may extend to the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d of the laminate 10, as shown. In this case, the external electrode 21 is provided so as to cover the entire first end surface 10a of the multilayer body 10 and part of each of the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d. , the external electrode 22 is provided so as to cover the entire second end surface 10c of the laminate 10 and a portion of each of the upper surface 10e, the lower surface 10f, the first side surface 10b, and the second side surface 10d. The shape of the external electrode 21 and the external electrode 22 is not particularly limited and can be changed as appropriate. For example, the external electrode 21 may have an L-shape covering part of each of the first end surface 10a and the lower surface 10f, or may have a plate-like shape covering part of the lower surface 10f. Similarly, the external electrode 22 may be L-shaped to partially cover the second end surface 10c and the lower surface 10f, or may be plate-shaped to partially cover the lower surface 10f.

Next, with reference to FIG. 4, the laminated structure of the magnetic layers 11 to 16, the conductor patterns C11 to C16, and the insulating layers IS11 to IS16 in the laminate 10, and the shapes of the conductor patterns C11 to C16 will be described in detail. do. FIG. 4 is a cross-sectional view showing an enlarged part of the laminated structure of the laminated body 10. As shown in FIG. FIG. 4 shows a portion where conductor patterns C12 to C15 are laminated.

As shown in FIG. 4, the laminate 10 of the coil component 1 extends at least in the cross direction (in this embodiment, the direction along the WL plane) crossing the lamination direction (in this embodiment, the T-axis direction). a first conductor pattern (first conductor layer) extending along the conductor pattern; an insulator layer laminated on the first conductor pattern; and a second conductor layer laminated on the insulator layer and extending along the cross direction. and a conductor pattern (second conductor layer). In the laminate 10, the conductor patterns C11 to C16 have substantially the same pattern when viewed from the lamination direction. Also, the insulator layers IS11 to IS16 have substantially the same pattern when viewed from the stacking direction. That is, in the laminate 10, a set of conductor patterns and insulator layers having substantially the same structure are repeatedly laminated. For example, focusing on the conductor patterns C13 and C14, the conductor pattern C14 corresponds to the first conductor layer, and the conductor pattern C13 corresponds to the second conductor layer. Focusing on the conductor patterns C12 and C13, the conductor pattern C13 corresponds to the first conductor layer, and the conductor pattern C12 corresponds to the second conductor layer.

The width (that is, the dimension in the cross direction) W1 of the upper end of each of the conductor patterns C11-C16 is larger than the width W3 of the insulator layers IS11-IS16. Further, the width W2 of the lower end of each of the conductor patterns C11-C16 is less than or equal to the width W3 of the insulator layers IS11-IS16. In the embodiment of FIG. 4, the width W2 of the lower end of each of the conductor patterns C11-C16 is smaller than the width W3 of the insulator layers IS11-IS16. Each of the conductor patterns C11 to C16 has one side surface S1 and the other side surface S2 when viewed from the cross direction. The side surface S<b>1 and the side surface S<b>2 face the base portion 20 . In the embodiment of FIG. 4, the side S1 and the side S2 are both planar and slanted with respect to the stacking direction. Accordingly, the widths of the conductor patterns C11 to C16 gradually decrease from the upper side to the lower side, and each of the conductor patterns C11 to C16 has a trapezoidal shape in the cross section of FIG. The inclination angle θ1 at which the side surface S1 is inclined with respect to the lamination direction is substantially the same as the inclination angle θ2 at which the side surface S2 is inclined with respect to the lamination direction. As an example, the width W1 of the upper end of each of the conductor patterns C11-C16 can be about 105%-150% of the width W3 of the insulator layers IS11-IS16. The width W2 of the upper end of each of the conductor patterns C11-C16 can be about 70%-95% of the width W3 of the insulator layers IS11-IS16. The width W1 of the upper ends of the conductor patterns C11-C16 can be about 110% to 150% of the width of the lower ends of the conductor patterns C11-C16. In other words, the dimension of the portion where the upper ends of the conductor patterns C11 to C16 protrude with respect to the insulator layers IS11 to IS16 in the cross direction (that is, width W1−width W3) is the same as that of the insulator layers IS11 to IS16 in the cross direction. It is about 5% to 50% of the dimension of the portions that protrude from the lower ends of C11 to C16 (that is, width W3−width W2). Also, the inclination angles θ1 and θ2 can be set to about 5° to 45°. The cross-sectional shapes of the conductor patterns C11 to C16 may not all be substantially the same. For example, only some of the conductor patterns C11 to C16 may have upper widths W1 larger than the widths W3 of the insulator layers IS11 to IS16.

Next, an example of a method for manufacturing the coil component 1 will be described. First, an upper laminate to be the upper cover layer 18, an intermediate laminate, and a lower laminate to be the lower cover layer 18 are formed. The upper laminated body is formed by laminating a plurality of magnetic sheets to form the magnetic layers 18a to 18d. Similarly, the lower laminated body is formed by laminating a plurality of magnetic sheets to form the magnetic layers 19a to 19d. A magnetic sheet can be obtained, for example, by applying a slurry to the surface of a plastic base film, drying the slurry, and cutting the dried slurry into a predetermined size. The slurry is prepared, for example, by adding a solvent to a resin material containing filler particles. As the resin in which the filler particles are dispersed, for example, a resin material having excellent insulating properties such as polyvinyl butyral (PVB) resin and epoxy resin can be used.

The intermediate laminate is formed by laminating a plurality of sheets including insulator layers, conductor patterns, and magnetic layers. When producing each sheet, first, an insulating layer corresponding to the shape of the conductor pattern C included in the sheet is formed on the base film by screen printing or the like. At this time, a through hole is formed through the insulator layer in the lamination direction to form a via. Next, a magnetic layer is formed on the area where the insulating layer is not formed except for the through holes on the sheet. At this time, the magnetic layer is printed using a screen in which the side surfaces of the openings corresponding to the pattern of the magnetic layer are inclined. As a result, a magnetic layer having inclined side surfaces is formed. A corresponding conductor pattern is then formed on the insulator layer. As a result, the metal material forming the conductor pattern is embedded in the through hole to form the via. In addition, since the side surfaces of the magnetic layer are inclined, a conductor pattern having inclined side surfaces S1 and S2 is formed. After forming the sheets containing the respective conductor patterns C11 to C16, the base film is removed, and the sheets from the sheet containing the conductor pattern C16 to the sheet containing the conductor pattern C11 are sequentially laminated.

Next, the intermediate layered body produced as described above is sandwiched between the upper layered body and the lower layered body from above and below, and the upper layered body and the lower layered body are thermocompression bonded to the intermediate layered body to obtain the main layered body. Next, by using a cutting machine such as a dicing machine or a laser processing machine to singulate the body laminate into pieces of a desired size, a chip laminate corresponding to the laminate 10 is obtained. Next, this chip stack is degreased, and the degreased chip stack is heat-treated. Next, the external electrodes 21 and 22 are formed by applying a conductor paste to both ends of the heat-treated chip stack. The coil component 1 is obtained through the above steps.

As described above, in the coil component 1, the dimension (width W1) of the upper ends of the conductor patterns C11 to C16 is larger than the dimension (width W3) of the insulating layers IS11 to IS16 in the cross direction. The dimension (width W2) of the lower end is equal to or less than the width W3 of the insulator layers IS11 to IS16. Since the width W1 of the upper ends of the conductor patterns C11 to C16 is larger than the dimensions of the insulator layers IS11 to IS16, the width W1 of the upper ends of the conductor patterns C11 to C16 is equal to the width of the insulator layers IS11 to IS16. The cross-sectional areas of the conductor patterns C11 to C16 are larger than in the case of W3 or less. Therefore, the resistivity of the conductor patterns C11 to C16 can be reduced. In addition, since the width W2 of the lower ends of the conductor patterns C11 to C16 is equal to or less than the width W3 of the insulator layers IS11 to IS16, the insulator layers are interposed between the conductor patterns adjacent in the stacking direction. It is possible to suppress short circuits between matching conductor patterns. Therefore, it is possible to reduce the resistivity of the conductor patterns C11 to C16 while suppressing short circuits between the conductor patterns.

In the coil component 1, the width W2 of the lower ends of the conductor patterns C11 to C16 is smaller than the width W3 of the insulator layers IS11 to IS16 in the cross direction. This makes it possible to more reliably prevent short circuits between adjacent conductor patterns in the stacking direction.

Next, a coil component 1A according to a modification will be described with reference to FIG. As with the coil component 1, the coil component 1A according to the modification includes a laminate 10 in which a coil conductor 25 is embedded, an external electrode 21 electrically connected to one end of the coil conductor 25, and the coil conductor 25. and an external electrode 22 electrically connected to the other end of the. The laminate 10 includes at least a first conductor pattern (first conductor layer) extending along a cross direction intersecting the lamination direction, an insulator layer laminated on the first conductor pattern, and the insulator and a second conductor pattern (second conductor layer) laminated on the layer and extending along the cross direction. In the embodiment of FIG. 5, the laminate 10 has conductor patterns C11-C16, insulator layers IS11-IS16, and a base portion 20. In the embodiment of FIG.

The coil component 1A according to the modification differs from the coil component 1 in that, as shown in FIG. It is a curved point. Also in the coil component 1A, the width W2 of the lower ends of the conductor patterns C11-C16 is less than or equal to the width W3 of the insulator layers IS11-IS16. As a result, since the insulating layer is interposed between the conductor patterns adjacent in the stacking direction, short circuits between the conductor patterns adjacent in the stacking direction can be suppressed. In addition, since the side surfaces S1 and S2 of the conductor patterns C11 to C16 are curved so as to protrude toward the base portion 20, compared to the case where the side surfaces S1 and S2 of the conductor patterns C11 to C16 are flat, the The cross-sectional areas of the conductor patterns C11 to C16 can be increased. Therefore, it is possible to further reduce the resistivity in the conductor patterns C11 to C16.

Side surfaces S1 and S2 of the conductor patterns C11 to C16 of the coil component 1A are curved so as to protrude toward the base portion 20, but like the coil component 1B shown in FIG. The side surfaces S1 and S2 may be curved so that the conductor patterns C11 to C16 are recessed. In this case, the conductor patterns adjacent to each other in the stacking direction are less likely to come into contact with each other, so that short circuits between the conductor patterns adjacent to each other in the stacking direction can be suppressed. Also, when viewed from the stacking direction, the side surfaces S1 and S2 of the conductor patterns C11 to C16 may be curved surfaces having a plurality of inflection points.

Next, a coil component 1C according to a modification will be described with reference to FIG. As with the coil component 1, the coil component 1A according to the modification includes a laminate 10 in which a coil conductor 25 is embedded, an external electrode 21 electrically connected to one end of the coil conductor 25, and the coil conductor 25. and an external electrode 22 electrically connected to the other end of the. The laminate 10 includes at least a first conductor pattern (first conductor layer) extending along a cross direction intersecting the lamination direction, an insulator layer laminated on the first conductor pattern, and the insulator and a second conductor pattern (second conductor layer) laminated on the layer and extending along the cross direction. In the embodiment of FIG. 7, the laminate 10 has conductor patterns C11-C16, insulator layers IS11-IS16, and a base portion 20. In the embodiment of FIG.

The coil component 1C differs from the coil component 1 in that the inclination angle θ1 at which one side surface S1 of the conductor patterns C11 to C16 is inclined with respect to the lamination direction is such that the other side surface S2 of the conductor patterns C11 to C16 is inclined in the lamination direction. This point is greater than the tilt angle θ2 of the tilt. In the coil component 1C, the conductor patterns C11 to C16 extend in the crossing direction on one side surface S1 rather than on the other side surface S2 of the conductor patterns C11 to C16. Therefore, even if there are restrictions on the dimensions of the conductor patterns C11 to C16 on the other side (that is, the side surface S2 side) of the coil component 1C in the intersecting direction, and the conductor patterns C11 to C16 cannot be expanded to the other side. , the resistivity in the conductor patterns C11 to C16 can be reduced.

The dimensions, materials, and arrangements of each component described herein are not limited to those explicitly described in the embodiments, and each component may be included within the scope of the present invention. can be modified to have dimensions, materials, and arrangements of Also, components not explicitly described in this specification may be added to the described embodiments, and some of the components described in each embodiment may be omitted.

1, 1A, 1B, 1C... Coil component 20... Base part C11 to C16... Conductor pattern (first conductor layer, second magnetic layer) IS11 to IS16... Insulator layer S1, S2... Side surface θ1 , θ2 . . . tilt angle.

Claims (6)

a first conductor layer extending along a first direction out of cross directions intersecting the vertical direction;
an insulator layer laminated on the upper end of the first conductor layer;
a second conductor layer laminated on the upper end of the insulator layer and extending along the first direction;
a base portion covering the first conductor layer, the insulator layer, and the second conductor layer;
In the width direction orthogonal to the first direction ,
the dimension of the upper end of the first conductor layer is larger than the dimension of the insulator layer;
the dimension of the lower end of the second conductor layer is equal to or less than the dimension of the insulator layer;
the top and bottom edges of the insulator layer have the same dimensions;
Laminated coil parts. 2. The laminated coil component according to claim 1, wherein a dimension of said lower end of said second conductor layer in said width direction is smaller than a dimension of said insulator layer. each of the first conductor layer and the second conductor layer has two side surfaces facing the base portion when viewed from a cross section along the vertical direction;
3. The laminated coil component according to claim 1, wherein at least one of said two side surfaces is inclined with respect to said vertical direction when viewed from said intersecting direction. A first inclination angle at which one side surface of the first conductor layer and the second conductor layer is inclined with respect to the vertical direction when viewed from the cross direction is 4. The laminated coil component according to claim 3, wherein the other side surface is larger than the second inclination angle with respect to the vertical direction. 3. The laminated coil component according to claim 1, wherein side surfaces of said first conductor layer and said second conductor layer are curved so as to protrude toward said base portion when viewed from said intersecting direction. A circuit board comprising the laminated coil component according to any one of claims 1 to 5.

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