JP2006039663A - 液循環システム及びこれを用いる液冷システム - Google Patents

液循環システム及びこれを用いる液冷システム Download PDF

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Publication number
JP2006039663A
JP2006039663A JP2004214574A JP2004214574A JP2006039663A JP 2006039663 A JP2006039663 A JP 2006039663A JP 2004214574 A JP2004214574 A JP 2004214574A JP 2004214574 A JP2004214574 A JP 2004214574A JP 2006039663 A JP2006039663 A JP 2006039663A
Authority
JP
Japan
Prior art keywords
impeller
liquid
pump
liquid circulation
circulation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004214574A
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English (en)
Japanese (ja)
Inventor
Hironori Oikawa
洋典 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2004214574A priority Critical patent/JP2006039663A/ja
Priority to TW094121472A priority patent/TW200610480A/zh
Priority to US11/187,357 priority patent/US20060018775A1/en
Priority to CNA2005100859957A priority patent/CN1725150A/zh
Publication of JP2006039663A publication Critical patent/JP2006039663A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/08—Cooling; Heating; Preventing freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004214574A 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム Pending JP2006039663A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004214574A JP2006039663A (ja) 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム
TW094121472A TW200610480A (en) 2004-07-22 2005-06-27 Liquid-circulating system and liquid-cooling system using the same
US11/187,357 US20060018775A1 (en) 2004-07-22 2005-07-21 Liquid circulation system and liquid cooling system therewith
CNA2005100859957A CN1725150A (zh) 2004-07-22 2005-07-21 液体循环系统以及使用了该液体循环系统的液冷系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004214574A JP2006039663A (ja) 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム

Publications (1)

Publication Number Publication Date
JP2006039663A true JP2006039663A (ja) 2006-02-09

Family

ID=35657349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004214574A Pending JP2006039663A (ja) 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム

Country Status (4)

Country Link
US (1) US20060018775A1 (enExample)
JP (1) JP2006039663A (enExample)
CN (1) CN1725150A (enExample)
TW (1) TW200610480A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019138256A (ja) * 2018-02-14 2019-08-22 日本電産サンキョー株式会社 冷却装置
JP2022084711A (ja) * 2021-03-08 2022-06-07 バイドゥ ユーエスエイ エルエルシー 高度な液体冷却シール構造
JP7485126B2 (ja) 2018-03-30 2024-05-16 ニデック株式会社 冷却装置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047371A (ja) * 2004-07-30 2006-02-16 Orion Denki Kk 表示管を備えた電子機器
TWI363141B (en) * 2006-01-11 2012-05-01 Delta Electronics Inc Water pump and bearing thereof
US20070224059A1 (en) * 2006-03-23 2007-09-27 Cheng-Tien Lai Miniature pump for liquid cooling system
EP1895825A1 (de) * 2006-08-31 2008-03-05 Gesellschaft für Innovat. Industrieelektronik mbH Aufbau für eine Stromversorgung mit einer Kühleinrichtung
US7688589B2 (en) * 2007-11-01 2010-03-30 Asia Vital Components Co., Ltd. Water cooled heat dissipation module for electronic device
JP2010022711A (ja) * 2008-07-23 2010-02-04 Fujitsu Ltd 放熱用水枕
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
CN107436657B (zh) * 2016-05-26 2019-11-01 刘小明 Pc终端及其散热装置
WO2018095609A2 (en) 2016-11-22 2018-05-31 Belimo Holding Ag Hydronic system and method for operating such hydronic system
GB2565592A (en) 2017-08-18 2019-02-20 Cooltera Ltd A cooling unit
TWI672091B (zh) * 2017-11-22 2019-09-11 微星科技股份有限公司 散熱器及冷卻系統
TWI742747B (zh) * 2019-08-28 2021-10-11 訊凱國際股份有限公司 渦流水箱
CN114063743B (zh) * 2020-07-31 2025-09-26 华为技术有限公司 液冷系统及电子设备
CN114153292B (zh) * 2021-11-18 2023-08-22 南方电网数字电网研究院有限公司 一种服务器散热装置
CN114371768B (zh) * 2021-12-21 2024-11-12 惠州汉旭五金塑胶科技有限公司 单水排内置双水泵的水冷散热水排
TWI842444B (zh) * 2023-03-21 2024-05-11 黃崇賢 應用於液冷散熱器的液冷排
CN118658841B (zh) * 2024-08-19 2024-11-01 成都贡爵微电子有限公司 一种大功率SiP的板级集成散热结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI272054B (en) * 2002-06-26 2007-01-21 Matsushita Electric Industrial Co Ltd Cooling device, method for manufacturing the same and portable equipment
JP2004047843A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 電子装置
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
JP4122250B2 (ja) * 2003-03-31 2008-07-23 山洋電気株式会社 電子部品冷却装置
JP4244703B2 (ja) * 2003-05-26 2009-03-25 パナソニック株式会社 冷却装置
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
JP2005129812A (ja) * 2003-10-27 2005-05-19 Hitachi Ltd 液冷システム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019138256A (ja) * 2018-02-14 2019-08-22 日本電産サンキョー株式会社 冷却装置
JP7181443B2 (ja) 2018-02-14 2022-12-01 日本電産サンキョー株式会社 冷却装置
JP7485126B2 (ja) 2018-03-30 2024-05-16 ニデック株式会社 冷却装置
JP2022084711A (ja) * 2021-03-08 2022-06-07 バイドゥ ユーエスエイ エルエルシー 高度な液体冷却シール構造
US12216025B2 (en) 2021-03-08 2025-02-04 Baidu Usa Llc Advanced sealing structure for liquid cooling

Also Published As

Publication number Publication date
TWI293860B (enExample) 2008-02-21
CN1725150A (zh) 2006-01-25
TW200610480A (en) 2006-03-16
US20060018775A1 (en) 2006-01-26

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