TW200610480A - Liquid-circulating system and liquid-cooling system using the same - Google Patents

Liquid-circulating system and liquid-cooling system using the same

Info

Publication number
TW200610480A
TW200610480A TW094121472A TW94121472A TW200610480A TW 200610480 A TW200610480 A TW 200610480A TW 094121472 A TW094121472 A TW 094121472A TW 94121472 A TW94121472 A TW 94121472A TW 200610480 A TW200610480 A TW 200610480A
Authority
TW
Taiwan
Prior art keywords
liquid
impeller
same
cooling system
hole
Prior art date
Application number
TW094121472A
Other languages
Chinese (zh)
Other versions
TWI293860B (en
Inventor
Hironori Oikawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200610480A publication Critical patent/TW200610480A/en
Application granted granted Critical
Publication of TWI293860B publication Critical patent/TWI293860B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/08—Cooling; Heating; Preventing freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

To obtain a liquid-circulating system and a liquid-cooling system using the same. A pump 114, which is provided with an impeller having a plurality of blades 203, is installed via a packing 210 at an opening section formed on the wall surface of one of the components, such as a radiator 112 in a liquid circulation path so that the impeller of the pump part may be arranged therein. Inside the component, a partitioning plate 305 having a hole 304 at a position facing the center of the impeller is provided, and a port 306 is provided between the surfaces of the wall having the opening section and the partitioning plate. The impeller rotates to generate a liquid flow from the inside of the component to the port via the hole.
TW094121472A 2004-07-22 2005-06-27 Liquid-circulating system and liquid-cooling system using the same TW200610480A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004214574A JP2006039663A (en) 2004-07-22 2004-07-22 Liquid-circulating system and liquid-cooling system using the same

Publications (2)

Publication Number Publication Date
TW200610480A true TW200610480A (en) 2006-03-16
TWI293860B TWI293860B (en) 2008-02-21

Family

ID=35657349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121472A TW200610480A (en) 2004-07-22 2005-06-27 Liquid-circulating system and liquid-cooling system using the same

Country Status (4)

Country Link
US (1) US20060018775A1 (en)
JP (1) JP2006039663A (en)
CN (1) CN1725150A (en)
TW (1) TW200610480A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047371A (en) * 2004-07-30 2006-02-16 Orion Denki Kk Electronic equipment equipped with display tube
TWI363141B (en) * 2006-01-11 2012-05-01 Delta Electronics Inc Water pump and bearing thereof
US20070224059A1 (en) * 2006-03-23 2007-09-27 Cheng-Tien Lai Miniature pump for liquid cooling system
EP1895825A1 (en) * 2006-08-31 2008-03-05 Gesellschaft für Innovat. Industrieelektronik mbH Structure for a power supply with a cooling device
US7688589B2 (en) * 2007-11-01 2010-03-30 Asia Vital Components Co., Ltd. Water cooled heat dissipation module for electronic device
JP2010022711A (en) * 2008-07-23 2010-02-04 Fujitsu Ltd Water pillow for heat radiation
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
CN105263301B (en) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 A kind of liquid cooling heat radiation system and its liquid radiating row
CN107436657B (en) * 2016-05-26 2019-11-01 刘小明 PC terminal and its radiator
WO2018095609A2 (en) * 2016-11-22 2018-05-31 Belimo Holding Ag Hydronic system and method for operating such hydronic system
GB2565592A (en) 2017-08-18 2019-02-20 Cooltera Ltd A cooling unit
TWI672091B (en) * 2017-11-22 2019-09-11 微星科技股份有限公司 Heat dissipation device and cooling system
JP7181443B2 (en) * 2018-02-14 2022-12-01 日本電産サンキョー株式会社 Cooling system
US20220283050A1 (en) * 2021-03-08 2022-09-08 Baidu Usa Llc Advanced sealing structure for liquid cooling
CN114153292B (en) * 2021-11-18 2023-08-22 南方电网数字电网研究院有限公司 Heat abstractor of server
CN114371768A (en) * 2021-12-21 2022-04-19 惠州汉旭五金塑胶科技有限公司 Water-cooling radiating water drain with single water drain and built-in double water pumps

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561226B (en) * 2001-09-25 2003-11-11 Matsushita Electric Ind Co Ltd Ultra-thin pump and cooling system including the pump
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI272054B (en) * 2002-06-26 2007-01-21 Matsushita Electric Ind Co Ltd Cooling device, method for manufacturing the same and portable equipment
JP2004047843A (en) * 2002-07-15 2004-02-12 Hitachi Ltd Electronic equipment
JP3981628B2 (en) * 2002-11-28 2007-09-26 株式会社東芝 Cooling pump, electrical equipment and personal computer
JP4122250B2 (en) * 2003-03-31 2008-07-23 山洋電気株式会社 Electronic component cooling system
JP4244703B2 (en) * 2003-05-26 2009-03-25 パナソニック株式会社 Cooling system
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
JP2005129812A (en) * 2003-10-27 2005-05-19 Hitachi Ltd Liquid-cooling system

Also Published As

Publication number Publication date
CN1725150A (en) 2006-01-25
US20060018775A1 (en) 2006-01-26
JP2006039663A (en) 2006-02-09
TWI293860B (en) 2008-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees