CN1725150A - 液体循环系统以及使用了该液体循环系统的液冷系统 - Google Patents

液体循环系统以及使用了该液体循环系统的液冷系统 Download PDF

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Publication number
CN1725150A
CN1725150A CNA2005100859957A CN200510085995A CN1725150A CN 1725150 A CN1725150 A CN 1725150A CN A2005100859957 A CNA2005100859957 A CN A2005100859957A CN 200510085995 A CN200510085995 A CN 200510085995A CN 1725150 A CN1725150 A CN 1725150A
Authority
CN
China
Prior art keywords
mentioned
impeller
liquid
pump
circulation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100859957A
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English (en)
Chinese (zh)
Inventor
及川洋典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1725150A publication Critical patent/CN1725150A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/08—Cooling; Heating; Preventing freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNA2005100859957A 2004-07-22 2005-07-21 液体循环系统以及使用了该液体循环系统的液冷系统 Pending CN1725150A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004214574A JP2006039663A (ja) 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム
JP214574/2004 2004-07-22

Publications (1)

Publication Number Publication Date
CN1725150A true CN1725150A (zh) 2006-01-25

Family

ID=35657349

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100859957A Pending CN1725150A (zh) 2004-07-22 2005-07-21 液体循环系统以及使用了该液体循环系统的液冷系统

Country Status (4)

Country Link
US (1) US20060018775A1 (enExample)
JP (1) JP2006039663A (enExample)
CN (1) CN1725150A (enExample)
TW (1) TW200610480A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107436657A (zh) * 2016-05-26 2017-12-05 刘小明 Pc终端及其散热装置
CN109819626A (zh) * 2017-11-22 2019-05-28 微星科技股份有限公司 散热器及冷却系统
CN110162156A (zh) * 2018-02-14 2019-08-23 日本电产三协株式会社 冷却装置
CN110234933A (zh) * 2016-11-22 2019-09-13 贝利莫控股公司 液体循环系统及用于操作此液体循环系统的方法
CN112449552A (zh) * 2019-08-28 2021-03-05 讯凯国际股份有限公司 涡流水箱
CN114063743A (zh) * 2020-07-31 2022-02-18 华为技术有限公司 液冷系统及电子设备

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047371A (ja) * 2004-07-30 2006-02-16 Orion Denki Kk 表示管を備えた電子機器
TWI363141B (en) * 2006-01-11 2012-05-01 Delta Electronics Inc Water pump and bearing thereof
US20070224059A1 (en) * 2006-03-23 2007-09-27 Cheng-Tien Lai Miniature pump for liquid cooling system
EP1895825A1 (de) * 2006-08-31 2008-03-05 Gesellschaft für Innovat. Industrieelektronik mbH Aufbau für eine Stromversorgung mit einer Kühleinrichtung
US7688589B2 (en) * 2007-11-01 2010-03-30 Asia Vital Components Co., Ltd. Water cooled heat dissipation module for electronic device
JP2010022711A (ja) * 2008-07-23 2010-02-04 Fujitsu Ltd 放熱用水枕
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
GB2565592A (en) 2017-08-18 2019-02-20 Cooltera Ltd A cooling unit
JP7238401B2 (ja) 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
US12216025B2 (en) 2021-03-08 2025-02-04 Baidu Usa Llc Advanced sealing structure for liquid cooling
CN114153292B (zh) * 2021-11-18 2023-08-22 南方电网数字电网研究院有限公司 一种服务器散热装置
CN114371768B (zh) * 2021-12-21 2024-11-12 惠州汉旭五金塑胶科技有限公司 单水排内置双水泵的水冷散热水排
TWI842444B (zh) * 2023-03-21 2024-05-11 黃崇賢 應用於液冷散熱器的液冷排
CN118658841B (zh) * 2024-08-19 2024-11-01 成都贡爵微电子有限公司 一种大功率SiP的板级集成散热结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI272054B (en) * 2002-06-26 2007-01-21 Matsushita Electric Industrial Co Ltd Cooling device, method for manufacturing the same and portable equipment
JP2004047843A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 電子装置
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
JP4122250B2 (ja) * 2003-03-31 2008-07-23 山洋電気株式会社 電子部品冷却装置
JP4244703B2 (ja) * 2003-05-26 2009-03-25 パナソニック株式会社 冷却装置
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
JP2005129812A (ja) * 2003-10-27 2005-05-19 Hitachi Ltd 液冷システム

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107436657A (zh) * 2016-05-26 2017-12-05 刘小明 Pc终端及其散热装置
CN107436657B (zh) * 2016-05-26 2019-11-01 刘小明 Pc终端及其散热装置
CN110234933A (zh) * 2016-11-22 2019-09-13 贝利莫控股公司 液体循环系统及用于操作此液体循环系统的方法
US10890351B2 (en) 2016-11-22 2021-01-12 Belimo Holding Ag Hydronic system and method for operating such hydronic system
CN109819626A (zh) * 2017-11-22 2019-05-28 微星科技股份有限公司 散热器及冷却系统
CN109819626B (zh) * 2017-11-22 2023-03-28 微星科技股份有限公司 散热器及冷却系统
CN110162156A (zh) * 2018-02-14 2019-08-23 日本电产三协株式会社 冷却装置
CN110162156B (zh) * 2018-02-14 2023-10-20 日本电产三协株式会社 冷却装置
CN112449552A (zh) * 2019-08-28 2021-03-05 讯凯国际股份有限公司 涡流水箱
CN112449552B (zh) * 2019-08-28 2025-06-27 讯凯国际股份有限公司 涡流水箱
CN114063743A (zh) * 2020-07-31 2022-02-18 华为技术有限公司 液冷系统及电子设备

Also Published As

Publication number Publication date
TWI293860B (enExample) 2008-02-21
TW200610480A (en) 2006-03-16
US20060018775A1 (en) 2006-01-26
JP2006039663A (ja) 2006-02-09

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