TW200610480A - Liquid-circulating system and liquid-cooling system using the same - Google Patents

Liquid-circulating system and liquid-cooling system using the same

Info

Publication number
TW200610480A
TW200610480A TW094121472A TW94121472A TW200610480A TW 200610480 A TW200610480 A TW 200610480A TW 094121472 A TW094121472 A TW 094121472A TW 94121472 A TW94121472 A TW 94121472A TW 200610480 A TW200610480 A TW 200610480A
Authority
TW
Taiwan
Prior art keywords
liquid
impeller
same
cooling system
hole
Prior art date
Application number
TW094121472A
Other languages
English (en)
Chinese (zh)
Other versions
TWI293860B (enExample
Inventor
Hironori Oikawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200610480A publication Critical patent/TW200610480A/zh
Application granted granted Critical
Publication of TWI293860B publication Critical patent/TWI293860B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/08—Cooling; Heating; Preventing freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094121472A 2004-07-22 2005-06-27 Liquid-circulating system and liquid-cooling system using the same TW200610480A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004214574A JP2006039663A (ja) 2004-07-22 2004-07-22 液循環システム及びこれを用いる液冷システム

Publications (2)

Publication Number Publication Date
TW200610480A true TW200610480A (en) 2006-03-16
TWI293860B TWI293860B (enExample) 2008-02-21

Family

ID=35657349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121472A TW200610480A (en) 2004-07-22 2005-06-27 Liquid-circulating system and liquid-cooling system using the same

Country Status (4)

Country Link
US (1) US20060018775A1 (enExample)
JP (1) JP2006039663A (enExample)
CN (1) CN1725150A (enExample)
TW (1) TW200610480A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047371A (ja) * 2004-07-30 2006-02-16 Orion Denki Kk 表示管を備えた電子機器
TWI363141B (en) * 2006-01-11 2012-05-01 Delta Electronics Inc Water pump and bearing thereof
US20070224059A1 (en) * 2006-03-23 2007-09-27 Cheng-Tien Lai Miniature pump for liquid cooling system
EP1895825A1 (de) * 2006-08-31 2008-03-05 Gesellschaft für Innovat. Industrieelektronik mbH Aufbau für eine Stromversorgung mit einer Kühleinrichtung
US7688589B2 (en) * 2007-11-01 2010-03-30 Asia Vital Components Co., Ltd. Water cooled heat dissipation module for electronic device
JP2010022711A (ja) * 2008-07-23 2010-02-04 Fujitsu Ltd 放熱用水枕
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
CN107436657B (zh) * 2016-05-26 2019-11-01 刘小明 Pc终端及其散热装置
WO2018095609A2 (en) 2016-11-22 2018-05-31 Belimo Holding Ag Hydronic system and method for operating such hydronic system
GB2565592A (en) 2017-08-18 2019-02-20 Cooltera Ltd A cooling unit
TWI672091B (zh) * 2017-11-22 2019-09-11 微星科技股份有限公司 散熱器及冷卻系統
JP7181443B2 (ja) * 2018-02-14 2022-12-01 日本電産サンキョー株式会社 冷却装置
JP7238401B2 (ja) 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
TWI742747B (zh) * 2019-08-28 2021-10-11 訊凱國際股份有限公司 渦流水箱
CN114063743B (zh) * 2020-07-31 2025-09-26 华为技术有限公司 液冷系统及电子设备
US12216025B2 (en) 2021-03-08 2025-02-04 Baidu Usa Llc Advanced sealing structure for liquid cooling
CN114153292B (zh) * 2021-11-18 2023-08-22 南方电网数字电网研究院有限公司 一种服务器散热装置
CN114371768B (zh) * 2021-12-21 2024-11-12 惠州汉旭五金塑胶科技有限公司 单水排内置双水泵的水冷散热水排
TWI842444B (zh) * 2023-03-21 2024-05-11 黃崇賢 應用於液冷散熱器的液冷排
CN118658841B (zh) * 2024-08-19 2024-11-01 成都贡爵微电子有限公司 一种大功率SiP的板级集成散热结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI272054B (en) * 2002-06-26 2007-01-21 Matsushita Electric Industrial Co Ltd Cooling device, method for manufacturing the same and portable equipment
JP2004047843A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 電子装置
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
JP4122250B2 (ja) * 2003-03-31 2008-07-23 山洋電気株式会社 電子部品冷却装置
JP4244703B2 (ja) * 2003-05-26 2009-03-25 パナソニック株式会社 冷却装置
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
JP2005129812A (ja) * 2003-10-27 2005-05-19 Hitachi Ltd 液冷システム

Also Published As

Publication number Publication date
TWI293860B (enExample) 2008-02-21
CN1725150A (zh) 2006-01-25
US20060018775A1 (en) 2006-01-26
JP2006039663A (ja) 2006-02-09

Similar Documents

Publication Publication Date Title
TW200610480A (en) Liquid-circulating system and liquid-cooling system using the same
US9677820B2 (en) Electronic device and liquid cooling heat dissipation structure thereof
US10271456B2 (en) Enclosure for liquid submersion cooled electronics
US8760865B2 (en) Computer casing having liquid cooling unit
US8550149B2 (en) Water-cooled heat sink
US10895262B2 (en) Pump module having two impellers in series and a multiple plate housing
TW200507737A (en) Cooling device for an electronic instrument
US7733647B2 (en) Waterproof casing for a power supply
US20190107122A1 (en) Slim pump structure
TW200741103A (en) Pump and liquid supply apparatus
ATE491095T1 (de) Tauchpumpe
TWI744363B (zh) 用於電氣箱櫃之冷卻板總成
TWI256876B (en) Liquid-cooling type heat dissipation module
TW201418581A (zh) 散熱風扇及帶有散熱風扇之散熱裝置
AU2015223267B2 (en) Bilge pump having concealed air-lock vent
TWI742747B (zh) 渦流水箱
US10739829B2 (en) Pressurized infusion device and liquid cooling system
TW201314055A (zh) 風扇結構及應用其的電子裝置
KR101088016B1 (ko) 이중의 공기 냉각 순환구조를 가지는 케이스
JP4438407B2 (ja) Ｄｃブラシレスポンプ
JP6581806B2 (ja) ポンプユニット、給水装置
CN202565146U (zh) 功率模块用内置式水冷散热板
KR20180114347A (ko) 컴퓨터 중앙처리장치의 수냉식 냉각용 냉각수 저장장치
US20150044042A1 (en) Fan assembly
US20180058464A1 (en) Pump Having Edge Mounted O-Ring Seal

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees