JP2006032748A - Substrate with built-in component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board with built-in component which can reduce cost, and to provide a wiring board with built-in components of high reliability. <P>SOLUTION: At first, a recess 2a is formed in the upper surface of an insulating layer 2, and conductive layers 5, 6, 9 are formed, at least in both the upper and lower surfaces of the insulating layer 2 and the inner surface of the recess 2a. The conductive layers 5, 6 of both the upper and lower surfaces of the insulating layer 2 are subjected to patterning, and a core wiring board is manufactured. A component 12 is positioned inside the recess 2a, and thereafter, the terminal of the component 12 and the conductive layer 9 formed in the inner surface of the recess 2a are connected by a solder 13. Lamination is formed, by laminating insulating layers 3, 4 each in both the upper and lower surfaces of the core wiring board, whereto the component 12 is connected by the solder 13 so as to fill the periphery of the component. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a component-embedded substrate for manufacturing a component-embedded substrate with a built-in electric / electronic component, and a component-embedded substrate with a built-in electric / electronic component.

  In recent years, electronic technology has advanced, electronic devices and communication devices have become highly functional, and miniaturization has also progressed. In such a situation, for example, semiconductor mounting on a wiring board, a bare chip mounting method not using package mounting has been put into practical use in order to improve mounting density. In addition, passive components such as capacitors and resistors are downsized to a size of 0.6 mm × 0.3 mm (0603).

As the wiring board itself, the electrical connection between the wiring layers (interlayer connection) is based on the conductive layer formed on the inner surface of the through hole, and a hole is formed for each layer by a CO ₂ laser or a UV-YAG laser. There is a shift to those that form plating on the inside and those that are filled with conductive paste (so-called blind vias). For wiring pattern formation, a method (additive method) of forming a metallized wiring by plating instead of a method by etching (subtractive method) is being used for miniaturization. Thereby, it is possible to form finely up to about L / S (line / space) = about 20 μm / 20 μm.

In such a situation, in order to further improve the component mounting density and contribute to downsizing of the device, for example, a component built-in wiring board in which components are built in the wiring board can be used. An example of the component built-in wiring board is disclosed in Japanese Patent Application Laid-Open No. 2004-134424.
JP 2004-134424 A

  In the above publication, a solder paste is applied between a component terminal and a conductive layer, and the solder paste is reflowed in a reflow furnace to electrically and mechanically connect the component terminal and the conductive layer. . Here, in the above publication, since a through hole is formed in the core wiring board, a support member for positioning a component in the through hole is required. Since this support member is housed in the reflow furnace together with the core wiring board and components, it is necessary to form the support member from a high heat resistant material.

  The present invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a method for manufacturing a component built-in wiring board and a highly reliable component built-in wiring board capable of reducing cost.

  In the method for manufacturing a wiring board with a built-in component according to the present invention, a recess is formed on the upper surface of the first insulating layer, and a conductive layer is formed on at least the upper and lower surfaces of the first insulating layer and the inner surface of the recess. Patterning portions of the conductive layers on the upper and lower surfaces of the layer to manufacture a core wiring board; positioning the electrical / electronic component in the recess; and the terminals of the positioned electrical / electronic component; A step of connecting a portion of the conductive layer formed on the inner surface of the recess with a conductive member, and the electric / electronic overlaid on both upper and lower surfaces of the core wiring board to which the electric / electronic component is connected by the conductive member. And a step of laminating and forming a second insulating layer so as to fill the periphery of the component.

  According to the method of manufacturing a wiring board with a built-in component of the present invention, since the core wiring board having the insulating layer with the recess formed on the upper surface is manufactured, the electrical / electronic component can be supported on the inner bottom surface of the recess. it can. Thereby, since a support member becomes unnecessary, cost reduction can be aimed at.

  The component built-in wiring board of the present invention includes a first insulating layer having a recess formed on the upper surface, a conductive layer formed on at least the upper and lower surfaces of the first insulating layer and the inner surface of the recess, and a terminal. And the electrical / electronic component embedded in the recess so that the terminal faces the portion of the conductive layer formed on the inner surface of the recess, and the terminal of the electrical / electronic component embedded in the recess Embedded in the recess, and a connecting member that is electrically and mechanically connected between the terminal and the conductive layer portion provided at a distance between the conductive layer formed on the inner surface of the recess and the conductive layer portion. The upper / lower two second insulating layers are provided so as to cover the outer surface of the electric / electronic component other than the portion connected to the connection member and to be in close contact with the upper and lower surfaces of the electric / electronic component. It is characterized by.

  According to the method of manufacturing a component built-in wiring board of the present invention, the cost can be reduced. According to the component built-in wiring board of the present invention, a highly reliable component built-in wiring board can be provided.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic vertical sectional view of a component built-in wiring board according to the present embodiment.

  As shown in FIG. 1, the component built-in wiring board 1 includes insulating layers 2 to 4, near the boundary between the insulating layers 2 and 3, near the boundary between the insulating layers 2 and 4, the upper surface of the insulating layer 3, and the insulating layer. A four-layer wiring board having conductive layers 5 to 8 on the lower surface of the layer 4. Electrical connection (interlayer connection) between the conductive layers 5 and 6 is made by the conductive layer 9 in the vertical direction. Electrical connection between the conductive layers 5 and 7 and between the conductive layers 6 and 8 is made by the conductive bumps 10 and 11, respectively. Such conductive bumps 10 and 11 improve the utilization efficiency of the main surface of the wiring board and are suitable for high-density mounting.

  A recess 2 a is formed on the upper surface side of the insulating layer 2, and a hole 2 b communicating with the recess 2 a is formed on the lower surface side of the insulating layer 2. An electrical / electronic component 12 (hereinafter, “electrical / electronic component” is simply referred to as “component”) is incorporated in the recess 2 a so that the upper surface is not positioned above the upper surface of the conductive layer 5. Both terminals of the component 12 face the conductive layer 9 formed in the plate thickness direction and are electrically and mechanically connected via solder 13 as a connecting member. As shown in the figure, the conductive layer 9 is formed on the inner surface of the recess 2a and the inner surface of the hole 2b, and can be directly electrically connected to the conductive layers 5 and 6. The concave portion 2a is occupied by the protruding portion to the inside of the component 12, the solder 13, and the upper and lower insulating layers 3 and 4.

  The specific dimension (thickness) is preferably such that the thickness of the insulating layer 2 is about 0.5 mm to 1.5 mm. The reason why the thickness of the insulating layer 2 is set to 0.5 mm to 1.5 mm is that when the thickness of the insulating layer 2 is less than 0.5 mm, the rigidity necessary to support the component 12 cannot be maintained. Moreover, if the thickness of the insulating layer 2 exceeds 1.5 mm, the thickness of the insulating layer 2 becomes too thick, and the meaning of incorporating the component 12 in the insulating layer 2 is lost. The insulating layer 2 uses a single layer, but may be a laminate of two or more layers.

  In addition, each member material is, for example, epoxy resin, polyimide resin, bismaleimide triazine resin, etc. for the insulating layers 2-4, copper, for example, for the conductive layers 5-9, and fine metal, for example, for the conductive bumps 10, 11. A conductive resin in which grains (Ag, Cu, Au, solder, etc.) are dispersed in a resin can be used. For the solder 13, a conductive resin can be used instead.

  Examples of the component 12 include passive components and active components such as a chip resistor, a chip capacitor, a chip inductor, and a chip diode. The size of the component 12 is preferably, for example, 0.6 mm × 0.3 mm (0603), 0.4 mm × 0.2 mm (0402), or the like.

  Next, an example of a process for manufacturing the component built-in wiring board 1 having the above structure will be described with reference to FIGS. 2 (a) to 6 (b). 2 (a) to 5 (c) are diagrams schematically showing a process for manufacturing the component built-in wiring board according to the present embodiment, and FIGS. 6 (a) and 6 (b) It is the figure which showed typically the process which manufactures the wiring board raw material which concerns on this Embodiment. In these drawings, the same reference numerals are assigned to the same equivalent parts. Moreover, the same code | symbol is attached | subjected also to the part corresponding to the component built-in wiring board shown in FIG.

  First, a core wiring board composed of the insulating layer 2 and the conductive layers 5, 6, 9 is prepared. This core wiring board can be produced, for example, as follows. For example, a flat Cu plate 21 having a thickness of about 0.15 mm is prepared, and as shown in FIG. 2A, a convex portion 21a is formed on the Cu plate 21 by etching using, for example, a photolithography technique. Specifically, for example, the surface of the Cu plate 21 is chemically polished to improve the adhesion to the resist dry film, and then the resist dry film is laminated on the Cu plate 21. Then, the dry film is exposed with an alignment exposure machine having, for example, an ultrahigh pressure mercury lamp through a photomask, and further spray-developed with sodium carbonate. By leaving the dry film of this development pattern on the Cu plate 21, a patterned resist is formed on the Cu plate 21. When the resist is formed on the Cu layer 21, using this as a mask, a chemical solution based on ferric chloride is used as an etchant, and the Cu plate 21 at a position removed as a resist pattern is spray-etched. Thereby, the convex portion 21 a is formed on the Cu plate 21.

  After forming the convex portions 21a on the Cu plate 21, as shown in FIG. 2B, for example, an Ni layer 22 having a thickness of about 0.5 μm is formed on the Cu plate 21 by, for example, electrolytic plating, and the Ni layer 22 is formed. For example, a Cu layer 23 having a thickness of about 0.5 μm is formed.

  After forming the Ni layer 22 and the Cu layer 23 on the Cu plate 21, the insulating layer 2 having a thickness of about 0.5 mm to 1.5 mm is laminated on the Cu layer 22 as shown in FIG. A Cu foil 24 is laminated on the insulating layer 2 and pressed while heating. Thereby, these components are integrated, and the convex portion 21 a and the Ni layer 22 and the Cu layer 23 on the convex portion 21 a enter the insulating layer 2, and the concave portion 2 a is formed in the insulating layer 2. In this manufacturing process, the insulating layer 2 formed using “R-1551” (trade name) manufactured by Matsushita Electric Works, Ltd. was used.

  After the concave portion 2a is formed in the insulating layer 2, the portion of the Cu foil 24 located on the convex portion 21a is removed by etching, for example, and an opening 24a is formed in the Cu foil 24 as shown in FIG. . This etching can be performed by the same method as the etching of the Cu plate 21.

After the opening 24a is formed in the Cu foil 24, a portion of the insulating layer 2 exposed from the opening 24a is irradiated with a laser such as a CO ₂ laser or a YAG laser, for example, so as to insulate as shown in FIG. Holes 2 b are formed in the layer 2 and the Cu layer 23. Thereby, the hole 2b connected to the recessed part 2a is formed. Since the Ni layer 22 functions as a stopper layer, no hole is formed in the Ni layer 22.

  After the holes 2b are formed in the insulating layer 2 and the like, a protective film 25 is attached to the Cu foil 24 so that the Cu foil 24 is not etched by the etching described below as shown in FIG. In this manufacturing process, “Hitalex” (trade name) manufactured by Hitachi Chemical Co., Ltd. was used as the protective film 25. And these things are immersed in an alkaline etching solution, for example, and the Cu plate 21 is selectively removed as shown in FIG.

  After removing the Cu plate 21, the protective film 25 is peeled off from the Cu foil 24. Thereafter, the Ni layer 22 is selectively removed by etching, for example. As a result, the Cu layer 23 is exposed on the upper surface side of the insulating layer 2 as shown in FIG.

  After the Cu layer 23 is exposed on the upper surface side of the insulating layer 2, Cu plating is performed on the inner surface of the hole 2b by, for example, an electroless plating method, and the Cu layer 23 and the Cu foil 24 are electrically connected. Thereafter, Cu plating is performed on the Cu layer 23 and the like by an electrolytic plating method and thickened. Thereby, the conductive layers 5, 6, and 9 are integrally formed as shown in FIG.

  After the conductive layers 5, 6, and 9 are formed, the conductive layers 5 and 6 are patterned by etching, for example, to form a circuit as shown in FIG. Thereby, a core wiring board is created. This etching can be performed by the same method as the etching of the Cu plate 21. The conductive layers 5 and 6 may be subjected to blackening reduction treatment in order to improve the adhesion with the insulating layers 3 and 4 to be laminated thereafter.

  After creating the core wiring board, the component 12 is positioned in the recess 2a by a mounting device such as a mounter as shown in FIG. Next, as shown in FIG. 4B, solder paste 26 (the solder paste is, for example, Sn-3.0Ag-0.5Cu lead-free solder) is applied to a predetermined position near both terminals of the component 12. . Such application can be performed, for example, by screen printing or a dispenser. Here, screen printing using a screen plate having 0.5 mm diameter pits was used.

  After the solder paste 26 is applied, these are accommodated in a reflow furnace without using a support member, and the solder paste 26 is reflowed. As a result, the solder paste 26 enters between the conductive layer 9 and the component 12 as shown in FIG. After that, the solder paste 26 is hardened and becomes the solder 13 by leaving it to stand. In addition, it is also possible to use an electrically conductive paste instead of the solder paste 26. In this case, for example, an electrical and mechanical connection is established by drying and curing in an oven.

  Next, the wiring board material 27 is laminated on both surfaces of the core wiring board and pressed while heating to integrate the core wiring board and the wiring board material 27 as shown in FIG. Here, the wiring board material 27 is composed of the prepregs 28 and 29 to be the insulating layers 3 and 4, the conductive layers 7 and 8, and the conductive bumps 10 and 11. For example, the wiring board material 27 is formed as follows. be able to.

  First, a conductive layer 7 (8) such as a Cu foil (thickness is 18 μm, for example) is prepared, and a necessary position (a specific position) on the conductive layer 7 (8) is prepared as shown in FIG. A substantially conical conductive bump 10 (11) is formed at a position according to the layout of the wiring board. This can be done, for example, by printing a conductive paste on the conductive layer 7 (8) using screen printing.

  As the screen plate in this case, for example, a screen plate having 0.2 mm through holes (pits) can be used. Thereby, for example, the conductive bump 10 (11) having a bottom diameter of about 0.15 mm or more can be formed. As the conductive paste, for example, metal particles (Ag, Au, Cu, solder, etc.) dispersed in a paste-like resin such as an epoxy resin, and a volatile solvent mixed can be used. After printing, the conductive paste is cured by drying in an oven, for example.

  Next, using a dedicated machine, the conductive layer 7 (8) is opposed to the prepreg 28 (29) (thickness is, for example, 0.06 mm) to be the insulating layer 3 (4), and is shown in FIG. 6B. As shown, the conductive bump 10 (11) is passed through the semi-cured prepreg 28 (29). Thereby, the wiring board material 27 is created. The prepreg 28 (29) is obtained by impregnating a reinforcing material such as glass fiber with a curable resin such as an epoxy resin. Moreover, it is in a semi-cured state before curing, and has thermoplasticity (fluidity due to heat) and thermosetting.

  For the lamination / integration of the core wiring board and the wiring board material 27, for example, alignment is performed with a lay-up device, the core wiring board and the wiring board material 27 are arranged in an overlapping manner, and this is performed using a vacuum lamination heat press. Set to a predetermined temperature and pressure profile. As a result of this lamination and integration, the conductive bumps 10 and 11 are plastically deformed by crushing their heads, and electrical connection with the conductive layers 5 and 6 is established. Further, the prepreg 28 (29) is cured, and the insulating layers 3 and 4 are formed.

  Here, the conductive layers 5 and 6 are positioned by sinking to the insulating layer 2 side due to the thermoplasticity (fluidity due to heat) of the prepreg 28 (29), and the conductive layers 5 and 6 are the heat of the prepreg 28 (29). Due to plasticity, it sinks into the insulating layer side and comes to a position. Further, due to the thermoplasticity of the prepreg 28 (29), the insulating layer 2 is integrally formed with the insulating layers 3 and 4 on the periphery thereof so as to cover and closely contact the built-in component 12. This eliminates the need for a hole filling process around the part 12 and simplifies the process, and also prevents the generation of voids and improves the reliability.

  The wiring board material 27 laminated on the outside may be one having a larger number of conductive layers instead of the one shown in FIG. 6B (for example, a prepreg 28 (in place of the one shown in FIG. 6A). If the conductive layer after patterning is pasted on both sides of (29), the number of conductive layers will be two at the stage of FIG. 6 (b). Further, the wiring board material 27 laminated on the outside does not necessarily need to be accompanied by the conductive bumps 10 (11) as shown in FIG. In this case, since there is no conductive bump 10 (11), the interlayer connection between the conductive layer 5 (6) and the conductive layer 7 (8) cannot be made by the conductive bump 10 (11). By providing a through hole in the wiring board, an interlayer connection structure by this through hole can be formed.

  After the core wiring board and the wiring board material 27 are laminated and integrated, the conductive layers 7 and 8 are patterned by etching, for example, to form a circuit as shown in FIG. This patterning can be performed by the same method as the patterning of the conductive layers 5 and 6. Thus, the component built-in wiring board 1 according to the present embodiment can be obtained. In addition, after the above lamination / integration, an insulating layer and a conductive layer may be further laminated / integrated (build-up) on the outside in the same manner.

  In the present embodiment, since the recess 2a is formed on the upper surface of the insulating layer 2, the component 12 can be supported by the inner bottom surface of the recess 2a. This eliminates the need for a support member that supports the component 12, thereby reducing the cost.

  In this embodiment, the hole 2b communicating with the recess 2a is formed on the lower surface of the insulating layer 2, and the conductive layer 9 is formed not only on the inner surface of the recess 2a but also on the inner surface of the hole 2b. Electrical connections between layers 5 and 6 can be made.

(Second Embodiment)
Next, a component built-in wiring board according to a second embodiment of the present invention will be described with reference to FIG. FIG. 7 is a schematic vertical sectional view of the component built-in wiring board according to the present embodiment. In FIG. 7, the same parts as those already described with reference to FIGS. 1 to 6C are denoted by the same reference numerals. The following explanation will be made avoiding duplication.

  As shown in FIG. 7, in this embodiment, insulating layers 31 to 33 are used instead of the insulating layer 2, and conductive layers 34 and 35 are provided in the vicinity of the boundary between them. Conductive bumps 36 to 38 are used for interlayer connection between the conductive layers 5 and 34. The conductive layer 9 can be directly electrically connected to the conductive layers 34 and 35. The conductive bumps 36 to 38 can be formed by using screen printing as described in FIG.

  The advantage of this embodiment is that all the interlayer connections are made by the conductive bumps 10, 11, 36 to 38 by making the interlayer connection by the three conductive bumps 36 to 38 with respect to the total thickness of the core wiring board. This is what I did. Here, the reason why the core wiring board is connected between the three conductive bumps 36 to 38 is that if the number is smaller than this, it is necessary to form a high bump and it is difficult to efficiently form the conductive bump. If there are about three in this way, there will be no difficulty in the formation height necessary for the total thickness. As a result, the core wiring board has four conductive layers, and has six conductive layers as a whole.

  However, if the formation height of the conductive bumps 36 to 38 is increased, a thicker prepreg can be penetrated. As a result, the number of conductive layers of the core wiring board is reduced even if the same component is incorporated. be able to. On the contrary, if the formation height of the conductive bumps 36 to 38 is lowered, a thinner prepreg is used. As a result, the number of conductive layers of the core wiring board can be increased.

  In order to manufacture the component built-in wiring board 1 shown in FIG. 7, instead of the insulating layer 2 shown in FIG. 2C, insulating layers 31 to 33, conductive layers 34 and 35, and conductive bumps 36 to 38 are configured. A four-layer plate as an element may be used. The subsequent processes are essentially the same as those shown in FIGS. 2 (d) to 5 (c). In order to obtain a four-layer plate, conductive bumps are printed and formed, and the formed conductive bumps are penetrated through the prepreg (see FIG. 6A and FIG. 6B for the above). What is necessary is just to repeat the process of laminating | stacking copper foil (or insulating layer with a wiring layer) on the side.

  In this embodiment, as in the previous embodiment, the existing manufacturing equipment can be used almost as it is, leading to a reduction in the manufacturing cost of the wiring board. Similarly, in the process for mounting and incorporating the component 12, the occurrence of defects in component mounting is extremely small, and manufacturing with a high yield is possible. Furthermore, by using four conductive layers in the core wiring board, the thickness of the core wiring board is set to a dimension that facilitates securing the component built-in space, and all the interlayer connections between the conductive layers such as the conductive layers 34 and 35 are made of conductive bumps. It is possible to realize further high-density mounting by performing 10, 11, 36 to 38.

  The present invention is not limited to the description of the above embodiment, and the structure, material, arrangement of each member, and the like can be appropriately changed without departing from the gist of the present invention.

FIG. 1 is a schematic vertical sectional view of the component built-in wiring board according to the first embodiment. FIG. 2A to FIG. 2D are diagrams schematically showing a process for manufacturing the component built-in wiring board according to the first embodiment. FIG. 3A to FIG. 3D are diagrams schematically showing a process for manufacturing the component built-in wiring board according to the first embodiment. FIG. 4A to FIG. 4D are diagrams schematically showing a process for manufacturing the component built-in wiring board according to the first embodiment. FIG. 5A to FIG. 5C are diagrams schematically showing a process for manufacturing the component built-in wiring board according to the first embodiment. FIGS. 6A and 6B are diagrams schematically showing a process for manufacturing the wiring board material according to the first embodiment. FIG. 7 is a schematic vertical sectional view of the component built-in wiring board according to the second embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Component built-in wiring board, 2-4, 31-33 ... Insulating layer, 5-9, 34, 35 ... Conductive layer 10, 11, 36-38 ... Conductive bump, 12 ... Component, 13 ... Solder.

Claims (7)

A recess is formed on the upper surface of the first insulating layer, a conductive layer is formed on at least the upper and lower surfaces of the first insulating layer and the inner surface of the recess, and portions of the conductive layers on the upper and lower surfaces of the insulating layer are patterned. The process of manufacturing the core wiring board,
Positioning an electrical / electronic component within the recess;
Connecting the terminal of the positioned electrical / electronic component and the portion of the conductive layer formed on the inner surface of the recess with a conductive member;
Stacking and forming a second insulating layer so as to overlap each of the upper and lower surfaces of the core wiring board to which the electrical / electronic component is connected by the conductive member and to fill the periphery of the electrical / electronic component. A method for manufacturing a component built-in wiring board.   The concave portion is formed by laminating a metal body having a convex portion corresponding to the concave portion and the first insulating layer, and pressurizing the metal body and the first insulating layer while heating. The method of manufacturing a component built-in wiring board according to claim 1.   In the step of forming the core wiring board, a through hole communicating with the recess is further formed on the lower surface side of the first insulating layer, and the conductive layer is also formed on the inner surface of the through hole. 3. A method of manufacturing a component built-in wiring board according to claim 1 or 2.   The method for manufacturing a component built-in wiring board according to any one of claims 1 to 3, wherein the conductive member is solder or conductive resin.   The step of manufacturing the core wiring board is to manufacture a core wiring board having four conductive layers, and to be manufactured so that electrical connection between these conductive layers is made with conductive bumps. The method of manufacturing a component built-in wiring board according to any one of claims 1 to 4. A first insulating layer having a recess formed on the upper surface;
A conductive layer formed on at least the upper and lower surfaces of the first insulating layer and the inner surface of the recess;
An electrical / electronic component embedded in the recess so that the terminal faces a portion of a conductive layer formed on the inner surface of the recess;
The terminal of the electrical / electronic component embedded in the recess and the portion of the conductive layer formed on the inner surface of the recess are electrically and mechanically connected to the terminal and the portion of the conductive layer. A connecting member to be connected to,
Two second upper and lower second electrodes are provided so as to cover the outer surface of the electric / electronic component embedded in the recess except for the portion connected to the connecting member and to be in close contact with the upper and lower surfaces of the electric / electronic component. A wiring board with a built-in component, comprising: an insulating layer. A plurality of plate direction conductive layers electrically connectable to the conductive layer;
The component built-in wiring board according to claim 6, further comprising: an interlayer connection body formed of conductive bumps for interlayer connection of the plurality of plate direction conductive layers.

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