JP2006030780A - Illumination optical apparatus, exposure apparatus and method for manufacturing microdevice - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination optical apparatus facilitating the optical axis adjustment of an illumination optical system. <P>SOLUTION: The illumination optical apparatus to illuminate an objective surface M with light from a light source is equipped with: a relay optical system 8 which guides the light from the light source to a predetermined position; an optical fiber 10 having an entrance end where the light from the relay optical system 8 enters and a plurality of exiting ends 10b to 10h where the light entering the entrance end 10d is divided into a plurality of beams to exit; and an inclination direction adjusting mechanism which inclines the entrance end 10a of the optical fiber 10 with respect to the optical axis of the relay optical system 8 so as to align the optical axis of the relay optical system 8 to the optical axis of the optical fiber 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an illumination optical apparatus used for manufacturing a semiconductor integrated circuit, a liquid crystal display element, etc., an exposure apparatus using the illumination optical apparatus, and a method of manufacturing a micro device using the exposure apparatus.

  A liquid crystal display element, which is one of the micro devices, is usually formed by patterning a transparent thin film electrode on a glass substrate (plate) into a desired shape by a photolithography technique, and switching elements and electrodes such as TFT (Thin Film Transistor). Manufactured by forming wiring. In a manufacturing process using this photolithography technique, a projection exposure apparatus that projects and exposes a pattern, which is an original image formed on a mask, onto a plate coated with a photosensitive agent such as a photoresist via a projection optical system. It is used.

  In recent years, with an increase in the area of a liquid crystal display element, it is desired to expand an exposure area of a projection exposure apparatus used in a photolithography process. To enlarge the exposure area of the projection exposure apparatus, mask the slit-shaped illumination light whose length in the longitudinal direction is set to be the same as the effective diameter of the projection optical system on the object plane side (mask side) of the projection optical system In a state where slit-like light through the mask is irradiated onto the plate through the projection optical system, the mask and the plate are moved relative to the projection optical system and scanned. A part of the pattern formed on the plate is sequentially transferred to one shot area set on the plate, and after the transfer, the plate is moved stepwise to perform exposure on the other shot areas in the same manner. A projection exposure apparatus of the type has been devised.

  Also, in recent years, in order to further expand the exposure area, projection exposure including a so-called multi-lens projection optical system that uses a plurality of small partial projection optical systems instead of using one large projection optical system. An apparatus has been devised (see, for example, Patent Document 1). In the projection exposure apparatus described in Patent Document 1, a plurality of small partial projection optical systems are arranged as a first row at a predetermined interval in a direction orthogonal to the scanning direction (non-scanning direction) and in a second row. Are arranged in a non-scanning direction at a predetermined interval. Further, the first row partial projection optical system and the second row partial projection optical system are arranged at a predetermined interval in the scanning direction, and the exposure region joint and the second row corresponding to the first row partial projection optical system are arranged. The whole surface of the plate is exposed by connecting the joints of the exposure areas corresponding to the partial projection optical system. Further, in a projection exposure apparatus including such a multi-lens projection optical system, an illumination fiber emitted from a light source includes a relay optical system, and an optical fiber that divides the illumination light emitted from the relay optical system into a plurality of pieces. Through the plurality of partial projection optical systems.

Japanese Patent Laid-Open No. 7-57986

  By the way, in a projection exposure apparatus provided with the above-described multi-lens projection optical system, it is necessary to perform optical axis adjustment for matching the optical axes of the optical members constituting the illumination optical system for illuminating the mask. . Here, in the conventional illumination optical system, when the optical axis adjustment for matching the optical axis of the relay optical system and the optical axis of the optical fiber is performed, the incident end of the optical fiber is the illumination optical system. The optical axis adjustment in the vertical direction of the optical axis of the illumination optical system could be performed by adjusting the position of the incident end of the optical fiber. It was necessary to adjust the optical axis in the tilt direction with respect to the optical axis by moving the relay optical system.

  However, along with the recent increase in the exposure area, the projection exposure apparatus has also increased in size, and the relay optical system is also increasing in size and weight, so in order to adjust the optical axis of the illumination optical system, A large and heavy relay optical system had to be moved, resulting in a great burden.

  An object of the present invention is to provide an illumination optical apparatus capable of easily adjusting the optical axis of an illumination optical system, an exposure apparatus provided with the illumination optical apparatus, and a method of manufacturing a micro device using the exposure apparatus. is there.

  The illumination optical device according to claim 1 is an illumination optical device that illuminates a surface to be irradiated with light from a light source unit. A relay optical system that guides light from the light source unit to a predetermined position; and An optical fiber having an incident end where light enters, and a plurality of exit ends that divide and emit light incident from the incident end, an optical axis of the relay optical system, and an optical axis of the optical fiber. In order to make it correspond, it is provided with the inclination direction adjustment mechanism which inclines the said incident end of the said optical fiber with respect to the optical axis of the said relay optical system.

  According to the illumination optical device of the first aspect, since the tilt direction adjusting mechanism for tilting the incident end of the optical fiber with respect to the optical axis of the relay optical system is provided, the optical axis of the relay optical system and the optical fiber The optical axis can be easily matched. That is, there is no need to move the housing in which the relay optical system, which has been enlarged with the recent increase in exposure area, for precise adjustment, and the optical axis of the relay optical system and the optical axis of the optical fiber. Can be adjusted easily and appropriately. Therefore, it is possible to satisfactorily illuminate the irradiated surface with the illumination light that passes through the optical fiber and the relay optical system in which the optical axes are appropriately adjusted by the tilt direction adjusting mechanism.

  The illumination optical apparatus according to claim 2, wherein the incident end of the optical fiber is perpendicular to the optical axis of the relay optical system so that the optical axis of the relay optical system coincides with the optical axis of the optical fiber. It is further characterized by further comprising a vertical adjustment mechanism for moving to the right.

  According to the illumination optical device of the second aspect, since the optical fiber further includes the vertical adjustment mechanism for moving the incident end of the optical fiber in the vertical direction of the optical axis of the relay optical system, the optical axis of the relay optical system and the optical fiber Of the optical axis of the relay optical system and the optical axis of the relay optical system and the optical axis of the optical fiber can be adjusted easily and accurately. Accordingly, it is possible to satisfactorily illuminate the irradiated surface with the illumination light via the relay optical system and the optical fiber in which the optical axes are accurately adjusted by the tilt direction adjusting mechanism and the vertical direction adjusting mechanism.

  The illumination optical apparatus according to claim 3 is characterized in that the tilt direction adjusting mechanism and the vertical direction adjusting mechanism are arranged at the incident end of the optical fiber.

  According to the illumination optical device of the third aspect, since the tilt direction adjusting mechanism and the vertical direction adjusting mechanism are arranged at the incident end of the optical fiber, the optical axis of the relay optical system and the optical axis of the optical fiber can be easily set. Can match. That is, there is no need to move the housing containing the relay optical system, which has been enlarged with the recent increase in exposure area, for precise adjustment, and the optical axis of the relay optical system and the optical axis of the optical fiber. Of the optical axis of the relay optical system and the optical axis of the optical fiber can be adjusted easily and accurately. Accordingly, it is possible to satisfactorily illuminate the irradiated surface with the illumination light via the relay optical system and the optical fiber in which the optical axes are accurately adjusted by the tilt direction adjusting mechanism and the vertical direction adjusting mechanism.

  An exposure apparatus according to claim 4, wherein the exposure apparatus illuminates the mask in an exposure apparatus that transfers a mask pattern onto a photosensitive substrate. A device is provided.

  According to the exposure apparatus of the fourth aspect, since the illumination optical apparatus in which the optical axis of the relay optical system and the optical fiber is accurately adjusted is provided, the pattern image of the mask is formed on the photosensitive substrate with high throughput. Can be exposed.

  According to a fifth aspect of the present invention, there is provided a microdevice manufacturing method comprising: an exposure step of exposing a pattern image of a mask onto a photosensitive substrate using the exposure apparatus according to claim 4; and a photosensitive substrate exposed by the exposure step. And a developing step for developing the film.

  According to the method of manufacturing a microdevice according to claim 5, the pattern image of the mask is transferred to the photosensitive substrate by using the exposure apparatus including the illumination optical apparatus in which the optical axis of the relay optical system and the optical fiber is accurately adjusted. Since the exposure is performed above, the microdevice can be manufactured with high throughput.

  According to the illumination optical apparatus of the present invention, the tilt direction adjusting mechanism that tilts the incident end of the optical fiber with respect to the optical axis of the relay optical system and the vertical that moves the incident end of the optical fiber in the direction perpendicular to the optical axis of the relay optical system. A direction adjustment mechanism is provided. In addition, since the tilt direction adjusting mechanism and the vertical direction adjusting mechanism are arranged at the incident end of the optical fiber, the housing in which the relay optical system that has been enlarged with the recent increase in the exposure area is stored is precisely There is no need to move to match the optical axis, the displacement of the optical axis of the relay optical system and the optical axis of the optical fiber in the tilt direction, and the vertical direction of the optical axis of the relay optical system and the optical axis of the optical fiber Can be adjusted easily and accurately. Accordingly, it is possible to satisfactorily illuminate the irradiated surface with the illumination light via the relay optical system and the optical fiber in which the optical axes are accurately adjusted by the tilt direction adjusting mechanism and the vertical direction adjusting mechanism.

  According to the exposure apparatus of the present invention, the illumination optical apparatus in which the optical axis of the relay optical system and the optical fiber is accurately adjusted is provided, so that the mask pattern image is exposed on the photosensitive substrate with high throughput. be able to.

  Also, according to the microdevice manufacturing method of the present invention, a mask pattern image is formed on a photosensitive substrate using an exposure apparatus that includes an illumination optical apparatus in which the optical axis alignment of the relay optical system and the optical fiber is accurately adjusted. Since exposure is performed, microdevices can be manufactured with high throughput.

  A projection exposure apparatus according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an overall schematic configuration of the projection exposure apparatus according to the first embodiment. In this embodiment, as shown in FIG. 1, a plurality of parts (in this embodiment, a part of a pattern of a mask (irradiated surface) M is projected onto a plate P as a photosensitive substrate. The pattern image formed on the mask M by moving the mask M and the plate P synchronously in the scanning direction with respect to the projection optical system PL including the seven) catadioptric partial projection optical systems PL1 to PL7. A step-and-scan type scanning projection exposure apparatus that performs scanning exposure will be described as an example.

  In the following description, the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. In this embodiment, the direction in which the plate P is moved (scanning direction) is set in the X-axis direction.

  As shown in FIG. 1, the projection exposure apparatus has a light source (light source unit) composed of an ultrahigh pressure mercury lamp (not shown) arranged at the first focal position of the elliptical mirror 4, and a predetermined amount of light from the light source. An illumination optical device including a relay optical system 8 leading to a position, an optical fiber box 10, and seven illumination optical units IL1 to IL7 is provided. The light beam emitted from the light source is reflected by the elliptical mirror 4 and the reflecting mirror 6, condensed at the second focal position of the elliptical mirror 4, passes through the relay optical system 8, and enters the incident end 10 a of the optical fiber box 10. To do. The optical fiber box 10 accommodates, for example, a random light guide fiber configured by randomly bundling a large number of fiber strands, and includes an incident end 10a and seven exit ends 10b, 10c, 10d, 10e, 10f, and 10g. , 10h.

  The incident end 10a of the optical fiber box 10 is inclined with respect to the optical axis of the relay optical system 8 so that the optical axis of the relay optical system 8 and the optical axis of the optical fiber accommodated in the optical fiber box 10 coincide with each other. It is configured to be possible. The incident end 10a of the optical fiber box 10 is configured to be movable in the direction perpendicular to the optical axis of the relay optical system 8 so that the optical axis of the relay optical system 8 coincides with the optical axis of the optical fiber. That is, the incident end 10a of the optical fiber box 10 is provided with an inclination direction adjusting mechanism and a vertical direction adjusting mechanism.

  FIG. 2 is a perspective view showing the incident end 10 a of the optical fiber box 10. As shown in FIG. 2, the incident end 10a includes a cylindrical member 30 that accommodates an incident side, which is one end of a number of fiber strands, and the cylindrical member 30 is disposed in the opening, and the cylindrical member 30 is placed in an optical fiber box. A first mounting member 32 for mounting on the housing 10, and a cylindrical member 30 and a first mounting member 32 in the opening, and the cylindrical member 30 and the first mounting member 32 are mounted on the housing of the optical fiber box 10. The 2nd attachment member 34 for attaching to is provided.

  FIG. 3 is a perspective view of the cylindrical member 30. The cylindrical member 30 is provided with a flange portion 30 a at the end of the optical fiber box 10 facing the housing. Further, parallel pins 33 and 34 extending in the Z-axis direction in the orthogonal coordinates shown in FIG. 3 are provided on the upper and lower portions in the vicinity of the flange portion 30a.

  FIG. 4 is a perspective view illustrating a state in which the cylindrical member 30 is disposed in the opening of the first mounting member 32 and the first mounting member 32 and the cylindrical member 30 are combined. As shown in FIG. 4, the parallel pins 33 and 34 provided on the cylindrical member 30 penetrate the side wall surface forming the opening of the first mounting member 32 in the Y-axis direction. Therefore, the cylindrical member 30 is movable in the Z-axis direction in the orthogonal coordinates shown in FIG. 4 within the opening of the first mounting member 32. Note that the position of the cylindrical member 30 in the Z-axis direction within the opening of the first mounting member 32 penetrates the side wall surface forming the opening of the first mounting member 32 in the Y-axis direction, and the outside of the cylindrical member 30 It is determined by screws 35 and 36 for bringing the tip portion into contact with the wall surface.

  Further, the cylindrical member 30 can rotate around the Z axis in the orthogonal coordinates shown in FIG. 4 around the parallel pins 33 and 34 provided on the cylindrical member 30. The rotational position around the Z axis of the cylindrical member 30 passes through the wall surface forming the opening of the first mounting member 32 in the X axis direction, and the front end is brought into contact with the flange portion 30a of the cylindrical member 30. It is determined by the screw 37 (and a screw similar to the screw 37 provided at a position sandwiching the cylindrical member 30).

  Further, parallel pins 38 and 39 extending in the Y-axis direction in the orthogonal coordinates shown in FIG. 4 are provided on the left and right wall surfaces of the first mounting member 32. FIG. 2 shows a state in which the cylindrical member 30 and the first mounting member 32 are arranged in the opening of the second mounting member 34, and the cylindrical member 30, the first mounting member 32, and the second mounting member 34 are combined. FIG. As shown in FIG. 2, the parallel pins 38 and 39 provided on the first mounting member 32 penetrate the side wall surface forming the opening of the second mounting member 34 in the Y-axis direction. Accordingly, the first mounting member 32 is movable in the Y-axis direction in the orthogonal coordinates shown in FIG. 2 within the opening of the second mounting member 34. The positions of the cylindrical member 30 and the first mounting member 32 in the Y-axis direction in the opening of the second mounting member 34 penetrate the side wall surface forming the opening of the second mounting member 34 in the Y-axis direction. These are determined by screws 40 and 41 that abut the front end portion on the outer wall surface of the first mounting member 32.

  Further, the cylindrical member 30 and the first attachment member 32 can rotate around the Y axis in the orthogonal coordinates shown in FIG. 2 around the parallel pins 38 and 39 provided on the first attachment member 32. The rotational position of the cylindrical member 30 about the Y axis passes through the flange portion provided around the opening of the first mounting member 32 in the X-axis direction, and the distal end portion extends to the flange portion of the second mounting member 34. It is determined by screws 41 and 42 for abutting.

  The cylindrical member 30 is configured to be tiltable with respect to the optical axis of the relay optical system 8 by the tilt direction adjusting mechanism and the vertical direction adjusting mechanism provided at the incident end 10a of the optical fiber box 10, and the relay The optical system 8 is configured to be movable in the direction perpendicular to the optical axis.

  The light beam incident on the incident end 10a of the optical fiber box 10 is mixed by propagating inside the optical fiber box 10 and divided into a plurality of (in this embodiment, seven), and the seven light beams in the optical fiber box 10 are divided. The light exits from the exit ends 10b to 10h and enters the seven illumination optical units IL1, IL2, IL3, IL4, IL5, IL6, and IL7, respectively. Here, the light incident on the illumination optical unit IL1 is emitted from the illumination optical unit IL1 through a collimator lens, a fly-eye lens, a condenser lens (not shown) provided in the illumination optical unit IL1, and the illumination optical unit IL1 of the mask M. The illumination area corresponding to is illuminated substantially uniformly. As shown in FIG. 1, the light from the illumination area corresponding to the illumination optical unit IL1 of the mask M is partially projected out of the seven partial projection optical systems PL1 to PL7 arranged to correspond to each illumination area. The light enters the optical system PL1.

  The partial projection optical system PL1 projects an image of a pattern formed on the illumination area corresponding to the illumination optical unit IL1 of the mask M onto the plate P. The light that has passed through the partial projection optical system PL1 forms an image of the pattern of the mask M on the plate P. The image at this time is an erect image.

  The light that has passed through the illumination optical units IL2 to IL7 is emitted from the respective illumination optical units IL2 to IL7 via unillustrated collimating lenses, fly-eye lenses, condenser lenses, etc. included in the illumination optical units IL2 to IL7. The illumination areas corresponding to the illumination optical units IL2 to IL7 of the mask M are illuminated substantially uniformly. The light from the illumination areas corresponding to the respective illumination optical units IL2 to IL7 of the mask M is incident on the respective partial projection optical systems PL2 to PL7 corresponding to the respective illumination areas, and the respective illumination optical units IL2 to IL2 on the plate P. An image of a pattern formed in each illumination area corresponding to IL7 is formed.

  The mask M is fixed by a mask holder (not shown), and is placed on a mask stage (not shown). A mask stage laser interferometer (not shown) is disposed on the mask stage, and the mask stage laser interferometer measures and controls the position of the mask stage. The plate P is fixed by a plate holder (not shown), and is placed on a plate stage (not shown). A movable mirror 50 is provided on the plate stage. Laser light emitted from a plate stage laser interferometer (not shown) is incident on the movable mirror 50, and the incident laser light is reflected by the movable mirror 50. The plate stage laser interferometer measures and controls the position of the plate stage based on the interference of the laser light incident on the movable mirror 50 and reflected by the movable mirror 50.

  On the plate stage on which the plate P is placed, a detector 20 that monitors the illuminance is disposed at a height substantially equal to the exposure surface of the plate P. The detector 20 detects the illuminance of the light flux on the plate P, and adjusts the angle of the incident end 10a of the optical fiber box 10 by adjusting the detected illuminance to be large. The angle of the incident end 10a can be adjusted by monitoring the amount of light that illuminates the mask M. For example, a half mirror that divides a light beam is provided in the optical path of each of the illumination optical units IL1 to IL7. A detector for monitoring the illuminance may be provided at the end of the branched light path, and the detected illuminance may be similarly adjusted.

  The partial projection optical systems PL1, PL3, PL5, and PL7 are arranged as a first column with a predetermined interval in the direction (Y direction) orthogonal to the X direction (scanning direction), and the partial projection optical systems PL2, PL4, and PL6 are Y. They are arranged as second rows with a predetermined interval in the direction. Further, the first-row partial projection optical systems PL1, PL3, PL5, and PL7 and the second-row partial projection optical systems PL2, PL4, and PL6 are arranged at a predetermined interval in the X direction. An off-axis alignment system 52 is disposed between the first row partial projection optical system and the second row partial projection optical system in order to align the plate P. An autofocus system 54 is arranged between the first row partial projection optical system and the second row partial projection optical system in order to adjust the focus position of the mask M and the plate P.

  According to the projection exposure apparatus according to the first embodiment, the incident end of the optical fiber box can be tilted with respect to the optical axis of the relay optical system, and the incident end of the optical fiber box is made light of the relay optical system. Because the axis can be moved in the vertical direction, it is easy and reliable to adjust the deviation in the tilt direction and the deviation in the vertical direction between the optical axis of the relay optical system and the optical axis of the optical fiber accommodated in the optical fiber box. can do. Accordingly, the mask can be satisfactorily illuminated by the illumination light via the relay optical system and the optical fiber with the optical axis matching adjusted accurately, and the pattern image of the mask can be exposed on the plate with high throughput.

  Next, a projection exposure apparatus according to a second embodiment of the present invention will be described with reference to the drawings. The configuration of the projection exposure apparatus according to the second embodiment is the same as the configuration of the incident end 10a of the optical fiber box 10 of the projection exposure apparatus according to the first embodiment shown in FIGS. It has been changed to. Therefore, in the description of the second embodiment, a detailed description of the same configuration as that of the projection exposure apparatus according to the first embodiment is omitted. In the description of the projection exposure apparatus according to the second embodiment, the same configuration as that of the projection exposure apparatus according to the first embodiment is the same as that used in the first embodiment. This will be described using the reference numerals.

  In the following description, the XYZ orthogonal coordinate system shown in FIGS. 5 and 6 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. As in the first embodiment, the XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. Yes.

FIG. 5 is a side view of the incident end 10 a of the optical fiber box 10, and FIG. 6 is a front view of the incident end 10 a of the optical fiber box 10. The incident end 10 a of the optical fiber box 10 is provided with a base plate 50 for attaching the incident end 10 a to the housing of the optical fiber box 10. The base plate 50 has a rectangular shape, and is provided with elongated holes 50a whose longitudinal direction is the Y-axis direction at the four corners. The base plate 50 is attached to the optical fiber box 10 by screws 51 through the elongated holes 50a. Fixed to the housing. Further, the base plate 50 is provided with U-shaped notches 50b having openings on both outer sides in the Y-axis direction. The notches 50b are provided in the housing of the optical fiber box 10 and the like. The sliding member 52 constituted by is fitted. Accordingly, the base plate 50 can be easily moved in the longitudinal direction (Y-axis direction) of the long hole 50a, and the position of the base plate 50 in the Y-axis direction (the light of the relay optical system 8) depends on the position fixed by the screw 51. The first cylindrical member 53 that accommodates the incident side, which is one end of a number of fiber strands, is fixed to the base plate 50 at the incident end 10 a of the optical fiber box 10. A second cylindrical member 54 having a flange portion is provided. The flange portion of the second cylindrical member 54 is provided with a long hole 54a whose longitudinal direction is the Z-axis direction at each of the four corners, and the second cylindrical member 54 is screwed by a screw 55 through the long hole 54a. Is fixed to the base plate 50. Further, the second cylindrical member 54 is provided with U-shaped notches 54b having openings on both outer sides in the Z-axis direction, and a bearing or the like provided on the base plate 50 in the notch 54b. The constructed sliding member 56 is fitted. Further, a contact portion 54c with which the tip end portion of the screw 57 contacts is provided at one end portion of the second cylindrical member 54 in the Z-axis direction. Accordingly, by moving the screw 57 forward or backward, the second cylindrical member 54 can be easily moved in the longitudinal direction (Z-axis direction) of the long hole 54 a, and the second cylinder 54 is positioned depending on the position fixed by the screw 55. The position in the Z-axis direction of the cylindrical member 54 (the position of the relay optical system 8 in the direction perpendicular to the optical axis) is determined.

  The first cylindrical member 53 has a flange portion 53 a at an intermediate portion, and the end portion on the fiber box 10 side is inserted into the cylindrical portion of the second cylindrical member 54. A portion of the first cylindrical member 53 inserted into the cylindrical portion of the second cylindrical member 54 is provided with a sliding member 58 constituted by a bearing or the like extending in the Y-axis direction. Is fitted in a long hole 54d provided on the side wall of the second cylindrical member 54 and having the X-axis direction as a longitudinal direction.

The first cylindrical member 53 is fixed to the second cylindrical member 54 with a screw 59 in a hole 53b provided in the flange portion 53a. Further, the tip of the screw 59 is in contact with the side surface of the sliding member 58. Therefore, by moving the screw 59 forward or backward, the first cylindrical member 53 can be inclined around the Z axis in the orthogonal coordinates shown in FIGS. 5 and 6.
Further, by moving forward or backward the screw 60 penetrating through the flange portion 53a of the first cylindrical member 53 and having the tip portion abutting against the side wall portion of the second cylindrical member 54, the orthogonal coordinates shown in FIGS. The first cylindrical member 53 can be inclined around the Y axis.

  The first cylindrical member 53 is configured to be tiltable with respect to the optical axis of the relay optical system 8 by an inclination direction adjusting mechanism and a vertical direction adjusting mechanism provided at the incident end 10 a of the optical fiber box 10. The relay optical system 8 is configured to be movable in the direction perpendicular to the optical axis.

  According to the projection exposure apparatus according to the second embodiment, the incident end of the optical fiber box can be tilted with respect to the optical axis of the relay optical system, and the incident end of the optical fiber box is made light of the relay optical system. Because the axis can be moved in the vertical direction, it is easy and reliable to adjust the deviation in the tilt direction and the deviation in the vertical direction between the optical axis of the relay optical system and the optical axis of the optical fiber accommodated in the optical fiber box. can do. Accordingly, the mask can be satisfactorily illuminated by the illumination light via the relay optical system and the optical fiber with the optical axis matching adjusted accurately, and the pattern image of the mask can be exposed on the plate with high throughput.

  In the exposure apparatus according to the above-described embodiment, the reticle (mask) is illuminated by the illumination optical system, and the transfer pattern formed on the mask is exposed to the photosensitive substrate (wafer) using the projection optical system (exposure). Step), a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 7 is a flowchart of an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus according to the above-described embodiment. Will be described with reference to FIG.

First, in step S301 in FIG. 7, a metal film is deposited on one lot of wafers.
In the next step S302, a photoresist is applied on the metal film on the wafer of one lot. Thereafter, in step S303, using the exposure apparatus according to the above-described embodiment, the image of the pattern on the mask is sequentially exposed and transferred to each shot area on the wafer of one lot via the projection optical system. . Thereafter, in step S304, the photoresist on the one lot of wafers is developed, and in step S305, the resist pattern is etched on the one lot of wafers to form a pattern on the mask. Corresponding circuit patterns are formed in each shot area on each wafer.

  Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the micro device manufacturing method described above, since exposure is performed using the exposure apparatus according to the above-described embodiment, the mask can be illuminated with illumination light through the illumination optical system in which the optical axis is adjusted, A microdevice having an extremely fine circuit pattern can be obtained with high accuracy. In steps S301 to S305, a metal is vapor-deposited on the wafer, a resist is applied on the metal film, and exposure, development, and etching processes are performed. Prior to these processes, on the wafer. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.

  In the exposure apparatus according to the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 8, in the pattern formation step S401, a so-called photolithographic step is performed in which the exposure pattern according to the above-described embodiment is used to transfer and expose a mask pattern onto a photosensitive substrate (such as a glass substrate coated with a resist). Is done. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since the exposure is performed using the exposure apparatus according to the above-described embodiment, the mask can be illuminated with illumination light through the illumination optical system in which the optical axis is adjusted. Therefore, a semiconductor device having an extremely fine circuit pattern can be obtained with high accuracy.

It is a perspective view which shows schematic structure of the projection exposure apparatus concerning 1st Embodiment. It is a perspective view which shows the structure of the incident end of the optical fiber concerning 1st Embodiment. It is a perspective view which shows the cylindrical member of the incident end of the optical fiber concerning 1st Embodiment. It is a perspective view which shows the cylindrical member and 1st attachment member of the incident end of the incident end of the optical fiber concerning 1st Embodiment. It is a side view of the incident end of the optical fiber concerning 2nd Embodiment. It is a front view of the incident end of the optical fiber concerning 2nd Embodiment. It is a flowchart which shows the manufacturing method of the semiconductor device as a micro device concerning embodiment. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 4 ... Elliptic mirror, 6 ... Reflecting mirror, 8 ... Relay optical system, 10 ... Optical fiber box, 10a ... Incident end, 10b-10h ... Outlet end, 50 ... Moving mirror, 52 ... Alignment system, 54 ... Auto focus system, IL1 to IL7: illumination optical unit, PL: projection optical system, PL1 to PL7: partial projection optical system, M: mask, P: plate.

Claims (5)

In the illumination optical device that illuminates the irradiated surface with light from the light source unit,
A relay optical system for guiding light from the light source unit to a predetermined position;
An optical fiber having an incident end on which light from the relay optical system is incident, and a plurality of emission ends that divide and emit light incident from the incident end;
A tilt direction adjusting mechanism for tilting the incident end of the optical fiber with respect to the optical axis of the relay optical system in order to match the optical axis of the relay optical system with the optical axis of the optical fiber;
An illumination optical apparatus comprising:   A vertical adjustment mechanism for moving the incident end of the optical fiber in a direction perpendicular to the optical axis of the relay optical system in order to match the optical axis of the relay optical system with the optical axis of the optical fiber; The illumination optical apparatus according to claim 1, characterized in that:   The illumination optical apparatus according to claim 2, wherein the tilt direction adjustment mechanism and the vertical direction adjustment mechanism are arranged at the incident end of the optical fiber. In an exposure apparatus that transfers a mask pattern onto a photosensitive substrate,
An exposure apparatus comprising the illumination optical apparatus according to claim 1 for illuminating the mask. An exposure step of exposing a pattern image of a mask onto a photosensitive substrate using the exposure apparatus according to claim 4;
A development step of developing the photosensitive substrate exposed by the exposure step;
A method for manufacturing a microdevice, comprising:

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