JP2006029931A - Construction structure defect sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily sense defect position and defect degree after disaster such as an earthquake, in structure such as concrete. <P>SOLUTION: In concrete constituting a structure, a device having at least strain sensor, amplifier circuit, analog/digital converter, rectifier/detection/modulation/demodulation circuits, and communication controller is embedded or contacted in constitution. An electronic circuit of the device is operated by energy of electromagnetic wave emitted from external leaders to measure the strain and transmit the results to the leader with electromagnetic wave. By this manner, strain measurement can be conducted with non-contact without wiring and so the degree of defects can be grasped without largely affecting the design and construction of the structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to an inspection system that detects the degree and position of damage to a structure.

In the field of architecture and civil engineering, development of techniques for monitoring damages to building structures after disasters such as earthquakes or with aging has been carried out. Most noticeable is strain monitoring using optical fibers. This technology attaches an optical fiber to a member of a structure, transmits light, and measures a minute path difference of the light,
This is a method for measuring the strain of a member. In this method, the apparatus for measuring the change in the path difference is large and expensive, and it is difficult to measure multipoints and large areas because of cost. In addition, since the connection type is indispensable from the measurement principle, there is a problem that the appearance is deteriorated in the case of a building such as a building. In order to avoid it, it was necessary to devise design and construction for that purpose. In addition, structural members are often subjected to interior and exterior wall installation, painting, etc. due to apparent problems. When measuring strain, it is necessary to remove the interior and repair it after measurement. It was a restriction.

Therefore, this invention provides the damage detection apparatus which can suppress either of the said subjects.

  In order to solve the above problems, for example, an RF analog circuit for modulating / demodulating a signal transmitted by a carrier wave of electromagnetic waves and generating a DC power source, a logic circuit for controlling chip operation, an amplifier circuit for a strain sensor signal, a distortion A device composed of a sensor circuit is arranged inside or on the surface of the structure.

Specifically, it is preferable to have the following configuration.
(1) It is formed so that it can be installed inside or on the surface of a building structure, and includes a substrate and an electronic circuit having a strain measuring function formed on the substrate,
The electronic circuit has a power supply circuit that generates a power supply from electromagnetic energy irradiated from outside the electronic circuit.

For example, an electronic circuit having a strain measurement function is installed in a structural material of a building, and a part of the electronic circuit includes a circuit that generates a DC power source from electromagnetic energy received from the outside. This is a structural damage inspection apparatus. As an example, the sensor that is moved by the RF power feeding is formed on a silicon substrate.
(2) It is formed so as to be installed inside or on the surface of a building structure, and includes a substrate, and an electronic circuit having a strain measuring function formed on the substrate,
The electronic circuit includes an RF analog circuit for modulating / demodulating an electromagnetic wave signal and generating a DC power source, a logic circuit for controlling chip operation, a strain sensor circuit for measuring strain, and an amplifier circuit for the strain sensor signal. This is a damage detection device for a structure.
(3) A power supply circuit which is formed so as to be installed inside or on the surface of a building structure, and generates a power source from a substrate, a strain sensor circuit formed on the substrate, and electromagnetic wave energy irradiated from outside the substrate. And a receiving unit that wirelessly receives information based on a strain measurement value measured by a damage detection apparatus for a building structure having an electronic circuit, and a recording unit that records the received information. Characteristic damage detection reader.
(4) In any one of the above, the structure damage detection device is characterized in that the electronic circuit is formed so as to be arranged between the building structure and the interior, exterior, or paint of the building.
(5) In any one of the above, the damage detection apparatus for a structure is characterized in that the substrate is a silicon substrate and the circuit is formed on one substrate.
(6) In any one of the above, the antenna includes an antenna that communicates with the electronic circuit, the electronic circuit is formed on one of the substrates, and the antenna has a region disposed outside the substrate. This is a structural damage detection device.
(7) In any one of the above, the substrate is a single crystal silicon substrate, and the substrate is formed so as to be disposed inside or on the surface of the building structure material. is there. Further, for example, a strain measurement circuit having an impurity diffusion layer on the surface of the silicon substrate is formed.
(8) A Wheatstone bridge circuit including a plurality of resistance layers constituting a strain sensor resistor and a dummy resistor is provided on one main surface of the single crystal semiconductor substrate, and the strain sensor resistor is a P-type formed in the semiconductor substrate. The impurity diffusion layer is arranged in a direction along the <110> direction from the direction orthogonal to the <110> direction, and the dummy resistor is a P-type impurity diffusion layer formed in the semiconductor substrate. The longitudinal direction of the structure is arranged in the direction along the <100> direction from the direction orthogonal to the <100> direction.

  Alternatively, a strain sensor having a Wheatstone bridge formed on a silicon substrate is formed so as to be in contact with or embedded in a building structure material.

In addition, a conversion circuit that converts a digital signal based on a signal from the Wheatstone bridge circuit, a transmission circuit that transmits the digital signal to the outside of the semiconductor substrate, and a power supply circuit are provided.
(9) A Wheatstone bridge circuit including a plurality of resistance layers constituting a strain sensor resistor and a dummy resistor is provided on one main surface of the single crystal semiconductor substrate, and the strain sensor resistor is an N-type formed in the semiconductor substrate. The longitudinal direction of the impurity diffusion layer is arranged in a direction along the <100> direction from the direction orthogonal to the <100> direction, and the dummy resistor is a P-type impurity diffusion layer formed in the semiconductor substrate. And the longitudinal direction of the structure is arranged in the direction along the <110> direction from the direction orthogonal to the <110> direction.
(10) The damage to the structure according to any one of the above, wherein the structure includes an antenna connected to the electronic circuit, and a member having higher permeability than the non-measurement object is disposed on the measurement object side of the antenna. It is a detection device.
(11) The damage detection device for a structure according to any one of the above, wherein the electronic circuit has an ID number unique to the electronic circuit.
(12) In any one of the above, the electronic circuit includes a temperature measurement circuit, and is a structural damage detection apparatus.
(13) The structure damage detection device according to any one of the above, wherein any one of vibration power generation, solar power generation, temperature difference power generation, and a battery that drives the electronic circuit is provided. For example, sensing preferably uses self-generated power, and transmission is performed with RF power.

The power generation device performs sensor driving other than during data transmission.
(14) In any one of the above, the electronic circuit includes a non-volatile memory circuit that can incorporate sensor calibration data.

According to the present invention, it is possible to provide a damage detection apparatus for a structure that can contribute to solving any of the above problems.

  A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows a measurement system 1 according to a first embodiment of the present invention. The measurement system 1 in this embodiment includes a measurement unit 3 disposed on the surface of a structural member 2 that is an object to be measured, and a reader 4 that supplies electromagnetic waves to the measurement unit 3 and is supplied with electromagnetic waves that are measurement results. The diagnostic unit 5 diagnoses the degree of damage using the result of the reader 4. Here, the structural member 2 is a portion that shares and bears the load of the building structure, and is considered separately from the one that is installed only for the purpose of maintaining the appearance.

The measurement unit 3 includes at least an RF analog circuit unit 6 that performs modulation / demodulation of a signal transmitted on a carrier wave such as 13.56 MHz, 2.45 GHz, 860 to 960 MHz, and generation of a DC power source, as shown in the circuit block configuration of FIG. It comprises a strain sensor signal amplification circuit section 7, a sensor analog circuit section 8 that performs A / D conversion, a strain sensor section 9, a communication control circuit section 10, and an antenna section 11. In the first embodiment, all of the measuring parts 3 are formed on one silicon substrate 12 except for the antenna 11 as shown in FIG. Since all the circuits except the antenna 11 are formed on one silicon substrate 12 in this way, the measurement unit 3 can be realized with a few millimeters or less, so the measurement unit 3 can be installed regardless of the installation location. It has the advantage that it can be done and does not detract from the aesthetics of the building. Further, it is possible to perform measurement by simply pasting or embedding a chip, and there is an advantage that a support structure for installing the measurement unit 3 is not required. Moreover, since it can be mass-produced by the manufacturing process of a semiconductor device, there is an advantage that it can be produced in large quantities at low cost.
If the distorted antenna 11 is externally attached, the area of the antenna can be increased, so that there is an advantage that the communication distance can be increased accordingly. When the electromagnetic wave is supplied from the reader 4, the measuring unit 3 can operate the circuit with the energy of the electromagnetic wave. The strain of the structural member 2 is detected by the strain sensor 9, amplified by the amplifier circuit 7, and then converted into digital data by the sensor analog circuit 8. Further, using the communication control circuit 10 and the RF analog circuit unit 6, the measured value is transmitted to the reader 4 through the antenna 11. As described above, since the measuring unit 3 can operate using the electromagnetic wave of the reader 4 as a power source, the strain state of the structural member 2 can be easily monitored wirelessly. Although FIG. 3 shows the case of a loop antenna, a dipole antenna, a Yagi-Uda antenna, or a patch antenna as shown in FIG. 4 may be used depending on the frequency used.

  In FIG. 3, the back surface of the silicon substrate 12 facing the element formation surface, that is, the front surface of FIG. 3, is a main connection surface 21 for contacting the structural member 2, and silicon changes when the strain of the structural member 2 changes. Strain is transmitted to the strain sensor 9 through the back surface of the substrate 12, and is regarded as a change in resistance.

  The strain sensor 9 is preferably an impurity diffusion layer resistor using a piezoresistive effect because of its high sensitivity. However, even if it corresponds to a resistance wire type strain gauge, the performance is inferior, but it is substituted for a purpose that does not require accuracy. can do. Further, by providing a Wheatstone bridge in one chip as in this embodiment, there is an advantage that accurate measurement can be performed even when the temperature of the structural member 2 changes. FIG. 5 shows a measuring unit 3 having a Wheatstone bridge. The strain sensor 9 is formed with a P-type impurity diffusion layer extending in the <110> direction of the silicon substrate 12, and the dummy resistor 13 in the Wheatstone bridge has a P-type extending in the <100> direction of the silicon substrate 12. An impurity diffusion layer is formed. Thus, by forming the P-type impurity diffusion layer so that the <100> direction is long, the sensitivity to strain can be extremely reduced. Therefore, even when a strain similar to that of the strain sensor 9 is applied to the dummy resistor 13, the resistance value does not change and can be used as a dummy resistor. Therefore, even when the temperature of the structural member 2 changes and the temperature of the measurement unit 3 changes following this, the Wheatstone bridge can be built in the measurement unit 3, so that accurate measurement is possible. When the N-type impurity diffusion layer is used, the strain sensor 9 forms the N-type impurity diffusion layer so that the <100> direction of the silicon substrate 12 is the longitudinal direction, and the dummy resistor 13 in the Wheatstone bridge is the silicon substrate. An N-type impurity diffusion layer is formed so that the <110> direction of 12 is the longitudinal direction. In FIG. 5, the strain sensor 9 is disposed at the end of the silicon substrate 12. However, more accurate measurement is possible when the strain sensor 9 is disposed at the center.

  Moreover, the installation method of the measurement part 3 is demonstrated using FIG. 1 and FIG. FIG. 1 shows a case where a measuring unit 3 is arranged on the surface of the structural member 2. The back surface of the silicon substrate 12 of the measuring unit 3 is connected to the structural member 2, and when the structural member 2 is distorted, the strain is transmitted to the silicon substrate 12, so that the strain sensor 9 can measure the strain. . Here, the back surface indicates a surface facing the element formation surface of the silicon substrate 12, but even if the element formation surface is connected to the structural member 2, the reliability of the element is slightly inferior, but the same effect can be obtained. . The installation method shown in FIG. 1 has an advantage that installation is easy. Further, a chip may be embedded as shown in FIG. In the case where the structural member 2 is cement, according to the method of the present invention, since it is wireless, it can be easily installed simply by mixing and has an advantage of high sensitivity. In the above installation method, the antenna 11 has an advantage that the communication distance becomes longer if it is exposed on the surface of the structural member 2, but communication is possible even if it is embedded. Although not shown, the measurement unit 3 may be half embedded in the structural member 2. In this case, there is an advantage that the communication distance can be increased and the connection reliability is excellent because it is embedded. Note that it is desirable to arrange the antenna so as to be parallel to the surface of the structural member 2 because the antenna can receive electromagnetic waves from the reader 4 efficiently.

  FIG. 7 shows a case where the measurement unit 3 in the case where the antenna 11 is formed on the silicon substrate 12 is used. The case with a built-in antenna is shown. Moreover, the case of 1 board is shown. In this case, although the communication distance does not increase, there is an advantage that the size can be further reduced and the reliability is high because the joint 202 with the antenna 11 is not exposed. Also, in this embodiment, an example in which all the sensors and control circuits are mounted on a silicon chip is shown as an example that takes advantage of being able to be downsized and manufactured at low cost. However, a plurality of components are assembled on a resin substrate. By using one board, the same effect as in FIG. 7 may be used. By forming the diffusion layer on the substrate, it is possible to suppress the occurrence of fatigue. In this case, a normal strain gauge may be used, or only the sensor portion of FIG. 5 may be used. In this case, although there is a disadvantage that the size of the measuring unit 3 is increased, there is an advantage that a small amount can be easily produced. In FIG. 7, all the circuits are mounted on the silicon chip, but may be divided into two chips.

  FIG. 8 shows a measurement unit 3 suitable when the structural member 2 is a metal. This shows the case where there is a high permeability material. When the structural member 2 is a metal, the magnetic flux irradiated from the reader 4 changes its direction in a direction parallel to the structural member 2, so that there is a problem that it is difficult for electromagnetic waves to reach the antenna unit 11. Therefore, in the present invention, as shown in FIG. 8, a high magnetic permeability material 204 is disposed between the external antenna and the structural member 2, but the back surface of the silicon substrate 12 is in contact with the structural member 2. By arranging the high magnetic permeability material 204 between the antenna part 11 and the structural member 2 in this way, the electromagnetic wave can easily pass through the high magnetic permeability material 204. There is an advantage that it is easy to reach. On the other hand, since the silicon substrate 12 is in contact with the structural member 2, the strain of the structural member 2 is transmitted to the silicon substrate 12, and the strain is detected by a change in resistance value of the impurity diffusion layer resistance formed on the surface of the silicon substrate 12. Is possible. Further, a layer of a metal material 203 such as aluminum may be present between the high magnetic permeability material 204 and the structural member 2. In this case, since the electromagnetic wave transmission characteristic is almost determined by the metal layer 203, there is an advantage that the electromagnetic wave transmission characteristic remains unchanged even when the material of the structural member 2 changes.

  The effects and advantages of the present patent in this embodiment are summarized below. Since the measurement unit 3 can operate using the electromagnetic wave of the reader 4 as a power source, the strain state of the structural member 2 can be monitored wirelessly. Therefore, since there is no need to connect for measurement, even when the measuring unit 3 is arranged on the structural member, there is no concern about the appearance, and there are few problems of positional interference with other members. There is an advantage that there is no restriction on the place. In addition, since the measuring unit 3 is simply a silicon chip with the antenna 11 formed thereon, it is very small and has an advantage that it is not limited by the installation location. Moreover, although a measured value can be obtained wirelessly, since the power source is an electromagnetic wave from the reader 4, there is an advantage that a power source such as a battery is unnecessary, and it is not necessary to replace the power source such as a battery. In addition, as shown in FIG. 1, the structural member 2 is usually covered with an inner / outer casing 14 in many cases, and conventionally, it has been necessary to perform measurement after removing the inner / outer casing 14. However, according to the present invention, since wireless communication is possible, measurement can be performed without removing the interior. That is, it is possible to easily perform measurement while maintaining a good appearance without the need for construction. That is, there is a great advantage that regular measurement / diagnosis can be easily performed in a normal use state.

  The strain value measured in this way is taken in via the electromagnetic wave into a reader 4 having a receiving unit that wirelessly receives information from the measuring unit, and the reader 4 has an information storage unit for recording information therein. More preferably, it has a line and mobile phone function after data collection, and is sent to the diagnosis unit 5 via an electromagnetic recording medium such as a flash memory card. The diagnosis unit 5 compares the data measured in the past and estimates the degree of damage. In addition, Preferably, it has a display part which displays that information was taken in.

  After the measuring unit 3 is installed on the structural member 2, the sensing data is read by the reader 4, and the sensing data is constantly compared with this standard in the state where it is held in the recording medium or the diagnostic unit 5 with the value as a reference. It is desirable to use it for damage diagnosis after a disaster. After the measurement unit 3 is installed on the structural member 2, residual stress may be generated in the measurement unit 3 with mounting, and even in this case, there is an advantage that a highly accurate measurement result can be obtained.

  However, even if the diagnostic unit 5 is not necessarily provided, there are many cases where the same effect can be obtained even if there is a function of reading or displaying the measurement value from the reader 4. That is, there are cases where the measurer can sufficiently grasp the degree of damage even if the measurer only makes a comparative study using the numerical values.

  The second embodiment of the present invention is a case where the data sent from the measuring unit 3 to the reader 4 can transmit not only the measured value but also a unique ID number to each measuring unit 3. FIG. 9 shows a circuit block configuration of the measurement unit 3 in this embodiment. As shown in FIG. 9, in addition to the first embodiment, at least a circuit having a function of holding a unique ID number and a function of sequentially outputting the ID number together with sensing data is added. These are displayed in a state included in the ID issuing unit 15 in FIG. By using the measurement unit 3, it is possible to sequentially transmit the ID number and sensing data unique to each measurement unit to the reader 4. Since the reader 4 and the diagnosis unit 5 can manage corresponding measurement values and ID numbers in pairs, it is particularly useful when performing history management. In other words, when comparing strain states before and after a disaster, it is only necessary to search by ID number, which has the advantage of greatly saving labor. Further, after the measurement unit 3 is installed on the structural member 2, residual strain resulting from the installation may occur. However, it is necessary to measure the residual strain immediately after installation and store it as a calibration value. According to the present embodiment, since each measurement unit 3 outputs an ID number together with the measurement value at this time, there is an advantage that the calibration value corresponding to each measurement unit 3 can be easily managed. Further, by providing a congestion control function in the measurement unit 3 together with ID number management, even if another measurement unit 3 is arranged nearby, it can be read by the reader 4 while being identified.

  A third embodiment of the present invention is shown in FIG. In this embodiment, the measurement unit 3 has a nonvolatile memory 16 and can store data in a nonvolatile manner. The non-volatile memory 16 may contain sensor calibration data, or a past history of sensing data may be accumulated. When the calibration data is entered, the sensing data is transmitted together with the calibration data, and the sensing data is calibrated by the reader 4 and can be obtained as a highly accurate measurement result. The calibration data is preferably measured in advance for each measurement unit 3 and written in the nonvolatile memory 16. By writing calibration data for each measurement unit, there is an advantage that highly accurate measurement is possible even when the sensor characteristics of the measurement unit vary. The calibration data is preferably a function of temperature.

  It is also effective to write the measured value in the nonvolatile memory 16 after installing the measuring unit 3 on the structural member 2. When the measuring unit 3 is installed on the structural member 2, a residual stress is applied according to the mounting state. Therefore, the residual stress after the mounting is grasped as an initial state and recorded, thereby enabling high-precision measurement. There is an advantage. In addition, by writing the data before the occurrence of the disaster into the measuring unit 3 and reading the data together with the data after the occurrence of the disaster to the reader 4, it is possible to easily grasp the change.

  A fourth embodiment of the present invention is shown in FIG. In the present embodiment, a temperature sensor 17 is built in the measuring unit 3 together with a strain sensor, and temperature sensing data can be sequentially transmitted to the reader 4 along with the strain. The temperature sensor 17 is preferably one that can be measured using the temperature dependence of a diode formed in a silicon substrate as its principle. Since a diode can be formed by implanting impurity ions into a silicon substrate, it can be formed simultaneously with an ion implantation layer of a transistor such as another communication control circuit 10, which has the advantage of simplifying the process.

  As described above, the temperature sensor 17 and the strain sensor are built in at the same time, and the sensing data is sequentially transmitted to the reader 4 so that the characteristics of the strain sensor can be corrected on the side of the reader 4 or the diagnosis unit 5 based on the temperature data. There is an advantage that more accurate measurement is possible. There is also an advantage that temperature and strain data can be managed simultaneously. In addition, the addition of a function for issuing an ID has an advantage that data management by the reader 4 and the diagnosis unit 5 becomes easier.

  FIG. 12 shows a configuration diagram of the fifth embodiment of the present invention, which has a self-power generation unit 18 and can measure strain even when the reader / writer is not irradiated with radio waves. In addition, a nonvolatile memory 16 is built in, and the strain value can be stored in a nonvolatile manner. If it is stored when the value is equal to or greater than a preset value, only a history of a large load can be extracted and stored. As a result, the necessary memory capacity can be reduced, and there is an advantage that it is possible to operate even with a small amount of power generation. The built-in timer 19 has the advantage that the time, load and ID number can be stored simultaneously. Further, the measurement value stored in the nonvolatile memory 16 may be readable by electromagnetic induction or microwave. In other words, since a large amount of power is required to transmit the measured value by radio waves, the energy for transmitting radio waves is covered by electromagnetic induction or microwaves, and measurements that do not require a large amount of power are self-generated energy. Covering it has the advantage that it will not run out of energy even when the power generation amount of the self-power generation unit 18 is small. Here, the self-power generation unit 18 includes a battery, vibration power generation, solar power generation, power generation using a piezoelectric element, power generation by fluid force, and the like. As described above, this embodiment has a great advantage that it can be operated even in an application example in which the output of the self-power generation unit 18 is small.

  FIG. 13 is a block diagram of the sixth embodiment of the present invention. In this embodiment, the diffusion resistance layer formed on the silicon substrate 12 is used as a strain sensor 9 and a dummy resistor 13 for detecting strain. The strain sensor 9 is formed with an impurity diffusion layer extending in the <110> direction of the silicon substrate 12, and the dummy resistor 13 in the Wheatstone bridge has an impurity diffusion layer extending in the <100> direction of the silicon substrate 12. Is formed. By arranging the diffusion layer in this way, even when the temperature of the structural member 2 changes and the temperature of the measurement unit 3 changes following this, the Wheatstone bridge can be built in the measurement unit 3 so that the accuracy is high. It is possible to measure well. The surface of the silicon substrate 12 that opposes the element formation surface is disposed so as to be in contact with the structural member 2, and the strain is detected by a change in the resistance value of the diffusion layer. This change in resistance value is captured as a change in voltage by the Wheatstone bridge formed in the silicon substrate 12, pulled out by the wiring out of the silicon substrate 12, and digitized by the digitized power transmission circuit 206. It is sent to 205. Electric power for operating these circuits is provided by the self-power generation unit 18. According to the present embodiment, because the strain is read by the change in the resistance value of the diffusion resistance formed in the silicon substrate 12, it has an advantage that it is more resistant to repeated loads than a strain gauge using a conventional thin film and does not fatigue. is there. Therefore, there is an advantage that maintenance is easy without performing a work to be taken out because the sensor is fatigued after a certain time. Further, the Wheatstone bridge is housed in one chip on the silicon substrate 12, and there is an advantage that it can be made very small as compared with the conventional external Wheatstone bridge. Therefore, there is an advantage that there is no restriction on the installation place because there is no concern about appearance and there are few problems of positional interference with other members. Furthermore, since the strain sensor is made by applying the semiconductor manufacturing process, fine lines can be processed with high accuracy, and this makes it possible to reduce power consumption to one-hundredth that of a conventional strain sensor with high resistance. It becomes. Therefore, even when the measured value is transmitted wirelessly, it is possible to measure without worrying about consumption of the self-power generation unit 18, and even when a battery is used as the self-power generation unit, long-term measurement can be performed without battery replacement Has the advantage of becoming.

  Further, in this embodiment, the strain sensor portion is formed on the silicon substrate 12, but only this may be placed in contact with the structural member 2 and other portions may be arranged away from the structural member. In particular, by separating the antenna 11 from the structural member 2, there is an advantage that the communication distance is increased when the structural member 2 is a metal. Further, by separately installing the silicon substrate 12 and other parts, there are advantages that the degree of freedom of installation is increased and interference with other members can be avoided.

  14 to 18 show a structure monitoring and damage detection system when the present invention is used. FIG. 14 shows a case where the present invention is applied to a general building such as a building or a general house. The measuring unit 3 is attached or embedded in a column 20 where strain concentration is expected in a general building. The column 20 and the measuring unit 3 may be covered with an inner / outer casing 14. The wiring is not exposed to the visible portion outside the inner / outer casing 14, and the appearance is the same as when the measuring unit 3 is not provided, and the strain state can be monitored simply by bringing the reader 4 closer to the measuring unit 3. The degree of damage is diagnosed in the diagnostic information 5 thus obtained by the diagnosis unit 5, and the location for repairing and reinforcing the structure is specified based on this. As described above, according to the present invention, a great advantage that the measuring unit 3 can be installed and sensed without deteriorating the appearance is produced. 14 shows the case where the measuring unit 3 is attached to a column. However, if the strain is likely to concentrate or a portion where strain is expected to be concentrated after a disaster, the wall, beam, hinge, joint, window glass A similar effect can be obtained by attaching to a window, arousing part or other members.

FIG. 15 shows a case where the present invention is applied to a truss structure such as a cable-stayed bridge, a suspension bridge, and an iron bridge. Similarly, the measurement unit 3 is installed at a location where strain concentration is expected. For example, you may install in parts, such as a welding location, a bolt fastening location, and a hinge. FIG. 16 shows the case where the present invention is installed on a bridge, FIG. 17 shows the case where the present invention is applied to a suspension bridge, and FIG. 18 shows the case where it is installed on a tunnel.
Conventionally, when sensing such a place, it has been necessary to extend the wiring from the sensor installed at the measurement location to the hand of the measurer, and there has been a problem that the degree of freedom of installation has been limited. However, in the case of this embodiment, even when sensing a place where it is difficult to reach, sensing can be performed only by bringing the reader 4 close to it, so that there is an advantage that the degree of freedom of the installation position can be expanded.
Conventionally, when sensing such a place, it is necessary to extend the wiring from the sensor installed at the measurement place to the hand of the measurer.In this case, due to excessive external force at the time of disaster or high temperature exposure due to fire, There is a high possibility that any part of the wiring that has been stretched for a long time will be damaged, and the reliability of measurement after a disaster is often significantly impaired. However, according to the present invention, since there is no need to extend the wiring for a long time, there is an advantage that highly reliable measurement is possible without worrying about disconnection of the wiring.
Further, conventionally, only the number of sensors corresponding to the measuring instrument placed at the hand of the measurer can be installed, and the number of measurement points is greatly limited considering the cost. However, according to the present embodiment, the measurement values of a large number of measurement units 3 can be obtained by simply bringing the readers 4 close to each other, and therefore, countless sensing information from the measurement units 3 can be obtained using only a small number of readers 4. . That is, according to this embodiment, there is an advantage that installation of a large number of measuring units 3 can be realized without worrying about cost.

  According to the embodiment described so far, the following operational effects can be obtained.

  According to this embodiment, when monitoring a structure, sensing information is transmitted by electromagnetic waves. Therefore, it is not necessary to connect the sensing information from the measurement unit 3 attached to the object to be measured and take it out. That is, there is no need to remove the interior or exterior, or to provide wiring from a part of the interior, so that the appearance is not impaired. Thus, there is an advantage that no special construction or design is required for the interior or exterior, and it can be easily installed.

  Moreover, according to this form, the power supply of the measurement part 3 attached to the to-be-measured object is supplied with electromagnetic waves, without connecting with the reader 4. FIG. Even when the structural member that is the object to be measured is covered with the interior or exterior, the power can be supplied without removing it. In other words, there is no need to perform measurement by removing the interior or exterior, and once the measurement unit 3 is installed, there is an advantage that measurement can be performed simply by bringing the reader 4 close to the installation location. In addition, there is an advantage that the power supply is consumed unlike the wireless measurement system using a battery, and there is no need to remove and replace the interior and exterior.

  In addition, according to this embodiment, since there is no need to connect the sensing information from the measuring unit 3 attached to the object to be measured and take it out, the wiring stretched for a long time in the event of a disaster such as an earthquake or a fire is disconnected. Reliable measurement is possible without being unusable.

In addition, according to this embodiment, there is an advantage that reliable measurement is possible even when used for a long time because it is resistant to repeated loads and does not fatigue.

It is a schematic diagram which shows the measurement system of the 1st Example of this invention. It is a circuit diagram of the measurement part in the 1st example of the present invention. It is a schematic diagram which shows the measurement part in the 1st Example of this invention. It is a schematic diagram which shows the measurement part in the 1st Example of this invention. It is a perspective view which shows the measurement part in the 1st Example of this invention. It is the schematic diagram which showed the attachment method of the measurement part in the 1st Example of this invention. It is a perspective view which shows the measurement part in the 1st Example of this invention. It is sectional drawing which shows the measurement part in the 1st Example of this invention. It is a circuit diagram which shows the measurement system of 2nd Example of this invention. It is a circuit diagram of the measurement part in the 3rd example of the present invention. It is a circuit diagram of the measurement part in 4th Example of this invention. It is a circuit diagram of the measurement part in 5th Example of this invention. It is a circuit diagram of the measurement part in the 6th example of the present invention. It is an Example at the time of applying this invention to a general building. It is an Example at the time of applying this invention to a truss structure. It is an Example at the time of applying this invention to a bridge. It is an Example at the time of applying this invention to a suspension bridge. It is an Example at the time of applying this invention to a tunnel.

Explanation of symbols

1.Measurement system
2.Structural members
3.Measurement part
4 reader
5.Diagnostic Department
6.RF analog circuit
7.Amplification circuit
8.Sensor analog circuit
9.Strain sensor
10.Communication control circuit
11.Antenna
12.Silicon substrate
13.Dummy resistor
14.Interior and exterior
15.ID issuing department
16.Non-volatile memory
17.Temperature sensor
18. Self-power generation unit
19.Timer
20.Pillar
21.Main adhesive surface
22.Element formation layer
23. Beam
24. Pier
25. Bridged
26. Hanging members
27. Tunnel
28. Tunnel interior
201.Film
202.Junction
203.Metal
204.High permeability material
205. Receiver
206 Digitized transmission circuit

Claims (14)

It is formed so as to be installed inside or on the surface of a building structure, and includes a substrate and an electronic circuit having a strain measuring function formed on the substrate,
The damage detection device for a building structure, wherein the electronic circuit includes a power supply circuit that generates power from electromagnetic energy irradiated from outside the electronic circuit. It is formed so as to be installed inside or on the surface of a building structure, and includes a substrate and an electronic circuit having a strain measuring function formed on the substrate,
The electronic circuit includes an RF analog circuit for modulating / demodulating an electromagnetic wave signal and generating a DC power source, a logic circuit for controlling chip operation, a strain sensor circuit for measuring strain, and an amplifier circuit for the strain sensor signal. Damage detection device for structures. A substrate, a strain sensor circuit formed on the substrate, and a power supply circuit that generates power from electromagnetic energy irradiated from outside the substrate; A damage detection apparatus for a building structure having an electronic circuit, comprising: a receiving unit that wirelessly receives information based on a measured strain measurement value; and a recording unit that records the received information. Damage detection reader. 3. The damage detection apparatus for a structure according to claim 1 or 2, wherein the electronic circuit is formed so as to be disposed between the building structure and the interior, exterior, or paint of the building. 3. The damage detection apparatus for a structure according to claim 1, wherein the substrate is a silicon substrate, and the circuit is formed on one substrate. 6. The antenna according to claim 1, further comprising an antenna that communicates with the electronic circuit, wherein the electronic circuit is formed on one of the substrates, and the antenna has a region arranged outside the substrate. A structural damage detection apparatus characterized by the above. 7. The substrate according to claim 1, wherein the substrate is a single crystal silicon substrate, and the substrate is formed so as to be disposed inside or on the surface of the building structural material. Structure damage detection device. On one main surface of the single crystal semiconductor substrate, a Wheatstone bridge circuit including a plurality of resistance layers constituting a strain sensor resistance and a dummy resistance is provided.
The strain sensor resistance is a P-type impurity diffusion layer formed in the semiconductor substrate, and its longitudinal direction is arranged in a direction along the <110> direction from a direction orthogonal to the <110> direction, and the dummy resistance is A P-type impurity diffusion layer formed in the semiconductor substrate, the longitudinal direction of which is arranged in the direction along the <100> direction from the direction orthogonal to the <100> direction. Damage detection device. On one main surface of the single crystal semiconductor substrate, a Wheatstone bridge circuit including a plurality of resistance layers constituting a strain sensor resistance and a dummy resistance is provided.
The strain sensor resistance is an N-type impurity diffusion layer formed in the semiconductor substrate, the longitudinal direction of which is arranged in the direction along the <100> direction from the direction orthogonal to the <100> direction, and the dummy resistance is Damage to a structure characterized in that it is a P-type impurity diffusion layer formed in a semiconductor substrate, and its longitudinal direction is arranged in a direction along the <110> direction from a direction orthogonal to the <110> direction Detection device. The antenna according to any one of claims 1, 2, 4 to 9, further comprising an antenna that communicates with the electronic circuit, wherein a member that is more permeable than the non-measurement object is disposed on the measurement object side of the antenna. Damage detection device for structures. 11. The structure damage detection device according to claim 1, wherein the electronic circuit has an ID number unique to the electronic circuit. 12. The structure damage detection device according to claim 1, wherein the electronic circuit includes a temperature measurement circuit. 13. Damage to a structure according to any one of claims 1, 2, 4 to 12, characterized by comprising any one of vibration power generation, solar power generation, temperature difference power generation, and battery driving the electronic circuit. Detection device. 14. The structural damage detection device according to claim 1, wherein a non-volatile memory circuit capable of incorporating sensor calibration data is incorporated in the electronic circuit.

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