JP2006022278A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006022278A5 JP2006022278A5 JP2004203661A JP2004203661A JP2006022278A5 JP 2006022278 A5 JP2006022278 A5 JP 2006022278A5 JP 2004203661 A JP2004203661 A JP 2004203661A JP 2004203661 A JP2004203661 A JP 2004203661A JP 2006022278 A5 JP2006022278 A5 JP 2006022278A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- groups
- examples
- composition
- trialkoxysilyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
はじめに、本発明の室温硬化性オルガノポリシロキサン組成物について詳述する。
(A)成分のオルガノポリシロキサンは本組成物の主剤であり、分子鎖中のケイ素原子に結合した一般式:
−X−Si(OR1)3
で示されるトリアルコキシシリル含有基を一分子中に2個有することを特徴とする。式中のR1は同じかまたは異なるアルキル基もしくはアルコキシアルキル基であり、R1のアルキル基としては、メチル基、エチル基、プロピル基が例示され、R1のアルコキシアルキル基としては、メトキシメチル基、メトキシエチル基が例示される。また、式中のXはオキシ基またはアルキレン基であり、Xのアルキレン基としては、エチレン基、プロピレン基、ブチレン基が例示される。このようなトリアルコキシシリル含有基としては、例えば、トリメトキシシロキシ基、トリエトキシシロキシ基、ジメトキシエトキシシロキシ基、メトキシジエトキシシロキシ基、トリイソプロポキシシロキシ基、トリ(メトキシエトキシ)シロキシ基等のトリアルコキシシロキシ基;トリメトキシシリルエチル基、トリメトキシシリルプロピル基、トリエトキシシリルエチル基等のトリアルコキシシリルアルキル基が挙げられ、特に、トリメトキシシロキシ基、トリメトキシシリルエチル基が好ましい。このトリアルコキシシリル含有基の結合位置は特に限定されず、例えば、分子鎖末端のケイ素原子および/または分子鎖中のケイ素原子が挙げられる。特に、(A)成分は、分子鎖両末端のケイ素原子にトリアルコキシシリル含有基を有するジオルガノポリシロキサンであることが好ましい。このトリアルコキシシリル含有基以外のケイ素原子に結合している基としては、メチル基、エチル基、プロピル基、ブチル基、ヘキシル基、オクチル基、デシル基、オクタデシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;ビニル基、アリル基、ブテニル基、ヘキセニル基等のアルケニル基;フェニル基、トリル基、ナフチル基等のアリール基;ベンジル基、フェネチル基等のアラルキル基;クロロメチル基,3−クロロプロピル基、3,3,3−トリフルオロプロピル基等の置換もしくは非置換の一価炭化水素基が例示され、商業的に入手可能であることから、好ましくは、メチル基、フェニル基である。このオルガノポリシロキサンの分子構造は特に限定されず、例えば、直鎖状、一部分岐を有する直鎖状、分岐鎖状、環状が挙げられ、好ましくは、直鎖状である。また、この25℃における粘度は100〜1,000,000mPa・sの範囲内であり、好ましくは、100〜100,000mPa・sの範囲内である。これは、粘度が上記範囲の下限未満であると、組成物により形成される硬化物の機械的特性が低下する傾向があるからであり、一方、上記範囲の上限を超えると、組成物の取扱作業性が低下し、該組成物をシール剤またはポッティング剤に使用できなくなるからである。
First, the room temperature curable organopolysiloxane composition of the present invention will be described in detail.
The organopolysiloxane of component (A) is the main component of the composition, and has the general formula bonded to the silicon atom in the molecular chain:
-X-Si (OR 1 ) 3
It is characterized by having two trialkoxysilyl-containing groups represented by R 1 in the formula is the same or different alkyl group or alkoxyalkyl group, examples of the alkyl group of R 1 include a methyl group, an ethyl group, and a propyl group, and examples of the alkoxyalkyl group of R 1 include methoxymethyl Examples thereof include a methoxyethyl group. X in the formula is an oxy group or an alkylene group, and examples of the alkylene group of X include an ethylene group, a propylene group, and a butylene group. Examples of such a trialkoxysilyl-containing group include trimethoxysiloxy group, triethoxysiloxy group, dimethoxyethoxysiloxy group, methoxydiethoxysiloxy group, triisopropoxysiloxy group, tri (methoxyethoxy) siloxy group and the like. Alkoxysiloxy groups; trialkoxysilylalkyl groups such as trimethoxysilylethyl group, trimethoxysilylpropyl group, triethoxysilylethyl group and the like can be mentioned, and trimethoxysiloxy group and trimethoxysilylethyl group are particularly preferable. The bonding position of the trialkoxysilyl-containing group is not particularly limited, and examples thereof include a silicon atom at the end of the molecular chain and / or a silicon atom in the molecular chain. In particular, the component (A) is preferably a diorganopolysiloxane having trialkoxysilyl-containing groups on silicon atoms at both ends of the molecular chain. Examples of the groups bonded to silicon atoms other than the tri-alkoxysilane Li Le-containing group, a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, decyl group and octadecyl group; cyclopentyl Groups, cycloalkyl groups such as cyclohexyl groups; alkenyl groups such as vinyl groups, allyl groups, butenyl groups, hexenyl groups; aryl groups such as phenyl groups, tolyl groups, naphthyl groups; aralkyl groups such as benzyl groups, phenethyl groups; A substituted or unsubstituted monovalent hydrocarbon group such as a methyl group, 3-chloropropyl group, and 3,3,3-trifluoropropyl group is exemplified and is commercially available. , A phenyl group. The molecular structure of the organopolysiloxane is not particularly limited, and examples thereof include a straight chain, a partially branched straight chain, a branched chain, and a ring, and preferably a straight chain. The viscosity at 25 ° C. is in the range of 100 to 1,000,000 mPa · s, preferably in the range of 100 to 100,000 mPa · s. This is because if the viscosity is less than the lower limit of the above range, the mechanical properties of the cured product formed by the composition tend to deteriorate, whereas if the viscosity exceeds the upper limit of the above range, the composition is handled. This is because workability is lowered and the composition cannot be used as a sealant or a potting agent.
また、本組成物には、本発明の目的を損なわない範囲で、上記(C)成分や(E)成分以外のシリカ微粉末、沈降法シリカ、石英、炭酸カルシウム、二酸化チタン、けいそう土、アルミナ、マグネシア、酸化亜鉛、コロイド状炭酸カルシウム、カーボンブラック等の充填剤;これらをシラン化合物、シラザン化合物、あるいは低重合度シロキサンで表面処理した充填剤;その他、有機溶剤、防カビ剤、難燃剤、耐熱剤、可塑剤、チクソ性付与剤、顔料等を含有してもよい。 Further, in the present composition, within the range not impairing the object of the present invention, silica fine powder other than the above component (C) and component (E), precipitated silica, quartz, calcium carbonate, titanium dioxide, diatomaceous earth, Fillers such as alumina, magnesia, zinc oxide , colloidal calcium carbonate, carbon black; fillers surface-treated with silane compounds, silazane compounds, or low-polymerization siloxane; other organic solvents, fungicides, flame retardants , A heat-resistant agent, a plasticizer, a thixotropic agent, a pigment and the like may be contained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004203661A JP4799835B2 (en) | 2004-07-09 | 2004-07-09 | Room temperature curable organopolysiloxane composition and electrical / electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004203661A JP4799835B2 (en) | 2004-07-09 | 2004-07-09 | Room temperature curable organopolysiloxane composition and electrical / electronic equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006022278A JP2006022278A (en) | 2006-01-26 |
JP2006022278A5 true JP2006022278A5 (en) | 2007-08-09 |
JP4799835B2 JP4799835B2 (en) | 2011-10-26 |
Family
ID=35795785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004203661A Expired - Fee Related JP4799835B2 (en) | 2004-07-09 | 2004-07-09 | Room temperature curable organopolysiloxane composition and electrical / electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4799835B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5285892B2 (en) * | 2007-10-25 | 2013-09-11 | 東レ・ダウコーニング株式会社 | Room temperature curable organopolysiloxane composition |
JP5534656B2 (en) * | 2008-07-17 | 2014-07-02 | 東レ・ダウコーニング株式会社 | Room temperature curable organopolysiloxane composition |
JP2012236942A (en) * | 2011-05-13 | 2012-12-06 | Dow Corning Toray Co Ltd | Method of protecting transparent nonmetallic electroconductive part |
JP2013012556A (en) | 2011-06-28 | 2013-01-17 | Sony Corp | Solid-state image pickup device, manufacturing method of the same and electronic apparatus |
KR101884177B1 (en) | 2013-12-27 | 2018-08-02 | 다우 코닝 도레이 캄파니 리미티드 | Room-temperature-curable silicone rubber composition, and the use thereof |
WO2015098118A1 (en) | 2013-12-27 | 2015-07-02 | Dow Corning Toray Co., Ltd. | Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60255602A (en) * | 1984-05-29 | 1985-12-17 | Toyota Motor Corp | Preparation of ultrafine particle of oxide |
US4888380A (en) * | 1988-09-26 | 1989-12-19 | Dow Corning Corporation | Clear, non-slumping silicone sealants |
US4962151A (en) * | 1989-06-22 | 1990-10-09 | Dow Corning Corporation | Silicone sealant compositions |
JP3725178B2 (en) * | 1991-03-22 | 2005-12-07 | 東レ・ダウコーニング株式会社 | Room temperature curable organopolysiloxane composition |
JPH0739547B2 (en) * | 1992-01-10 | 1995-05-01 | 東レ・ダウコーニング・シリコーン株式会社 | Room temperature curable organopolysiloxane composition |
JPH06248184A (en) * | 1993-02-24 | 1994-09-06 | Toshiba Silicone Co Ltd | Room-temperature curing polyorganosiloxane composition |
JP3447805B2 (en) * | 1994-06-14 | 2003-09-16 | 信越化学工業株式会社 | Silicone composition for release paper and coated article thereof |
JPH11246742A (en) * | 1998-02-27 | 1999-09-14 | Hitachi Chem Co Ltd | Paste composition and semiconductor device prepared by using same |
JP2001192641A (en) * | 2000-01-06 | 2001-07-17 | Dow Corning Toray Silicone Co Ltd | Sealant composition |
JP2003049072A (en) * | 2001-05-30 | 2003-02-21 | Dow Corning Toray Silicone Co Ltd | Cold curable silicone rubber composition |
JP2002356616A (en) * | 2001-05-30 | 2002-12-13 | Dow Corning Toray Silicone Co Ltd | Room temperature-curable silicone rubber composition |
BR0210737A (en) * | 2001-07-26 | 2004-07-20 | Dow Corning Toray Silicone | Room temperature curable organopolysiloxane composition |
JP2004352947A (en) * | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | Room temperature-curing type of thermally conductive silicone rubber composition |
JP4180477B2 (en) * | 2003-09-10 | 2008-11-12 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Room temperature curable polyorganosiloxane composition |
JP4733937B2 (en) * | 2004-07-09 | 2011-07-27 | 東レ・ダウコーニング株式会社 | Room temperature curable organopolysiloxane composition and electrical / electronic equipment |
-
2004
- 2004-07-09 JP JP2004203661A patent/JP4799835B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2529186T3 (en) | Translucent silicone rubber forming composition in two parts | |
JP6270484B2 (en) | Organosiloxane composition | |
EP1227133B1 (en) | Room temperature curable silicone rubber composition | |
JP4766679B2 (en) | Heat-curing organopolysiloxane composition | |
JP4840602B2 (en) | Method for curing room temperature curable organopolysiloxane composition | |
KR20170106404A (en) | The room temperature curable organopolysiloxane composition | |
JP2006241253A (en) | Room-temperature-curable organopolysiloxane composition | |
JP2006022277A5 (en) | ||
JP2009102591A5 (en) | ||
JP2006022278A5 (en) | ||
JP2687038B2 (en) | Room temperature curable composition | |
JP2003221506A (en) | Room temperature-curable organopolysiloxane composition | |
JP2006131824A (en) | Room temperature curable organopolysiloxane composition | |
US7470804B2 (en) | Magnesium alloy-bonding organopolysiloxane composition and composite article | |
JPS5887151A (en) | Room temperature curing organopolysiloxane composition | |
JP2006265372A (en) | Room temperature-curable organopolysiloxane composition | |
JP2005162974A (en) | Room temperature-curable organopolysiloxane composition | |
WO2023068094A1 (en) | Room temperature-curable organopolysiloxane composition, adhesive, sealing agent, and coating agent | |
JP5177357B2 (en) | Low contamination room temperature curable organopolysiloxane composition and building material | |
JP2000129128A (en) | Curable silicone composition | |
JP2000129240A (en) | Display filler/adhesive | |
JP2005213487A (en) | Room temperature-curing polyorganosiloxane composition | |
JP5258550B2 (en) | Room temperature curable organopolysiloxane composition | |
JP2005194420A (en) | Curable composition for sealing material | |
US8791170B2 (en) | Photocurable organopolysiloxane composition |