JP2006004738A - Bending device for lead wire of fine fluorescent lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bending device for a lead wire of a fine fluorescent lamp, capable of accurately and efficiently bending the extra fine lead wire of the fine fluorescent lamp used for the backlight of a liquid crystal television or the like at a required angle. <P>SOLUTION: This bending device has a lamp supporting means to receive the base portion of the lead wire by its V-shaped groove, a positioning means to accurately position and fix the lead wire by moving the lamp to the V-shaped groove, and a movable body vertically approaching to and parting from the lead wire accurately positioned by the positioning means. In this movable body, a nipper to cut the excessive material of the lead wire, and a bending means to bend the lead wire from the intermediate position of the lead wire after the excessive material is cut by the nipper are provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is a lead lamp bending of a thin fluorescent lamp capable of bending an ultrafine lead wire of a thin fluorescent lamp (thin fluorescent lamp) used as a backlight of a liquid crystal television or the like at an arbitrary angle at its root portion. Relates to the device.

In recent years, thin and long thin fluorescent lamps having a diameter of several mm (for example, 2 mm) have been used as backlights for liquid crystal televisions. The length has reached around 30 cm to 70 cm with the spread of large televisions.
An example of a thin fluorescent lamp currently manufactured and sold is, for example, Japanese Patent Application Laid-Open No. 09-320532 (small fluorescent tube and small fluorescent tube device). In this fluorescent lamp, lead wires protrude from both ends of a long and narrow straight tube fluorescent lamp. The same applies to the double-sealed lamp for surface light source disclosed in JP-A-10-283999.

  In these conventional thin fluorescent lamps, an electrical cord such as a wire harness is soldered to a lead wire. The soldered thin fluorescent lamp is sent to an assembly factory where it is combined with other parts and incorporated into a liquid crystal screen.

  In order to make sure that the lead wire and the wire harness are soldered securely and firmly, the lead wire is slightly bent as shown in Japanese Patent Laid-Open No. 2000-075801 (backlight unit and electronic equipment), and hooked to this. There is an example in which the conductor portion of the cord bent is passed through and the joint portion is soldered. Such appropriate folding can be easily performed using a simple bending jig.

  However, the lead wire is very thin, about 0.3 mm, and the protruding portion is difficult to bend because different metals are welded due to thermal expansion, and can be bent accurately, for example, 30 ° or more. was difficult. If it is bent more than this, there is a risk that a force is applied to the sealed body and the sealed portion is broken, or the welded portion of the lead wire is detached.

Due to the special circumstances of these thin fluorescent lamps, a conventional metal bending machine or the like cannot be applied as it is.
JP 09-320532 A, page 1, FIG. Japanese Patent Laid-Open No. 10-283999, page 1, FIG. JP 2000-075801 A, page 1, FIG.

  In view of the above problems, the present invention efficiently bends the lead wire of a thin fluorescent lamp at an arbitrary angle without damaging the sealing body and without applying an excessive force to the welded portion of the lead wire. An object of the present invention is to provide a lead wire bending apparatus for a special thin fluorescent lamp.

  In addition, the lead wire bending device for a thin fluorescent lamp that can be bent at an arbitrary angle after making the lead wire length suitable by one machine and making the lead wire length suitable is provided. Objective.

The thin fluorescent lamp lead wire bending apparatus of the present invention capable of solving the above-mentioned problems is a lamp support in which the root portion of the lead wire of the thin fluorescent lamp is received by a thin (1 mm or less) V-shaped groove. Means,
Positioning means for moving the lamp supported by the lamp supporting means with respect to the V-shaped groove and accurately positioning and fixing the V-shaped groove, leaving an appropriate interval;
A moving body that approaches and separates from the vertical direction with respect to the lead wire accurately positioned by the positioning means,
The moving body is provided with a nipper that cuts the remaining material of the lead wire, and lead wire bending means that bends the lead wire after cutting the remaining material with the nipper at an arbitrary angle from an intermediate position. And The cutting of the remaining material can be performed before or after bending.

  The bending means is rotationally driven along a bent portion of the lead wire with a holding member for pressing the lead wire placed in the V-shaped groove and a bending reference position of the lead wire as a rotation center, And a rotating body that bends the lead wire outside the reference position at a required angle. By rotating the rotating body, the bent portion can be bent at an arbitrary angle without difficulty.

  The nippers and the bending means are arranged separately below and above the lead wire, the nipper is raised to cut off the lead wire surplus material, and the bending means is lowered to lower the lead wire middle part. The nippers or the bending means can be sequentially driven as the moving body moves up and down to bend. In this way, it is possible to attach a nipper and a bending means to one moving body as a base.

  According to the lead wire bending apparatus for a thin fluorescent lamp of the present invention, the root portion of the very thin lead wire is received by the thin V-shaped groove, accurately positioned, and the nipper and the bending member provided in the movable body that can be moved up and down. The means can be used to provide a bend of any angle with the required dimensions.

  If the lead wire is pressed into the V-shaped groove and the outer bent part is bent with a rotating body that rotates along this, a force will not be applied to the lead wire or the envelope, resulting in a defective product. Without this, it is possible to give an appropriate bending with high accuracy to a thin and weak lead wire.

  When the nipper and the bending means are provided in one moving body, the nipper and the bending means can be sequentially driven according to the lifting and lowering operation of the moving body, and the bending process can be performed efficiently.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a front view of a lead wire bending apparatus for a thin fluorescent lamp showing an embodiment of the present invention, and FIG. 2 is a side view thereof. FIG. 1 is a schematic cross-sectional view taken along line F1-F1 of FIG. 3, 4, and 5 are partially enlarged explanatory views.

  As shown in the figure, the lead wire bending apparatus 1 for a thin fluorescent lamp of the present invention is a device for bending a lead wire 3 of a long thin fluorescent lamp 2. The length of the fluorescent lamp 2 is approximately 30 to 70 cm and is approximately 2 mm in diameter. The outer diameter of the lead wire 3 is, for example, 0.3 mm. The length of the lead wire 3 is manufactured with a sufficient length. In order to be used for a later soldering operation, the remaining material is cut with an appropriate length, for example, a distance to the bending position of 2 to 3 mm and a length of the bent portion of 2 to 3 mm. The bending angle is shown as an example of 90 ° depending on the specification.

  As shown in FIGS. 1 and 2, a supply chute 5 is disposed in front of the base frame 4 (leftward in FIG. 2), and an extraction chute 6 is disposed behind. In the middle, a pair of V blocks 7 that receive the base portion of the lead wire 3 protruding from the end of the fluorescent lamp 2 with a thin V-shaped groove are arranged.

  The supply chute 5 has a slope with a downward slope toward the V block 7, and has a configuration in which the top of the fluorescent lamps 2 arranged in a row on the slope is received by a partition 8. In addition, a free-mount cylinder 9 for lightly pressing the second and subsequent fluorescent lamps 2 of the head position fluorescent lamps 2 stopped by the partition 8 with urethane rubber attached to the end of the rod, and the head position fluorescent lamp 2 A partition up / down drive cylinder 11 is provided that lowers the partition 8 and stops the partition 8 to roll to the ramp feed position 10. Accordingly, the fluorescent lamps 2 placed on the slope are stopped by the partition 8 and can be placed one by one at the lamp feed position 10 by the operations of the free mount cylinder 9 and the partition vertical drive cylinder 11. The fluorescent lamp 2 placed at the lamp feeding position 10 is lifted by the lifting block 12V of the pitch feeding device 12, is sequentially sent to the next lamp feeding position at a predetermined pitch, and finally moves onto the V block 7. It will be posted. The pitch feeding device 12 includes a lifting dual rod cylinder 13 that moves up and down, an air slide cylinder 14 that moves the lifting rod 12 in the front-rear direction, and a lifting V block 12V that is driven by the cylinders 13 and 14.

  The fluorescent lamp 2 transferred onto the V block 7 is pitch-fed onto the take-out plate 15 after the bending process, and then flows onto the take-out chute 6. Accordingly, a large number of processed fluorescent lamps 2 are assembled on the take-out chute 6 and shipped.

  As shown in detail in FIG. 3, the V block 7 that supports the lead wire 3 of the fluorescent lamp 2 is fixed to the upper end portion of the restriction plate 17 supported on the bracket 16. Accordingly, the lead wire 3 of the fluorescent lamp 2 lifted by the lifting V block 12 </ b> V is supported by the V-shaped groove of the V block 7 fixed to the upper end of the restriction plate 17.

  A stopper 19 is disposed on the bracket 18 located on the inner side (left side in FIG. 3) of the bracket 16, and an arm 20 protrudes toward the inner side. An LM guide 21 is supported on the arm 20, A cylinder 23 with a spring 22 is disposed at the end. The cylinder 23 is connected to a chuck device 24 supported on the LM guide 21 via a spring 22.

  The chuck device 24 includes a stopper bolt 26 that abuts against the stopper 19 via a bracket 25, and an air chuck device 29 that drives a claw portion 27 with a drive portion 28. Therefore, by inserting the fluorescent lamp 2 with the claw portion 27 and abutting the stopper bolt 26 against the stopper 19, the end of the lamp tube can be abutted against the V block 7 and the gap amount can be adjusted appropriately.

  As shown in FIG. 1, lead wire processing devices 32 including a nipper 30 and a bending means 31 are provided at both upper left and right ends of the device 1.

  As shown in an enlarged view in FIG. 4, the lead wire processing device 32 has a linear rail 34 on a base plate 33, and is provided with a vertical moving body 36 via a linear block 35. An air nipper 38 is provided below the moving body 36 via a support plate 37. The air nipper 38 has a blade 39 whose blade surface is directed obliquely upward on the inside, and is configured to cut off surplus material of the lead wire 3 by air drive. The blade 39 is normally positioned below, and at the time of cutting, the blade 39 is raised from below with respect to the lead wire 3 and is cut with the surplus material of the lead wire 3 interposed therebetween.

  An air cylinder 41 for bending driving is provided at the upper end of the moving body 36 via a pin 40, and the lower end of the rod is coupled to a rotating portion of a rotating body 43 supported at one end by a shaft 42 by a pin 44. Has been.

  FIG. 5 shows details of the rotating body 43. The shaft 42 is formed so as to straddle the intermediate portion 45, and a tip 46 made by quenching a special steel material to reduce friction is embedded in the bottom surface of the intermediate portion 45. The position of the tip 46 (left end in FIG. 5A) coincides with the center line of the shaft 42. The tip 46 is replaceable.

  (A) As shown in the figure, it is always in a horizontal position, and when the air cylinder 41 for bending driving is operated, the pin 44 is pushed down, and as shown in (a) and (b), it can be rotated up to 90 °. It is. If it stops halfway, the bending angle can be adjusted. After the surplus material is cut off, the lead wire 3 is disposed along the lower surface of the chip 46 shown in (a), and is bent downward along the chip 46. Details are shown in FIG.

  In FIG. 4 again, the moving body 36 is driven by an air cylinder 47 for driving up and down. The base plate 33 is provided with another air cylinder 49 that drives the presser rod 48 up and down. The presser rod 48 is fixed to a linear block 51 that can be raised and lowered with respect to the linear rail 50 fixed to the base plate 33, and can be raised and lowered by driving an air cylinder 49. A lead presser 52 is provided at the lower end of the presser rod 48. The tip of the lead presser 52 is formed with a special shape so as to press both the end of the fluorescent lamp 2 and the upper part of the V block 7. A rubber material is affixed to the pressing surface of the fluorescent lamp 2 so that the lead wire 3 is pressed firmly and the tube end of the fluorescent lamp 2 is pressed lightly. Therefore, the fluorescent lamp 2 can be pressed by the lead presser 52 and the bending means 31 can be driven. Here, the bending means 31 is composed of air cylinders 41, 47, 49, a rotating body 43, a lead presser 52, and related parts. In FIG. 4, the lead presser 52 is illustrated, but actually, it is located slightly above the rotating body 43 or substantially at the same position.

  The effect | action is shown about the lead wire bending apparatus 1 by the above structure. As shown in FIGS. 1 and 2, the fluorescent lamps 2 are transferred one by one from the supply chute 5 onto the V block 7. This transfer is performed by pitch-feeding one by one by sequentially driving the cylinders 11, 13, and 14.

  The fluorescent lamp 2 transferred between the V blocks 7 and 7 is gripped by the claw portion 27 of the chuck device 24 as shown in FIG. Assuming that the length of the fluorescent lamp 2 is L1, the distance L2 between the V blocks 7 and 7 is adjusted to be longer by a margin width d, for example, 1.9 mm. Accordingly, the distances L3 and L4 between the end portion of the fluorescent lamp 2 and the V block 7 when gripped by the claw portion 27 are indefinite at the initial stage. The fluorescent lamp 2 is gripped by the claw portion 27 and moved to the left in FIG. 6, for example, and the distance L3 is set to zero (0). Since the spring 22 acts, the fluorescent lamp 2 is not damaged. Therefore, the gripping by the claw portion 27 is once removed and gripped again, and this time, the ½ amount of the margin width, for example, 0.95 mm is moved in the opposite right direction. As a result, the distance between both ends of the fluorescent lamp 2 and each block 7 is maintained at an appropriate distance L5 (0.95 mm). In the present invention, the chuck device 24 used for positioning the fluorescent lamp 2 and its drive source, and the V block 7 are referred to as positioning means.

  Next, the nipper 30 is raised from the lower position as shown in FIG. 4 to cut off the remaining material of the lead wire 3. The cut surplus material is stored in a waste material bucket through a chute (not shown). Next, the air cylinders 47 and 49 are driven to hold the fluorescent lamp 2 on the V block 7, and the lower surface of the chip 46 of the rotating body 43 and the bent portion of the lead wire 3 are brought into contact with each other, followed by bending. The bending process is performed as the rotating body 43 rotates as shown in FIG. Further, as shown in FIG. 7 in an enlarged manner, at this time, the axis center of the rotating body 43 is in contact with the upper surface of the lead wire 3 on the bending center line of the lead wire 3, and the rotating body 43 of the rotating body 43 is centered on this point. Since the tip 46 is rotationally driven, the lead wire 3 is not forced and can be bent flexibly to 90 °. The lead wire processing device 32 shown in FIG.

  Thereafter, the rotation of the rotating body 43 is returned, retreated upward, the lifting V block 12V is operated and pitch-fed, the processed fluorescent lamp 2 is taken out onto the take-out plate 15, and the next unprocessed fluorescent lamp 2 is sent onto the V block 7 and repeatedly bent.

  The present invention is not limited to the above embodiment, and can be appropriately modified in design without departing from the gist of the present invention, and can be implemented in various aspects.

It is a front view of the lead wire bending apparatus of the thin fluorescent lamp concerning one embodiment of the present invention. It is a right view of FIG. It is a partial enlarged front view which shows the structure of a positioning means. It is a partial enlarged front view which shows the structure of a nipper and a bending means. It is explanatory drawing which shows the detail and effect | action of a rotary body. It is explanatory drawing for demonstrating the positioning system with respect to the V-shaped groove | channel of a thin fluorescent lamp. It is explanatory drawing which expands and shows a rotary body part further.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lead wire bending apparatus 2 Fluorescent lamp 3 Lead wire 4 Base frame 5 Supply chute 6 Takeout chute 7 V block 8 Partition 9, 11, 13, 14, 23, 41, 47, 49 Cylinder 10 Lamp feed position 12 Pitch feed Device 12V Lifting V block 15 Extraction plate 16, 18 Bracket 17 Restriction plate 19 Stopper 20 Arm 21 LM guide 22 Spring 24 Chuck device 25 Bracket 26 Stopper bolt 27 Claw portion 28 Drive portion 29 Air chuck device 30 Nipper 31 Bending means 32 Lead Line processing device 33 Base plate 34, 50 Linear rail 35 51 Linear block 36 Moving body 37 Support plate 38 Air nipper 39 Blade 40, 44 Pin 42 Axis 43 Rotating body 45 Intermediate part 46 Tip 4 Presser rod 52 lead presser

Claims (3)

Lamp support means for receiving the root portion of the lead wire of the thin fluorescent lamp with a thin V-shaped groove;
Positioning means for moving the lamp supported by the lamp supporting means with respect to the V-shaped groove and accurately positioning and fixing;
A moving body that approaches and separates from the vertical direction with respect to the lead wire positioned by the positioning means,
The moving body is provided with a nipper that cuts the remaining material of the lead wire, and lead wire bending means that bends the lead wire after cutting the remaining material with the nipper at an arbitrary angle from an intermediate position. Lead wire bending device for thin fluorescent lamps.   The bending means is rotationally driven along a bent portion of the lead wire with a holding member for pressing the lead wire placed in the V-shaped groove and a bending reference position of the lead wire as a rotation center, A lead wire bending apparatus for a thin fluorescent lamp, comprising: a rotating body for bending a lead wire outward from the reference position at a required angle. The nippers and the bending means are arranged separately below and above the lead wire, the nipper is raised to cut off the lead wire surplus material, and the bending means is lowered to lower the lead wire middle part. The lead wire bending apparatus for a thin fluorescent lamp, wherein the nipper or the bending means is sequentially driven as the moving body moves up and down so as to be bent.

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