JP2005539404A - サブパターン転写ナノスケールメモリ構造 - Google Patents

サブパターン転写ナノスケールメモリ構造 Download PDF

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Publication number
JP2005539404A
JP2005539404A JP2005501049A JP2005501049A JP2005539404A JP 2005539404 A JP2005539404 A JP 2005539404A JP 2005501049 A JP2005501049 A JP 2005501049A JP 2005501049 A JP2005501049 A JP 2005501049A JP 2005539404 A JP2005539404 A JP 2005539404A
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JP
Japan
Prior art keywords
wiring
nanoscale
microscale
memory array
memory
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Pending
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JP2005501049A
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English (en)
Japanese (ja)
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JP2005539404A5 (enExample
Inventor
デオン,アンドレ
エム リーバー,チャールズ
ディー リンカーン,パトリック
サヴェージ,ジョン
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SRI International Inc
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SRI International Inc
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Publication of JP2005539404A publication Critical patent/JP2005539404A/ja
Publication of JP2005539404A5 publication Critical patent/JP2005539404A5/ja
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/02Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/02Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
    • G11C13/025Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/10Decoders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/121Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/71Three dimensional array
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/81Array wherein the array conductors, e.g. word lines, bit lines, are made of nanowires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • H10B20/20Programmable ROM [PROM] devices comprising field-effect components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/943Information storage or retrieval using nanostructure

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Micro-Organisms Or Cultivation Processes Thereof (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
  • Silicon Compounds (AREA)
  • Prostheses (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Ropes Or Cables (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Read Only Memory (AREA)
JP2005501049A 2002-07-25 2003-07-24 サブパターン転写ナノスケールメモリ構造 Pending JP2005539404A (ja)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US39894302P 2002-07-25 2002-07-25
US40039402P 2002-08-01 2002-08-01
US41517602P 2002-09-30 2002-09-30
US42901002P 2002-11-25 2002-11-25
US44199503P 2003-01-23 2003-01-23
US46535703P 2003-04-25 2003-04-25
US46738803P 2003-05-02 2003-05-02
PCT/US2003/023199 WO2004034467A2 (en) 2002-07-25 2003-07-24 Sublithographic nanoscale memory architecture

Publications (2)

Publication Number Publication Date
JP2005539404A true JP2005539404A (ja) 2005-12-22
JP2005539404A5 JP2005539404A5 (enExample) 2006-09-07

Family

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Family Applications (2)

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JP2005501049A Pending JP2005539404A (ja) 2002-07-25 2003-07-24 サブパターン転写ナノスケールメモリ構造
JP2005508519A Pending JP2006512782A (ja) 2002-07-25 2003-07-24 サブパターン転写ナノスケールインターフェースの確率的組立体

Family Applications After (1)

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JP2005508519A Pending JP2006512782A (ja) 2002-07-25 2003-07-24 サブパターン転写ナノスケールインターフェースの確率的組立体

Country Status (7)

Country Link
US (2) US6900479B2 (enExample)
EP (3) EP1525585A2 (enExample)
JP (2) JP2005539404A (enExample)
AT (2) ATE421147T1 (enExample)
AU (2) AU2003298529A1 (enExample)
DE (2) DE60325903D1 (enExample)
WO (2) WO2004034467A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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JP2009525193A (ja) * 2006-01-27 2009-07-09 ヒューレット−パッカード デベロップメント カンパニー エル.ピー. ミックススケール電子界面
KR101409310B1 (ko) * 2007-03-28 2014-06-18 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 3차원 크로스바 어레이 접합에 저장된 정보를 판독 및 기록하기 위한 3차원 크로스바 어레이 시스템 및 방법
JP2018006757A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ 半導体素子
JP2018006755A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノトランジスタ
JP2018006756A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノヘテロ接合構造
JP2018006754A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノヘテロ接合構造

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WO2002017362A2 (en) * 2000-08-22 2002-02-28 President And Fellows Of Harvard College Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
EP1342075B1 (en) * 2000-12-11 2008-09-10 President And Fellows Of Harvard College Device contaning nanosensors for detecting an analyte and its method of manufacture
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WO2004034467A2 (en) 2002-07-25 2004-04-22 California Institute Of Technology Sublithographic nanoscale memory architecture
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JP2009525193A (ja) * 2006-01-27 2009-07-09 ヒューレット−パッカード デベロップメント カンパニー エル.ピー. ミックススケール電子界面
KR101409310B1 (ko) * 2007-03-28 2014-06-18 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 3차원 크로스바 어레이 접합에 저장된 정보를 판독 및 기록하기 위한 3차원 크로스바 어레이 시스템 및 방법
JP2018006757A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ 半導体素子
JP2018006755A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノトランジスタ
JP2018006756A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノヘテロ接合構造
JP2018006754A (ja) * 2016-07-01 2018-01-11 ツィンファ ユニバーシティ ナノヘテロ接合構造

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EP1525586A2 (en) 2005-04-27
WO2004061859A2 (en) 2004-07-22
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DE60313462D1 (de) 2007-06-06
ATE360873T1 (de) 2007-05-15
AU2003298529A8 (en) 2004-07-29
US20040113138A1 (en) 2004-06-17
WO2004034467A2 (en) 2004-04-22
ATE421147T1 (de) 2009-01-15
AU2003298530A8 (en) 2004-05-04
JP2006512782A (ja) 2006-04-13
US20040113139A1 (en) 2004-06-17
EP1525586B1 (en) 2007-04-25
EP1758126A3 (en) 2007-03-14
EP1758126A2 (en) 2007-02-28
AU2003298529A1 (en) 2004-07-29
US6963077B2 (en) 2005-11-08
DE60313462T2 (de) 2008-01-03
WO2004034467A3 (en) 2004-08-26
WO2004061859A3 (en) 2005-02-03
EP1525585A2 (en) 2005-04-27
US6900479B2 (en) 2005-05-31

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