JP2005538535A5 - - Google Patents

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Publication number
JP2005538535A5
JP2005538535A5 JP2004521992A JP2004521992A JP2005538535A5 JP 2005538535 A5 JP2005538535 A5 JP 2005538535A5 JP 2004521992 A JP2004521992 A JP 2004521992A JP 2004521992 A JP2004521992 A JP 2004521992A JP 2005538535 A5 JP2005538535 A5 JP 2005538535A5
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JP
Japan
Prior art keywords
component
compound
resin
thermal
layered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004521992A
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English (en)
Japanese (ja)
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JP2005538535A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2003/022710 external-priority patent/WO2004008497A2/en
Publication of JP2005538535A publication Critical patent/JP2005538535A/ja
Publication of JP2005538535A5 publication Critical patent/JP2005538535A5/ja
Pending legal-status Critical Current

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JP2004521992A 2002-07-15 2003-07-15 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用 Pending JP2005538535A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39629402P 2002-07-15 2002-07-15
PCT/US2003/022710 WO2004008497A2 (en) 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof

Publications (2)

Publication Number Publication Date
JP2005538535A JP2005538535A (ja) 2005-12-15
JP2005538535A5 true JP2005538535A5 (OSRAM) 2006-08-31

Family

ID=30116003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521992A Pending JP2005538535A (ja) 2002-07-15 2003-07-15 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用

Country Status (7)

Country Link
US (1) US20060040112A1 (OSRAM)
EP (1) EP1531985A4 (OSRAM)
JP (1) JP2005538535A (OSRAM)
CN (1) CN1681648A (OSRAM)
AU (1) AU2003254046A1 (OSRAM)
TW (1) TW200409246A (OSRAM)
WO (1) WO2004008497A2 (OSRAM)

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DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
US20070069373A1 (en) * 2005-09-29 2007-03-29 Roth Arti P Device with surface cooling and method of making
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CN104768742A (zh) * 2012-11-09 2015-07-08 3M创新有限公司 热界面组合物及其制备和使用方法
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US9899643B2 (en) 2013-02-27 2018-02-20 Ioxus, Inc. Energy storage device assembly
US9738976B2 (en) 2013-02-27 2017-08-22 Ioxus, Inc. Energy storage device assembly
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US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
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JP6320331B2 (ja) * 2015-03-16 2018-05-09 三菱電機株式会社 電力用半導体装置
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105441034A (zh) * 2015-12-03 2016-03-30 深圳德邦界面材料有限公司 一种橡胶改性的相变导热界面材料及制备方法
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US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
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US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108235666B (zh) * 2018-02-11 2024-03-01 中国科学院工程热物理研究所 表面调控的柔性微槽群热沉、散热装置和方法
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US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
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CN116640366A (zh) * 2023-06-27 2023-08-25 广东力王新材料有限公司 一种橡胶相变材料及其制备工艺
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