JP2005538535A - 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用 - Google Patents

熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用 Download PDF

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Publication number
JP2005538535A
JP2005538535A JP2004521992A JP2004521992A JP2005538535A JP 2005538535 A JP2005538535 A JP 2005538535A JP 2004521992 A JP2004521992 A JP 2004521992A JP 2004521992 A JP2004521992 A JP 2004521992A JP 2005538535 A JP2005538535 A JP 2005538535A
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JP
Japan
Prior art keywords
component
thermal
resin
layered
compound
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2004521992A
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English (en)
Japanese (ja)
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JP2005538535A5 (OSRAM
Inventor
デイーン，ナンシー
ノール，ポーラ
タウンゼント，ロバート
グエン，ミイ
エデイ，コリン
カラン，ダン
Original Assignee
ハネウエル・インターナシヨナル・インコーポレーテツド
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Publication date
Application filed by ハネウエル・インターナシヨナル・インコーポレーテツド filed Critical ハネウエル・インターナシヨナル・インコーポレーテツド
Publication of JP2005538535A publication Critical patent/JP2005538535A/ja
Publication of JP2005538535A5 publication Critical patent/JP2005538535A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2004521992A 2002-07-15 2003-07-15 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用 Pending JP2005538535A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39629402P 2002-07-15 2002-07-15
PCT/US2003/022710 WO2004008497A2 (en) 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof

Publications (2)

Publication Number Publication Date
JP2005538535A true JP2005538535A (ja) 2005-12-15
JP2005538535A5 JP2005538535A5 (OSRAM) 2006-08-31

Family

ID=30116003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521992A Pending JP2005538535A (ja) 2002-07-15 2003-07-15 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用

Country Status (7)

Country Link
US (1) US20060040112A1 (OSRAM)
EP (1) EP1531985A4 (OSRAM)
JP (1) JP2005538535A (OSRAM)
CN (1) CN1681648A (OSRAM)
AU (1) AU2003254046A1 (OSRAM)
TW (1) TW200409246A (OSRAM)
WO (1) WO2004008497A2 (OSRAM)

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JP2016171269A (ja) * 2015-03-16 2016-09-23 三菱電機株式会社 電力用半導体装置
JP2018538690A (ja) * 2015-12-03 2018-12-27 深▲セン▼▲徳▼邦界面材料有限公司Ｓｈｅｎｚｈｅｎ Ｄａｒｂｏｎｄ Ｉｎｔｅｒｆａｃｅ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． ゴム変性の相変化熱伝導材料及びその製造方法

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DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP4551074B2 (ja) * 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7192116B2 (en) * 2003-11-26 2007-03-20 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat from a fluid ejector carriage
US7261389B2 (en) * 2003-11-26 2007-08-28 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat into a fluid ejector carriage device
WO2005096731A2 (en) * 2004-03-30 2005-10-20 Honeywell International Inc. Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US7319048B2 (en) * 2004-09-03 2008-01-15 Intel Corporation Electronic assemblies having a low processing temperature
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
US20070069373A1 (en) * 2005-09-29 2007-03-29 Roth Arti P Device with surface cooling and method of making
US20070148467A1 (en) * 2005-12-23 2007-06-28 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
EP2188834A4 (en) * 2007-09-11 2014-03-19 Dow Corning COMPOSITE, THERMAL INTERMEDIATE MATERIAL WITH THE COMPOSITE AND METHOD FOR ITS MANUFACTURE AND USE
WO2009035907A2 (en) * 2007-09-11 2009-03-19 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
US20090111925A1 (en) * 2007-10-31 2009-04-30 Burnham Kikue S Thermal interface materials, methods of production and uses thereof
WO2009114372A2 (en) * 2008-03-13 2009-09-17 Honeywell International Inc. Thermal interconnect and integrated interface systems, methods of production and uses thereof
KR20100062550A (ko) * 2008-12-02 2010-06-10 삼성전기주식회사 패턴부가 형성된 솔더 레지스트층을 구비한 패키지 기판 및그 제조방법
CN102341474B (zh) 2009-03-02 2014-09-24 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
CN104768742A (zh) * 2012-11-09 2015-07-08 3M创新有限公司 热界面组合物及其制备和使用方法
KR102218844B1 (ko) * 2013-02-27 2021-02-23 이옥서스, 인크. 에너지 저장 장치 조립체
US9899643B2 (en) 2013-02-27 2018-02-20 Ioxus, Inc. Energy storage device assembly
US9738976B2 (en) 2013-02-27 2017-08-22 Ioxus, Inc. Energy storage device assembly
US9892868B2 (en) 2013-06-21 2018-02-13 Ioxus, Inc. Energy storage device assembly
KR20160094385A (ko) 2013-12-05 2016-08-09 허니웰 인터내셔날 인코포레이티드 조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
CN107250317A (zh) 2014-12-05 2017-10-13 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
MX393621B (es) * 2016-03-08 2025-03-24 Honeywell Int Inc Material de camibo de fase.
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108235666B (zh) * 2018-02-11 2024-03-01 中国科学院工程热物理研究所 表面调控的柔性微槽群热沉、散热装置和方法
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
TW202543812A (zh) * 2019-10-25 2025-11-16 德商漢高股份有限及兩合公司 可三維圖案化之熱介面
CN116640366A (zh) * 2023-06-27 2023-08-25 广东力王新材料有限公司 一种橡胶相变材料及其制备工艺
US20250214088A1 (en) * 2023-12-28 2025-07-03 Lenovo Enterprise Solutions (Singapore) Pte Ltd. Removing a ferromagnetic liquid from a surface

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Publication number Priority date Publication date Assignee Title
JP2016171269A (ja) * 2015-03-16 2016-09-23 三菱電機株式会社 電力用半導体装置
JP2018538690A (ja) * 2015-12-03 2018-12-27 深▲セン▼▲徳▼邦界面材料有限公司Ｓｈｅｎｚｈｅｎ Ｄａｒｂｏｎｄ Ｉｎｔｅｒｆａｃｅ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． ゴム変性の相変化熱伝導材料及びその製造方法

Also Published As

Publication number Publication date
WO2004008497A3 (en) 2004-04-01
EP1531985A2 (en) 2005-05-25
US20060040112A1 (en) 2006-02-23
EP1531985A4 (en) 2008-03-19
CN1681648A (zh) 2005-10-12
TW200409246A (en) 2004-06-01
AU2003254046A8 (en) 2004-02-02
WO2004008497B1 (en) 2004-05-06
WO2004008497A2 (en) 2004-01-22
AU2003254046A1 (en) 2004-02-02

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