JP2005537662A - 高誘電率の上部誘電体を有する誘電体蓄積メモリセル(monos)およびそのための方法 - Google Patents
高誘電率の上部誘電体を有する誘電体蓄積メモリセル(monos)およびそのための方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 12
- LPQOADBMXVRBNX-UHFFFAOYSA-N ac1ldcw0 Chemical compound Cl.C1CN(C)CCN1C1=C(F)C=C2C(=O)C(C(O)=O)=CN3CCSC1=C32 LPQOADBMXVRBNX-UHFFFAOYSA-N 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 20
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 20
- 239000004065 semiconductor Substances 0.000 abstract description 16
- 230000008901 benefit Effects 0.000 abstract description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 15
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- TVGGZXXPVMJCCL-UHFFFAOYSA-N [Si].[La] Chemical group [Si].[La] TVGGZXXPVMJCCL-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
図中の要素は単純化と明確化のための示されたものであり、必ずしも一定の比率で描かれていないことは当業者にとって明らかである。例えば、図中の要素のいくつかの寸法を、本発明の実施態様の理解を高めるために役立つように、他の要素に対して誇張することができる。
30および側壁スペーサ34に整合したソース/ドレイン領域38,40を形成し、ゲート32および側壁スペーサ36に整合したソース/ドレイン領域42,44を形成した後の半導体デバイス10を示す。本願で用いられている「ソース/ドレイン」なる用語は、一般的な用法と一致しており、MOSトランジスタの電流電極を表すためと、MOSトランジスタの電流電極が一般的にソースかドレインのいずれかとして機能することにおいて互換性があることを分かるようにするために使用されている。これらのプロセス工程により、NVM部分22においてNVMセル46が完成し、トランジスタ部分20においてトランジスタ48が完成する。この結果、NVMセル46の上部誘電体が、ゲート電極30と窒化シリコン層16との間の高度な結合を行う。高k誘電体層18は、漏洩を低くするために比較的厚く、通常のトランジスタ形成と互換性がある方法で形成される。高k誘電体層18による高度な結合と、その比較的大きな厚さとが、消去時間と漏洩との双方を許容可能にする。
Claims (3)
- 誘電体蓄積メモリセルであって、
基板と、
前記基板の上に位置し、第1の相対誘電率を有する第1誘電体層と、
前記第1誘電体層の上に位置し、データ値を表す電荷を蓄積する電荷蓄積層と、
前記電荷蓄積層の上に位置し、前記第1の相対誘電率よりも大きい第2の相対誘電率を有する第2誘電体層と、
前記電荷蓄積層と前記第2誘電体層との間に介在し、10オングストローム未満の厚さを有する界面層と、
前記第2誘電体層の上に位置し、当該誘電体蓄積メモリセルの制御電極を形成するゲート電極と、
前記基板内において前記ゲート電極の下の領域のすぐ近くに形成される第1電流電極および第2電流電極とを備え、
前記第1誘電体と比べて第2誘電体の相対誘電率が大きいことによって、前記ゲート電極と、蓄積電荷を含む電荷蓄積層内の場所との間の容量結合が増大されるとともに、前記ゲート電極から前記電荷蓄積層への電荷の漏洩が低減される、誘電体蓄積メモリセル。 - 誘電体蓄積メモリセルを形成する方法であって、
基板を設ける工程と、
前記基板の上に位置し、第1の相対誘電率を有する第1誘電体層を設ける工程と、
前記第1誘電体層の上に位置し、データ値を表す電荷を蓄積する電荷蓄積層を設ける工程と、
前記電荷蓄積層の上に位置し、前記第1の相対誘電率よりも大きい第2の相対誘電率を有する第2誘電体層を設ける工程と、
前記第2誘電体層を、前記電荷蓄積層と前記第2誘電体層の間に位置し、10オングストローム未満の厚さを有する界面層を形成する環境に露出させる工程と、
当該誘電体蓄積メモリセルのゲート電極であって、前記第2誘電体層の上に位置するゲート電極を形成する工程と、
前記基板内において前記ゲート電極の下の領域のすぐ近くに第1電流電極および第2電流電極を形成する工程とを備える方法。 - 誘電体蓄積メモリセルであって、
基板と、
前記基板の上に位置し、第1の相対誘電率を有する第1誘電体層と、
前記第1誘電体層の上に位置し、データ値を表す電荷を蓄積する電荷蓄積層と、
前記電荷蓄積層の上に位置する第2誘電体層であって、前記第1の相対誘電率よりも大きい第2の相対誘電率を有して、第2誘電体層によって容量結合を制御することと、第2誘電体によって電荷の漏洩を低減することとの少なくとも一方を行なう、第2誘電体層と、
前記第2誘電体層の上に位置し、該誘電体蓄積メモリセルの制御電極を形成するゲート電極と、
前記基板内において前記ゲート電極の下の領域のすぐ近くに形成される第1電流電極および第2電流電極とを備える誘電体蓄積メモリセル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/230,810 US6812517B2 (en) | 2002-08-29 | 2002-08-29 | Dielectric storage memory cell having high permittivity top dielectric and method therefor |
PCT/US2003/022991 WO2004021399A2 (en) | 2002-08-29 | 2003-07-24 | Dielectric storage memory cell (monos) having high permittivity top dielectric and method therefor |
Publications (2)
Publication Number | Publication Date |
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JP2005537662A true JP2005537662A (ja) | 2005-12-08 |
JP2005537662A5 JP2005537662A5 (ja) | 2006-08-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004532818A Pending JP2005537662A (ja) | 2002-08-29 | 2003-07-24 | 高誘電率の上部誘電体を有する誘電体蓄積メモリセル(monos)およびそのための方法 |
Country Status (8)
Country | Link |
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US (1) | US6812517B2 (ja) |
EP (1) | EP1547157A2 (ja) |
JP (1) | JP2005537662A (ja) |
KR (1) | KR100979661B1 (ja) |
CN (1) | CN100466292C (ja) |
AU (1) | AU2003263803A1 (ja) |
TW (1) | TWI305676B (ja) |
WO (1) | WO2004021399A2 (ja) |
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JP2009049368A (ja) * | 2007-08-13 | 2009-03-05 | Micronics Internatl Co Ltd | 高速消去式電荷捕捉メモリーセル |
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US9876025B2 (en) | 2015-10-19 | 2018-01-23 | Sandisk Technologies Llc | Methods for manufacturing ultrathin semiconductor channel three-dimensional memory devices |
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US20190103414A1 (en) * | 2017-10-04 | 2019-04-04 | Cypress Semiconductor Corporation | Embedded sonos with a high-k metal gate and manufacturing methods of the same |
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2003
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- 2003-07-24 WO PCT/US2003/022991 patent/WO2004021399A2/en not_active Application Discontinuation
- 2003-07-24 CN CNB038206153A patent/CN100466292C/zh not_active Expired - Fee Related
- 2003-07-24 KR KR1020057003561A patent/KR100979661B1/ko not_active IP Right Cessation
- 2003-07-24 JP JP2004532818A patent/JP2005537662A/ja active Pending
- 2003-07-24 AU AU2003263803A patent/AU2003263803A1/en not_active Abandoned
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US6245652B1 (en) * | 1998-09-04 | 2001-06-12 | Advanced Micro Devices, Inc. | Method of forming ultra thin gate dielectric for high performance semiconductor devices |
JP2002118184A (ja) * | 2000-10-11 | 2002-04-19 | Sony Corp | 不揮発性半導体記憶装置の動作方法 |
JP2003068897A (ja) * | 2001-06-28 | 2003-03-07 | Samsung Electronics Co Ltd | 浮遊トラップ型不揮発性メモリ素子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006114905A (ja) * | 2004-10-08 | 2006-04-27 | Samsung Electronics Co Ltd | 不揮発性の半導体メモリ素子 |
JP2009049368A (ja) * | 2007-08-13 | 2009-03-05 | Micronics Internatl Co Ltd | 高速消去式電荷捕捉メモリーセル |
Also Published As
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WO2004021399A3 (en) | 2004-04-01 |
TWI305676B (en) | 2009-01-21 |
EP1547157A2 (en) | 2005-06-29 |
AU2003263803A1 (en) | 2004-03-19 |
CN100466292C (zh) | 2009-03-04 |
KR20050035895A (ko) | 2005-04-19 |
WO2004021399A2 (en) | 2004-03-11 |
US6812517B2 (en) | 2004-11-02 |
CN1685525A (zh) | 2005-10-19 |
AU2003263803A8 (en) | 2004-03-19 |
US20040041192A1 (en) | 2004-03-04 |
KR100979661B1 (ko) | 2010-09-02 |
TW200406889A (en) | 2004-05-01 |
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