JP2005528680A - 指紋センサの製造方法及びその指紋センサ - Google Patents
指紋センサの製造方法及びその指紋センサ Download PDFInfo
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- JP2005528680A JP2005528680A JP2004504178A JP2004504178A JP2005528680A JP 2005528680 A JP2005528680 A JP 2005528680A JP 2004504178 A JP2004504178 A JP 2004504178A JP 2004504178 A JP2004504178 A JP 2004504178A JP 2005528680 A JP2005528680 A JP 2005528680A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Microelectronics & Electronic Packaging (AREA)
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- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Human Computer Interaction (AREA)
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- Bioinformatics & Cheminformatics (AREA)
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- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Computation (AREA)
- Bioinformatics & Computational Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (10)
- センサチップ(10)を製造するステップ、
該チップを基板(20)上に装着するステップ、
該チップ(10)を、ワイヤボンディングワイヤ(28)によって基板(20)に接続するステップ、
チップ/基板アッセンブリを型内に配置するステップ、及び
基板及びチップを少なくとも部分的に覆い、且つワイヤを完全に封入するように、保護樹脂を前記型内に流し込むステップ
を実行する指紋センサの製造方法であって、
前記型が、樹脂のバンプ(30)が、チップの少なくとも一辺に形成された、チップの感知表面から少なくとも500ミクロンだけ突出するような形状を有し、前記バンプが、ワイヤボンディングワイヤを保護し、且つ指紋を検出する指の位置決めガイドを形成し、これにより、指がバンプに突き当たる時にチップの感知有効表面と向かい合うようになる方法。 - 前記チップの少なくとも一辺がガイドバンプを有さないことを特徴とする、請求項1に記載の方法。
- 指を有効表面上でスライドさせることによって指紋検出ができるように前記センサを設計し、チップを細長いストリップの形状にすることと、チップの少なくとも二辺がガイドバンプを有さないように型を固定することとを特徴とする、請求項2に記載の方法。
- チップの有効表面が、該表面を保護する薄い成形樹脂層(36)で覆われるような形状に型を形成することを特徴とする、請求項1ないし3のいずれか1項に記載の方法。
- 基板を型内に配置する前に、センサの感知表面を覆う樹脂の高さを完璧に規定するため、型の底部に接する調整された高さを有するスペーサ(38)を集積回路チップの表側の面に配置し、その後チップを型内に配置することを特徴とする、請求項4に記載の方法。
- チップの感知表面上に出るスペーサの厚さを、約10から数10ミクロンの範囲とすることを特徴とする、請求項4又は5に記載の方法。
- 前記バンプの高さを1ミリメートル未満とすることを特徴とする、請求項1ないし6のいずれか1項に記載の方法。
- 感知表面(12)を備えたセンサチップ、
電気的接続部(26)が設けられた基板、及び
該電気的接続部(26)にチップを接続するワイヤボンディングワイヤ(28)
を備えた指紋センサであって、
基板及びチップを少なくとも部分的に覆い、且つワイヤボンディングワイヤを完全に封入する成形保護樹脂を有すること、及び、該樹脂が、チップの少なくとも一辺、且つ多くとも三辺に設けられ、感知表面上に少なくとも500ミクロン隆起しているバンプを形成しており、該バンプが、ワイヤボンディングワイヤを封入し、且つ指紋を検出する指のガイドを構成していることを特徴とする、センサ。 - 指をチップの長手方向に対して垂直方向に横断するようにスライドさせたときに指紋が検出されるように設計されたセンサであって、前記チップがストリップの形状になっており、前記樹脂バンプが、チップの二辺以内に設けられていて、これらの辺が短辺であることを特徴とする、請求項8に記載のセンサ。
- バンプの感知表面上の高さが1ミリメートル未満であることを特徴とする、請求項9に記載のセンサ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0205732A FR2839570B1 (fr) | 2002-05-07 | 2002-05-07 | Procede de fabrication de capteur d'empreinte digitale et capteur correspondant |
PCT/FR2003/001378 WO2003096265A1 (fr) | 2002-05-07 | 2003-05-02 | Procede de fabrication de capteur d'empreinte digitale et capteur correspondant |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005528680A true JP2005528680A (ja) | 2005-09-22 |
JP2005528680A5 JP2005528680A5 (ja) | 2006-06-08 |
JP4433402B2 JP4433402B2 (ja) | 2010-03-17 |
Family
ID=29286362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004504178A Expired - Fee Related JP4433402B2 (ja) | 2002-05-07 | 2003-05-02 | 指紋センサの製造方法及びその指紋センサ |
Country Status (8)
Country | Link |
---|---|
US (2) | US7393711B2 (ja) |
EP (1) | EP1512114B1 (ja) |
JP (1) | JP4433402B2 (ja) |
KR (1) | KR20050010787A (ja) |
AU (1) | AU2003249391A1 (ja) |
DE (1) | DE60303037T2 (ja) |
FR (1) | FR2839570B1 (ja) |
WO (1) | WO2003096265A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009512095A (ja) * | 2005-10-18 | 2009-03-19 | オーセンテック,インコーポレイテッド | フレキシブル回路を備えた指センサおよびそれに関連する方法 |
JP2013534008A (ja) * | 2010-06-18 | 2013-08-29 | オーセンテック,インコーポレイテッド | センシングエリア上に封止層を有する指センサおよび関連する方法 |
JP2016129254A (ja) * | 2012-10-01 | 2016-07-14 | 富士電機株式会社 | 半導体装置 |
JP2019074794A (ja) * | 2017-10-12 | 2019-05-16 | 富士通コネクテッドテクノロジーズ株式会社 | 電子機器 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8358816B2 (en) | 2005-10-18 | 2013-01-22 | Authentec, Inc. | Thinned finger sensor and associated methods |
TWI325618B (en) * | 2007-01-02 | 2010-06-01 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
US7705613B2 (en) * | 2007-01-03 | 2010-04-27 | Abhay Misra | Sensitivity capacitive sensor |
CN104378907B (zh) * | 2013-08-12 | 2017-06-30 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
TWI534962B (zh) * | 2013-12-09 | 2016-05-21 | 茂丞科技股份有限公司 | 具有外觀隱藏的耦合電極之近接式感測器及其製造方法 |
US9390308B2 (en) | 2014-09-12 | 2016-07-12 | Blackberry Limited | Fingerprint scanning method |
TWI594341B (zh) * | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | 指紋辨識裝置封裝及其製造方法 |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
KR20170082358A (ko) * | 2016-01-06 | 2017-07-14 | 하나 마이크론(주) | 스마트 기기의 트랙패드 반도체 패키지 및 그 제조 방법 |
KR101870506B1 (ko) * | 2016-04-14 | 2018-06-22 | 앰코테크놀로지코리아(주) | 핑거 프린트 센서용 반도체 패키지 및 이의 제조 방법 |
KR20200092665A (ko) * | 2019-01-25 | 2020-08-04 | 삼성전자주식회사 | 생체신호 측정용 텍스쳐 인터페이스 및 이를 포함한 생체신호 측정장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132535A (ja) * | 1984-07-25 | 1986-02-15 | Sanyo Electric Co Ltd | センサの製造方法 |
FR2640842B1 (fr) | 1988-12-20 | 1991-07-26 | Thomson Csf | Antenne hydrophonique lineaire modulaire directionnelle |
JP4024335B2 (ja) * | 1996-01-26 | 2007-12-19 | ハリス コーポレイション | 集積回路のダイを露出させる開口部を有する集積回路装置とその製造方法 |
US6331452B1 (en) * | 1999-04-12 | 2001-12-18 | Verdicom, Inc. | Method of fabricating integrated circuit package with opening allowing access to die |
JP2001141411A (ja) * | 1999-11-12 | 2001-05-25 | Sony Corp | 指紋認識用半導体装置 |
ATE280976T1 (de) * | 2000-03-24 | 2004-11-15 | Infineon Technologies Ag | Gehäuse für biometrische sensorchips |
DE10109327A1 (de) * | 2001-02-27 | 2002-09-12 | Infineon Technologies Ag | Halbleiterchip und Herstellungsverfahren für ein Gehäuse |
JP3766034B2 (ja) * | 2002-02-20 | 2006-04-12 | 富士通株式会社 | 指紋センサ装置及びその製造方法 |
US6653723B2 (en) * | 2002-03-09 | 2003-11-25 | Fujitsu Limited | System for providing an open-cavity low profile encapsulated semiconductor package |
JP2005346271A (ja) * | 2004-06-01 | 2005-12-15 | Fujitsu Ltd | 指紋センサーパッケージ |
-
2002
- 2002-05-07 FR FR0205732A patent/FR2839570B1/fr not_active Expired - Fee Related
-
2003
- 2003-05-02 WO PCT/FR2003/001378 patent/WO2003096265A1/fr active IP Right Grant
- 2003-05-02 DE DE60303037T patent/DE60303037T2/de not_active Expired - Fee Related
- 2003-05-02 US US10/513,308 patent/US7393711B2/en not_active Expired - Fee Related
- 2003-05-02 KR KR10-2004-7017919A patent/KR20050010787A/ko not_active Application Discontinuation
- 2003-05-02 EP EP03749916A patent/EP1512114B1/fr not_active Expired - Fee Related
- 2003-05-02 AU AU2003249391A patent/AU2003249391A1/en not_active Abandoned
- 2003-05-02 JP JP2004504178A patent/JP4433402B2/ja not_active Expired - Fee Related
-
2008
- 2008-06-30 US US12/165,529 patent/US20080309459A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009512095A (ja) * | 2005-10-18 | 2009-03-19 | オーセンテック,インコーポレイテッド | フレキシブル回路を備えた指センサおよびそれに関連する方法 |
JP4881387B2 (ja) * | 2005-10-18 | 2012-02-22 | オーセンテック,インコーポレイテッド | フレキシブル回路を備えた指センサおよびそれに関連する方法 |
JP2013534008A (ja) * | 2010-06-18 | 2013-08-29 | オーセンテック,インコーポレイテッド | センシングエリア上に封止層を有する指センサおよび関連する方法 |
JP2016129254A (ja) * | 2012-10-01 | 2016-07-14 | 富士電機株式会社 | 半導体装置 |
US9953961B2 (en) | 2012-10-01 | 2018-04-24 | Fuji Electric Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2019074794A (ja) * | 2017-10-12 | 2019-05-16 | 富士通コネクテッドテクノロジーズ株式会社 | 電子機器 |
JP7027108B2 (ja) | 2017-10-12 | 2022-03-01 | Fcnt株式会社 | 電子機器 |
Also Published As
Publication number | Publication date |
---|---|
DE60303037T2 (de) | 2006-08-03 |
US20050180609A1 (en) | 2005-08-18 |
US20080309459A1 (en) | 2008-12-18 |
AU2003249391A1 (en) | 2003-11-11 |
FR2839570B1 (fr) | 2004-09-17 |
US7393711B2 (en) | 2008-07-01 |
EP1512114A1 (fr) | 2005-03-09 |
JP4433402B2 (ja) | 2010-03-17 |
EP1512114B1 (fr) | 2005-12-28 |
KR20050010787A (ko) | 2005-01-28 |
DE60303037D1 (de) | 2006-02-02 |
FR2839570A1 (fr) | 2003-11-14 |
WO2003096265A1 (fr) | 2003-11-20 |
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