JP2005526240A - Sawデバイスと併用される圧力モニター - Google Patents
Sawデバイスと併用される圧力モニター Download PDFInfo
- Publication number
- JP2005526240A JP2005526240A JP2003578881A JP2003578881A JP2005526240A JP 2005526240 A JP2005526240 A JP 2005526240A JP 2003578881 A JP2003578881 A JP 2003578881A JP 2003578881 A JP2003578881 A JP 2003578881A JP 2005526240 A JP2005526240 A JP 2005526240A
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- JP
- Japan
- Prior art keywords
- substrate
- saw device
- saw
- pressure monitor
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 230000008859 change Effects 0.000 claims abstract description 20
- 239000012530 fluid Substances 0.000 claims abstract description 6
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- 238000006073 displacement reaction Methods 0.000 claims description 14
- 230000004044 response Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 229910017052 cobalt Inorganic materials 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
- G01L1/162—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
- G01L1/165—Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators with acoustic surface waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
- G01L9/0025—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element with acoustic surface waves
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Sawing (AREA)
Abstract
Description
Claims (14)
- 硬質フレームを有するベースと;ベースに固定されこのベースとともに実質上流体密チェンバーを規定する蓋であって、その少なくとも一部が可撓性であり該モニター周辺の流体圧の変化に応答して偏位するダイアフラムを形成する蓋と;ダイアフラムの偏位をチェンバー内に配備された変形可能基板に伝送するためにフレームのエッジから離れている手段であって、変形可能基板がこれに取り付けられた第1表面弾性波(SAW)デバイスとチェンバー内に取り付けられた少なくとも第2および第3SAWデバイスを有しており、前記第2SAWデバイスが基準基板部に担われているとともにその伝播方向が前記第1および第3SAWデバイスの少なくとも一つの伝播方向に対してある角度で傾斜している手段とを備え、該モニター周辺域内の圧力の変化によって誘起されたダイアフラムの偏位が変形可能基板の変形結果をもたらし、この変形結果が前記基準基板部の変形なしに変形可能基板に取り付けられたSAWデバイスによって測定可能である圧力モニター。
- 前記変形可能基板が、単一基板の第1領域によって形成され、また前記基準基板部が単一基板の第2領域によって形成されている請求項1に記載の圧力モニター。
- 前記単一基板が、一端でベース上に支持され、またその長さに沿って部分的に一点で偏位伝送手段によって係合された片持ち梁の形状をなし、前記第1領域がベース支持部と偏位伝送手段の係合点間の基板部分であり、また前記第2領域が偏位手段の係合点と基板の自由端間の基板部分である請求項2に記載の圧力モニター。
- 単一基板が、第1支持部材によってベース上に一端で支持されるとともに、第2支持部材によってその長さに沿ってある一点で部分的に支持されたビームの形状をなし、前記第1領域が前記第1支持部材と前記第2支持部材間で基板の部分によって形成され、また前記第2領域が前記第2支持部材を越えて突出する基板の部分によって形成され、偏位伝送手段が前記第1領域と係合する請求項2に記載の圧力モニター。
- 前記第1SAWデバイスが、前記第3SAWデバイスの伝播方向と平行である伝播方向を有している先行請求項のいずれにも記載の圧力モニター。
- 前記SAWデバイスの各々が、SAW共振装置である先行請求項のいずれにも記載の圧力モニター。
- 前記SAWデバイスの各々が、異なる共振周波数を有している先行請求項のいずれにも記載の圧力モニター。
- 前記第2SAWデバイスが、前記第3SAWデバイスに対して10〜30°の範囲の角度で傾斜した伝播方向に向けられている先行請求項のいずれにも記載の圧力モニター。
- 前記第2SAWデバイスが、前記第3SAWデバイスに対して16〜20°の範囲の角度で傾斜した伝播方向に向けられている先行請求項のいずれにも記載の圧力モニター。
- 前記第2SAWデバイスが、前記第3SAWデバイスに対して18°の角度で傾斜した伝播方向に向けられている先行請求項のいずれにも記載の圧力モニター。
- SAWデバイスの全てが、単一基板の同じ側に配置されている先行請求項のいずれにも記載の圧力モニター。
- 前記SAWデバイスが単一基板の両側に分布されている請求項1から10のいずれにも記載の圧力モニター。
- 前記第3SAWデバイスが、前記非変形可能基板部上に取り付けられている請求項1に記載の圧力モニター。
- 前記第3SAWデバイスが、前記第1SAWデバイスに対して前記変形可能基板の対向側上に取り付けられている請求項1に記載の圧力モニター。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0206705A GB0206705D0 (en) | 2002-03-21 | 2002-03-21 | Pressure monitor incorporating saw device |
GB0302311A GB2386684B (en) | 2002-03-21 | 2003-01-31 | Pressure monitor incorporating saw device |
GBGB0305461.6A GB0305461D0 (en) | 2003-03-10 | 2003-03-10 | Improvements in the construction of saw devices |
PCT/GB2003/001181 WO2003081195A1 (en) | 2002-03-21 | 2003-03-17 | Pressure monitor incorporating saw device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005526240A true JP2005526240A (ja) | 2005-09-02 |
JP4320593B2 JP4320593B2 (ja) | 2009-08-26 |
Family
ID=28457506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003578881A Expired - Fee Related JP4320593B2 (ja) | 2002-03-21 | 2003-03-17 | Sawデバイスと併用される圧力モニター |
Country Status (9)
Country | Link |
---|---|
US (1) | US7151337B2 (ja) |
EP (1) | EP1485692B1 (ja) |
JP (1) | JP4320593B2 (ja) |
CN (1) | CN100338451C (ja) |
AT (1) | ATE356981T1 (ja) |
AU (1) | AU2003216841A1 (ja) |
DE (1) | DE60312493T2 (ja) |
TW (1) | TWI266046B (ja) |
WO (1) | WO2003081195A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009541731A (ja) * | 2006-06-23 | 2009-11-26 | トランセンス テクノロジーズ ピーエルシー | Tpmsセンサ予圧の組立て後の自動調整 |
JP2010145277A (ja) * | 2008-12-19 | 2010-07-01 | Bridgestone Corp | センサモジュール、及びセンサモジュールを備えたタイヤ・ホイール組立体 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE356981T1 (de) * | 2002-03-21 | 2007-04-15 | Transense Technologies Plc | Druckmonitor mit oberflächenwellenvorrichtung |
GB0305461D0 (en) * | 2003-03-10 | 2003-04-16 | Transense Technologies Plc | Improvements in the construction of saw devices |
US7392706B2 (en) * | 2003-11-27 | 2008-07-01 | Kyocera Corporation | Pressure sensor device |
US7000298B2 (en) | 2004-04-20 | 2006-02-21 | Honeywell International Inc. | Method a quartz sensor |
US7205701B2 (en) | 2004-09-03 | 2007-04-17 | Honeywell International Inc. | Passive wireless acoustic wave chemical sensor |
US7243547B2 (en) * | 2004-10-13 | 2007-07-17 | Honeywell International Inc. | MEMS SAW sensor |
US7165455B2 (en) | 2004-12-18 | 2007-01-23 | Honeywell International Inc. | Surface acoustic wave sensor methods and systems |
GB2426590B (en) * | 2005-05-26 | 2009-01-14 | Transense Technologies Plc | Pressure sensor |
US7651879B2 (en) | 2005-12-07 | 2010-01-26 | Honeywell International Inc. | Surface acoustic wave pressure sensors |
GB0612520D0 (en) * | 2006-06-23 | 2006-08-02 | Transense Technologies Plc | Post assembly automatic adjustment of tpms sensor preload |
US7576470B2 (en) | 2007-04-30 | 2009-08-18 | Honeywell International Inc. | Mechanical packaging of surface acoustic wave device for sensing applications |
US7726184B2 (en) | 2007-12-28 | 2010-06-01 | Honeywell International Inc. | Surface acoustic wave sensor and package |
US7730772B2 (en) | 2007-12-28 | 2010-06-08 | Honeywell International Inc. | Surface acoustic wave sensor and package |
GB0807405D0 (en) * | 2008-04-23 | 2008-05-28 | Transense Technologies Plc | Pressure sensor |
GB2462128B (en) | 2008-07-25 | 2012-05-02 | Transense Technologies Plc | SAW sensor with adjustable preload |
US8384524B2 (en) | 2008-11-26 | 2013-02-26 | Honeywell International Inc. | Passive surface acoustic wave sensing system |
US8317392B2 (en) | 2008-12-23 | 2012-11-27 | Honeywell International Inc. | Surface acoustic wave based micro-sensor apparatus and method for simultaneously monitoring multiple conditions |
DE102009056060B4 (de) | 2009-08-19 | 2011-09-22 | Vectron International Gmbh & Co.Kg | Messsystem zur drahtlosen positionsunabhängigen Messung der Temperatur |
JP5310572B2 (ja) * | 2010-01-13 | 2013-10-09 | 凸版印刷株式会社 | 圧力センサ |
US9032782B1 (en) * | 2010-06-16 | 2015-05-19 | Rapid Diagnostek, Inc. | Diagnostic testing sensors for resonant detectors |
CN102175358A (zh) * | 2010-12-06 | 2011-09-07 | 北京理工大学 | 采用三层应力传递模型的无源无线声表面波应力传感器 |
TWI431445B (zh) | 2010-12-22 | 2014-03-21 | Ind Tech Res Inst | 控制系統與其初始化方法 |
JP5658061B2 (ja) * | 2011-03-08 | 2015-01-21 | セイコーインスツル株式会社 | 力学量センサ |
WO2013074422A1 (en) | 2011-11-17 | 2013-05-23 | Transense Technologies Plc | Quartz Substrate Orientations for Compact Monolithic Differential Temperature Sensor, and Sensors Using Same |
NO3004829T3 (ja) * | 2013-06-06 | 2018-07-28 | ||
CN104931127A (zh) * | 2015-06-02 | 2015-09-23 | 杨松 | 桥梁式微动传感器和生理信号采集垫 |
CN110036268B (zh) * | 2016-11-30 | 2021-09-28 | 基斯特勒控股公司 | 用于测量力的测量传感器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US3878477A (en) * | 1974-01-08 | 1975-04-15 | Hewlett Packard Co | Acoustic surface wave oscillator force-sensing devices |
US4216401A (en) * | 1978-12-22 | 1980-08-05 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
FR2561383B1 (fr) * | 1984-03-16 | 1986-09-19 | Thomson Csf | Capteur de forces vectoriel a ondes elastiques de surface |
JPS6180024A (ja) * | 1984-09-27 | 1986-04-23 | Shimadzu Corp | 表面弾性波圧力センサ |
GB8610253D0 (en) * | 1986-04-26 | 1986-05-29 | Stc Plc | Resonator device |
GB2235533B (en) | 1989-08-11 | 1994-02-09 | Stc Plc | Piezoelectric sensor device |
US6060812A (en) * | 1997-08-01 | 2000-05-09 | Toda; Kohji | Ultrasonic touch-position sensing device |
GB2352814B (en) | 1999-07-28 | 2003-04-09 | Transense Technologies Plc | Pressure monitor system |
GB2361318A (en) | 2000-04-12 | 2001-10-17 | Marconi Caswell Ltd | A surface acoustic wave strain sensor |
US6571638B2 (en) * | 2000-06-30 | 2003-06-03 | Sawtek, Inc. | Surface-acoustic-wave pressure sensor and associated methods |
GB0024813D0 (en) | 2000-10-10 | 2000-11-22 | Transense Technologies Plc | Pressure monitoring device incorporating saw device |
US6456168B1 (en) * | 2000-12-29 | 2002-09-24 | Cts Corporation | Temperature compensated crystal oscillator assembled on crystal base |
JP2003087080A (ja) * | 2001-07-06 | 2003-03-20 | Murata Mfg Co Ltd | 弾性表面波素子及びその製造方法 |
ATE356981T1 (de) * | 2002-03-21 | 2007-04-15 | Transense Technologies Plc | Druckmonitor mit oberflächenwellenvorrichtung |
US6907787B2 (en) * | 2003-04-30 | 2005-06-21 | Honeywell International Inc. | Surface acoustic wave pressure sensor with microstructure sensing elements |
US20050109095A1 (en) * | 2003-11-20 | 2005-05-26 | Sinnett Jay C. | Saw transducer interface to pressure sensing diaphragm |
-
2003
- 2003-03-17 AT AT03712379T patent/ATE356981T1/de not_active IP Right Cessation
- 2003-03-17 JP JP2003578881A patent/JP4320593B2/ja not_active Expired - Fee Related
- 2003-03-17 AU AU2003216841A patent/AU2003216841A1/en not_active Abandoned
- 2003-03-17 WO PCT/GB2003/001181 patent/WO2003081195A1/en active IP Right Grant
- 2003-03-17 US US10/508,468 patent/US7151337B2/en not_active Expired - Lifetime
- 2003-03-17 CN CNB038109573A patent/CN100338451C/zh not_active Expired - Fee Related
- 2003-03-17 DE DE60312493T patent/DE60312493T2/de not_active Expired - Lifetime
- 2003-03-17 EP EP03712379A patent/EP1485692B1/en not_active Expired - Lifetime
- 2003-03-20 TW TW092106168A patent/TWI266046B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009541731A (ja) * | 2006-06-23 | 2009-11-26 | トランセンス テクノロジーズ ピーエルシー | Tpmsセンサ予圧の組立て後の自動調整 |
JP2010145277A (ja) * | 2008-12-19 | 2010-07-01 | Bridgestone Corp | センサモジュール、及びセンサモジュールを備えたタイヤ・ホイール組立体 |
Also Published As
Publication number | Publication date |
---|---|
TWI266046B (en) | 2006-11-11 |
TW200306410A (en) | 2003-11-16 |
DE60312493T2 (de) | 2007-07-12 |
CN1653321A (zh) | 2005-08-10 |
US20050225214A1 (en) | 2005-10-13 |
AU2003216841A1 (en) | 2003-10-08 |
WO2003081195A1 (en) | 2003-10-02 |
JP4320593B2 (ja) | 2009-08-26 |
EP1485692A1 (en) | 2004-12-15 |
EP1485692B1 (en) | 2007-03-14 |
US7151337B2 (en) | 2006-12-19 |
ATE356981T1 (de) | 2007-04-15 |
DE60312493D1 (de) | 2007-04-26 |
CN100338451C (zh) | 2007-09-19 |
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