JP2005512063A - コンタクトストラクチャとその製造方法およびそれを用いたコンタクトアセンブリ - Google Patents

コンタクトストラクチャとその製造方法およびそれを用いたコンタクトアセンブリ Download PDF

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Publication number
JP2005512063A
JP2005512063A JP2003549932A JP2003549932A JP2005512063A JP 2005512063 A JP2005512063 A JP 2005512063A JP 2003549932 A JP2003549932 A JP 2003549932A JP 2003549932 A JP2003549932 A JP 2003549932A JP 2005512063 A JP2005512063 A JP 2005512063A
Authority
JP
Japan
Prior art keywords
contactor
carrier
contact
adapter
contact structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003549932A
Other languages
English (en)
Japanese (ja)
Inventor
チョウ，ユ
ユ，ディヴィッド
エドワード アルダズ，ロバート
エイ コウリー，セオドア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/007,292 external-priority patent/US6676438B2/en
Priority claimed from US10/014,630 external-priority patent/US6641430B2/en
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JP2005512063A publication Critical patent/JP2005512063A/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2003549932A 2001-12-03 2002-11-29 コンタクトストラクチャとその製造方法およびそれを用いたコンタクトアセンブリ Withdrawn JP2005512063A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/007,292 US6676438B2 (en) 2000-02-14 2001-12-03 Contact structure and production method thereof and probe contact assembly using same
US10/014,630 US6641430B2 (en) 2000-02-14 2001-12-08 Contact structure and production method thereof and probe contact assembly using same
PCT/JP2002/012508 WO2003048788A1 (fr) 2001-12-03 2002-11-29 Structure de contact, procede de production de cette structure et ensemble contact de sonde utilisant cette structure

Publications (1)

Publication Number Publication Date
JP2005512063A true JP2005512063A (ja) 2005-04-28

Family

ID=26676789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003549932A Withdrawn JP2005512063A (ja) 2001-12-03 2002-11-29 コンタクトストラクチャとその製造方法およびそれを用いたコンタクトアセンブリ

Country Status (4)

Country Link
JP (1) JP2005512063A (fr)
KR (2) KR100924623B1 (fr)
TW (1) TW200301360A (fr)
WO (1) WO2003048788A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101363485B1 (ko) * 2013-08-12 2014-02-18 주식회사 프로이천 엘씨디 패널 테스트 검사용 테스트 니들 및 이를 갖는 프로브 블록, 테스트 니들의 제조 방법
KR101406270B1 (ko) * 2006-10-16 2014-06-12 폼팩터, 인코포레이티드 탄소 나노튜브 프로브의 제작 방법 및 사용 방법
JP2016099337A (ja) * 2015-07-27 2016-05-30 株式会社日本マイクロニクス 接触検査装置
JP2016109664A (ja) * 2014-11-26 2016-06-20 株式会社日本マイクロニクス プローブ及び接触検査装置
KR101662951B1 (ko) * 2015-06-14 2016-10-14 김일 푸쉬 플레이트가 있는 프로브 카드
KR20170129806A (ko) * 2015-03-13 2017-11-27 테크노프로브 에스.피.에이. 특히 고주파 응용을 위한 수직형 프로브를 구비한 테스트 헤드
KR102145719B1 (ko) * 2019-04-12 2020-08-19 윌테크놀러지(주) 벤딩방향 제어가 가능한 수직형 프로브 카드용 니들유닛
WO2022039439A1 (fr) * 2020-08-19 2022-02-24 (주)포인트엔지니어링 Moule de film d'oxydation anodique, structure de moule le comprenant, procédé de fabrication d'un article moulé l'utilisant, et article moulé correspondant
WO2023090062A1 (fr) * 2021-11-22 2023-05-25 株式会社日本マイクロニクス Gabarit, système et procédé de rangement de sonde

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7364477B2 (en) * 2004-11-12 2008-04-29 Sony Ericsson Mobile Communications Ab Low profile circuit board connector
US7737708B2 (en) * 2006-05-11 2010-06-15 Johnstech International Corporation Contact for use in testing integrated circuits
KR100806379B1 (ko) * 2006-12-22 2008-02-27 세크론 주식회사 프로브 및 이를 포함하는 프로브 카드
TWI381168B (zh) * 2009-09-02 2013-01-01 Au Optronics Mfg Shanghai Corp 通用探針模組
TWI425718B (zh) * 2011-06-21 2014-02-01 Nat Chip Implementation Ct Nat Applied Res Lab 連接座結構組及其連接座結構
TW201537181A (zh) 2014-03-25 2015-10-01 Mpi Corp 垂直式探針裝置及使用於該垂直式探針裝置之支撐柱
TWI596346B (zh) 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
KR101907270B1 (ko) * 2016-09-05 2018-10-12 주식회사 코엠테크 프로브 회전 방지 기능을 구비한 수직형 프로브 모듈
TWI597504B (zh) * 2017-01-26 2017-09-01 Electronic components conveying device and its application test classification equipment
KR102590407B1 (ko) 2017-10-31 2023-10-16 폼팩터, 인크. 디커플링된 전기 및 기계 프로브 연결들을 갖는 mems 프로브 카드 조립체
CN109725209B (zh) * 2017-10-31 2022-08-30 富泰华工业（深圳）有限公司 测试治具及具有所述测试治具的测试装置
TWI821750B (zh) * 2020-10-07 2023-11-11 台灣愛司帝科技股份有限公司 電子元件量測設備、電子元件量測方法及發光二極體的製造方法
KR102685910B1 (ko) * 2021-10-06 2024-07-17 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이를 구비하는 검사장치
EP4382920A1 (fr) * 2022-12-06 2024-06-12 Microtest S.p.A. Tête de sonde comprenant des broches pogo pour essai de déverminage au niveau tranche

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165969A (ja) * 1987-12-23 1989-06-29 Hitachi Ltd カセット構造形コンタクト方式
JPH0290062A (ja) * 1988-09-27 1990-03-29 Nec Corp プローブ・カード
JPH0769349B2 (ja) * 1993-04-02 1995-07-26 榊 矢野 プローブの固定構造及びこの構造に用いるプローブ
JP3099947B2 (ja) * 1997-02-03 2000-10-16 日本電子材料株式会社 垂直作動型プローブカード
US6540524B1 (en) * 2000-02-14 2003-04-01 Advantest Corp. Contact structure and production method thereof
JP3392079B2 (ja) * 1999-08-09 2003-03-31 日本電子材料株式会社 プローブカード

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101406270B1 (ko) * 2006-10-16 2014-06-12 폼팩터, 인코포레이티드 탄소 나노튜브 프로브의 제작 방법 및 사용 방법
KR101363485B1 (ko) * 2013-08-12 2014-02-18 주식회사 프로이천 엘씨디 패널 테스트 검사용 테스트 니들 및 이를 갖는 프로브 블록, 테스트 니들의 제조 방법
JP2016109664A (ja) * 2014-11-26 2016-06-20 株式会社日本マイクロニクス プローブ及び接触検査装置
KR20170129806A (ko) * 2015-03-13 2017-11-27 테크노프로브 에스.피.에이. 특히 고주파 응용을 위한 수직형 프로브를 구비한 테스트 헤드
KR102536001B1 (ko) 2015-03-13 2023-05-24 테크노프로브 에스.피.에이. 특히 고주파 응용을 위한 수직형 프로브를 구비한 테스트 헤드
KR101662951B1 (ko) * 2015-06-14 2016-10-14 김일 푸쉬 플레이트가 있는 프로브 카드
JP2016099337A (ja) * 2015-07-27 2016-05-30 株式会社日本マイクロニクス 接触検査装置
KR102145719B1 (ko) * 2019-04-12 2020-08-19 윌테크놀러지(주) 벤딩방향 제어가 가능한 수직형 프로브 카드용 니들유닛
WO2022039439A1 (fr) * 2020-08-19 2022-02-24 (주)포인트엔지니어링 Moule de film d'oxydation anodique, structure de moule le comprenant, procédé de fabrication d'un article moulé l'utilisant, et article moulé correspondant
WO2023090062A1 (fr) * 2021-11-22 2023-05-25 株式会社日本マイクロニクス Gabarit, système et procédé de rangement de sonde
TWI823662B (zh) * 2021-11-22 2023-11-21 日商日本麥克隆尼股份有限公司 探針收納治具、探針收納系統及探針收納方法

Also Published As

Publication number Publication date
KR100924623B1 (ko) 2009-11-02
WO2003048788A1 (fr) 2003-06-12
KR20040070199A (ko) 2004-08-06
KR100888128B1 (ko) 2009-03-11
KR20090026815A (ko) 2009-03-13
TW200301360A (en) 2003-07-01

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A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20060207