JP2005508815A - 袋 - Google Patents

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Publication number
JP2005508815A
JP2005508815A JP2003543921A JP2003543921A JP2005508815A JP 2005508815 A JP2005508815 A JP 2005508815A JP 2003543921 A JP2003543921 A JP 2003543921A JP 2003543921 A JP2003543921 A JP 2003543921A JP 2005508815 A JP2005508815 A JP 2005508815A
Authority
JP
Japan
Prior art keywords
bag
side wall
moisture
transparent material
desiccant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003543921A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005508815A5 (enExample
Inventor
カーン スラッティ，ナジブ
セン タン，タック
ピン，ベネディクト ロウ，チー
ポー，クリスティーン ンガ，ビー
リアン，ジェニー オン，ワイ
チェオン，バーナード イオン，コク
ユン ティエ，チン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of JP2005508815A publication Critical patent/JP2005508815A/ja
Publication of JP2005508815A5 publication Critical patent/JP2005508815A5/ja
Pending legal-status Critical Current

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Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B65D81/267—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being in sheet form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Food Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Bag Frames (AREA)
JP2003543921A 2001-10-19 2001-10-19 袋 Pending JP2005508815A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Publications (2)

Publication Number Publication Date
JP2005508815A true JP2005508815A (ja) 2005-04-07
JP2005508815A5 JP2005508815A5 (enExample) 2005-12-22

Family

ID=20429001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003543921A Pending JP2005508815A (ja) 2001-10-19 2001-10-19 袋

Country Status (6)

Country Link
US (1) US20050023178A1 (enExample)
EP (1) EP1436218B1 (enExample)
JP (1) JP2005508815A (enExample)
KR (1) KR100642160B1 (enExample)
DE (1) DE60122023T2 (enExample)
WO (1) WO2003042072A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10351118A1 (de) * 2003-11-03 2005-06-16 Abb Patent Gmbh Elekroinstallationsgerät des Außenbereichs
DK176388B1 (da) * 2004-07-21 2007-10-29 Resq As Emballage til emballering af sikkerheds- og redningsudstyr samt anvendelse af emballagen hertil
EP1828750A1 (de) * 2004-12-22 2007-09-05 Süd-Chemie Ag Vorrichtung zur detektion mindestens einer chemischen komponente
US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
EP1840046A1 (de) * 2006-03-29 2007-10-03 Mondi Packaging AG Verpackung mit Temperaturanzeige
CA2552301C (en) * 2006-07-12 2015-01-27 Genpak Lp Packaging roll stock with windows
JP5612658B2 (ja) * 2009-03-23 2014-10-22 ダウ グローバル テクノロジーズ エルエルシー 光電子デバイス
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
DE102014215404A1 (de) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Halbleitermaterials
US10597214B2 (en) * 2016-12-30 2020-03-24 Nuscale Power, Llc Combined shipping protection and impingement detection wrap
DE102022109618A1 (de) 2021-04-28 2022-11-03 Dräger Safety AG & Co. KGaA Anordnung umfassend ein Atemschutzgerät und einen Beutel mit einem Feuchte-Indikator und Verfahren zur Herstellung einer solchen Anordnung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
US5274914A (en) * 1986-11-25 1994-01-04 Hitachi, Ltd. Method of producing surface package type semiconductor package
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4813791A (en) * 1987-09-18 1989-03-21 Multiform Desiccants, Inc. Bag with integral material treating packets
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5791485A (en) * 1994-10-24 1998-08-11 Raytheon Company Electrostatic discharge protection bag
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use
US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container

Also Published As

Publication number Publication date
EP1436218A1 (en) 2004-07-14
EP1436218B1 (en) 2006-08-02
WO2003042072A1 (en) 2003-05-22
DE60122023T2 (de) 2007-03-08
WO2003042072A8 (en) 2004-05-27
KR100642160B1 (ko) 2006-11-08
US20050023178A1 (en) 2005-02-03
DE60122023D1 (de) 2006-09-14
KR20040045852A (ko) 2004-06-02

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