US20050023178A1 - Bag - Google Patents

Bag Download PDF

Info

Publication number
US20050023178A1
US20050023178A1 US10/825,987 US82598704A US2005023178A1 US 20050023178 A1 US20050023178 A1 US 20050023178A1 US 82598704 A US82598704 A US 82598704A US 2005023178 A1 US2005023178 A1 US 2005023178A1
Authority
US
United States
Prior art keywords
bag
moisture
transparent material
side wall
bag according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/825,987
Other languages
English (en)
Inventor
Najib Surattee
Tak Thang
Benedict Ping Loh
Bee Ng
Jenny Lian Ong
Bernard Cheong Yeong
Ching Tye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20050023178A1 publication Critical patent/US20050023178A1/en
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: THANG, TAK SENG, YEONG, BERNARD KOK CHEONG, TYE, CHING YUN, LOH, BENEDICT CHEE PING, NG, BEE POH, ONG, JENNY WAI LIAN, SURATTEE, NAJIB KHAN
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B65D81/267—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being in sheet form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Definitions

  • the invention relates to a bag, and especially to a bag for an electronics device which is substantially impervious to moisture.
  • the bag material includes a metal foil layer which is normally opaque.
  • the bags usually also contain a desiccant to ensure that the air within the bag remains as dry as possible, and a moisture indicator to enable a user to confirm that the moisture within the bag is below a pre-defined level when the bag is opened.
  • one of the problems with this conventional system is that it is necessary to have two additional components (the desiccant and the moisture indicator), which need to be inserted into the bag with the semiconductor device prior to sealing of the bag. In addition, it is not possible to view the moisture indicator without first opening the bag.
  • a bag comprising side walls that are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
  • the side walls of the bag further comprise a desiccant material which defines at least a portion of an inside wall of the bag.
  • the desiccant material may be a silica gel.
  • the side walls of the bag comprise a laminated material which may comprise a metal foil.
  • the substantially transparent material may be a transparent moisture barrier film, such as DY3008-NM 260 moisture barrier film manufactured by Dou Yee Enterprises (S) Pte Ltd.
  • the bag is for containing an electronics device, such as a packaged semiconductor device.
  • FIG. 1 shows a bag for a semiconductor device
  • FIG. 2 is a cross-sectional view along the line AA in FIG. 1 .
  • FIGS. 1 and 2 show a bag 1 .
  • the bag includes a moisture indicator strip embedded on the barrier bag.
  • the outer layer is able to prevent moisture from entering and the inner layer has material able to absorb moisture (to replace silica gel.)
  • the sheets 3 , 4 each have a respective fourth edge 7 , 8 that defines an opening 6 into which a packaged semiconductor device (not shown) may be inserted prior to sealing the opening 6 by sealing together the edges 7 , 8 , for example by a thermoplastic welding process.
  • the sheets 3 , 4 each include a laminated aluminum foil material 9 on the outside and a layer of a desiccant material 10 , such as silica gel, on the inside.
  • a desiccant material 10 such as silica gel
  • the desiccant material 10 may be located within a porous inner bag 15 that is attached to the inner wall of the foil material 9 , as shown in FIG. 2 .
  • the sheet 3 includes a window portion 11 , which is formed from a substantially transparent material 12 that is also substantially impervious to moisture.
  • a suitable material may be DY3008-NM 260 moisture barrier film produced by Dou Yee Enterprises (S) Pte Ltd.
  • a moisture indicating material 13 Located adjacent to the transparent material 12 is a moisture indicating material 13 , which is located on the inside of the transparent material 12 .
  • a packaged semiconductor device is placed within the bag 1 and the ends 7 , 8 of the sheets 3 , 4 are sealed together to seal the semiconductor device within the bag 1 .
  • the desiccant 10 on the inside of the side walls 3 , 4 absorbs any moisture within the bag 1 after it has been sealed.
  • a user can view the moisture indicator 13 through the transparent material 12 to ensure that the moisture within the bag 1 is below a predetermined level.
  • the moisture indicator 13 may comprise three separate moisture level indicators 16 , 17 , 18 .
  • the indicator 16 may be a first warning that the moisture in the bag 1 is approaching a danger level
  • the indicator 17 may provide an intermediate warning that indicates to a user to put the semiconductor device into a new bag
  • the indicator 18 may be provide a warning that the moisture levels have exceeded the recommended maximum level and that the electronic device within the bag should be inspected before use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Food Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Bag Frames (AREA)
US10/825,987 2001-10-19 2004-04-16 Bag Abandoned US20050023178A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2001/000223 Continuation WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Publications (1)

Publication Number Publication Date
US20050023178A1 true US20050023178A1 (en) 2005-02-03

Family

ID=20429001

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/825,987 Abandoned US20050023178A1 (en) 2001-10-19 2004-04-16 Bag

Country Status (6)

Country Link
US (1) US20050023178A1 (enExample)
EP (1) EP1436218B1 (enExample)
JP (1) JP2005508815A (enExample)
KR (1) KR100642160B1 (enExample)
DE (1) DE60122023T2 (enExample)
WO (1) WO2003042072A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
US20070205136A1 (en) * 2004-07-21 2007-09-06 Resq A/S Method of Packaging Safety and Rescue Equipment and a Package for Packaging Safety and Rescue Equipment and use of the Method and the Package
EP1840046A1 (de) * 2006-03-29 2007-10-03 Mondi Packaging AG Verpackung mit Temperaturanzeige
US20080014391A1 (en) * 2006-07-12 2008-01-17 Coutts David A Packaging roll stock with windows
US20090301191A1 (en) * 2004-12-22 2009-12-10 Sud-Chemie Ag Device for detecting at least one chemical constituent
US20100237453A1 (en) * 2009-03-23 2010-09-23 Bonekamp Jeffrey E Optoelectronic device
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
US20180186545A1 (en) * 2016-12-30 2018-07-05 Nuscale Power, Llc Combined shipping protection and impingement detection wrap

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10351118A1 (de) * 2003-11-03 2005-06-16 Abb Patent Gmbh Elekroinstallationsgerät des Außenbereichs
DE102014215404A1 (de) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Halbleitermaterials
DE102022109618A1 (de) 2021-04-28 2022-11-03 Dräger Safety AG & Co. KGaA Anordnung umfassend ein Atemschutzgerät und einen Beutel mit einem Feuchte-Indikator und Verfahren zur Herstellung einer solchen Anordnung

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
US4813791A (en) * 1987-09-18 1989-03-21 Multiform Desiccants, Inc. Bag with integral material treating packets
US4971196A (en) * 1986-11-25 1990-11-20 Hitachi, Ltd. Surface package type semiconductor package
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5295297A (en) * 1986-11-25 1994-03-22 Hitachi, Ltd. Method of producing semiconductor memory
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5791485A (en) * 1994-10-24 1998-08-11 Raytheon Company Electrostatic discharge protection bag
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
US5295297A (en) * 1986-11-25 1994-03-22 Hitachi, Ltd. Method of producing semiconductor memory
US5295297B1 (en) * 1986-11-25 1996-11-26 Hitachi Ltd Method of producing semiconductor memory
US5095626A (en) * 1986-11-25 1992-03-17 Hitachi, Ltd. Method of producing semiconductor memory packages
US4971196A (en) * 1986-11-25 1990-11-20 Hitachi, Ltd. Surface package type semiconductor package
US4813791A (en) * 1987-09-18 1989-03-21 Multiform Desiccants, Inc. Bag with integral material treating packets
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5791485A (en) * 1994-10-24 1998-08-11 Raytheon Company Electrostatic discharge protection bag
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use
US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070205136A1 (en) * 2004-07-21 2007-09-06 Resq A/S Method of Packaging Safety and Rescue Equipment and a Package for Packaging Safety and Rescue Equipment and use of the Method and the Package
US20090301191A1 (en) * 2004-12-22 2009-12-10 Sud-Chemie Ag Device for detecting at least one chemical constituent
US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
EP1840046A1 (de) * 2006-03-29 2007-10-03 Mondi Packaging AG Verpackung mit Temperaturanzeige
US20080014391A1 (en) * 2006-07-12 2008-01-17 Coutts David A Packaging roll stock with windows
US9498930B2 (en) * 2006-07-12 2016-11-22 Genpak Lp Packaging roll stock with windows
US20100237453A1 (en) * 2009-03-23 2010-09-23 Bonekamp Jeffrey E Optoelectronic device
US8829634B2 (en) 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
US20180186545A1 (en) * 2016-12-30 2018-07-05 Nuscale Power, Llc Combined shipping protection and impingement detection wrap
US10597214B2 (en) * 2016-12-30 2020-03-24 Nuscale Power, Llc Combined shipping protection and impingement detection wrap

Also Published As

Publication number Publication date
DE60122023D1 (de) 2006-09-14
EP1436218A1 (en) 2004-07-14
WO2003042072A1 (en) 2003-05-22
KR100642160B1 (ko) 2006-11-08
JP2005508815A (ja) 2005-04-07
EP1436218B1 (en) 2006-08-02
WO2003042072A8 (en) 2004-05-27
KR20040045852A (ko) 2004-06-02
DE60122023T2 (de) 2007-03-08

Similar Documents

Publication Publication Date Title
US20050023178A1 (en) Bag
US4679688A (en) Package for risk samples
KR102331469B1 (ko) 종이 가방
US5551557A (en) Efficient method and apparatus for establishing shelf-life of getters utilized within sealed enclosures
US6176371B1 (en) Biological sample storage package and method for making same
US7314312B2 (en) Sample bag closure device
EP0629497A2 (en) A multi-wall film
SE8704789D0 (sv) Flexibelt, ark eller banformigt forpackningslaminat; sett att framstella laminatet samt av laminatet framstellda forpackningsbehallare
EP3640153A1 (en) Packaging container and method for manufacturing same
CN104968572A (zh) 用于食品的容器、制造容器的方法、检测内部气体的方法及用于填充容器的生产系统
EP0189406B1 (en) Package for risk samples
JP2005508815A5 (enExample)
JP2885079B2 (ja) 湿度調節積層袋
CA2648880A1 (en) Gusseted pouch
US20050116014A1 (en) Shipping device suitable for biohazardous specimens
US20040208401A1 (en) Nested safety mailing envelope
US3384294A (en) Plastic bag with tuck-in valve
US5257697A (en) Package for sheets of photosensitive material
KR930007762A (ko) 포장용 용기
JP4712795B2 (ja) 封着袋立ての底部と蓋部を有する筒状袋
JPH02166073A (ja) 医療用器具包装体およびその集積体
US3125273A (en) Photographic solution pouch
US3414120A (en) Packaging material
JP2543336Y2 (ja) 口栓付き液体容器
EP0812771A1 (en) Container handle opening dust seal

Legal Events

Date Code Title Description
AS Assignment

Owner name: INFINEON TECHNOLOGIES AG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SURATTEE, NAJIB KHAN;THANG, TAK SENG;LOH, BENEDICT CHEE PING;AND OTHERS;REEL/FRAME:015887/0277;SIGNING DATES FROM 20041025 TO 20050131

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION