JP2005503942A5 - - Google Patents

Download PDF

Info

Publication number
JP2005503942A5
JP2005503942A5 JP2003531777A JP2003531777A JP2005503942A5 JP 2005503942 A5 JP2005503942 A5 JP 2005503942A5 JP 2003531777 A JP2003531777 A JP 2003531777A JP 2003531777 A JP2003531777 A JP 2003531777A JP 2005503942 A5 JP2005503942 A5 JP 2005503942A5
Authority
JP
Japan
Prior art keywords
substrate
channel
polymer
conductive
traces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003531777A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005503942A (ja
JP4243541B2 (ja
Filing date
Publication date
Priority claimed from US09/941,058 external-priority patent/US6591496B2/en
Application filed filed Critical
Publication of JP2005503942A publication Critical patent/JP2005503942A/ja
Publication of JP2005503942A5 publication Critical patent/JP2005503942A5/ja
Application granted granted Critical
Publication of JP4243541B2 publication Critical patent/JP4243541B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003531777A 2001-08-28 2002-06-27 埋め込み電気トレースおよびその製造方法 Expired - Fee Related JP4243541B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/941,058 US6591496B2 (en) 2001-08-28 2001-08-28 Method for making embedded electrical traces
PCT/US2002/020480 WO2003028417A1 (en) 2001-08-28 2002-06-27 Embedded electrical traces and method for making

Publications (3)

Publication Number Publication Date
JP2005503942A JP2005503942A (ja) 2005-02-10
JP2005503942A5 true JP2005503942A5 (cg-RX-API-DMAC7.html) 2006-01-05
JP4243541B2 JP4243541B2 (ja) 2009-03-25

Family

ID=25475859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003531777A Expired - Fee Related JP4243541B2 (ja) 2001-08-28 2002-06-27 埋め込み電気トレースおよびその製造方法

Country Status (6)

Country Link
US (2) US6591496B2 (cg-RX-API-DMAC7.html)
EP (1) EP1421835B1 (cg-RX-API-DMAC7.html)
JP (1) JP4243541B2 (cg-RX-API-DMAC7.html)
AT (1) ATE306804T1 (cg-RX-API-DMAC7.html)
DE (1) DE60206641T2 (cg-RX-API-DMAC7.html)
WO (1) WO2003028417A1 (cg-RX-API-DMAC7.html)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102522B2 (en) * 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
US20060110580A1 (en) * 2003-04-28 2006-05-25 Aylward Peter T Article comprising conductive conduit channels
US7371452B2 (en) * 2003-04-28 2008-05-13 Eastman Kodak Company Conductive patterned sheet utilizing multi-layered conductive conduit channels
US7138170B2 (en) * 2003-04-28 2006-11-21 Eastman Kodak Company Terminated conductive patterned sheet utilizing conductive conduits
US8062734B2 (en) * 2003-04-28 2011-11-22 Eastman Kodak Company Article comprising conductive conduit channels
US7001658B2 (en) * 2003-04-28 2006-02-21 Eastman Kodak Company Heat selective electrically conductive polymer sheet
TWI220523B (en) * 2003-05-26 2004-08-21 Ritek Corp Write once recording medium
DE10331714B4 (de) * 2003-07-11 2006-05-24 Micronas Gmbh Verfahren zur Strukturierung der Oberfläche eines Substrats
DE20310834U1 (de) * 2003-07-14 2003-12-24 Klopp, Hans Transparentes Gehäuse mit Versorgungsleitungen für einen elektrischen Verbraucher
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
JP2006261322A (ja) * 2005-03-16 2006-09-28 Jsr Corp 電磁波シールドフィルムおよびその製造方法
JP2006278617A (ja) * 2005-03-29 2006-10-12 Jsr Corp 電磁波シールドフィルム
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
WO2007061448A2 (en) * 2005-05-18 2007-05-31 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US8354160B2 (en) 2006-06-23 2013-01-15 3M Innovative Properties Company Articles having durable hydrophobic surfaces
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
US7412765B2 (en) * 2006-07-14 2008-08-19 Auden Techno Corp. Method of manufacturing a sticker type antenna
US8017308B2 (en) 2006-08-11 2011-09-13 Battelle Memorial Institute Patterning non-planar surfaces
US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
DE102007020656B4 (de) * 2007-04-30 2009-05-07 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
JP5739083B2 (ja) * 2008-05-08 2015-06-24 帝人株式会社 樹脂成形体及びその成形方法
KR20100090493A (ko) * 2009-02-06 2010-08-16 삼성전자주식회사 비휘발성 메모리 장치 및 그 제조 방법
GB0914961D0 (en) * 2009-08-27 2009-09-30 Appleton Steve Electrically heated window
US8813324B2 (en) 2010-03-24 2014-08-26 Western Digital (Fremont), Llc Method for providing a piezoelectric multilayer
SG184986A1 (en) 2010-04-28 2012-11-29 3M Innovative Properties Co Silicone-based material
SG185084A1 (en) 2010-04-28 2012-12-28 3M Innovative Properties Co Articles including nanosilica-based primers for polymer coatings and methods
EP2625314A1 (en) 2010-10-06 2013-08-14 3M Innovative Properties Company Anti-reflective articles with nanosilica-based coatings and barrier layer
US20120086649A1 (en) * 2010-10-12 2012-04-12 Innovation & Infinity Global Corp. Conductive circuits for a touch panel and the manufacturing method thereof
EP2445321A1 (en) * 2010-10-13 2012-04-25 Innovation & Infinity Global Corp. Conductive circuits for a touch panel and the manufacturing method thereof
GB2520817B (en) * 2013-11-06 2017-10-04 Hamilton Sundstrand Corp High-temperature environment electronic chassis
US9386712B2 (en) 2013-11-06 2016-07-05 Hamilton Sundstrand Corporation High-temperature environment electronic chassis
DE102014107480B4 (de) * 2014-05-27 2016-02-04 Webasto SE Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben
EP3155691B1 (en) 2014-06-12 2021-04-07 BAE Systems PLC Electro-optic windows
EP2955789A1 (en) * 2014-06-12 2015-12-16 BAE Systems PLC Electro-optic windows
KR102302150B1 (ko) * 2015-02-16 2021-09-16 한국전자통신연구원 자기장 차폐 시트 및 그 제조 방법
US10563292B2 (en) * 2015-04-09 2020-02-18 Electronics And Telecommunications Research Institute Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same
WO2017086381A1 (ja) * 2015-11-17 2017-05-26 大日本印刷株式会社 加熱電極装置、通電加熱ガラス、発熱板、乗り物、建築物用窓、導電体付きシート、導電性パターンシート、導電性発熱体、合わせガラスおよび導電性発熱体の製造方法
FR3048659B1 (fr) * 2016-03-10 2018-04-13 Valeo Systemes D'essuyage Systeme de detection optique pour vehicule automobile
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
DE102017208075A1 (de) 2017-05-12 2018-11-15 Magna Powertrain Bad Homburg GmbH Bauteil mit EMV Schutz für elektronische Platine
CN109085710A (zh) * 2018-10-17 2018-12-25 吴江友鑫新材料科技有限公司 一种具有电磁屏蔽效果的调色玻璃及其制备方法
DE102019201348A1 (de) * 2019-02-01 2020-08-06 Lpkf Laser & Electronics Ag Metallisierte Mikrostrukturen in Glasträgern
CN113767716B (zh) 2019-05-06 2024-07-30 3M创新有限公司 图案化导电制品
CN114442395B (zh) * 2022-01-26 2023-05-16 福耀玻璃工业集团股份有限公司 电致变色器件及其电极结构和制备方法、玻璃总成和车辆

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
US2963748A (en) 1957-05-27 1960-12-13 Young Lawrence John Printed circuits
US3075280A (en) 1959-10-19 1963-01-29 Bell Telephone Labor Inc Method of making printed wiring assemblies
GB993984A (en) 1962-08-24 1965-06-02 Standard Telephones Cables Ltd Improvements in or relating to electrical circuits
US3247579A (en) 1964-05-18 1966-04-26 Microwave Electronics Corp Circuit fabrication method
US3434939A (en) * 1965-10-07 1969-03-25 Fabri Tek Inc Process for making printed circuits
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3800020A (en) 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
CH591570A5 (cg-RX-API-DMAC7.html) 1972-11-28 1977-09-30 Buser Ag Maschf Fritz
US3932927A (en) 1973-03-05 1976-01-20 Motorola, Inc. Scannable light emitting diode array and method
US3952152A (en) 1974-10-29 1976-04-20 Teletype Corporation CRT shield
CH585611A5 (en) 1975-04-09 1977-03-15 Boccadoro Ferdinando Diamond grain surface grinding wheel mfr. - with thread cut in wheel and part filled with grain before rolling flat
US4179797A (en) 1978-03-23 1979-12-25 Xerox Corporation Method of making a resistor array
FR2430847A1 (fr) 1978-07-13 1980-02-08 Saint Gobain Vitrage chauffant et/ou d'alarme
GB2033667A (en) 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
US4381421A (en) 1980-07-01 1983-04-26 Tektronix, Inc. Electromagnetic shield for electronic equipment
NL8100601A (nl) 1981-02-09 1982-09-01 Philips Nv Ruit voorzien van elektrische draad en draad.
US4412255A (en) 1981-02-23 1983-10-25 Optical Coating Laboratory, Inc. Transparent electromagnetic shield and method of manufacturing
US4510347A (en) 1982-12-06 1985-04-09 Fine Particles Technology Corporation Formation of narrow conductive paths on a substrate
KR840009026A (ko) 1983-03-02 1984-12-20 아아르 미첼(외2) 데니스 전기 전도체를 절연 기판에 접착하는 방법
US4604678A (en) * 1983-07-18 1986-08-05 Frederick Parker Circuit board with high density electrical tracers
KR850700097A (ko) 1983-09-21 1985-10-21 로이 에이취, 맷신길 인쇄회로판 제조방법
US5061438A (en) 1983-09-21 1991-10-29 Allied-Signal Inc. Method of making a printed circuit board
US5094811A (en) 1983-09-21 1992-03-10 Allied-Signal Method of making a printed circuit board
AU570309B2 (en) 1984-03-26 1988-03-10 Unisearch Limited Buried contact solar cell
US4693783A (en) 1984-12-31 1987-09-15 Gte Laboratories Incorporated Method of producing interconnections in a semiconductor integrated circuit structure
US4614837A (en) 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
US4759965A (en) * 1985-08-06 1988-07-26 Canon Kabushiki Kaisha Ceramic, preparation thereof and electronic circuit substrate by use thereof
US4755415A (en) 1985-10-03 1988-07-05 Fuji Photo Film Co., Ltd. Optical shutter array and method for making
US4997674A (en) 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
US5059485A (en) 1988-06-08 1991-10-22 Akzo America Inc. Conductive metallization of substances without developing agents
US4985601A (en) 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
US5055637A (en) 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces
JPH033292A (ja) 1989-05-30 1991-01-09 Matsushita Electric Ind Co Ltd 回路基板及びそれを用いたイメージセンサ
US5169488A (en) 1990-10-25 1992-12-08 International Business Machines Corporation Method of forming planarized, reusable calibration grids
JP3361556B2 (ja) 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
US5462624A (en) 1992-12-22 1995-10-31 Vlsi Technology, Inc. Embedded inter-connect frame
FR2708170B1 (fr) 1993-07-19 1995-09-08 Innovation Dev Cie Gle Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.
US5481400A (en) 1993-11-09 1996-01-02 Hughes Aircraft Company Survivable window grids
US5595943A (en) 1994-06-30 1997-01-21 Hitachi, Ltd. Method for formation of conductor using electroless plating
JPH11506412A (ja) 1995-06-06 1999-06-08 デイヴィッド サーノフ リサーチ センター，インコーポレイテッド 超小型電気管路の製造方法
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
US5731086A (en) * 1995-06-07 1998-03-24 Gebhardt; William F. Debossable films
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
US5745989A (en) 1995-08-04 1998-05-05 Exotic Materials, Inc. Method of preparation of an optically transparent article with an embedded mesh
JPH09115334A (ja) 1995-10-23 1997-05-02 Mitsubishi Materiais Corp 透明導電膜および膜形成用組成物
WO1998037133A1 (en) 1997-02-20 1998-08-27 Partnerships Limited, Inc. Low temperature method and compositions for producing electrical conductors
US6103640A (en) 1997-09-12 2000-08-15 Bridgestone Corporation Electromagnetic-wave shielding and light transmitting plate
US6103033A (en) 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
US6117781A (en) * 1999-04-22 2000-09-12 Advanced Micro Devices, Inc. Optimized trench/via profile for damascene processing
US6663786B2 (en) * 2001-06-14 2003-12-16 International Business Machines Corporation Structure having embedded flush circuitry features and method of fabricating

Similar Documents

Publication Publication Date Title
JP2005503942A5 (cg-RX-API-DMAC7.html)
JP2005514216A5 (cg-RX-API-DMAC7.html)
WO2004101857A3 (en) Methods and apparatus for forming multi-layer structures using adhered masks
WO2005045524A3 (en) A method of forming a patterned layer on a substrate
EP1448489A4 (en) ARRAY OF BIOMEDICAL ELECTROCHEMICAL SENSORS AND MANUFACTURING METHOD
EP1375431A3 (en) Method of manufacturing inorganic nanotube
WO2004093141A3 (en) Methods for producing light emitting device
SG135111A1 (en) Device manufacturing method and computer program product
JP2009516382A5 (cg-RX-API-DMAC7.html)
AU2003209795A1 (en) A method for forming a film, by using electrostatic forces
WO2005114719A3 (en) Method of forming a recessed structure employing a reverse tone process
WO2004100214A3 (en) Metal sacrificial layer
JP2010507258A5 (cg-RX-API-DMAC7.html)
JP2007506277A5 (cg-RX-API-DMAC7.html)
WO2006036297A3 (en) Organic electroluminescence device and method of production of same
SE0302467D0 (sv) A method and a device for manufacturing of electrical components
JP2006501659A5 (cg-RX-API-DMAC7.html)
TW200520213A (en) Method for fabricating image sensor with inorganic microlens
WO2006023088A3 (en) Light emitting device processes
WO2008048928A3 (en) Methods of patterning a material on polymeric substrates
EP1763287A3 (en) A method for fabricating organic electroluminescent devices
WO2005120164A3 (en) Three dimensional antennas formed using wet conductive materials and methods for production thereof
ATE480601T1 (de) Siliconzusammensetzungen und deren verwendung bei der gezielten ablösung oder übertragung von gedruckten oder geformten strukturen und übertragungsverfahren dafür
SG140481A1 (en) A method for fabricating micro and nano structures
WO2003083427A3 (en) Corrugated diaphragm