JP2005347713A5 - - Google Patents

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Publication number
JP2005347713A5
JP2005347713A5 JP2004168939A JP2004168939A JP2005347713A5 JP 2005347713 A5 JP2005347713 A5 JP 2005347713A5 JP 2004168939 A JP2004168939 A JP 2004168939A JP 2004168939 A JP2004168939 A JP 2004168939A JP 2005347713 A5 JP2005347713 A5 JP 2005347713A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004168939A
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JP4347751B2 (ja
JP2005347713A (ja
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Priority claimed from JP2004168939A external-priority patent/JP4347751B2/ja
Priority to JP2004168939A priority Critical patent/JP4347751B2/ja
Priority to US10/869,821 priority patent/US7071833B2/en
Priority to EP05751421A priority patent/EP1755158A4/en
Priority to PCT/JP2005/010265 priority patent/WO2005122239A1/ja
Priority to TW094118700A priority patent/TWI370256B/zh
Publication of JP2005347713A publication Critical patent/JP2005347713A/ja
Publication of JP2005347713A5 publication Critical patent/JP2005347713A5/ja
Publication of JP4347751B2 publication Critical patent/JP4347751B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004168939A 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法 Expired - Fee Related JP4347751B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004168939A JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法
US10/869,821 US7071833B2 (en) 2004-06-07 2004-06-16 Failure analyzing system and method for displaying the failure
EP05751421A EP1755158A4 (en) 2004-06-07 2005-06-03 ERROR ANALYSIS SYSTEM AND ERROR DISPLAY METHOD
PCT/JP2005/010265 WO2005122239A1 (ja) 2004-06-07 2005-06-03 不良解析システム及び不良箇所表示方法
TW094118700A TWI370256B (en) 2004-06-07 2005-06-07 Fault analysis system and display method for fault locatins for displaying a failure postion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004168939A JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法

Publications (3)

Publication Number Publication Date
JP2005347713A JP2005347713A (ja) 2005-12-15
JP2005347713A5 true JP2005347713A5 (ja) 2007-07-05
JP4347751B2 JP4347751B2 (ja) 2009-10-21

Family

ID=35447063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004168939A Expired - Fee Related JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法

Country Status (5)

Country Link
US (1) US7071833B2 (ja)
EP (1) EP1755158A4 (ja)
JP (1) JP4347751B2 (ja)
TW (1) TWI370256B (ja)
WO (1) WO2005122239A1 (ja)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP5037826B2 (ja) * 2006-01-25 2012-10-03 株式会社アドバンテスト 解析装置および解析方法
WO2007114930A2 (en) * 2006-03-31 2007-10-11 Teseda Corporation Secure test-for-yield chip diagnostics management system and method
US7765444B2 (en) * 2006-11-06 2010-07-27 Nec Electronics Corporation Failure diagnosis for logic circuits
US8194968B2 (en) 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7669100B2 (en) * 2007-03-08 2010-02-23 Freescale Semiconductor, Inc. System and method for testing and providing an integrated circuit having multiple modules or submodules
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US8688405B2 (en) * 2007-06-15 2014-04-01 Shell Oil Company Remote monitoring systems and methods
KR101448971B1 (ko) 2007-08-20 2014-10-13 케이엘에이-텐코어 코오포레이션 실제 결함들이 잠재적으로 조직적인 결함들인지 또는 잠재적으로 랜덤인 결함들인지를 결정하기 위한 컴퓨터-구현 방법들
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
WO2010014609A2 (en) * 2008-07-28 2010-02-04 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US8539389B2 (en) 2010-09-27 2013-09-17 Teseda Corporation Correlation of device manufacturing defect data with device electrical test data
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
CN102385843A (zh) * 2011-08-11 2012-03-21 上海华碧检测技术有限公司 一种液晶面板显示驱动芯片的电性分析方法
US8907697B2 (en) 2011-08-31 2014-12-09 Teseda Corporation Electrical characterization for a semiconductor device pin
US9939488B2 (en) 2011-08-31 2018-04-10 Teseda Corporation Field triage of EOS failures in semiconductor devices
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
JP6917930B2 (ja) 2018-03-15 2021-08-11 キオクシア株式会社 不良解析装置および不良解析方法

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JPH0714898A (ja) * 1993-06-23 1995-01-17 Mitsubishi Electric Corp 半導体ウエハの試験解析装置および解析方法
JPH08203973A (ja) * 1995-01-25 1996-08-09 Sony Corp 半導体装置および半導体装置の良否選別方法
JP3436456B2 (ja) * 1996-06-14 2003-08-11 三菱電機株式会社 エミッション顕微鏡による半導体装置の故障解析方法及び半導体装置故障解析システム
JPH1167853A (ja) * 1997-08-26 1999-03-09 Mitsubishi Electric Corp ウェーハマップ解析補助システムおよびウェーハマップ解析方法
JP3995768B2 (ja) * 1997-10-02 2007-10-24 株式会社ルネサステクノロジ 不良解析方法及びその装置
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
JP2001267389A (ja) * 2000-03-21 2001-09-28 Hiroshima Nippon Denki Kk 半導体メモリ生産システム及び半導体メモリ生産方法
JP3767677B2 (ja) * 2000-10-24 2006-04-19 富士通株式会社 半導体試験データ処理方法
JP4146074B2 (ja) * 2000-11-28 2008-09-03 株式会社アドバンテスト フェイル解析装置
JP2002217252A (ja) * 2001-01-22 2002-08-02 Nec Yamagata Ltd マーキングプローバーシステム、マーキング方法及び半導体装置の製造方法
JP2002237506A (ja) * 2001-02-09 2002-08-23 Mitsubishi Electric Corp 故障解析装置及び故障解析方法、並びに半導体装置の製造方法
JP2005109056A (ja) * 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd 半導体素子の検査装置

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