JP2005347304A - Thin film forming device and its manufacturing method, and masking member used for its manufacture - Google Patents

Thin film forming device and its manufacturing method, and masking member used for its manufacture Download PDF

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JP2005347304A
JP2005347304A JP2004161598A JP2004161598A JP2005347304A JP 2005347304 A JP2005347304 A JP 2005347304A JP 2004161598 A JP2004161598 A JP 2004161598A JP 2004161598 A JP2004161598 A JP 2004161598A JP 2005347304 A JP2005347304 A JP 2005347304A
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substrate
metal film
thin film
film
forming
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Masaaki Kadomi
昌明 角見
Yoshimasa Yamaguchi
義正 山口
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Nippon Electric Glass Co Ltd
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Nippon Electric Glass Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To effectively avoid faults such as peeling or dropping off of a metal film formed on the surface of the substrate by optimizing the form or shape of the metal film. <P>SOLUTION: In a window 1 for an optical component wherein a metal film 12 is formed on the surface of the substrate 10, a plurality of recesses 13 are formed on the surface of the metal film 12, and a smooth and continuous surface without bending is formed in a region from the bottom 13x of the recess 13 to the surface 12x thereof. Preferably, the surface of an end edge 10w in the plane direction of the metal film 12 is gradually made closer to the surface of the substrate 10 as it approaches to the termination side, and it is made to reach the surface of the substrate 12 at its termination. In concrete, the substrate 10 comprises a window glass 10 whose outside contour profile is regularly octagonal or regularly polygonal with nine or more sides, a window 11 for light transmission is provided at the center of the window glass 10, and the metal film 12 is formed on the surface of its periphery. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、薄膜形成体及びその製造方法並びにその製造に用いるマスキング部材に係り、特に、薄膜形成体における基板の表面に形成される金属膜の形態の改良技術に関する。   The present invention relates to a thin film formed body, a method for producing the same, and a masking member used for the production, and more particularly to a technique for improving the form of a metal film formed on the surface of a substrate in the thin film formed body.

例えば、光通信或いは光学系システム等に使用される光半導体モジュール等の光素子部品は、パッケージ等からなる包囲体の内部に、半導体レーザダイオードやフォトダイオードなどの光素子を収納してなる。この光素子は、包囲体の壁部を介して外部との間で光信号を送受信する必要があるため、その包囲体の壁部には、光透過用孔が形成されると共に、この光透過用孔は、その内側と外側との間で光信号のやり取りを可能とする窓ガラスを備えた光素子用窓部品によって覆われる。この場合、包囲体は、光素子部品の高信頼性や高耐久性を確保することを目的として、その内部空間が密封状態(例えば真空状態)とされる。   For example, an optical element component such as an optical semiconductor module used for optical communication or an optical system system includes an optical element such as a semiconductor laser diode or a photodiode inside an enclosure made of a package or the like. Since this optical element needs to transmit and receive optical signals to and from the outside through the wall portion of the enclosure, a hole for light transmission is formed in the wall portion of the enclosure, and this light transmission The hole is covered with a window element for an optical element having a window glass that enables an optical signal to be exchanged between the inside and the outside. In this case, the inner space of the enclosure is sealed (for example, in a vacuum state) for the purpose of ensuring high reliability and high durability of the optical element component.

従って、上記の光素子用窓部品は、包囲体の壁部に形成された光透過用孔を気密状態に封止できることが要求される。このような要請に応じるべく、下記の特許文献1、2には、窓ガラス板の中央部を円形の光透過用の窓部とし且つその周囲に金属膜を形成してなる光素子用窓部品を、包囲体の壁部における光透過用孔の周縁に半田を介して接着する技術が開示されている。詳述すると、この光素子用窓部品は、窓ガラス板の表面の中央部周囲に形成した金属膜と、パッケージ等の包囲体の光透過用孔周縁における金属製の当接面とを、金属半田を使用して気密状態に接着することにより、光透過用孔を塞ぐように構成されている。   Therefore, the above-described optical element window part is required to be able to seal the light transmitting hole formed in the wall portion of the enclosure in an airtight state. In order to meet such a demand, the following Patent Documents 1 and 2 disclose that a window part for an optical element in which a central part of a window glass plate is a circular light transmitting window part and a metal film is formed around the window part. Has been disclosed in which a solder is attached to the periphery of a light transmitting hole in the wall portion of the enclosure. More specifically, this optical element window component includes a metal film formed around the center of the surface of the window glass plate and a metal contact surface at the periphery of the light transmitting hole of an enclosure such as a package. The light transmission hole is closed by bonding in an airtight state using solder.

尚、上記の金属膜は、窓ガラス板側から順に、窓ガラス板との付着性に優れたクロム膜やチタン膜からなる第1の膜と、金属半田成分の拡散を防止するためのパラジウム膜または白金膜もしくはニッケル膜からなる第2の膜と、金属半田との接着性に優れた金膜からなる第3の膜とによって構成される。   The metal film includes, in order from the window glass plate side, a first film made of a chromium film or a titanium film having excellent adhesion to the window glass plate, and a palladium film for preventing diffusion of metal solder components. Alternatively, the second film is made of a platinum film or a nickel film, and the third film is made of a gold film having excellent adhesion to metal solder.

この場合、上記の光素子用窓部品を製造する工程の中には、ガラスからなる基板の表面に、フォトリソグラフィ法で金属膜をパターニングする成膜工程が存在し、この成膜工程の最終処理として、エッチング液に浸すことにより金属膜の不要部分をエッチング除去することが行なわれる(例えば、下記の特許文献3参照)。   In this case, in the process of manufacturing the optical element window part described above, there is a film forming process for patterning a metal film by photolithography on the surface of the substrate made of glass, and the final processing of this film forming process Then, an unnecessary portion of the metal film is etched away by being immersed in an etching solution (see, for example, Patent Document 3 below).

特許第2993472号公報Japanese Patent No. 2993472 特開平10−112568号公報Japanese Patent Laid-Open No. 10-112568 特開2002−131517号公報JP 2002-131517 A

ところで、上記のようにフォトリソグラフィ法で金属膜を基板の表面にパターニングする方法によれば、成膜工程完了後の金属膜の表面は、必然的に滑らかな平面となる。このため、上記の光素子用窓部品においては、包囲体の壁部に対する接着面が、窓ガラス板上に形成されている金属膜の表面となることから、その接着面積は、金属膜の表面における平面部の面積となる。   By the way, according to the method of patterning the metal film on the surface of the substrate by the photolithography method as described above, the surface of the metal film after completion of the film forming process inevitably becomes a smooth plane. For this reason, in the above-mentioned window part for an optical element, since the adhesion surface to the wall portion of the enclosure is the surface of the metal film formed on the window glass plate, the adhesion area is the surface of the metal film. It is the area of the plane part in.

従って、このような手法では、光素子用窓部品を包囲体の壁部に半田付けする際の接着面積を、金属膜の表面における平面部の面積よりも広くするための工夫が何ら施されていないことになる。このため、小型化が要請される光半導体モジュール等の光素子部品においては、窓ガラス板を小さくすることによりその配設スペースをできる限り狭くした上で、包囲体の壁部に対する窓ガラス板の接着面積を充分に広くすることが困難となる。そして、これに起因して、窓ガラス板の接着強度を適度に高めるには至らず、包囲体の内部空間の気密性が阻害される等の不具合を招く。   Therefore, in such a technique, some measures are taken to make the adhesion area when soldering the window part for optical elements to the wall part of the enclosure larger than the area of the flat part on the surface of the metal film. There will be no. For this reason, in an optical element component such as an optical semiconductor module that is required to be miniaturized, the window space is reduced as much as possible by reducing the size of the window glass plate, and the window glass plate with respect to the wall portion of the enclosure It becomes difficult to make the bonding area sufficiently wide. And, due to this, the adhesive strength of the window glass plate cannot be increased moderately, leading to problems such as impairing the airtightness of the internal space of the enclosure.

しかも、フォトリソグラフィ法の成膜工程の最終段階で、金属膜の不要部分をエッチング除去する際には、エッチング液の濃度や室温の変化に応じてエッチング速度にバラツキが生じるため、このエッチング液の濃度やエッチング時間が正確に設定されていなければ、所謂オーバーエッチングが生じる。このオーバーエッチングは、マスクの面方向中央部側に向かって進行するものであるから、金属膜の成膜面積が設定値よりも狭くなる。更に、このオーバーエッチングは、図10に示すように、金属膜20の窓ガラス板21に近接する部位を過度に侵食することから、金属膜20の面方向における端縁部20aは、窓ガラス板21の表面から遠ざかるに連れて金属膜非形成部21a側への張り出し寸法が大きくなるような傾斜を有することになる。加えて、金属膜20の端縁部20aでは、半田との接着性の低い第1の膜20aa及び第2の膜20abが露出した状態となる。これらが原因となって、金属膜が半田や窓ガラス板から剥離し易くなり、包囲体の内部空間の気密性阻害を招く等の不具合が生じる。   In addition, when the unnecessary portion of the metal film is removed by etching at the final stage of the photolithography process, the etching rate varies depending on the concentration of the etchant and the change in room temperature. If the concentration and etching time are not set accurately, so-called over-etching occurs. Since this over-etching proceeds toward the center in the surface direction of the mask, the deposition area of the metal film becomes narrower than the set value. Further, as shown in FIG. 10, this over-etching excessively erodes a portion of the metal film 20 that is close to the window glass plate 21, so that the edge 20a in the surface direction of the metal film 20 is a window glass plate. As the distance from the surface of 21 is increased, the projecting dimension toward the metal film non-forming portion 21a side is increased. In addition, at the edge portion 20a of the metal film 20, the first film 20aa and the second film 20ab having low adhesion to the solder are exposed. For these reasons, the metal film is easily peeled off from the solder or the window glass plate, causing problems such as airtightness of the inner space of the enclosure being hindered.

本発明は、上記事情に鑑みてなされたものであり、基板の表面に形成される金属膜の形態あるいは形状を適切化することにより、当該金属膜の剥離や欠損等の不具合を有効に回避することを技術的課題とする。   The present invention has been made in view of the above circumstances, and by appropriately optimizing the form or shape of the metal film formed on the surface of the substrate, it is possible to effectively avoid problems such as peeling or chipping of the metal film. This is a technical issue.

上記技術的課題を解決するためになされた本発明は、基板の表面に金属膜を形成してなる薄膜形成体において、上記金属膜の表面に複数の凹部が形成されると共に、これらの凹部の底面からそれぞれ上記表面に至る部位が、屈曲部を有しない滑らかな連続面で形成されていることを特徴とするものである。この場合、基板としては、ガラス、セラミック、ガラスセラミック等からなるものを挙げることができる。   In order to solve the above technical problem, the present invention provides a thin film formed body in which a metal film is formed on a surface of a substrate, and a plurality of recesses are formed on the surface of the metal film. The portions from the bottom surface to the surface are each formed by a smooth continuous surface having no bent portion. In this case, examples of the substrate include those made of glass, ceramic, glass ceramic and the like.

このような構成によれば、薄膜形成体の基板の表面に形成された金属膜の表面に複数の凹部が形成されていることから、従来のように金属膜の表面が単なる平面である場合と比較して、金属膜の表面積が広くなる。従って、薄膜形成体が例えば既述の光素子用窓部品のように、その金属膜の表面が半田による接着面となる場合においては、複数の凹部が金属膜の表面に形成されていることにより、その接着面積が効果的に広くなる。これにより、被接着面(例えば既述のパッケージ等のような包囲体の壁部の金属面)に対する薄膜形成体の接着強度を高めることができると共に、薄膜形成体を小型にしても充分な接着面積ひいては充分な接着強度を確保することができ、薄膜形成体を使用した部品(例えば光素子部品)の小型化に寄与することが可能となる。しかも、金属膜の表面部分においては、複数の凹部の各底面からそれぞれ表面に至る部位が、屈曲部を有しない滑らかな連続面で形成されているため、欠損等が生じ難くなると共に、金属膜の表面から各凹部の底面に至る全領域が金属半田等を介して被接着面に気密性を阻害されることなく良好に接着され得ることになる。   According to such a configuration, since the plurality of recesses are formed on the surface of the metal film formed on the surface of the substrate of the thin film formed body, the surface of the metal film is simply a flat surface as in the past. In comparison, the surface area of the metal film is increased. Accordingly, when the surface of the metal film is an adhesive surface by solder, such as the optical element window part described above, a plurality of recesses are formed on the surface of the metal film. The adhesion area is effectively widened. As a result, the adhesion strength of the thin film formed body to the surface to be bonded (for example, the metal surface of the wall portion of the enclosure such as the package described above) can be increased, and sufficient adhesion can be achieved even if the thin film formed body is small. As a result, sufficient adhesive strength can be ensured, and it is possible to contribute to miniaturization of a component (for example, an optical element component) using the thin film formed body. In addition, in the surface portion of the metal film, the portions extending from the bottom surfaces of the plurality of recesses to the surface are each formed with a smooth continuous surface that does not have a bent portion. The entire region from the surface to the bottom surface of each recess can be satisfactorily adhered to the adherend surface through metal solder or the like without impairing airtightness.

また、上記技術的課題を解決するためになされた本発明は、基板の表面に金属膜を形成してなる薄膜形成体において、上記金属膜の面方向における端縁部の表面が、終端側に移行するに連れて上記基板の表面に漸次近づき且つその終端で上記基板の表面に至っていることを特徴とするものである。   Further, the present invention made to solve the above technical problem is a thin film formed body in which a metal film is formed on the surface of a substrate, wherein the surface of the edge portion in the surface direction of the metal film is on the terminal side. As it moves, it gradually approaches the surface of the substrate and reaches the surface of the substrate at the end thereof.

このような構成によれば、金属膜の面方向における端縁部は、基板の表面に近づくに連れて面積が漸増して張り出すことになり、従来のフォトリソグラフィ法を採用して金属膜を形成した場合のような所謂オーバーエッチングによる基板の表面近傍における不当な金属膜の侵食が生じなくなる。しかも、金属膜が、例えば、基板側から順に、基板との付着性に優れた第1の膜と、半田成分の拡散を防止するための第2の膜と、半田との付着性に優れた第3の膜とを有している場合であっても、その金属膜の端縁部では、第1の膜が第2の膜により覆われ且つ第2の膜が第3の膜により覆われることから、半田との接着性の低い第1、第2の膜が露出しなくなる。これらに伴なって、金属膜の成膜面積が設定値よりも狭くなるという不具合が回避されるばかりでなく、金属膜が半田や基板から剥離し難くなるという利点も享受できる。   According to such a configuration, the edge portion in the surface direction of the metal film protrudes with an area gradually increasing as it approaches the surface of the substrate, and the metal film is formed by using a conventional photolithography method. The so-called over-etching as formed does not cause undue metal film erosion near the surface of the substrate. Moreover, the metal film, for example, in order from the substrate side, the first film having excellent adhesion to the substrate, the second film for preventing diffusion of solder components, and the adhesion to solder are excellent. Even if it has a third film, at the edge of the metal film, the first film is covered with the second film and the second film is covered with the third film. Therefore, the first and second films having low adhesiveness with the solder are not exposed. As a result, the problem that the metal film formation area becomes narrower than the set value is avoided, and the advantage that the metal film is difficult to peel from the solder or the substrate can be enjoyed.

上記の構成において、基板は、外輪郭形状が正八角形またはそれよりも辺の数が多い正多角形の窓ガラスからなると共に、該窓ガラスの中央部に光透過用の窓部をなす金属膜の非形成部を有し且つその周囲の表面に金属膜を形成することが好ましい。尚、窓ガラスは、硼珪酸ガラスもしくは無アルカリガラスでなることが好ましい。   In the above configuration, the substrate is made of a regular octagonal window glass whose outer contour shape is a regular octagon or a larger number of sides than that, and a metal film forming a light transmitting window at the center of the window glass It is preferable to form a metal film on the surrounding surface. The window glass is preferably made of borosilicate glass or alkali-free glass.

このようにすれば、薄膜形成体が、既述の光素子用窓部品として有効利用される。そして、この窓ガラスの外輪郭形状が、正八角形またはそれよりも辺の数が多い正多角形とされていることから、例えば従来(上記の特許文献1、2に開示された技術)のような正六角形の窓ガラスと比較して、両者の外接円を同一径とすれば、接着面積をより広く、つまり包囲体の壁部の光透過用孔周縁に対する窓ガラスの接着面積をより広く確保できることになる。また、両者の接着面積を同一とした場合には、正六角形の窓ガラスよりも、外接円の径を小さくできることから、その配設スペースを狭小にして、包囲体の小型化ひいては光素子部品の小型化に寄与することも可能となる。しかも、正多角形であることから、丸形、或いは正多角形でない多角形と比較して、加工性が極度に悪化することもない。従って、窓ガラスの外輪郭形状としては、多角形の中でも、適度に良好な加工性を維持した上で優れた接着強度を有し或いは小型化に役立ち得る最適な多角形が選択されていることになる。尚、加工性に着目すれば、窓ガラスの外輪郭形状は、辺の数が偶数の正多角形であることが好ましく、更にこれに代えてまたはこれと共に、正八角形よりも辺の数が多く且つ正十六角形よりも辺の数が少ない正多角形であることがより好ましい。   If it does in this way, a thin film formation object is effectively used as an above-mentioned window part for optical elements. And since the outer contour shape of this window glass is a regular octagon or a regular polygon having a larger number of sides than that, for example, as in the prior art (the techniques disclosed in Patent Documents 1 and 2 above) Compared to regular hexagonal window glass, if both circumscribed circles have the same diameter, a larger bonding area is secured, that is, a larger window glass bonding area with respect to the periphery of the light transmission hole in the wall of the enclosure is secured. It will be possible. Also, if the bonding area of both is the same, the diameter of the circumscribed circle can be made smaller than that of a regular hexagonal window glass. It is also possible to contribute to downsizing. And since it is a regular polygon, compared with the polygon which is not a round shape or a regular polygon, workability does not deteriorate extremely. Therefore, as the outer contour shape of the window glass, among polygons, an optimum polygon that has excellent adhesive strength while maintaining moderately good workability or can be used for miniaturization is selected. become. If attention is paid to workability, the outer contour shape of the window glass is preferably a regular polygon having an even number of sides, and instead of or in addition to this, the number of sides is larger than that of a regular octagon. Further, it is more preferably a regular polygon having fewer sides than a regular decagon.

上記技術的課題を解決するためになされた本発明に係る方法は、スパッタ法または真空蒸着法により基板の表面に金属膜を成膜する工程を含む薄膜形成体の製造方法であって、上記基板の表面にマスキング部材を着脱可能に固定すると共に、上記マスキング部材を通過して上記基板の表面に達する材料粒子の量を部分的に異ならせることにより、表面に複数の凹部を有する金属膜を上記基板の表面に形成することを特徴とするものである。   The method according to the present invention made to solve the above technical problem is a method of manufacturing a thin film forming body including a step of forming a metal film on a surface of a substrate by sputtering or vacuum deposition, A masking member is detachably fixed to the surface of the metal film, and the amount of material particles that pass through the masking member and reach the surface of the substrate is partially varied, thereby forming a metal film having a plurality of recesses on the surface. It is formed on the surface of a substrate.

このような構成によれば、従来のフォトリソグラフィ法に代えて、マスキング部材を使用したスパッタ法または真空蒸着法により基板の表面に金属膜が形成されることから、所謂オーバーエッチングにより基板の表面近傍に不当な金属膜の侵食部分が生じたり、或いは半田との接着性の低い膜が露出するという不具合が回避され、これに伴なう既述の利点を享受することが可能となる。しかも、マスキング部材を通過して基板の表面に達する材料粒子の量を部分的に異ならせることにより、換言すれば一部分に達する材料粒子の量を他の部分よりも相対的に少量とすることにより、表面に複数の凹部を有する金属膜を基板の表面に形成するようにしたから、金属膜の表面が単なる平面である場合と比較して、金属膜の表面積が広くなり、これに伴なう既述の種々の利点を享受することが可能となる。   According to such a configuration, the metal film is formed on the surface of the substrate by sputtering or vacuum deposition using a masking member instead of the conventional photolithography method. Therefore, it is possible to avoid the disadvantage that an unsuitable erosion portion of the metal film is generated or a film having low adhesion to the solder is exposed, and the advantages described above can be enjoyed. In addition, by partially varying the amount of material particles that pass through the masking member and reach the surface of the substrate, in other words, by making the amount of material particles that reach a part relatively smaller than other parts. Since the metal film having a plurality of recesses on the surface is formed on the surface of the substrate, the surface area of the metal film is increased compared with the case where the surface of the metal film is merely a flat surface. It is possible to enjoy the various advantages described above.

上記の製造方法を採用して、中央部に光透過用の窓部をなす金属膜の非形成部を有し且つその周囲に金属膜を有してなる単位薄膜形成部を、基板の表面に縦横に規則性をもって複数形成し、この基板を、45°ずつ相違する計4方向に沿ってそれぞれ直線上に切断することにより、上記複数の単位薄膜形成部の全てを相互に分離させることが好ましい。   By adopting the above manufacturing method, a unit thin film forming portion having a metal film non-forming portion forming a light transmitting window portion in the central portion and having a metal film around it is formed on the surface of the substrate. It is preferable to form a plurality of regular thin films vertically and horizontally, and to cut all of the plurality of unit thin film forming portions from each other by cutting the substrate into straight lines along a total of four directions that differ by 45 °. .

このようにすれば、優れた形態あるいは形状を有する金属膜が基板(窓ガラス)の表面に形成された既述の正多角形を呈する光素子用窓部品を、簡易に且つ短時間で効率良く製造することが可能となる。   In this way, an optical element window component having the above-described regular polygon shape in which a metal film having an excellent form or shape is formed on the surface of a substrate (window glass) can be easily and efficiently obtained in a short time. It can be manufactured.

また、上記技術的課題を解決するためになされた本発明に係るマスキング部材は、上記の製造方法に用いられるものであって、基板の表面に当接する複数の当接マスク部を、それらの相互間の間隙を材料粒子が直進して上記基板の表面に到達可能となるように配列すると共に、上記相互間の間隙に、隣り合う当接マスク部を連結する複数の連結マスク部を相互に離隔させて配列し、且つ上記当接マスク部を上記基板の表面に当接させた際に上記連結マスク部と上記基板の表面との間に材料粒子を回り込ませて上記基板の表面に到達させるための隙間が形成されるように構成したことを特徴とするものである。   A masking member according to the present invention, which has been made to solve the above technical problem, is used in the above-described manufacturing method, and includes a plurality of contact mask portions that contact the surface of the substrate. The gaps are arranged so that the material particles can go straight and reach the surface of the substrate, and a plurality of connection mask parts for connecting adjacent contact mask parts are spaced apart from each other. And when the contact mask portion is brought into contact with the surface of the substrate, material particles wrap around between the connection mask portion and the surface of the substrate to reach the surface of the substrate. It is characterized in that the gap is formed.

このような構成によれば、マスキング部材の複数の当接マスク部によって、材料粒子が基板の表面に達することを阻止されて、基板の表面に金属膜非形成部が形成されると共に、隣り合う当接マスク部の相互間の間隙を通じて材料粒子が基板の表面に直進して達することによって、基板の表面に金属膜が形成される。そして、この相互間の間隙には、隣り合う当接マスク部を連結する連結マスク部が形成されているが、材料粒子は、この連結マスク部の存在により直進して基板の表面に達することを阻止されるものの、基板の表面と連結マスク部との間の隙間に回り込んで基板の表面に達することができる。そして、このように隙間を回り込んで基板の表面に達する材料粒子の単位面積当たりの量は、直進して基板の表面に達する材料粒子の単位当たりの量よりも少量であるため、金属膜の表面における連結マスク部に対応する部位には凹部が形成される。この結果、基板上には、複数の凹部を有する金属膜が形成される。しかも、金属膜の端縁部には、フォトリソグラフィ法を採用した場合のようなオーバーエッチングに起因する侵食部分が形成されることがなく、また半田との接着性の低い膜が露出することもない。   According to such a configuration, the plurality of contact mask portions of the masking member prevent the material particles from reaching the surface of the substrate, so that the metal film non-formed portion is formed on the surface of the substrate and adjacent to each other. The material particles travel straight through the gap between the contact mask portions to reach the surface of the substrate, whereby a metal film is formed on the surface of the substrate. In addition, a connection mask portion that connects adjacent contact mask portions is formed in the gap between the two, but the material particles are allowed to travel straight due to the presence of the connection mask portion and reach the surface of the substrate. Although it is blocked, it can reach the surface of the substrate by wrapping around the gap between the surface of the substrate and the connecting mask portion. Since the amount per unit area of the material particles that reach the surface of the substrate through the gap in this way is smaller than the amount per unit of the material particles that travels straight and reaches the surface of the substrate, A concave portion is formed in a portion corresponding to the connection mask portion on the surface. As a result, a metal film having a plurality of recesses is formed on the substrate. In addition, no erosion caused by over-etching as in the case of adopting the photolithography method is formed at the edge of the metal film, and a film having low adhesiveness to solder may be exposed. Absent.

以上のように本発明に係る薄膜形成体によれば、基板の表面に形成された金属膜の表面に複数の凹部が形成されていることから、従来のように金属膜の表面が単なる平面である場合と比較して、金属膜の表面積が広くなり、これにより光素子用窓部品のようにその金属膜の表面が接着面となる場合においては、その接着面積が効果的に広くなる。従って、被接着面に対する薄膜形成体の接着強度を高めることができると共に、薄膜形成体を小型にしても充分な接着面積ひいては充分な接着強度を確保することができ、薄膜形成体を使用した部品の小型化に寄与することが可能となる。しかも、金属膜の表面部分においては、複数の凹部の各底面からそれぞれ表面に至る部位が、屈曲部を有しない滑らかな連続面で形成されているため、欠損等が生じ難くなると共に、金属膜の表面から各凹部の底面に至る全領域を金属半田等を介して被接着面に気密性を阻害されることなく良好に接着することが可能となる。   As described above, according to the thin film formed body according to the present invention, the surface of the metal film formed on the surface of the substrate is formed with a plurality of recesses. Compared to a case, the surface area of the metal film is increased, and in the case where the surface of the metal film becomes an adhesive surface as in a window part for an optical element, the adhesive area is effectively increased. Accordingly, the adhesion strength of the thin film formed body to the adherend surface can be increased, and even if the thin film formed body is reduced in size, a sufficient bonding area and thus sufficient adhesive strength can be ensured. It becomes possible to contribute to downsizing of the. In addition, in the surface portion of the metal film, the portions extending from the bottom surfaces of the plurality of recesses to the surface are each formed with a smooth continuous surface that does not have a bent portion. The entire region from the surface to the bottom surface of each recess can be satisfactorily bonded to the surface to be bonded through metal solder or the like without impairing airtightness.

また、本発明に係る薄膜形成体の製造方法によれば、マスキング部材を使用したスパッタ法または真空蒸着法により基板の表面に金属膜が形成されることから、所謂オーバーエッチングにより基板の表面近傍に不当な金属膜の侵食部分が生じたり、半田との接着性の低い膜が露出されるという不具合が回避される。更に、マスキング部材を通過して基板の表面に達する材料粒子の量を部分的に異ならせることにより表面に複数の凹部を有する金属膜を基板の表面に形成するようにしたから、金属膜の表面積を広くするための手法が簡素化されると共に、その製造に使用する装置や器具の小型化並びに工程の簡略化による低コスト化を図ることが可能となる。   In addition, according to the method of manufacturing a thin film formed body according to the present invention, a metal film is formed on the surface of the substrate by sputtering or vacuum deposition using a masking member. Problems such as an inappropriate erosion of the metal film or exposure of a film having low adhesion to the solder can be avoided. Furthermore, since the metal film having a plurality of recesses on the surface is formed on the surface of the substrate by partially varying the amount of material particles that pass through the masking member and reach the surface of the substrate, the surface area of the metal film It is possible to simplify the technique for widening the width of the apparatus and reduce the cost by downsizing the apparatus and instruments used for the manufacture and simplifying the process.

更に、本発明に係るマスキング部材によれば、隣接する当接マスク部の相互間における隙間の存在によって基板の表面に金属膜が形成され、且つ隣接する当接マスク部を連結する連結マスク部の存在によってその金属膜の表面に複数の凹部が形成されるため、マスキング部材の簡単な改良によって金属膜の表面積を有効に広くすることが可能となる。   Further, according to the masking member of the present invention, the metal film is formed on the surface of the substrate due to the presence of a gap between the adjacent contact mask portions, and the connection mask portion connecting the adjacent contact mask portions is provided. Since a plurality of recesses are formed on the surface of the metal film due to the presence, the surface area of the metal film can be effectively increased by simple improvement of the masking member.

以下、本発明の実施形態を添付図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

図1は、本発明の実施形態に係る薄膜形成体(光素子用窓部品)1が装着されてなる半導体レーザーダイオードモジュール(光素子部品)2の概略構成を示す縦断側面図である。同図に示すように、この光素子部品2は、レーザーチップ(光素子)3を収納するパッケージからなる包囲体4を備え、その内部空間は真空状態とされている。包囲体4の一壁部4aには、円形の光透過用孔5が形成されると共に、その一壁部4aの内面には、光透過用孔5を塞ぐ光素子用窓部品1が金属半田を用いて気密接着されている。そして、この実施形態では、レーザーチップ3から発せられた光が、包囲体4の内部空間に収納された球状レンズ6、上記の光素子用窓部品1、及び包囲体4の外部の光通路に配設された球状レンズ7を介して、フェルール8内の光ファイバ9に送られる構成とされている。   FIG. 1 is a longitudinal side view showing a schematic configuration of a semiconductor laser diode module (optical element component) 2 on which a thin film forming body (optical element window component) 1 according to an embodiment of the present invention is mounted. As shown in the figure, this optical element component 2 includes an enclosure 4 made of a package for storing a laser chip (optical element) 3, and its internal space is in a vacuum state. A circular light transmitting hole 5 is formed in one wall portion 4a of the enclosure 4, and an optical element window component 1 for closing the light transmitting hole 5 is formed on the inner surface of the one wall portion 4a with metal solder. Is hermetically bonded. In this embodiment, the light emitted from the laser chip 3 passes through the spherical lens 6 housed in the internal space of the enclosure 4, the optical element window part 1, and the optical path outside the enclosure 4. It is configured to be sent to the optical fiber 9 in the ferrule 8 through the arranged spherical lens 7.

上記光素子用窓部品1は、図2に示すように、外輪郭形状が正八角形の板状体からなる窓ガラス10を有し、この窓ガラス10の中央部には、円形をなす光透過用の窓部11が形成されると共に、この窓部11の周囲における表面側には、複数層の金属膜12が形成されている。そして、この金属膜12の表面には、周方向に等間隔で且つ放射状に延びる複数本の溝状の凹部13が形成されている。図3及び図4に示すように、これらの凹部13の底面13xは、凹部13を横切る方向においてそれぞれ湾曲し、且つこれらの底面13xから表面12xにそれぞれ連なる部位12yも、凹部13を横切る方向において湾曲しており、従ってこれらの凹部13の底面13xから表面12xに至る部位は、屈曲部を有することなく滑らかに連続している。この場合、窓ガラス10の外輪郭に外接する外接円の直径をL1とし、円形をなす窓部11の直径をL2とした場合に、この両者の比率L2/L1は、0.1〜0.9、好ましくは0.3〜0.8とされている(図2参照)。尚、この実施形態では、上記外接円の直径L1が、2.0〜3.5mm程度とされ、窓部11の直径L2が、0.6〜2.8mm程度とされている。 As shown in FIG. 2, the optical element window part 1 has a window glass 10 made of a plate-like body having a regular octagonal outer contour, and a circular light transmission is formed at the center of the window glass 10. A window portion 11 is formed, and a plurality of layers of metal films 12 are formed on the surface side around the window portion 11. A plurality of groove-like recesses 13 are formed on the surface of the metal film 12 and extend radially at equal intervals in the circumferential direction. As shown in FIGS. 3 and 4, the bottom surfaces 13x of the recesses 13 are curved in the direction crossing the recesses 13, and the portions 12 y connected to the surface 12 x from the bottom surface 13 x are also in the direction crossing the recesses 13. Therefore, the portion from the bottom surface 13x to the surface 12x of these recesses 13 is smoothly continuous without having a bent portion. In this case, when the diameter of the circumscribed circle circumscribing the outer contour of the window glass 10 is L 1 and the diameter of the circular window portion 11 is L 2 , the ratio L 2 / L 1 between them is 0. 1 to 0.9, preferably 0.3 to 0.8 (see FIG. 2). In this embodiment, the diameter L 1 of the circumscribed circle is about 2.0 to 3.5 mm, and the diameter L 2 of the window portion 11 is about 0.6 to 2.8 mm.

上記光素子用窓部品1について詳述すると、図3に示すように、窓ガラス10の表裏両面(表面のみでもよい)の全域には、反射防止膜14が形成されている。この反射防止膜14は、窓ガラス10の表裏両面にそれぞれ直接成膜されたタンタル酸化物膜(Ta25)またはニオブ酸化物膜(Nb25)と、このタンタル酸化物膜上またはニオブ酸化物膜上に成膜されたシリカ膜(SiO2)とから構成されている。この場合、必要ならば、シリカ膜上に更にタンタル酸化物膜またはニオブ酸化物膜を成膜し且つその上にシリカ膜を形成するようにしてもよい。 The optical element window part 1 will be described in detail. As shown in FIG. 3, an antireflection film 14 is formed on the entire front and back surfaces (or only the front surface) of the window glass 10. The antireflection film 14 includes a tantalum oxide film (Ta 2 O 5 ) or a niobium oxide film (Nb 2 O 5 ) directly formed on both the front and back surfaces of the window glass 10 and the tantalum oxide film or And a silica film (SiO 2 ) formed on the niobium oxide film. In this case, if necessary, a tantalum oxide film or a niobium oxide film may be further formed on the silica film, and a silica film may be formed thereon.

また、上記の金属膜12は、光透過性を有する円形の窓部11の周囲において、反射防止膜14(シリカ膜)上に形成されたクロム膜(またはチタン膜)からなる第1の膜12aと、この第1の膜12a上に形成されたパラジウム膜(または白金膜もしくはニッケル膜)からなる第2の膜12bと、この第2の膜12b上に形成された金膜からなる第3の膜12cとを有している。この場合、第1の膜12aは、窓ガラス10との付着性に優れると共に、第2の膜12bは、半田成分の拡散防止の役目を果たし、また第3の膜12cは、半田との付着性に優れている。そして、上記の反射防止膜14は、表面が凹部を有しない平面状の膜であるのに対して、第1、第2及び第3の膜12a、12b、12cは、それぞれ周方向に等間隔で且つ放射状に延びる複数本の凹部を有していることから、金属膜12の表面には、既に述べたように、複数本の凹部13が形成されている。   Further, the metal film 12 is a first film 12a made of a chromium film (or titanium film) formed on the antireflection film 14 (silica film) around the circular window portion 11 having optical transparency. A second film 12b made of a palladium film (or a platinum film or a nickel film) formed on the first film 12a and a third film made of a gold film formed on the second film 12b. And a film 12c. In this case, the first film 12a has excellent adhesion to the window glass 10, the second film 12b serves to prevent the diffusion of solder components, and the third film 12c adheres to the solder. Excellent in properties. The antireflection film 14 is a planar film having no concave portion on the surface, whereas the first, second and third films 12a, 12b and 12c are equally spaced in the circumferential direction. In addition, since the plurality of concave portions extending radially are provided, the plurality of concave portions 13 are formed on the surface of the metal film 12 as described above.

更に、図4に示すように、金属膜12の面方向における端縁部12wの表面は、終端側に移行するに連れて窓ガラス10の表面に漸次近づき且つその終端で窓ガラス10の表面(反射防止膜14)に至っている。また、金属膜12の端縁部12wにおいては、第1の膜12aが第2の膜12bにより全域または略全域が覆われ且つ第2の膜12bが第3の膜12cにより全域または略全域が覆われている。したがって、半田との接着性の低い第1、第2の膜12a、12bは、露出していない状態または殆ど露出していない状態となっている。尚、金属膜12の膜厚(端縁部12wを除く領域の膜厚)は、反射防止膜14が0.5μm程度、第1の膜12aが0.1μm程度、第2の膜12bが0.7μm程度、第3の膜12cが0.3μm程度とされている。   Furthermore, as shown in FIG. 4, the surface of the edge portion 12w in the surface direction of the metal film 12 gradually approaches the surface of the window glass 10 as it moves to the terminal side, and the surface of the window glass 10 at the terminal ( It reaches the antireflection film 14). In the edge portion 12w of the metal film 12, the first film 12a is entirely or substantially entirely covered by the second film 12b, and the second film 12b is entirely or substantially entirely covered by the third film 12c. Covered. Therefore, the first and second films 12a and 12b having low adhesiveness to the solder are not exposed or hardly exposed. The film thickness of the metal film 12 (the film thickness in the region excluding the edge portion 12w) is about 0.5 μm for the antireflection film 14, about 0.1 μm for the first film 12a, and 0 for the second film 12b. The third film 12c is about 0.3 μm.

以上のような構成を備えた光素子用窓部品1は、図5に示すように、包囲体4の一壁部4aの内面(金属面)における光透過用孔5の周縁部に、金属半田を用いて接着されている(金属半田については図示略)。詳述すると、窓ガラス10の窓部11の周囲に形成されている金属膜12が、包囲体4の一壁部4aの内面に、Au−Sn半田を用いて気密接着され、これにより光透過用孔5が光素子用窓部品1によって完全閉鎖された状態となっている。この場合、金属膜12の表面には、複数本の凹部13が形成されていることから、その表面積が単なる平面よりも広くなっている。従って、包囲体4の一壁部4aに対する金属膜12の接着面積、つまり金属膜12とAu−Sn半田との接着面積が広くなり、その接着強度が高められている。   As shown in FIG. 5, the optical element window component 1 having the above-described configuration is provided with metal solder on the peripheral portion of the light transmitting hole 5 on the inner surface (metal surface) of the one wall portion 4 a of the enclosure 4. (Metal solder is not shown). More specifically, the metal film 12 formed around the window portion 11 of the window glass 10 is hermetically bonded to the inner surface of one wall portion 4a of the enclosure 4 using Au—Sn solder, thereby transmitting light. The service hole 5 is completely closed by the optical element window part 1. In this case, since the plurality of recesses 13 are formed on the surface of the metal film 12, the surface area thereof is wider than a simple plane. Therefore, the adhesion area of the metal film 12 to the one wall 4a of the enclosure 4, that is, the adhesion area between the metal film 12 and the Au—Sn solder is increased, and the adhesion strength is increased.

次に、上記の光素子用窓部品1の製造方法及びこれに使用するマスキング部材について説明する。   Next, the manufacturing method of said window part 1 for optical elements and the masking member used for this are demonstrated.

図6は、マスキング部材15の一部を示す平面図、図7は、その要部拡大図である。これらの図に示すように、マスキング部材15は、縦方向に直線上に延びる複数本の縦枠材15aと、これらに直交する横方向に直線上に延びる複数本の横枠材15bとが交差連結されることにより、複数箇所に正方形状枠部15xが形成されている。更に、このマスキング部材15は、縦枠材15a及び横枠材15bに45°の傾斜角度をもって相反する2方向に延びる第1傾斜枠材15cと第2傾斜枠材15dとが交差連結され、且つこれらの傾斜枠材15c、15dが上記正方形状枠部15xの4角部周辺と交差連結されることにより、複数箇所に正八角形状枠部15yが形成されている。そして、これらの正八角形状枠部15yの内側に、それぞれ全周に所定の間隙を介在させた状態で円形の覆設体15eが配設され、この覆設体15eの外周部と、正八角形状枠部15yの各角部との間が、相互に離隔し且つ放射状に延びる複数本の連結体15fによって連結されている。   FIG. 6 is a plan view showing a part of the masking member 15, and FIG. 7 is an enlarged view of a main part thereof. As shown in these drawings, the masking member 15 includes a plurality of vertical frame members 15a extending linearly in the vertical direction and a plurality of horizontal frame members 15b extending linearly in the horizontal direction perpendicular thereto. By being connected, square frame portions 15x are formed at a plurality of locations. Further, the masking member 15 includes a first inclined frame member 15c and a second inclined frame member 15d extending in two opposite directions with an inclination angle of 45 ° to the vertical frame member 15a and the horizontal frame member 15b. These inclined frame members 15c and 15d are cross-connected to the periphery of the four corners of the square frame portion 15x, thereby forming regular octagonal frame portions 15y at a plurality of locations. A circular covering body 15e is disposed inside each of the regular octagonal frame portions 15y with a predetermined gap interposed on the entire circumference, and the outer periphery of the covering body 15e The corner portions of the shape frame portion 15y are connected to each other by a plurality of connecting bodies 15f that are separated from each other and extend radially.

この場合、図8に示すように、マスキング部材15を一枚のガラス基板16の表面にセット(着脱自在に固定)した状態の下では、上記正八角形状枠部15yを構成する枠材を含む全ての枠材15a〜15dと、全ての円形の覆設体15eとが、ガラス基板16の表面に当接する当接マスク部となるのに対して、全ての連結体15fつまり全ての連結マスク部と、ガラス基板16の表面との間には、隙間17が形成される。この隙間17は、その高さ方向寸法t1が、連結体15fの厚みの2倍以上とされている。詳述すると、このマスキング部材15は、全ての枠材15a〜15dの表面と、全ての覆設体15eの表面と、全ての連結体15fの表面とが、同一平面となるように形成された上で、連結体15fの厚みのみが、他の部位の共通した厚みt2の1/2未満(好ましくは1/3未満)となるように形成されている。尚、このマスキング部材15は、ステンレス鋼(例えばSUS430)で形成され、その大きさは、縦方向が50mm〜150mmで且つ横方向が50mm〜150mmとされている。また、上記の厚みt2は、0.1mm〜2.0mmとされている。   In this case, as shown in FIG. 8, under the condition that the masking member 15 is set (removably fixed) on the surface of one glass substrate 16, the frame material constituting the regular octagonal frame portion 15y is included. All the frame members 15a to 15d and all the circular covering bodies 15e serve as contact mask portions that contact the surface of the glass substrate 16, whereas all the connection bodies 15f, that is, all the connection mask portions. A gap 17 is formed between the glass substrate 16 and the surface of the glass substrate 16. The gap 17 has a height direction dimension t1 that is at least twice the thickness of the connecting body 15f. More specifically, the masking member 15 is formed such that the surfaces of all the frame members 15a to 15d, the surfaces of all the covering bodies 15e, and the surfaces of all the connecting bodies 15f are in the same plane. Above, only the thickness of the connection body 15f is formed to be less than 1/2 (preferably less than 1/3) of the thickness t2 common to other parts. The masking member 15 is formed of stainless steel (for example, SUS430), and the size thereof is 50 mm to 150 mm in the vertical direction and 50 mm to 150 mm in the horizontal direction. Moreover, said thickness t2 is 0.1 mm-2.0 mm.

このような構成のマスキング部材15をガラス基板16の表面にセットして、スパッタ法または真空蒸着法により成膜を行なう場合には、材料粒子は、各枠材15a〜15d、覆設体15e、及び連結体15fの相互間の間隙を通過することにより、ガラス基板16の表面(この時点では、ガラス基板16の表裏両面に、スパッタ法または真空蒸着法により既述の反射防止膜14が形成されている)に達する。その場合に、マスキング部材15の正八角形状枠部15yと円形の覆設体15eとの間の間隙には、複数本の連結体15fが配設されているため、各連結体15fの両側部近傍を通過した材料粒子は、各連結体15fの裏側の隙間17に回り込んでガラス基板16の表面に達するのに対して、各連結体15fの相互間における周方向中央部の周辺を通過した材料粒子は、直進してガラス基板16の表面に達する。   When the masking member 15 having such a structure is set on the surface of the glass substrate 16 and film formation is performed by a sputtering method or a vacuum evaporation method, the material particles include the frame members 15a to 15d, the covering member 15e, And the antireflection film 14 described above is formed on the surface of the glass substrate 16 (at this time, both the front and back surfaces of the glass substrate 16 by a sputtering method or a vacuum evaporation method) Reach). In that case, since a plurality of connecting bodies 15f are disposed in the gap between the regular octagonal frame portion 15y of the masking member 15 and the circular covering body 15e, both side portions of each connecting body 15f are arranged. The material particles that have passed through the vicinity go around the gap 17 on the back side of each connection body 15f and reach the surface of the glass substrate 16, while passing through the periphery of the central portion in the circumferential direction between the connection bodies 15f. The material particles go straight and reach the surface of the glass substrate 16.

従って、マスキング部材15の正八角形状枠部15yと覆設体15eとの間の間隙に対応するガラス基板16の表面部分には、材料粒子が直進して到達する部位と、材料粒子が回り込んで到達する部位とが存在することになる。そして、材料粒子が回り込んで到達する部位は、直進して到達する部位に比して、材料粒子の到達量が相対的に少なくなり、これにより、ガラス基板16の表面には、各連結体15f及びその両側部近傍に対応する部位に、既述の図2及び図3に示すような凹部13を有する金属膜12が形成される。また、マスキング部材15を使用してスパッタ法または真空蒸着法により金属膜12が形成されることから、既述の図4に示すように、金属膜12の各端縁部12wの表面は、終端側に移行するに連れて窓ガラス10の表面に漸次近づく傾斜状を呈してる。   Therefore, the portion where the material particles go straight and reach the surface portion of the glass substrate 16 corresponding to the gap between the regular octagonal frame portion 15y of the masking member 15 and the covering body 15e. There will be a part that can be reached by. And the part which material particle wraps around and reaches | attains compared with the part which goes straight and reaches | attains, the arrival amount of material particle becomes relatively small, and, thereby, on each surface of the glass substrate 16, each connection body is reached. The metal film 12 having the recesses 13 as shown in FIGS. 2 and 3 is formed in the portions corresponding to 15f and the vicinity of both sides thereof. Further, since the metal film 12 is formed by the sputtering method or the vacuum evaporation method using the masking member 15, the surface of each edge portion 12w of the metal film 12 is terminated as shown in FIG. As it moves to the side, it has an inclined shape that gradually approaches the surface of the window glass 10.

この結果、図9に示すように、ガラス基板16には、縦横に規則的に複数の正八角形状の単位薄膜形成部18が形成される。詳述すると、各単位薄膜形成部18は、ガラス基板16におけるマスキング部材15の正八角形状枠部15yの内側領域に対応する部位に、覆設体15eの形状に対応する円形の窓部11を中央部に有し且つその周囲の表面に金属膜12(同図に狭ピッチの平行斜線を付した部位)が形成されることにより構成されている。このような単位薄膜形成部18を複数有する一枚のガラス基板16は、45°ずつ相違する4方向に沿って、具体的には、複数箇所で矢印a方向に一挙に、複数箇所で矢印b方向に一挙に、複数箇所で矢印c方向に一挙に、複数箇所で矢印d方向に一挙に、それぞれ切断加工される。これにより、計4回の切断加工を行なうだけで、図2及び図3に示す光素子用窓部品1が多数製作される。   As a result, as shown in FIG. 9, a plurality of regular octagonal unit thin film forming portions 18 are regularly formed in the glass substrate 16 in the vertical and horizontal directions. More specifically, each unit thin film forming portion 18 has a circular window portion 11 corresponding to the shape of the covering body 15e at a portion corresponding to the inner region of the regular octagonal frame portion 15y of the masking member 15 in the glass substrate 16. A metal film 12 (portion with a narrow-pitch parallel diagonal line in the figure) is formed on the surface around the central portion. One glass substrate 16 having a plurality of such unit thin film forming portions 18 is arranged along four directions that are different by 45 °, specifically, at a plurality of places in the direction of arrow a, and at a plurality of places, arrows b. Cutting is performed in one direction at a time, at a plurality of locations in the direction of the arrow c, and at a plurality of locations in a direction of the arrow d. As a result, a large number of optical element window parts 1 shown in FIGS. 2 and 3 can be produced simply by performing a total of four cutting operations.

尚、上記実施形態では、ガラスからなる基板の表面に金属膜を形成する場合に本発明を適用したが、この基板は、セラミックまたはガラスセラミックであってもよい。   In the above embodiment, the present invention is applied when a metal film is formed on the surface of a substrate made of glass. However, the substrate may be ceramic or glass ceramic.

また、上記実施形態は、半導体レーザーダイオードモジュールに装着される光素子用窓部品1に本発明を適用したが、これ以外の光半導体モジュールその他の光素子部品についても、同様に本発明を適用することが可能であるばかりでなく、例えば太陽電池パネルやデフォーカス板等の薄膜形成体についても、同様に本発明を適用することが可能である。   Moreover, although the said embodiment applied this invention to the optical element window component 1 with which a semiconductor laser diode module is mounted | worn, this invention is applied similarly to optical semiconductor modules other than this and other optical element components. In addition, it is possible to apply the present invention to thin film forming bodies such as solar cell panels and defocus plates.

本発明の実施形態に係る薄膜形成体(光素子用窓部品)が装着された光素子部品を示す概略縦断面図である。It is a schematic longitudinal cross-sectional view which shows the optical element component with which the thin film forming body (window component for optical elements) which concerns on embodiment of this invention was mounted | worn. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)を示す平面図である。It is a top view which shows the thin film formation body (window part for optical elements) which concerns on embodiment of this invention. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)を示す縦断面図であって、図2のA−A線にしたがって切断した断面図である。It is a longitudinal cross-sectional view which shows the thin film formation body (window part for optical elements) which concerns on embodiment of this invention, Comprising: It is sectional drawing cut | disconnected according to the AA line of FIG. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)を示す要部拡大縦断面図である。It is a principal part expanded vertical sectional view which shows the thin film formation body (window part for optical elements) which concerns on embodiment of this invention. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)が光素子部品に装着された状態を示す要部拡大概略横断面図である。It is a principal part expansion schematic cross-sectional view which shows the state with which the thin film formation body (window component for optical elements) which concerns on embodiment of this invention was mounted | worn to the optical element component. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)の製造に使用されるマスキング部材を示す要部概略平面図である。It is a principal part schematic plan view which shows the masking member used for manufacture of the thin film formation body (window part for optical elements) which concerns on embodiment of this invention. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)の製造に使用されるマスキング部材を示す要部拡大平面図である。It is a principal part enlarged plan view which shows the masking member used for manufacture of the thin film formation body (window part for optical elements) which concerns on embodiment of this invention. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)の製造途中の状態を示す要部縦断正面図であって、図6のB−B線にしたがって切断した断面図に対応する図である。It is a principal part longitudinal front view which shows the state in the middle of manufacture of the thin film formation body (window part for optical elements) which concerns on embodiment of this invention, Comprising: The figure corresponding to sectional drawing cut | disconnected according to the BB line of FIG. It is. 本発明の実施形態に係る薄膜形成体(光素子用窓部品)の製造途中の状態を示す要部概略平面図である。It is a principal part schematic plan view which shows the state in the middle of manufacture of the thin film forming body (window part for optical elements) which concerns on embodiment of this invention. 従来例を示す縦断正面図である。It is a vertical front view which shows a prior art example.

符号の説明Explanation of symbols

1 薄膜形成体(光素子用窓部品)
10 基板(窓ガラス)
11 窓部
12 金属膜
12a 第1の膜
12b 第2の膜
12c 第3の膜
12w 金属膜の面方向における端縁部
12x 金属膜の表面
13 凹部
13x 凹部の底面
15 マスキング部材
15a 縦枠材(当接マスク部)
15b 横枠材(当接マスク部)
15c 第1傾斜枠材(当接マスク部)
15d 第2傾斜枠材(当接マスク部)
15e 円形の覆設体(当接マスク部)
15f 連結枠材(連結マスク部)
16 基板(ガラス基板)
17 材料粒子を回り込ませる隙間
1 Thin-film formation (window component for optical elements)
10 Substrate (window glass)
DESCRIPTION OF SYMBOLS 11 Window part 12 Metal film 12a 1st film | membrane 12b 2nd film | membrane 12c 3rd film | membrane 12w The edge part 12x in the surface direction of a metal film 12x The surface of a metal film 13 Recessed part 13x Bottom face of a recessed part 15 Masking member 15a Vertical frame material ( Contact mask)
15b Horizontal frame material (contact mask part)
15c 1st inclination frame material (contact mask part)
15d 2nd inclination frame material (contact mask part)
15e Circular covering body (contact mask part)
15f Connection frame material (connection mask part)
16 Substrate (glass substrate)
17 Clearance around material particles

Claims (6)

基板の表面に金属膜を形成してなる薄膜形成体において、上記金属膜の表面に複数の凹部が形成されると共に、これらの凹部の底面からそれぞれ上記金属膜の表面に至る部位が、屈曲部を有しない滑らかな連続面で形成されていることを特徴とする薄膜形成体。   In the thin film formed body formed by forming a metal film on the surface of the substrate, a plurality of recesses are formed on the surface of the metal film, and portions extending from the bottom surfaces of the recesses to the surface of the metal film are bent portions. A thin film forming body characterized in that the thin film forming body is formed with a smooth continuous surface not having any. 基板の表面に金属膜を形成してなる薄膜形成体において、上記金属膜の面方向における端縁部の表面が、終端側に移行するに連れて上記基板の表面に漸次近づき且つその終端で上記基板の表面に至っていることを特徴とする薄膜形成体。   In the thin film formed body formed by forming a metal film on the surface of the substrate, the surface of the edge portion in the surface direction of the metal film gradually approaches the surface of the substrate as it moves to the terminal side and A thin film forming body characterized by reaching a surface of a substrate. 上記基板は、外輪郭形状が正八角形またはそれよりも辺の数が多い正多角形の窓ガラスからなると共に、該窓ガラスの中央部に光透過用の窓部をなす金属膜の非形成部を有し且つその周囲の表面に上記金属膜が形成されていることを特徴とする請求項1または2に記載の薄膜形成体。   The substrate is made of a regular octagonal window glass whose outer contour shape is a regular octagon or a larger number of sides than that, and a non-metal film forming part forming a light transmitting window at the center of the window glass The thin film forming body according to claim 1, wherein the metal film is formed on a surface around the surface. スパッタ法または真空蒸着法により基板の表面に金属膜を成膜する工程を含む薄膜形成体の製造方法であって、上記基板の表面にマスキング部材を着脱可能に固定すると共に、上記マスキング部材を通過して上記基板の表面に達する材料粒子の量を部分的に異ならせることにより、表面に複数の凹部を有する金属膜を上記基板の表面に形成することを特徴とする薄膜形成体の製造方法。   A method of manufacturing a thin film forming body including a step of forming a metal film on a surface of a substrate by sputtering or vacuum vapor deposition, wherein the masking member is detachably fixed to the surface of the substrate and passes through the masking member. A method of manufacturing a thin-film formed body comprising: forming a metal film having a plurality of recesses on the surface of the substrate by partially varying the amount of material particles reaching the surface of the substrate. 請求項4に記載の薄膜形成体の製造方法により、中央部に光透過用の窓部をなす金属膜の非形成部を有し且つその周囲に金属膜を有してなる単位薄膜形成部を、基板の表面に縦横に規則性をもって複数形成し、この基板を、45°ずつ相違する計4方向に沿ってそれぞれ直線上に切断することにより、上記複数の単位薄膜形成部の全てを相互に分離させることを特徴とする薄膜形成体の製造方法。   A unit thin film forming portion comprising a metal film non-forming portion forming a light transmitting window portion at a central portion and a metal film surrounding the metal thin film forming portion. A plurality of unit thin film forming portions are mutually formed by forming a plurality of regular and vertical on the surface of the substrate, and cutting the substrate along straight lines along a total of four directions that differ by 45 °. A method for producing a thin film-formed body, wherein the thin film-formed body is separated. 請求項4または5に記載の薄膜形成体の製造方法に用いられるマスキング部材であって、基板の表面に当接する複数の当接マスク部を、それらの相互間の間隙を材料粒子が直進して上記基板の表面に到達可能となるように配列すると共に、上記相互間の間隙に、隣り合う当接マスク部を連結する複数の連結マスク部を相互に離隔させて配列し、且つ上記当接マスク部を上記基板の表面に当接させた際に上記連結マスク部と上記基板の表面との間に材料粒子を回り込ませて上記基板の表面に到達させるための隙間が形成されるように構成したことを特徴とするマスキング部材。   A masking member used in the method for manufacturing a thin film formed body according to claim 4 or 5, wherein a plurality of contact mask portions that are in contact with the surface of the substrate are formed such that material particles move straight through a gap therebetween. The contact masks are arranged so as to be able to reach the surface of the substrate, and a plurality of connection mask portions for connecting adjacent contact mask portions are spaced apart from each other in the gap between the contact masks. When the portion is brought into contact with the surface of the substrate, a gap is formed between the connection mask portion and the surface of the substrate so that the material particles can reach and reach the surface of the substrate. A masking member characterized by that.
JP2004161598A 2004-05-31 2004-05-31 Thin film forming device and its manufacturing method, and masking member used for its manufacture Pending JP2005347304A (en)

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WO2023238775A1 (en) * 2022-06-07 2023-12-14 日本電気硝子株式会社 Light transmission window member, manufacturing method therefor, prism, and electronic equipment

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