JP2005319470A5 - - Google Patents

Claims (13)

Sn-Ag-Cu solder material;
The on Sn-Ag-Cu solder material viewed contains a fine particle containing an element which does not substantially dissolve, the fine particles have a particle size of less than 1 [mu] m, a lead-free solder material. The lead-free solder material according to claim 1, wherein the fine particles have a particle diameter of 1 nm to 1 μm . The lead-free solder material of Claim 1 or 2 which contains the said element in the quantity of 0-0.5 mass% (however, excluding zero) on the whole lead-free solder material basis. The element includes one or more elements selected from the group consisting of B, Al, Ti, V, Cr, Mn, Fe, Co, Ni, Zr, Nb, and Mo. Lead-free solder material according to any one of the above. The lead-free solder material according to claim 4, wherein the element includes one or more elements selected from the group consisting of B, Ti, V, Cr, Mn, Zr, Nb, and Mo. The fine particles are selected from the group consisting of simple substances of B, Al, Ti, V, Cr, Mn, Fe, Co, Ni, Zr, Nb and Mo and oxides, carbides, nitrides and borides thereof. The lead-free solder material according to any one of claims 1 to 4, wherein the lead-free solder material is made of a material higher than that. Comprising 0 to 0.2% by weight of the element, 0 to 4% by weight of Ag, 0 to 1% by weight of Cu (except for zero) and the balance of Sn, based on the total amount of lead-free solder material; The lead-free solder material according to any one of claims 1 to 6. A method for producing a lead-free solder material, comprising mixing particles made of a Sn-Ag-Cu solder material and fine particles containing an element that does not substantially dissolve in the Sn-Ag-Cu solder material. The method for producing a lead-free solder material according to claim 8, wherein the particles made of the Sn-Ag-Cu solder material have a particle size of 5 to 40 µm. The method for producing a lead-free solder material according to claim 8 or 9, wherein the lead-free solder material according to any one of claims 1 to 7 is obtained. An electronic circuit board in which an electronic component is bonded to a board using the lead-free solder material according to claim 1. The manufacturing method of an electronic circuit board including joining an electronic component to a board | substrate by reflow soldering using the lead-free solder material in any one of Claims 1-7. The manufacturing method of an electronic circuit board including joining an electronic component to a board | substrate by flow soldering using the lead-free solder material in any one of Claims 1-7.