JP2005317643A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

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JP2005317643A
JP2005317643A JP2004131514A JP2004131514A JP2005317643A JP 2005317643 A JP2005317643 A JP 2005317643A JP 2004131514 A JP2004131514 A JP 2004131514A JP 2004131514 A JP2004131514 A JP 2004131514A JP 2005317643 A JP2005317643 A JP 2005317643A
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solid electrolytic
electrolytic capacitor
cathode
terminal
cathode layer
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JP4530340B2 (en
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Satoshi Iwai
悟志 岩井
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Tokin Corp
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NEC Tokin Toyama Ltd
NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor in which a connection strength between a cathode layer and a cathode terminal is increased so as not to be damaged even when affected by an unexpected external stress in an assembling production process. <P>SOLUTION: An uneven part comprising a groove 21, a rectangular recess 22, and a circular recess 23 is formed on one face of the cathode layer of a capacitor element, and conductive adhesives are coated on the uneven part to be cured for connecting with one end of the cathode terminal. Further, a depth from a crest to a trough of the uneven part is 5 μm or more. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、固体電解コンデンサに関するものである。   The present invention relates to a solid electrolytic capacitor.

近年、電子機器の小型化、デジタル化に伴い、これらの機器に使用される固体電解コンデンサにおいては大容量で小型のコンデンサが強く要求されている。図２に、一般的な固体電解コンデンサの断面図を示す。この固体電解コンデンサは、コンデンサ素子１を有しており、その外表面には陰極層８が形成されている。従来の技術では、陰極層８と陰極端子４の接続は導電性接着剤２を使用し接続している。また、陽極リード線６の先端には溶接などの機械的接続によって陽極端子３が接続されている。このように接続が行われた後、外装樹脂５が形成されている。   In recent years, with the downsizing and digitization of electronic devices, solid electrolytic capacitors used in these devices are strongly required to have large capacity and small capacitors. FIG. 2 shows a cross-sectional view of a general solid electrolytic capacitor. This solid electrolytic capacitor has a capacitor element 1, and a cathode layer 8 is formed on the outer surface thereof. In the conventional technique, the cathode layer 8 and the cathode terminal 4 are connected using the conductive adhesive 2. The anode terminal 3 is connected to the tip of the anode lead wire 6 by mechanical connection such as welding. After the connection is made in this way, the exterior resin 5 is formed.

このとき用いられるコンデンサ素子１の形状を図３に斜視図で示す。陽極体７には陽極リード線６が埋め込まれその一端が引き出されている。ここで、陽極体７は直方体状の多孔質体であるが、従来技術では、その表面の陰極層８はマクロ的には平坦な表面をもっていた。例えば特許文献１の図１などのようである。   The shape of the capacitor element 1 used at this time is shown in a perspective view in FIG. An anode lead wire 6 is embedded in the anode body 7 and one end thereof is drawn out. Here, the anode body 7 is a rectangular parallelepiped porous body, but in the conventional technique, the cathode layer 8 on the surface thereof has a macro flat surface. For example, as shown in FIG.

特開２００３−４５７５７号公報JP 2003-45757 A

このような固体電解コンデンサは近年の小型化に伴い、コンデンサ素子の陰極層と陰極端子の接触面積が小さくなってきており、陰極層と陰極端子の接続強度が下がっている。   With the recent miniaturization of such a solid electrolytic capacitor, the contact area between the cathode layer and the cathode terminal of the capacitor element is reduced, and the connection strength between the cathode layer and the cathode terminal is lowered.

この状況において、本発明の課題は、固体電解コンデンサの組立製造工程において予期せぬ外部応力の影響を受けた場合にも損傷しないように陰極層と陰極端子の接続強度を高めた固体電解コンデンサを提供することにある。   In this situation, an object of the present invention is to provide a solid electrolytic capacitor having an increased connection strength between the cathode layer and the cathode terminal so that the solid electrolytic capacitor is not damaged even under the influence of an unexpected external stress in the assembly manufacturing process. It is to provide.

第１の発明の固体電解コンデンサは、外表面に陰極層を有すると共に内部に埋め込まれ一端が引き出された陽極リード線を有するコンデンサ素子と、前記陰極層に電気的に接続された板状の陰極端子と、前記陽極リード線に電気的に接続された板状の陽極端子と、前記コンデンサ素子、前記陽極端子及び陰極端子を外装するように成形された樹脂とを備え、前記陽極端子と陰極端子とは前記樹脂の端面に沿って折り曲げられ、ついで前記樹脂の下面側に折り曲げ加工された固体電解コンデンサにおいて、前記陰極層の一部には複数の凹部又は凸部を有する凹凸部が形成され、前記凹凸部には導電性接着剤が塗布され硬化されて陰極端子の一端と接続されたことを特徴とする。   A solid electrolytic capacitor according to a first aspect of the present invention is a capacitor element having a cathode layer on the outer surface and having an anode lead wire embedded inside and drawn out at one end, and a plate-like cathode electrically connected to the cathode layer A terminal, a plate-like anode terminal electrically connected to the anode lead wire, and a resin molded to cover the capacitor element, the anode terminal, and the cathode terminal, the anode terminal and the cathode terminal Is a solid electrolytic capacitor that is bent along the end surface of the resin and then bent to the lower surface side of the resin, and a concave and convex portion having a plurality of concave portions or convex portions is formed in a part of the cathode layer, The uneven portion is coated with a conductive adhesive and cured to be connected to one end of the cathode terminal.

第２の発明の固体電解コンデンサは、前記凹凸部は、ストライプ状又は格子状であることを特徴とする、第１の発明の固体電解コンデンサである。   The solid electrolytic capacitor according to a second aspect of the present invention is the solid electrolytic capacitor according to the first aspect, wherein the concavo-convex portion has a stripe shape or a lattice shape.

第３の発明の固体電解コンデンサは、前記凹凸部は、多角形状又は円形状の凹部を有することを特徴とする、第１の発明の固体電解コンデンサである。   The solid electrolytic capacitor according to a third aspect of the present invention is the solid electrolytic capacitor according to the first aspect, wherein the uneven portion has a polygonal or circular recess.

第４の発明の固体電解コンデンサは、前記凹凸部の山から谷への深さは５μｍ以上であることを特徴とする、第１から第３のいずれかの固体電解コンデンサである。   A solid electrolytic capacitor according to a fourth aspect of the present invention is the solid electrolytic capacitor according to any one of the first to third aspects, wherein a depth from the peak to the valley of the uneven portion is 5 μm or more.

以上のように、本発明によれば、固体電解コンデンサのコンデンサ素子の陰極層に凹凸を形成することで、接触面積を増大させ陰極強度、すなわちコンデンサ素子の陰極層側と陰極端子の接続強度を高め、組立製造工程において予期せぬ応力が加えられたときにも損傷することのない固体電解コンデンサを提供することができる。   As described above, according to the present invention, by forming irregularities on the cathode layer of the capacitor element of the solid electrolytic capacitor, the contact area is increased and the cathode strength, that is, the connection strength between the cathode layer side of the capacitor element and the cathode terminal is increased. Thus, it is possible to provide a solid electrolytic capacitor that is not damaged when an unexpected stress is applied in an assembly manufacturing process.

次に、本発明の実施の形態を図面に基づいて説明する。本実施の形態の固体電解コンデンサの全体構造は、すでに説明した図２と同様である。まず、素子特性形成工程を経たコンデンサ素子１は陽極側においては陽極リード線６と陽極端子３を例えば溶接によって、電気的に且つ機械的に接続する。陰極側においてはコンデンサ素子１の全周面に陰極層８が形成されており、この陰極層面と陰極端子４を導電性接着剤２によって電気的に接続する。その後、外装樹脂５にて全体を被いモールド成形する。この後は従来公知の方法において陽極端子３、陰極端子４を定寸法にて切断・成形し最終形状にいたる。   Next, embodiments of the present invention will be described with reference to the drawings. The overall structure of the solid electrolytic capacitor of this embodiment is the same as that of FIG. First, in the capacitor element 1 that has undergone the element characteristic forming step, the anode lead wire 6 and the anode terminal 3 are electrically and mechanically connected, for example, by welding, on the anode side. On the cathode side, a cathode layer 8 is formed on the entire peripheral surface of the capacitor element 1, and the cathode layer surface and the cathode terminal 4 are electrically connected by the conductive adhesive 2. Thereafter, the whole is covered with the exterior resin 5 and molded. Thereafter, the anode terminal 3 and the cathode terminal 4 are cut and molded to a final shape by a conventionally known method.

この固体電解コンデンサにおいて、コンデンサ素子１と陰極端子４との接触面積について説明する。素子寸法が同じ大きさでも陰極層の表面に凹凸を付けることで、凹み分の接触面積が増大する。   In this solid electrolytic capacitor, the contact area between the capacitor element 1 and the cathode terminal 4 will be described. Even when the element dimensions are the same, the contact area of the dent is increased by making the surface of the cathode layer uneven.

そのコンデンサ素子１に対する陰極強度について比較する。従来技術ではコンデンサ素子面での導電性接着剤２の接触面積が少なくなり強度が低下してしまう。この陰極強度が下がった状態では、固体電解コンデンサの組立製造工程において予期せぬ外部応力の影響を受けコンデンサ素子１と陰極端子４にずれが発生した場合などは、コンデンサ素子１から陰極端子４が外れ、オープン状態となってしまう。本発明によると陰極層の表面積を従来技術より増大できるため、陰極強度が下がることはない。さらに凹凸に導電性接着剤２が入り込みアンカー効果を発揮するため陰極強度は従来技術より向上されることとなる。このように、陰極層の材質及び導電性接着剤を変更することなく、接着強度を高めることができる。   The cathode strength for the capacitor element 1 will be compared. In the prior art, the contact area of the conductive adhesive 2 on the capacitor element surface is reduced and the strength is lowered. In a state where the cathode strength is reduced, when the capacitor element 1 and the cathode terminal 4 are displaced due to an unexpected external stress in the assembly manufacturing process of the solid electrolytic capacitor, the capacitor terminal 1 is connected to the cathode terminal 4. It will come off and become open. According to the present invention, since the surface area of the cathode layer can be increased as compared with the prior art, the cathode strength does not decrease. Furthermore, since the conductive adhesive 2 enters the unevenness and exhibits an anchor effect, the cathode strength is improved as compared with the prior art. Thus, the adhesive strength can be increased without changing the material of the cathode layer and the conductive adhesive.

次に、本発明の実施例を挙げてさらに説明する。   Next, examples of the present invention will be further described.

陰極層の表面に凹凸を有するコンデンサ素子を用い、本実施例の固体電解コンデンサを組み立てる製造工程については、実施の形態で説明した工程と同様であるので省略して、コンデンサ素子についてのみ説明する。   Since the manufacturing process for assembling the solid electrolytic capacitor of this example using a capacitor element having irregularities on the surface of the cathode layer is the same as the process described in the embodiment, only the capacitor element will be described.

図１は、本実施例のコンデンサ素子を示し、図１（ａ）はストライプ状の凹凸が形成された場合の斜視図、図１（ｂ）は格子状の凹凸が形成された場合の斜視図、図１（ｃ）は円形状の凹部が繰り返し形成された場合の斜視図である。   1A and 1B show a capacitor element according to the present embodiment. FIG. 1A is a perspective view when stripe-like irregularities are formed, and FIG. 1B is a perspective view when lattice-like irregularities are formed. FIG.1 (c) is a perspective view when a circular recessed part is repeatedly formed.

図１（ａ）では、溝２１が繰り返し形成され、ストライプ状の凹凸となっている。その溝の断面形状については、台形、長方形などであっても、表面積の増加とアンカー効果においては同様に有効である。   In FIG. 1A, the grooves 21 are repeatedly formed to form stripe-shaped irregularities. Even if the cross-sectional shape of the groove is trapezoidal or rectangular, the increase in surface area and the anchor effect are also effective.

図１（ｂ）では、矩形の凹部２２が繰り返し形成され格子状の凹凸となっている。このとき、凹部は一般の多角形であってもよい。   In FIG. 1B, a rectangular recess 22 is repeatedly formed to form a lattice-like unevenness. At this time, the concave portion may be a general polygon.

図１（ｃ）では、円形状の凹部２３が繰り返して形成されているが、その円形状は楕円であっても真円であってもよい。   In FIG. 1C, the circular concave portion 23 is formed repeatedly, but the circular shape may be an ellipse or a perfect circle.

このように凹部の形状については、制限は少なく、製作に適したものを選択することができる。ただし、凹凸の山から谷への深さについては、５μｍ未満の場合では、凹部の数を増やせば表面積を増加することはできるが、アンカー効果が発揮されないので接続強度は高くない。また、その深さの上限について、大きすぎるとアンカー効果が低下するということはなく、その上限は、体積効率などの他の要因によって定められる。   Thus, there are few restrictions about the shape of a crevice, and the thing suitable for manufacture can be chosen. However, when the depth from the ridges to the valleys is less than 5 μm, the surface area can be increased by increasing the number of recesses, but the anchor effect is not exhibited, so the connection strength is not high. Further, if the upper limit of the depth is too large, the anchor effect does not decrease, and the upper limit is determined by other factors such as volume efficiency.

実施例のコンデンサ素子を示し、図１（ａ）はストライプ状の凹凸が形成された場合の斜視図、図１（ｂ）は格子状の凹凸が形成された場合の斜視図、図１（ｃ）は円形状の凹部が繰り返し形成された場合の斜視図。FIG. 1A is a perspective view when a stripe-shaped unevenness is formed, FIG. 1B is a perspective view when a lattice-shaped unevenness is formed, and FIG. ) Is a perspective view when a circular concave portion is repeatedly formed. 固体電解コンデンサの断面図。Sectional drawing of a solid electrolytic capacitor. 従来のコンデンサ素子の斜視図。The perspective view of the conventional capacitor | condenser element.

符号の説明Explanation of symbols

１ コンデンサ素子
２ 導電性接着剤
３ 陽極端子
４ 陰極端子
５ 外装樹脂
６ 陽極リード線
７ 陽極体
８ 陰極層
２１ 溝
２２ 矩形の凹部
２３ 円形状の凹部 DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Conductive adhesive 3 Anode terminal 4 Cathode terminal 5 Exterior resin 6 Anode lead wire 7 Anode body 8 Cathode layer 21 Groove 22 Rectangular recessed part 23 Circular recessed part

Claims (4)

外表面に陰極層を有すると共に内部に埋め込まれ一端が引き出された陽極リード線を有するコンデンサ素子と、前記陰極層に電気的に接続された板状の陰極端子と、前記陽極リード線に電気的に接続された板状の陽極端子と、前記コンデンサ素子、前記陽極端子及び陰極端子を外装するように成形された樹脂とを備え、前記陽極端子と陰極端子とは前記樹脂の端面に沿って折り曲げられ、ついで前記樹脂の下面側に折り曲げ加工された固体電解コンデンサにおいて、前記陰極層の一部には複数の凹部又は凸部を有する凹凸部が形成され、前記凹凸部には導電性接着剤が塗布され硬化されて陰極端子の一端と接続されたことを特徴とする固体電解コンデンサ。   A capacitor element having a cathode layer on the outer surface and having an anode lead wire embedded inside and drawn out at one end, a plate-like cathode terminal electrically connected to the cathode layer, and an electrical connection to the anode lead wire A plate-shaped anode terminal connected to the capacitor, and a resin molded so as to cover the capacitor element, the anode terminal, and the cathode terminal, and the anode terminal and the cathode terminal are bent along an end surface of the resin. Then, in the solid electrolytic capacitor bent on the lower surface side of the resin, a part of the cathode layer is formed with an uneven part having a plurality of concave parts or convex parts, and a conductive adhesive is formed on the uneven part. A solid electrolytic capacitor characterized by being applied and cured and connected to one end of a cathode terminal. 前記凹凸部は、ストライプ状又は格子状であることを特徴とする請求項１に記載の固体電解コンデンサ。   The solid electrolytic capacitor according to claim 1, wherein the uneven portion has a stripe shape or a lattice shape. 前記凹凸部は、多角形状又は円形状の凹部を有することを特徴とする請求項１に記載の固体電解コンデンサ。   The solid electrolytic capacitor according to claim 1, wherein the uneven portion has a polygonal or circular recess. 前記凹凸部の山から谷への深さは５μｍ以上であることを特徴とする、請求項１から請求項３のいずれかに記載の固体電解コンデンサ。   4. The solid electrolytic capacitor according to claim 1, wherein a depth from the peak to the valley of the uneven portion is 5 μm or more. 5.
JP2004131514A 2004-04-27 2004-04-27 Solid electrolytic capacitor Expired - Lifetime JP4530340B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012166418A (en) * 2011-02-14 2012-09-06 Seiko Epson Corp Piezoelectric element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343271A (en) * 1992-06-04 1993-12-24 Nec Toyama Ltd Molded chip type solid electrolytic capacitor
JPH0822932A (en) * 1994-07-06 1996-01-23 Nec Kansai Ltd Chip solid electrolytic capacitor
JP2003124070A (en) * 2001-10-17 2003-04-25 Rohm Co Ltd Structure of packaged electrolytic capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343271A (en) * 1992-06-04 1993-12-24 Nec Toyama Ltd Molded chip type solid electrolytic capacitor
JPH0822932A (en) * 1994-07-06 1996-01-23 Nec Kansai Ltd Chip solid electrolytic capacitor
JP2003124070A (en) * 2001-10-17 2003-04-25 Rohm Co Ltd Structure of packaged electrolytic capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012166418A (en) * 2011-02-14 2012-09-06 Seiko Epson Corp Piezoelectric element

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