JP2005294271A - Manufacturing method for anisotropic conductive adhesive film - Google Patents
Manufacturing method for anisotropic conductive adhesive film Download PDFInfo
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- JP2005294271A JP2005294271A JP2005157615A JP2005157615A JP2005294271A JP 2005294271 A JP2005294271 A JP 2005294271A JP 2005157615 A JP2005157615 A JP 2005157615A JP 2005157615 A JP2005157615 A JP 2005157615A JP 2005294271 A JP2005294271 A JP 2005294271A
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002245 particle Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims description 19
- 238000005507 spraying Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims 1
- 238000004220 aggregation Methods 0.000 abstract description 6
- 230000002776 aggregation Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 26
- 230000001070 adhesive effect Effects 0.000 description 25
- 239000010408 film Substances 0.000 description 24
- 239000010410 layer Substances 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 12
- 238000010030 laminating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- HHEFNVCDPLQQTP-UHFFFAOYSA-N ammonium perchlorate Chemical compound [NH4+].[O-]Cl(=O)(=O)=O HHEFNVCDPLQQTP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012789 electroconductive film Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000013056 hazardous product Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
Description
本発明は、液晶表示モジュ一ル等の電極と相対峙させた回路基板の電極を接続固定するために用いられる異方導電性接着フィルムの製造法に関する。 The present invention relates to a method for producing an anisotropic conductive adhesive film used for connecting and fixing an electrode of a circuit board that is opposed to an electrode of a liquid crystal display module or the like.
従来の異方導電性接着フィルムは、導電粒子を絶縁性接着剤中に分散し、剥離性フィルム上に製膜したものや、絶縁性接着剤中に導電粒子を含む層と含まない層をラミネ一トして、二層構造化したものが実用化されている。
接続回路の高精細化に対応して接続電極間スぺ一スは、従来の２００μｍ程度から５０μｍ以下が要求されてきている。これに伴い、異方導電性接着フィルムは従来の電極間の電気的接続と接着のみでなく、導電粒子の凝集による電極間短絡に関しても特性の向上が求められている。従来の方法では、絶縁性接着剤中に微小径の導電粒子を添加・分散させる際に、所謂（ままこ）状態になりやすく導電粒子の二次凝集が発生しやすい。この二次凝集粒子が隣接する電極間短絡の原因となり、接続電極間スぺ−スの矮小化と共に二次凝集粒子の微細化が切望されている。
また、接続電極の小面積化に対応する接続抵抗の増大を防止するために、導電粒子の添加量を増大する方向にある。一般に異方導電性接着フィルムで接続する際、接続電極間の導電粒子は絶縁性接着剤と共に接続電極のスぺ−スに向かって流動し、その結果、接続電極のスペ−スには導電粒子が多く集まる。接続電極スぺ−スの導電粒子が多くなるに従い、近接電極を導電粒子が短絡する危険性が高くなる。
接続時の粒子流れを少なくして、接続電極上に残る導電粒子数を確保する方法として、二層構造の異方導電性接着フィルムが提案されているが、まだ不十分である。二層構造品では、導電粒子入り絶縁性接着剤層が薄い程粒子流れが少ないという知見があるが、従来の塗工法では薄くするにも限度があり、極限までの薄層化する方法が望まれていた。
さらに、接続電極間スぺ−スが小さくなるに伴い、許容される導電性異物の大きさと混入量も厳しくなり、製膜前の接着剤精密濾過が望まれるが、導電粒子を分散させた接着剤の濾過は、添加する導電粒子の通過を阻害しない目開きが必要で精密濾過に限度があり、現状では不十分である。
Corresponding to the high definition of the connection circuit, the space between the connection electrodes is required to be about 200 μm to 50 μm or less. Along with this, the anisotropic conductive adhesive film is required not only for electrical connection and adhesion between conventional electrodes, but also for improvement in characteristics regarding short-circuiting between electrodes due to aggregation of conductive particles. In the conventional method, when the conductive particles having a small diameter are added and dispersed in the insulating adhesive, a so-called (remaining) state is likely to occur, and secondary aggregation of the conductive particles is likely to occur. The secondary agglomerated particles cause a short circuit between adjacent electrodes, and the miniaturization of the secondary agglomerated particles is desired as the space between the connecting electrodes is reduced.
In addition, in order to prevent an increase in connection resistance corresponding to a reduction in the area of the connection electrode, the amount of conductive particles added tends to increase. In general, when connecting with an anisotropic conductive adhesive film, the conductive particles between the connection electrodes flow toward the space of the connection electrodes together with the insulating adhesive, and as a result, the conductive particles are formed in the space of the connection electrodes. Many gather. As the number of conductive particles in the connection electrode space increases, the risk that the conductive particles short-circuit the proximity electrode increases.
An anisotropic conductive adhesive film having a two-layer structure has been proposed as a method for reducing the particle flow at the time of connection and ensuring the number of conductive particles remaining on the connection electrode, but it is still insufficient. In the two-layer structure product, there is a knowledge that the thinner the insulating adhesive layer with conductive particles, the smaller the particle flow. However, the conventional coating method has a limit to making it thin, and a method to make the layer as thin as possible is desired. It was rare.
Furthermore, as the space between the connecting electrodes becomes smaller, the size and amount of conductive foreign substances allowed become stricter, and it is desirable to perform fine filtration of the adhesive before film formation. Filtration of the agent requires an opening that does not obstruct the passage of the conductive particles to be added, and there is a limit to microfiltration, which is insufficient at present.
本発明は、上記３点の課題を解決するためになされた。第１の課題である導電粒子の二次凝集に関して、導電粒子は元々は単粒子であるが、液状絶縁性接着剤中に分散させるときに二次凝集することが確認されている。この工程をなくする方法として、乾式の粒子噴霧法により絶縁性接着剤層の表面に導電粒子を直接散布する方法を考案した。
また、第２の課題である導電粒子入り接着剤層の薄層化に関しても、本法では自動的に導電粒子層は、絶縁性接着剤層表面に配置されるため、粒子層の極限薄層化が可能となった。
第３の課題である導電性異物の除去に関しては、本散布法では接着剤製膜は、導電粒子が添加されていないため充分な精密濾過が可能であり、接着剤中の導電性異物の除去は容易である。
すなわち、本発明は、フィルムに導電粒子を散布して製造する異方導電性フィルムの製造法であって、一定の速度で移動するフィルムに対して、当該移動方向に対して水平方向に噴霧ノズルを固定し、導電粒子をエアエジェクタを通して流動化させて散布する、異方導電性接着フィルムの製造法である。
The present invention has been made to solve the above three problems. Regarding the secondary aggregation of the conductive particles, which is the first problem, the conductive particles are originally single particles, but it has been confirmed that secondary aggregation occurs when dispersed in the liquid insulating adhesive. As a method for eliminating this step, a method of spraying conductive particles directly on the surface of the insulating adhesive layer by a dry particle spraying method was devised.
In addition, regarding the thinning of the adhesive layer containing conductive particles, which is the second problem, since the conductive particle layer is automatically disposed on the surface of the insulating adhesive layer in this method, the extremely thin layer of the particle layer It became possible.
Regarding the removal of conductive foreign matter, which is the third problem, in this spraying method, the adhesive film can be sufficiently fine filtered because no conductive particles are added, and the conductive foreign matter in the adhesive is removed. Is easy.
That is, the present invention relates to a method for manufacturing an anisotropic conductive film manufactured by spraying conductive particles on a film, the spray nozzle being in a horizontal direction with respect to the moving direction with respect to the film moving at a constant speed. Is fixed, and the conductive particles are fluidized and dispersed through an air ejector, and the anisotropic conductive adhesive film is produced.
本発明による効果は、第１に導電粒子の二次凝集粒子径が小さくなること。第二に導電粒子の配置を異方導電性接着フィルムの表層に極めて近い層に集中させ、回路接続時の粒子流れを改善し、粒子補足率が高くなり、接着剤に添加する導電粒子数を少なくすることが可能になる。この結果、回路間スぺ一スに存在する導電粒子数が格段に少なくなり、回路間の短絡ポテンシャルを下げることができる。
また、絶縁性接着剤に被覆されない導電粒子が存在して、回路電極の一方には裸状態の導電粒子と電極の接触が可能となり、接続抵抗を下げることができる。
さらに前述の様に、絶縁性接着剤の塗布直前の細かい濾過が可能になり、異方導電性接着フィルム中の異物低減に、大きな効果が認められた。
The first effect of the present invention is that the secondary aggregated particle diameter of the conductive particles is reduced. Secondly, the arrangement of the conductive particles is concentrated on the layer very close to the surface layer of the anisotropic conductive adhesive film, improving the particle flow at the time of circuit connection, increasing the particle capture rate, and reducing the number of conductive particles added to the adhesive. It becomes possible to reduce. As a result, the number of conductive particles existing in the inter-circuit space is significantly reduced, and the short-circuit potential between the circuits can be lowered.
In addition, there are conductive particles that are not covered with the insulating adhesive, and the contact between the bare conductive particles and the electrode can be made on one of the circuit electrodes, and the connection resistance can be lowered.
Further, as described above, fine filtration immediately before the application of the insulating adhesive becomes possible, and a great effect was observed in reducing foreign matters in the anisotropic conductive adhesive film.
図１、図２、図３に本発明方法の実施に係る装置の概念図を示すが、本発明はこれに限定されるものでははい。図１は本発明方法による散布箱４内の導電粒子の動きと空気の流れ方向を示したもので、エジェクタ２からの空気と混合された導電粒子１が噴霧ノズル３をとおして接着剤を塗布した剥離性フィルム７上に散布される。図２は、剥離性フィルムに絶縁性接着剤を塗布し、導電粒子を散布した後、非粘着性のセパレ一タ６を合わせてラミネ一トロ一ル１２を通し、導電粒子を絶縁性接着剤層に押し込み固定する方法を示す。
図３は、セパレ−タ６上に導電粒子のみを散布した後、予め絶縁性接着剤を塗布した接着剤付フィルム基材７と合わせラミネ一トロ−ル１２を通して、導電粒子を固定する方法を示す。
ここで、絶縁性接着剤を剥離性フィルム基材に塗布する工程と導電粒子を散布・固定する工程を連続化することは、加工費低減に有効である。但し、一般に絶縁性接着剤は有機溶剤を使用する場合が多く、危険物取り扱い設備とするための初期設備費との兼ね合いであり、どちらを選択をするも自由である。
剥離性フィルム基材に絶縁性接着剤を塗布し、接着剤中の溶媒が揮散する段階のタック性がある時に、導電粒子を散布する方法も導電粒子固定の一つの方法である。また、完全に溶媒を揮散させた後に、絶縁性接着剤がタック性を有して散布された粒子を完全に固定できる場合は、そのまま異方導電性接着フィルムとすることができる。
図４はこのようにして製造した異方導電性接着フィルムの断面を示したもので、絶縁性接着剤１３の表面層に導電粒子の層１１が形成されている状態を示した。
図２、図３に示す方法において、絶縁性接着剤層が加熱によりタック性、塑性変形性が具現される場合は、ラミネ−トロ−ルの加熱又はラミネ一ト前に被ラミネ一ト物を加熱するのが望ましい。また、ラミネ一トロ一ル間隙を制御することにより、導電粒子の一部を露出させた状態の粒子固定も可能である。
図５に示すように多層化し、導電粒子層１１を中間に配置することも、接続部分の形状によっては粒子補足率の向上に効果的である場合もある。導電粒子層の位置は、どこでも本製造法では可能である。また、導電粒子層を含め、各層の溶融粘度を最適化することにより、粒子補足率の向上に効果的である。
1, 2, and 3 are conceptual diagrams of an apparatus according to the method of the present invention, but the present invention is not limited to this. FIG. 1 shows the movement of the conductive particles in the
FIG. 3 shows a method of fixing conductive particles through a laminating
Here, it is effective to reduce the processing cost to make the process of applying the insulating adhesive to the peelable film substrate and the process of spraying and fixing the conductive particles continuous. However, in general, the insulating adhesive often uses an organic solvent, and this is in balance with the initial equipment cost for making the hazardous material handling equipment, and it is free to choose either.
A method of spreading conductive particles when applying an insulating adhesive to a peelable film substrate and having tackiness at a stage where the solvent in the adhesive is volatilized is also one method of fixing conductive particles. In addition, when the insulating adhesive has tackiness and can completely fix the dispersed particles after completely evaporating the solvent, the anisotropic conductive adhesive film can be used as it is.
FIG. 4 shows a cross section of the anisotropically conductive adhesive film manufactured as described above, and shows a state in which a
In the method shown in FIG. 2 and FIG. 3, when the insulating adhesive layer is tacky and plastically deformable by heating, the object to be laminated is heated before heating or laminating the laminating roll. It is desirable to heat. Further, by controlling the laminar-troll gap, it is possible to fix particles in a state where a part of the conductive particles is exposed.
As shown in FIG. 5, multilayering and arranging the
フェノキシ樹脂（ＰＫＨＡ：ユニオンカ一バイド社製高分子エポキシ樹脂）とマイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂（ノバキュアＨＰ−３９４２ＨＰ：旭化成製、エポキシ当量１８５）の比率３０／７０とし、酢酸エチル３０％接着剤溶液を得た。この溶液を離型処理した二軸延伸ＰＥＴ樹脂フィルム製のセパレ−タＡ上に流延・乾燥して、２３μｍ厚みのフィルムＢを得た。直径５μｍの金めっきプラスチック粒子をエアエジェクタを通して流動化させて、噴霧ノズルからフィルムＢ上に平均８０００個／ｍｍ２の割合で散布し、フィルムＣを得た。なお、このフィルムＢは１ｍ／分の速度で移動させ、噴霧ノズルは固定し水平方向に散布した。
このフィルムＣに、離型処理した二軸延伸ＰＥＴ樹脂フィルム製のセパレ一タＡの離型処理面と導電粒子散布面を向かい合わせて重ね、二本の金属ロ−ル間を通して、散布した導電粒子をフィルムＣの表面層に押し込んで固定させた異方導電性接着フィルムＤを得た。
ＩＴＯガラス基板に、この異方導電性接着フィルムＤを貼り付け、セパレ−タムを剥がした後、５０μｍ×９０μｍの金バンプを有するべアチップを位置合わせして、１８０℃、２０ｋｇ／ｃｍ2 で２０秒の加熱加圧して回路接続をした。異方導電性接着フィルムＤを２００倍の光学顕微鏡で観察して、単位面積当たりの導電粒子数ａと二次凝集状態を計測した。また、回路接続した後のべアチップバンプ上の導電粒子数ｂを計測した。
A ratio of 30/70 of phenoxy resin (PKHA: polymer epoxy resin manufactured by Union Carbide Co.) and liquid epoxy resin (Novacure HP-3942HP: manufactured by Asahi Kasei, epoxy equivalent 185) containing a microcapsule type latent curing agent, acetic acid An ethyl 30% adhesive solution was obtained. This solution was cast and dried on a separator A made of a biaxially stretched PET resin film subjected to a release treatment to obtain a film B having a thickness of 23 μm. Gold-plated plastic particles having a diameter of 5 μm were fluidized through an air ejector and sprayed onto the film B from the spray nozzle at a rate of 8000 particles / mm 2 on average to obtain a film C. The film B was moved at a speed of 1 m / min, and the spray nozzle was fixed and sprayed in the horizontal direction.
On this film C, the release treatment surface of the separator A made of a biaxially stretched PET resin film and the conductive particle dispersion surface are overlapped with each other, and the dispersed conductive material is passed between the two metal rolls. An anisotropic conductive adhesive film D in which the particles were pressed into the surface layer of film C and fixed was obtained.
After this anisotropic conductive adhesive film D was attached to the ITO glass substrate and the separator was peeled off, the bare chip having 50 μm × 90 μm gold bumps was aligned, and 20 ° C. at 20 ° C. and 20 kg / cm 2 . The circuit was connected by heating and pressing for 2 seconds. The anisotropic conductive adhesive film D was observed with a 200-fold optical microscope, and the number of conductive particles a per unit area and the secondary aggregation state were measured. Further, the number b of conductive particles on the bear chip bump after circuit connection was measured.
比較例
実施例と同様の接着剤溶液により、１５μｍ厚さの導電粒子なし接着層Ｎを作製した。また、同接着剤溶液中に導電粒子を分散させて、８μｍ厚さの導電粒子入りの接着層Ｍを作製した。接着層Ｎと接着層Ｍを貼り合わせた２層構造異方導電性接着フィルムＬを得た。
この２層構造異方導電性接着フィルムＬを用いて、実施例と同様な接続と計測を実施した。
実施例と比較例の計測結果を表１に示す。
Comparative Example A conductive particle-free adhesive layer N having a thickness of 15 μm was produced using the same adhesive solution as in the example. In addition, conductive particles were dispersed in the adhesive solution to prepare an adhesive layer M containing conductive particles having a thickness of 8 μm. A two-layer anisotropic conductive adhesive film L in which the adhesive layer N and the adhesive layer M were bonded together was obtained.
Using this two-layer structure anisotropic conductive adhesive film L, the same connection and measurement as in the example were performed.
Table 1 shows the measurement results of Examples and Comparative Examples.
１ 導電粒子 ２ エジェクタ
３ 噴霧ノズル ４ 散布箱
５ 接地受け板 ６ セパレータ（剥離性フィルム）
７ 接着剤付剥離性フィルム基材 ８ 導電粒子
９ 製品 １１ 導電粒子層
１２ ラミネータ １３ 絶縁性接着剤層
１４ 絶縁性接着剤層
DESCRIPTION OF SYMBOLS 1 Conductive particle 2
7 Peelable Film Base with Adhesive 8 Conductive Particles 9
Claims (1)
A method for producing an anisotropic conductive film produced by spraying conductive particles on a film, wherein the spray nozzle is fixed in a horizontal direction with respect to the moving direction of the film moving at a constant speed, and the conductive particles A method for manufacturing anisotropically conductive adhesive films in which fluid is sprayed through an air ejector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005157615A JP4103902B2 (en) | 2005-05-30 | 2005-05-30 | Method for manufacturing anisotropic conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005157615A JP4103902B2 (en) | 2005-05-30 | 2005-05-30 | Method for manufacturing anisotropic conductive adhesive film |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10847197A Division JP4181231B2 (en) | 1997-04-25 | 1997-04-25 | Method for manufacturing anisotropic conductive adhesive film |
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| Publication Number | Publication Date |
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| JP2005294271A true JP2005294271A (en) | 2005-10-20 |
| JP4103902B2 JP4103902B2 (en) | 2008-06-18 |
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| JP2005157615A Expired - Fee Related JP4103902B2 (en) | 2005-05-30 | 2005-05-30 | Method for manufacturing anisotropic conductive adhesive film |
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| JP (1) | JP4103902B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100666124B1 (en) | 2005-10-31 | 2007-01-09 | 전자부품연구원 | Method of fabricating anisotropic conductive film using electrospun |
| CN112500806A (en) * | 2020-11-20 | 2021-03-16 | 东莞市哲华电子有限公司 | Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components |
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| JPS61127199A (en) * | 1984-11-26 | 1986-06-14 | 日本精線株式会社 | Conductive composite body and manufacture thereof |
| JPS61187393A (en) * | 1985-02-15 | 1986-08-21 | カシオ計算機株式会社 | Joint material for connection of electronic component |
| JPS62137571U (en) * | 1986-02-24 | 1987-08-29 | ||
| JPH07302667A (en) * | 1994-05-10 | 1995-11-14 | Hitachi Chem Co Ltd | Manufacture of anisotropic conductive resin film of bond and connection method between fine circuits |
| JPH0946028A (en) * | 1995-07-31 | 1997-02-14 | Nec Corp | Terminal connecting method and circuit board manufactured by method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6192859A (en) * | 1984-06-29 | 1986-05-10 | ザ、プロクタ−、エンド、ギヤンブル、カンパニ− | Method and device for uniformly distributing severally separated particle onto moving porous web |
| JPS61127199A (en) * | 1984-11-26 | 1986-06-14 | 日本精線株式会社 | Conductive composite body and manufacture thereof |
| JPS61187393A (en) * | 1985-02-15 | 1986-08-21 | カシオ計算機株式会社 | Joint material for connection of electronic component |
| JPS62137571U (en) * | 1986-02-24 | 1987-08-29 | ||
| JPH07302667A (en) * | 1994-05-10 | 1995-11-14 | Hitachi Chem Co Ltd | Manufacture of anisotropic conductive resin film of bond and connection method between fine circuits |
| JPH0946028A (en) * | 1995-07-31 | 1997-02-14 | Nec Corp | Terminal connecting method and circuit board manufactured by method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100666124B1 (en) | 2005-10-31 | 2007-01-09 | 전자부품연구원 | Method of fabricating anisotropic conductive film using electrospun |
| CN112500806A (en) * | 2020-11-20 | 2021-03-16 | 东莞市哲华电子有限公司 | Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4103902B2 (en) | 2008-06-18 |
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