CN112500806A - Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components - Google Patents
Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components Download PDFInfo
- Publication number
- CN112500806A CN112500806A CN202011310889.5A CN202011310889A CN112500806A CN 112500806 A CN112500806 A CN 112500806A CN 202011310889 A CN202011310889 A CN 202011310889A CN 112500806 A CN112500806 A CN 112500806A
- Authority
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- China
- Prior art keywords
- layer
- thermal
- manufacturing process
- adhesive tape
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 66
- 238000001035 drying Methods 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 21
- 239000010439 graphite Substances 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 abstract description 4
- 230000003068 static effect Effects 0.000 abstract description 4
- 239000004814 polyurethane Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a manufacturing process of a high-reliability heat-conducting adhesive tape for electronic components, which comprises the following steps: (1) preparing a substrate layer; (2) coating an antistatic layer on the bonding surface of the substrate layer, and drying; (3) then coating the prepared adhesive solution containing the adhesion promoter on an antistatic layer to obtain a thermal adhesion layer, and uniformly paving a plurality of graphite particles on the surface of the thermal adhesion layer; (4) pressing a plurality of graphite particles into the thermal bonding layer to form a plurality of grooves for accommodating the graphite particles on the surface of the thermal bonding layer, and drying; (5) and finally, attaching a release material layer on the surface of the thermal adhesive layer to obtain the thermal conductive adhesive tape. The invention mainly aims at the characteristic of coexistence of heat and static electricity of the electronic device, and the manufactured adhesive tape can simultaneously have excellent heat conductivity and excellent antistatic performance, can keep the bonding strength of the contact strength with the electronic device for a long time, and realizes the stability of heat dissipation performance.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a manufacturing process of a high-reliability heat-conducting adhesive tape for electronic components.
Background
Current electronic product often passes through fan heat dissipation, however, because bulky, can produce noise scheduling problem, is eliminated by the market gradually. Other heat dissipation materials such as copper foil and aluminum foil are used for heat dissipation, but due to limited resources and high price, the heat dissipation effect is not good as expected, and new efficient heat dissipation materials are gradually sought. Secondly, due to the diversity of electronic products, the existing products are often required to be customized, so that the electronic products are difficult to be suitable for specific use occasions and the popularization of the application is limited; therefore, if the adhesive tape with heat conducting and antistatic properties is designed according to the coexistence of heat and static electricity of electronic devices, the direction of efforts of ordinary persons in the art is changed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-reliability heat conduction adhesive tape manufacturing process for an electronic component.
The technical scheme of the invention is as follows:
a manufacturing process of a high-reliability heat-conducting adhesive tape for electronic components comprises the following steps:
(1) preparing a substrate layer;
(2) coating an antistatic layer on the bonding surface of the substrate layer, and drying;
(3) then coating the prepared adhesive solution containing the adhesion promoter on an antistatic layer to obtain a thermal adhesion layer, and uniformly paving a plurality of graphite particles on the surface of the thermal adhesion layer;
(4) pressing a plurality of graphite particles into the thermal bonding layer to form a plurality of grooves for accommodating the graphite particles on the surface of the thermal bonding layer, and drying;
(5) and finally, attaching a release material layer on the surface of the thermal adhesive layer to obtain the thermal conductive adhesive tape.
In the step (1), the base material layer is formed by biaxially stretching a polyethylene terephthalate as a raw material.
In the step (2), the antistatic layer is a PU antistatic coating.
In the step (2), the thickness of the antistatic layer is 5 to 15 μm.
And (2) drying by using an oven, wherein the length of the oven is 6-9 m, the drying temperature is controlled at 100-110 ℃, and the drying time is 15-30 s.
In step (3), the adhesion promoter is 3M94 adhesion promoter.
In the step (3), the thickness of the thermal adhesive layer is 10 to 30 μm.
In the step (3), the size of the graphite particles is 30-50 μm.
And (4) drying by using an oven, wherein the length of the oven is 3-6 m, the drying temperature is controlled at 70-85 ℃, and the drying time is 10-20 s.
In the step (5), the release material layer is a release film layer or a release paper layer.
Compared with the prior art, the invention has the beneficial effects that:
the invention aims at the coexistence characteristic of heat and static electricity of an electronic device, develops an adhesive tape simultaneously having excellent heat conductivity and excellent antistatic performance, wherein the heat conductivity is provided by graphite particles on the surface of a thermal bonding layer, and the performance characteristic of the graphite is utilized: excellent electrical and thermal conductivity, and ultra-high temperature resistance; the antistatic performance is provided by a PU antistatic coating between the thermal bonding layer and the substrate layer; in addition, the 3M94 adhesion promoter contained in the thermal bonding layer can ensure the double-sided adhesiveness of the thermal bonding layer, improve the adhesive force, maintain the adhesive strength of the contact strength with the electronic device for a long time when in use, and realize the stability of the heat radiation performance.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Examples
The invention provides a manufacturing process of a high-reliability heat conduction adhesive tape for electronic components, which mainly aims at the characteristic of coexistence of heat and static electricity of electronic components. The specific manufacturing method comprises the following steps:
(1) taking polyethylene glycol terephthalate as a raw material, and stretching the raw material in two directions to form a substrate layer;
(2) coating an anti-static layer on the bonding surface of the substrate layer, and drying, wherein the anti-static layer is made into a PU (polyurethane) anti-static coating, so that excellent anti-static performance can be provided for the adhesive tape, and the thickness of the anti-static layer is preferably 5-15 micrometers;
drying in an oven with the length of 6-9 m, the drying temperature controlled at 100-110 ℃ and the drying time 15-30 s;
(3) then coating the prepared adhesive solution containing the adhesion promoter on an antistatic layer to obtain a thermal adhesion layer, and uniformly paving a plurality of graphite particles on the surface of the thermal adhesion layer;
(4) pressing a plurality of graphite particles into the thermal bonding layer to form a plurality of grooves for accommodating the graphite particles on the surface of the thermal bonding layer, and drying;
the surface of the thermal bonding layer is embedded with the plurality of graphite particles, and the graphite has excellent electrical conductivity and thermal conductivity and ultra-strong high temperature resistance, so that the adhesive tape has excellent thermal conductivity and electrical conductivity;
preferably, the size of the graphite particles is 30-50 μm;
the adhesion promoter contained in the hot bonding layer is 3M94 adhesion promoter, so that the double-sided adhesiveness of the hot bonding layer is ensured, the adhesive force is improved, the bonding strength of the contact strength with an electronic device can be kept for a long time when the adhesive is used, and the stability of heat dissipation performance is realized;
preferably, the thickness of the thermal adhesive layer is 10 to 30 μm.
Drying in an oven, wherein the length of the oven is 3-6 m, the drying temperature is controlled at 70-85 ℃, and the drying time is 10-20 s;
(5) and finally, a release material layer (a release film layer or a release paper layer) is attached to the surface of the thermal bonding layer, so that the heat conduction adhesive tape with excellent heat conduction and excellent antistatic performance is obtained.
In conclusion, the adhesive tape manufactured by the process has excellent heat conductivity and excellent antistatic performance. The thermal conductivity is provided by the graphite particles on the surface of the thermal bonding layer, and the excellent electrical conductivity and thermal conductivity of the graphite and the performance characteristics of super-strong high temperature resistance are utilized; and the antistatic performance is provided by a PU antistatic coating layer between the thermal bonding layer and the substrate layer. In addition, the 3M94 adhesion promoter contained in the thermal bonding layer can ensure the double-sided adhesiveness of the thermal bonding layer, improve the adhesive force, maintain the adhesive strength of the contact strength with the electronic device for a long time when in use, and realize the stability of the heat radiation performance.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A manufacturing process of a high-reliability heat-conducting adhesive tape for electronic components is characterized by comprising the following steps:
(1) preparing a substrate layer;
(2) coating an antistatic layer on the bonding surface of the substrate layer, and drying;
(3) then coating the prepared adhesive solution containing the adhesion promoter on an antistatic layer to obtain a thermal adhesion layer, and uniformly paving a plurality of graphite particles on the surface of the thermal adhesion layer;
(4) pressing a plurality of graphite particles into the thermal bonding layer to form a plurality of grooves for accommodating the graphite particles on the surface of the thermal bonding layer, and drying;
(5) and finally, attaching a release material layer on the surface of the thermal adhesive layer to obtain the thermal conductive adhesive tape.
2. A manufacturing process of a highly reliable thermal conductive tape for electronic components as claimed in claim 1, wherein in step (1), said substrate layer is formed by biaxial stretching using polyethylene terephthalate as a raw material.
3. The manufacturing process of the high-reliability heat-conducting adhesive tape for the electronic components as claimed in claim 1, wherein in the step (2), the antistatic layer is a PU antistatic coating.
4. A manufacturing process of a high-reliability heat-conducting adhesive tape for electronic components as claimed in claim 1 or 3, wherein in the step (2), the thickness of the antistatic layer is 5 to 15 μm.
5. The manufacturing process of the high-reliability heat-conducting adhesive tape for the electronic components as claimed in claim 1, wherein in the step (2), an oven is adopted for drying, the length of the oven is 6-9 m, the drying temperature is controlled at 100-110 ℃, and the drying time is 15-30 s.
6. A highly reliable thermal conductive adhesive for electronic parts and components and tape manufacturing process according to claim 1, wherein in step (3), said adhesion promoter is 3M94 adhesion promoter.
7. The process for producing a highly reliable thermally conductive adhesive for electronic components as claimed in claim 1, wherein in the step (3), the thickness of the thermal adhesive layer is 10 to 30 μm.
8. A highly reliable thermal conductive paste for electronic parts and components as claimed in claim 1, wherein in step (3), the size of graphite particles is 30 to 50 μm.
9. The manufacturing process of the high-reliability heat-conducting adhesive for the electronic component as claimed in claim 1 is characterized in that in the step (4), an oven is adopted for drying, the length of the oven is 3-6 m, the drying temperature is controlled to be 70-85 ℃, and the drying time is 10-20 s.
10. The manufacturing process of the high-reliability heat-conducting adhesive tape for the electronic components as claimed in claim 1, wherein in the step (5), the release material layer is a release film layer or a release paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011310889.5A CN112500806A (en) | 2020-11-20 | 2020-11-20 | Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011310889.5A CN112500806A (en) | 2020-11-20 | 2020-11-20 | Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112500806A true CN112500806A (en) | 2021-03-16 |
Family
ID=74960035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011310889.5A Pending CN112500806A (en) | 2020-11-20 | 2020-11-20 | Manufacturing process of high-reliability heat-conducting adhesive tape for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112500806A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294271A (en) * | 2005-05-30 | 2005-10-20 | Hitachi Chem Co Ltd | Manufacturing method for anisotropic conductive adhesive film |
| CN105585972A (en) * | 2016-03-21 | 2016-05-18 | 苏州锦腾电子科技有限公司 | Adhesive tape for electronic device |
| WO2020189635A1 (en) * | 2019-03-18 | 2020-09-24 | 日榮新化株式会社 | Adhesive film |
-
2020
- 2020-11-20 CN CN202011310889.5A patent/CN112500806A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294271A (en) * | 2005-05-30 | 2005-10-20 | Hitachi Chem Co Ltd | Manufacturing method for anisotropic conductive adhesive film |
| CN105585972A (en) * | 2016-03-21 | 2016-05-18 | 苏州锦腾电子科技有限公司 | Adhesive tape for electronic device |
| WO2020189635A1 (en) * | 2019-03-18 | 2020-09-24 | 日榮新化株式会社 | Adhesive film |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20210316 |